JP2005159257A - Method for manufacturing electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic device wherein productivity can be improved by simplifying an assembly process. <P>SOLUTION: The electronic device is manufactured through a process A, a process B and a process C. In the process A, a mother board which has a plurality of board regions which are arranged in matrix shape is prepared, and electronic component elements are mounted on the respective board regions of the mother board. In the process B, a metal mother cover which has a plurality of cover regions which correspond to the board regions one by one is mounted/bonded on the mother board so that the electronic component elements are sealed. In the process C, a plurality of the electronic devices are obtained simultaneously by cutting the mother board and the mother cover together along the outer periphery of each of the board regions. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an electronic device such as a crystal resonator used in an electronic device such as a portable communication device or an electronic computer.

  Conventionally, crystal resonators have been used in electronic devices such as portable communication devices and electronic computers.

  As such a conventional crystal resonator, for example, as shown in FIG. 7, a pair of electrodes electrically connected to the connection pads via a conductive adhesive on the upper surface of an insulating substrate 21 provided with a pair of connection pads. A crystal resonator element 25 having a plurality of vibration electrodes and a seal ring 26 surrounding the crystal resonator element 25 are attached, and a metal lid 27 is joined to the upper portion of the seal ring 26 by seam welding or the like. Thus, there is known a structure in which the mounting area of the crystal resonator element 25 is hermetically sealed (see, for example, Patent Document 1). The crystal resonator includes input / output terminals provided on the lower surface of the insulating base 21. When a fluctuation voltage from the outside is applied between the vibrating electrodes of the crystal resonator element 25, thickness shear vibration is caused at a predetermined frequency according to the characteristics of the crystal resonator element 25. Reference signal having a predetermined frequency is oscillated and output by the external oscillation circuit based on the frequency. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.

  Further, the above-described insulating base 21 of the crystal resonator is formed by a multi-cavity technique in which a large mother substrate from which a plurality of insulating bases 21 can be cut is obtained to obtain individual pieces. Then, the quartz resonator element 25 and the seal ring 26 are attached to the obtained piece (insulating base member 21), and the lid 27 is joined to the upper portion of the seal ring 26, whereby the crystal resonator is manufactured.

The lid 27 of the crystal resonator element described above is also generally obtained by dividing a large metal plate from which a plurality of lids 27 can be cut out, similarly to the insulating base 21. During use, external noise is shielded by holding the lid 27 at the ground potential. Such a lid 27 is electrically connected to the ground terminal on the lower surface of the insulating base 21 via the seal ring 26 and the conductor pattern of the insulating base 21.
JP 2001-274649 A

  However, in the above-described conventional crystal resonator, it is necessary to obtain the insulating base 21 by dividing the large mother substrate and the lid 27 by dividing the large metal plate prior to the assembly. Since these two types of members are obtained in separate dividing steps, the assembly process of the crystal resonator becomes complicated, and there is a disadvantage that the productivity is not improved.

  Further, as described above, when assembling the crystal resonator after preparing the insulating base 21 and the lid 27 in advance, it is necessary to perform a work for holding the plurality of insulating bases 21 individually on the carrier. Further, the lids 27 must be individually aligned and attached on the individual insulating bases 21 held in this manner, and this also has the disadvantage that the assembly process of the crystal unit becomes complicated. It was.

  The present invention has been devised in view of the above-described drawbacks, and an object of the present invention is to provide an electronic device that can simplify an assembly process and improve productivity.

  The electronic device manufacturing method of the present invention includes a step A in which a mother board having a plurality of substrate areas arranged in a matrix is prepared, and an electronic component element is mounted on each board area of the mother board. A step B of placing and bonding on the mother substrate so that the element is sealed, and a plurality of electrons by collectively cutting the mother substrate and the mother cover along the outer periphery of each substrate region And the step C of obtaining the device at the same time.

  The electronic device manufacturing method of the present invention is characterized in that the electronic component element is a crystal resonator element.

  Furthermore, the method for manufacturing an electronic device according to the present invention is characterized in that a bonding material for bonding both the mother substrate and the mother cover is not present in the step C in the step C.

