JP4512185B2 - Manufacturing method of piezoelectric oscillator and sheet type substrate thereof - Google Patents

Description

  The present invention relates to a method for manufacturing a piezoelectric oscillator used in an electronic device such as a portable communication device, and a sheet type substrate thereof.

  Conventionally, piezoelectric oscillators have been used in electronic devices such as portable communication devices. As such a conventional piezoelectric oscillator 100, for example, a container 101 in which a piezoelectric vibrator 112 is accommodated in a concave opening 110 on the upper surface of a frame-shaped base 121 having a plurality of external terminals 126 attached to the lower surface. An integrated circuit 122 for controlling the oscillation output based on the vibration of the piezoelectric vibrator 112 via the substrate 120 and a chip-type electronic component 124 such as a capacitor are disposed on the bottom surface of the container 101 through the substrate 120, and these integrated circuits are integrated. A structure having a circuit 122 and a chip-type electronic component 124 mounted on the lower surface of the container 101 is known. (For example, see Patent Document 1)

  The container 101, the substrate 120, and the frame-shaped base 121 are usually formed so as to be integrated with a ceramic material such as glass-ceramic, and a wiring conductor is formed inside and on the surface thereof. It is manufactured by adopting a conventionally known ceramic green sheet lamination method or the like.

  The integrated circuit 122 is provided with a temperature compensation circuit for correcting the oscillation output of the crystal oscillator based on temperature compensation data created according to the temperature characteristics of the piezoelectric vibrator 112. After assembling the oscillator, in order to store the temperature compensation data in the memory in the integrated circuit 122, a signal input / output terminal 126 for writing temperature compensation data is provided on the lower surface or the outer surface of the frame-like base 121. It was common to leave.

JP 2000-269741 A

  The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.

  However, in the above-described conventional piezoelectric oscillator 100, it is necessary to obtain the container 101 by dividing the large mother substrate and the lid 130 by dividing the large mother cover prior to the assembly. Since these two types of members are obtained in separate dividing steps, the assembly process of the piezoelectric oscillator becomes complicated, and there is a problem that the productivity is not improved.

  Further, as described above, when assembling the piezoelectric oscillator after preparing the individual container 101 and the individual lid body 130 in advance, an operation for holding the plurality of containers 101 individually on the carrier is necessary. In addition, the lids 130 must be individually aligned and mounted on the individual containers 101 held by the carrier, which also causes a problem that the assembly process of the piezoelectric oscillator becomes complicated.

  Further, in the conventional piezoelectric oscillator described above, the product is usually assembled by individually mounting the piezoelectric vibrator 112, the integrated circuit 122, etc. on the individual pieces obtained after the division. In this case, the individual pieces are assembled. Needs to be mounted on the integrated circuit 122 and the like while being mounted and held on the carrier. Therefore, there is a problem that manufacturing facilities such as carriers increase, and this also complicates the manufacturing process.

  The present invention has been created in view of the above-described problems. Therefore, the object of the present invention is to provide a method for manufacturing a piezoelectric oscillator that can simplify the assembly process and improve productivity, and a sheet-type substrate thereof. It is in.

The sheet-type substrate of the present invention is formed on a sheet-type substrate having a structure in which the side surfaces of the container having a large number of concave openings are connected to each other, and a piezoelectric vibrator is mounted on each container having the concave openings. The container having the concave opening is integrally and hermetically sealed by a sheet-type substrate-sized lid placed on the concave opening, and the concave opening of each container The bottom surface of the container having a pair of walls opposite to each other is covered with a plurality of resins including at least one integrated circuit that conducts with the piezoelectric vibrator placed through the substrate on the bottom surface of the container having the pair of walls. chip-type electronic component are mounted, the signal input terminal to which a signal from the outside to each of the integrated circuit is used when matching the frequency characteristics of the piezoelectric oscillator is output to a desired frequency characteristics, respectively With opening Lies in the integrated circuit side of the pair of containers having a wall the integrated circuit signal input and output terminal sides of the discarded white piezoelectric provided in a region oscillator outer frame portion of the opening direction edge on, a large number of piezoelectric oscillator It is characterized by having.