  According to the method for manufacturing an electronic device of the present invention, first, a metal substrate having a mother board on which electronic component elements are mounted in each board area and a plurality of cover areas corresponding to the board area of the mother board in one-to-one correspondence. A mother cover is prepared, and the mother cover is placed on and bonded to the mother board so that the electronic component element is sealed, and then the mother board and the mother cover are placed on the outer periphery of each board region. Since a plurality of electronic devices are obtained at the same time by collectively cutting along the substrate, it is not necessary to divide the substrate and the cover into individual pieces prior to the assembly of the electronic device. By dividing, the substrate and the cover can be cut simultaneously.

  In addition, in this case, when the electronic device is assembled, the mother board itself functions as a carrier. Therefore, the individual pieces divided from the mother board are individually held by the carrier, or each individual piece is provided with a cover. There is no need for complicated work such as attaching to the camera.

  As a result, the assembly process of the electronic device is greatly simplified, and the productivity of the electronic device can be improved.

  Further, according to the method of manufacturing an electronic device of the present invention, if the bonding material for bonding the mother substrate and the mother cover is not present at the cut portion of the mother substrate and the mother cover in step C, the dicer is cut when the mother substrate and the mother cover are cut. Is less likely to come into contact with the bonding material, thereby effectively preventing defects such as cracks in the bonding material due to contact with the dicer.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view of a crystal resonator obtained when the manufacturing method of the present invention is applied to manufacture of a crystal resonator. The crystal resonator shown in FIG. It is composed of a crystal resonator element 5 as an element and a cover member 8.

  The insulating substrate 1 is formed so as to have a cavity portion opened upward by a ceramic material such as glass-ceramic or alumina ceramic, and a pair of connection pads 2 and a cavity on the bottom surface of the cavity portion are formed on the upper surface side. A bonding conductor layer 4 surrounding the periphery of the opening is provided, and an external terminal 3 such as an input terminal, an output terminal, and a ground terminal is provided on the lower surface side.

  The pair of connection pads 2 provided on the bottom surface of the cavity portion of the insulating base 1 are electrically connected to a vibration electrode 6 of a crystal resonator element 5 described later on the upper surface side through a conductive adhesive, and the lower surface side. Thus, it is electrically connected to an input / output terminal (input terminal, output terminal) on the lower surface of the insulating substrate through a conductor pattern on the insulating substrate 1, a via conductor inside the insulating substrate, or the like.

  On the other hand, the conductor layer 4 is electrically connected to a cover member 8 to be described later on the upper surface side via a bonding material 9, and on the lower surface side to a ground terminal on the lower surface of the insulating base via a via conductor inside the insulating base. Electrically connected.

  The external terminals described above are electrically connected to the circuit wiring of the external electric circuit via a conductive adhesive such as solder when the crystal resonator is mounted on an external electric circuit such as a mother board. Yes.

  In addition, the crystal resonator element 5 is mounted on the bottom surface of the cavity portion of the insulating base 1 described above.

  The quartz resonator element 5 is formed by attaching and forming a pair of vibrating electrodes 6 on both main surfaces of a quartz piece cut along a predetermined crystal axis, and a fluctuation voltage from the outside passes through the pair of vibrating electrodes 6 and the quartz piece. When applied to, thickness shear vibration occurs at a predetermined frequency.

  Such a quartz-crystal vibrating element 5 electrically and mechanically connects the vibrating electrode 6 attached to both main surfaces thereof and the corresponding connection pad 2 on the upper surface of the insulating base via the conductive adhesive 7. As a result, the insulating substrate 1 is mounted on the bottom surface of the cavity.

  Furthermore, a cover member 8 made of metal is attached to the periphery of the opening of the cavity portion of the insulating substrate 1. As the cover member 8, 42 alloy, Kovar, phosphor bronze, or the like may be used. The lower end portion of the cover member 8 is brazed to the conductor layer 4 through a bonding material 9 such as Au—Ni, and the cover member 8 extends along the outer peripheral portion of the cover member 8. Then, it is attached to the upper surface of the insulating substrate 1 by being joined to the upper surface of the insulating substrate 1 in an annular shape.

  The cover member 8 is for accommodating the quartz vibrating element 5 in a region surrounded by the insulating base 1 and hermetically sealing it, and is connected to the ground terminal on the lower surface of the insulating base via the conductor layer 4 described above. Electrically connected. Therefore, when the crystal resonator is used, the cover member 8 is held at the ground potential, and the crystal resonator element 5 is well protected from unnecessary external electrical action such as noise due to the shielding effect of the cover member 8. Is done.