In addition, the piezoelectric oscillator manufacturing method of the present invention is formed on a sheet-type substrate having a structure in which a plurality of concave openings are connected to each other on the side of the container, and the piezoelectric vibrator is formed in each container having the concave openings. The container having the concave opening is hermetically sealed by a lid placed on the concave opening, and then a pair of walls in the opposite direction to the concave opening of the container A plurality of chip-type electronic components including at least one integrated circuit connected to the piezoelectric vibrator placed through the substrate on the bottom of the container having the pair of walls are placed on the bottom of the container In a method for manufacturing a piezoelectric oscillator, a piezoelectric oscillator comprising a container and a plurality of chip-type electronic components including at least one integrated circuit electrically connected to the piezoelectric vibrator facing the bottom of the container is separated from the sheet-type substrate. , Sheet In the state of the substrate, the of the one main surface of the sheet-type substrate, and a step of mounting a piezoelectric vibrator in a container having a respective concave-shaped opening, all the concave openings on said sheet-type substrate A step of hermetically sealing the container having a sheet-shaped substrate large lid placed on the concave opening at a time, and the sheet-type substrate in a direction opposite to the concave opening of the container A plurality of chip-type electrons including at least one integrated circuit in conduction with the piezoelectric vibrator placed on the bottom surface of the container having a pair of walls on the other main surface via the substrate on the bottom surface of the container having the pair of walls A step of placing the component, a step of covering each of the chip-type electronic components with a resin, and a side of the integrated circuit signal input / output terminal of the container having the pair of walls on the side of the integrated circuit of each of the integrated circuits opening direction of the piezoelectric oscillator outer frame portion provided proximate the outer The signal input and output terminals that are on the parts, to output a signal to the step of dicing a step, the piezoelectric oscillator from the sheet-type substrate to match the frequency-temperature characteristic to a desired frequency-temperature characteristics of the piezoelectric oscillator It is characterized by comprising .

  According to the sheet-type substrate of the present invention, formed on the sheet-type substrate connected to each other on the side surface of the container having a large number of concave openings, each container having a concave opening has a piezoelectric vibrator mounted thereon. The container having the concave opening is hermetically sealed by a lid placed on the concave opening, and the bottom surface of the container opposite to the concave opening of each container is placed through the substrate. Since there are a large number of piezoelectric oscillators on which a plurality of chip-type electronic components including at least one integrated circuit that conducts with the mounted piezoelectric vibrators are mounted, the piezoelectric vibrators and integrated circuits are in the state of sheet-type substrates. Since a plurality of chip-type electronic components including a circuit can be mounted on a sheet-type substrate, a process for aligning each container, which has been conventionally required, with a carrier is not necessary, and the manufacturing process can be simplified.

  In addition, in the case of such a sheet type substrate, since the sheet type substrate serves as a carrier for carrying production equipment, it is possible to improve the production efficiency without preparing a carrier for carrying separately. The effect which becomes.

  In addition, according to the method for manufacturing a piezoelectric oscillator of the present invention, a sheet-type substrate having a configuration in which a plurality of concave openings are connected to each other on the side surface of the container, each container having a concave opening is provided. After a container having a piezoelectric opening and having a concave opening is hermetically sealed by a lid placed on the concave opening, a substrate is placed on the bottom surface of the container opposite to the concave opening of the container via a substrate. A plurality of chip-type electronic components including at least one integrated circuit that is electrically connected to the piezoelectric vibrator placed thereon, and at least one integrated that is electrically connected to each container and the piezoelectric vibrator facing the container bottom surface. In a piezoelectric oscillator manufacturing method in which a piezoelectric oscillator composed of a plurality of chip-type electronic components including a circuit is separated from a sheet-type substrate, piezoelectric vibration is generated in a container having a concave opening in the state of the sheet-type substrate. Child A step of hermetically sealing a container having all the concave openings on the sheet-type substrate at once with a lid placed on the concave opening, and a direction opposite to the concave opening of the container A step of placing a plurality of chip-type electronic components including at least one integrated circuit that conducts with a piezoelectric vibrator placed on the bottom surface of the container via a substrate; a step of covering each chip-type electronic component with a resin; The piezoelectric oscillator includes a step of inputting / outputting signals to / from each integrated circuit from the outside to adjust the frequency temperature characteristic of the piezoelectric oscillator to a desired frequency temperature characteristic, and a step of separating the piezoelectric oscillator from the sheet type substrate. Prior to the assembly, it is not necessary to previously divide the container and the lid into individual pieces, and the container and the lid can be cut simultaneously by batch division.

  Moreover, in this case, when the piezoelectric oscillator is assembled, the integrated sheet-type substrate itself functions as a carrier, so that individual pieces divided from the sheet-like substrate are individually held by the carrier, or There is an effect that no complicated work such as attaching a lid to each individual piece is required.