  Thus, the crystal resonator described above applies a variable voltage from the outside between the vibration electrodes 6-6 of the crystal resonator element 5 via the input / output terminal provided on the lower surface of the insulating base 1. A thickness-shear vibration is caused at a predetermined frequency according to the function of the crystal resonator, and a reference signal having a predetermined frequency is oscillated and output by an external oscillation circuit based on the resonance frequency of the crystal resonator. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.

  Next, a manufacturing method of the above-described crystal resonator will be described with reference to FIG.

(Process A)
First, as shown in FIG. 2A, a mother substrate 15 having a plurality of substrate regions arranged in a matrix is prepared, and the crystal resonator element 5 is mounted on each substrate region of the mother substrate 15.

  For example, the mother substrate 15 is formed by laminating two layers of a rectangular flat plate made of a ceramic material such as glass-ceramic and alumina ceramic, and further, a matrix made of a ceramic material, that is, vertical m columns × horizontal n rows. It is formed by laminating a plurality of substrates having a plurality of rectangular holes arranged in a matrix, and each substrate region centered on the holes arranged in a matrix has a cavity portion bottom surface on the upper surface side. A pair of connection pads 2 and a bonding conductor layer 4 surrounding the periphery of the opening are deposited and formed, and external terminals 3 such as input / output terminals and ground terminals are deposited and formed on the lower surface side.

  Such a mother substrate 15 is formed, for example, on the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent or the like to a ceramic material powder made of alumina ceramics, etc. The conductor paste is printed and applied in a predetermined pattern, and a plurality of the pastes are stacked, press-molded, and then fired at a high temperature.

  In addition, one crystal resonator element 5 is mounted on the bottom surface of the cavity portion of each substrate region of the obtained mother substrate 15, and the vibration electrode 6 of the crystal resonator element 5 and the mounting pad 2 on the upper surface of the mother substrate are electrically bonded. Electrically and mechanically connected via the agent 7.

  In the present embodiment, as shown in FIG. 3, a predetermined spare area is provided between the substrate areas arranged in a matrix.

(Process B)
Next, as shown in FIG. 2B, the quartz crystal resonator element 5 is sealed with a metal mother cover 16 having a plurality of cover regions 11 corresponding to the substrate region of the mother substrate 15 in one-to-one correspondence. In this way, it is placed and bonded onto the mother board 15.

  The mother cover 16 is manufactured by processing a metal plate made of metal such as 42 alloy, Kovar, phosphor bronze, etc., having a thickness of 60 μm to 100 μm into a predetermined shape by a conventionally known sheet metal processing. The cover 16 has a plurality of cover regions 11 arranged in a matrix so as to correspond to the substrate region of the mother substrate 15 on a one-to-one basis. In the present embodiment, the mother cover 16 is also provided with a predetermined surplus area, similar to the mother board 15.

  Such a mother cover 16 is placed on the mother substrate 15 such that the quartz crystal resonator element 5 of the substrate region corresponding to the inside of each cover region 11 is arranged, and then this is, for example, 300 ° C. to The mother cover 16 is joined to the mother board 15 by placing it in a heating furnace maintained at a temperature of 350 ° C. and heating and melting the joining material 9 at a high temperature. Thereafter, the integrated mother board 15 and mother cover 16 are gradually cooled to room temperature.

  In addition, it is preferable to perform a series of joining processes mentioned above in inert gas atmosphere, such as nitrogen gas and argon gas, and since the space in which the crystal vibration element 5 is accommodated by this is filled with inert gas, It is possible to effectively prevent the quartz vibrating element 5 from being corroded and deteriorated by oxygen, moisture in the atmosphere, or the like.

  Further, for example, as shown in FIG. 5, when the mother cover 16 is placed on the mother board 15, predetermined through holes are formed in the four corners of the marginal area provided on the outer periphery of the mother board 15 and the mother cover 16. The mother board 15 and the mother cover 16 may be aligned by inserting positioning pins into these through-holes, and a clip is used as shown in FIG. Then, the mother board 15 and the mother cover 16 may be temporarily fixed and then joined together, and the clip may be attached in a cutting process described later to be used as a fixing jig.

(Process C)
Finally, as shown in FIG. 2C, the mother substrate 15 and the mother cover 16 integrated in the step B are divided and cut along the outer periphery of each substrate region.

  The mother substrate 15 and the mother cover 16 are cut by, for example, collectively cutting the mother substrate 15 and the mother cover 16 from the mother substrate side using a dicer or the like. It is obtained at the same time. As described above, the cutting direction may be performed not from the mother board side but from the mother cover 16 side as described above, and is appropriately selected depending on the cutting means and the materials used for the mother board 15 and the mother cover 16. be able to.

  When a crystal resonator is manufactured by such a process, it is not necessary to divide the insulating substrate 1 and the cover member 8 into pieces prior to the assembly of the crystal resonator. And the cover member 8 can be cut simultaneously.

  In addition, in this case, since the mother board itself functions as a carrier when the crystal resonator is assembled, the pieces divided from the mother board 15 are individually held by the carrier, or each piece is covered. The complicated work of attaching the members 8 individually becomes unnecessary.

  As a result, the assembly process of the crystal unit is greatly simplified, and the productivity of the crystal unit can be improved.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  For example, in the above-described embodiment, as shown in FIG. 4A, if the groove portion 19 is formed in the mother cover 16 along the outer periphery of the substrate region, the mother cover 16 and the mother cover 16 are formed along the groove portion 19. Only by cutting the substrate 15, the mother substrate 15 can be accurately divided along the outer periphery of the substrate region. This also improves the productivity of the crystal unit and provides an electronic device with high dimensional accuracy. Therefore, it is preferable to form a groove 19 along the outer periphery of the substrate region in the mother cover 16.

  Further, in the step C of the above-described embodiment, as shown in FIG. 4B, if the bonding material 9 for bonding the mother substrate 15 and the mother cover 16 is not present at the cut portions of the mother substrate 15 and the mother cover 16, the mother substrate 15 In addition, when the mother cover 16 is cut, the dicer rarely comes into contact with the bonding material 9, and this effectively prevents the sealing material from being deteriorated due to a defect such as a crack in the bonding material 9 due to the contact with the dicer. Can do. Accordingly, it is preferable that the bonding material 9 for bonding the mother substrate 15 and the mother cover 16 is not present at the cut portions of the mother substrate 15 and the mother cover 16 in the process C.

  Further, in the above-described embodiment, the spare area is provided between the substrate areas of the mother board 15, but the board areas may be arranged close to each other without providing a spare area therebetween. . The same applies to the mother cover 16.

  Furthermore, in the above-described embodiment, the crystal resonator is configured by using a crystal resonator element as an electronic component element. However, other electronic devices, for example, an IC element or other piezoelectric element as an electronic component element are used. The present invention can also be applied to an electronic apparatus using the above.

It is sectional drawing of the crystal oscillator (electronic device) manufactured by the manufacturing method of this invention. (A) thru | or (c) are sectional drawings for demonstrating the manufacturing method concerning one Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method concerning one Embodiment of this invention. (A) thru | or (b) is sectional drawing for demonstrating the manufacturing method concerning other embodiment of this invention. It is a perspective view for demonstrating the manufacturing method concerning other embodiment of this invention. It is a perspective view for demonstrating the manufacturing method concerning other embodiment of this invention. It is sectional drawing of the conventional crystal oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 2 ... Connection pad 3 ... External terminal 4 ... Conductor layer 5 ... Crystal oscillation element (electronic component element)
DESCRIPTION OF SYMBOLS 6 ... Vibration electrode 7 ... Conductive adhesive material 8 ... Cover member 9 ... Joining material 11 ... Cover area | region 15 ... Mother board 16 ... Mother cover 19 ... Groove part

Claims (3)

Preparing a mother board having a plurality of substrate areas arranged in a matrix, and mounting an electronic component element on each board area of the mother board; and
Placing and joining a metal mother cover having a plurality of cover regions corresponding to the substrate region on a one-to-one basis on the mother substrate so that the electronic component element is sealed; and
And a step C of simultaneously obtaining a plurality of electronic devices by collectively cutting the mother substrate and the mother cover along the outer periphery of each substrate region. The method of manufacturing an electronic device according to claim 1, wherein the electronic component element is a crystal resonator element. 3. The method of manufacturing an electronic device according to claim 1, wherein a bonding material for bonding both of the mother substrate and the mother cover is not present in the cut portion of the mother substrate and the mother cover in the step C. 4.

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