  As a result, the assembly process of the piezoelectric oscillator is greatly simplified, and the productivity of the piezoelectric oscillator can be improved.

  Furthermore, according to the sheet type substrate of the present invention, in the state of the sheet type substrate, signals are input / output from / to each integrated circuit, and used when the frequency temperature characteristic of the piezoelectric oscillator is adjusted to a desired frequency temperature characteristic. Since the signal input / output terminals are located on the edge of the outer frame of the piezoelectric oscillator provided on the outside of the container having the respective concave openings, the signal input / output terminals are input in the state of the sheet type substrate. Data can be written from the output terminal to the integrated circuit. In this case, since the signal input / output terminals are in the area to be discarded of the outer frame portion, the signal input / output terminals can be discarded after the data writing to the integrated circuit is completed, so that the piezoelectric oscillator can be further downsized. Has the effect of

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol in each figure shall show the same object.

  FIG. 1 is a cross-sectional view of the piezoelectric oscillator A according to the first embodiment of the present invention obtained when the manufacturing method of the present invention and the sheet type substrate thereof are applied to the manufacture of the piezoelectric oscillator A. The piezoelectric oscillator A shown in FIG. 1 generally includes a container 1, a piezoelectric vibrator 12, an integrated circuit 22, and a resin 28. A piezoelectric oscillator A shown in FIG. 1 is a pair of a container 1 in which a piezoelectric vibrator 12 is accommodated in a concave opening 10 and a bottom surface of the container 1 via a substrate 2 and external terminal electrodes 9a and 9b provided on the bottom surface. It is mounted on the substrate 2 having the leg portions 21a and 21b and fixed, and the integrated circuit 22 is mounted on the lower surface of the substrate 2 located between the pair of leg portions 21a and 21b. .

  The container 1 includes, for example, a substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic, a seal ring 3 made of a metal such as 42 alloy, Kovar, and phosphor bronze, and a lid 4 made of the same metal as the seal ring 3. The container 1 is constructed by attaching the seal ring 3 to the upper surface of the substrate 2 and mounting and fixing the lid 4 on the upper surface of the substrate 2, and the upper surface of the substrate 2 positioned inside the seal ring 3. The piezoelectric vibrator 12 is mounted via the conductive adhesive 13. The container 1 accommodates a piezoelectric vibrator 12 in its inside, specifically, a concave opening 10 surrounded by the upper surface of the substrate 2, the inner surface of the seal ring 3, and the lower surface of the lid body 4. It is for stopping.

  On the other hand, the piezoelectric vibrator 12 accommodated in the concave opening 10 of the container 1 has a pair of vibrating electrodes (not shown) attached and formed on both main surfaces of a crystal piece cut along a predetermined crystal axis. Thus, when an externally varying voltage is applied to the crystal piece via a pair of vibrating electrodes, a thickness-shear vibration occurs at a predetermined frequency.

  On the other hand, a plurality of external terminal electrodes 9a and 9b are deposited and formed on the lower surface of the substrate 2 described above in the region between the pair of leg portions 21a and 21b. The formation of these external terminal electrodes 9a and 9b is performed. A flip chip type integrated circuit 22 formed in a rectangular shape is mounted on a region, that is, on the lower surface of the substrate 2 positioned between the pair of leg portions 21a and 21b. Is protected. As the resin 28 used here, an epoxy resin or the like having a relatively large shrinkage rate when cured is mainly used.

  The integrated circuit 22 has, on its circuit formation surface, a temperature sensing element (thermistor) that detects the ambient temperature state, and temperature compensation data that compensates for temperature characteristics of the piezoelectric vibrator 12, and the piezoelectric circuit is based on the temperature compensation data. A temperature compensation circuit that corrects the vibration characteristics of the vibrator 12 according to a temperature change, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the oscillation circuit is After being output to the outside, it is used as a reference signal such as a clock signal. Here, the piezoelectric vibrator 12 and the integrated circuit 22 are connected by an upper inner layer wiring 15 and a lower inner layer wiring 25 provided in the inner layer of the substrate 2. Further, a temperature compensation data writing signal input / output terminal 27 for compensating the temperature characteristics of the piezoelectric vibrator 12 is provided on the side surfaces of the leg portions 21a and 21b.

  FIG. 2 is a sectional view of the sheet-type substrate 50 of the piezoelectric oscillator A according to the first embodiment of the present invention. The sheet-type substrate 50 includes an upper plate substrate 16 and a lower plate substrate 26. On the upper surface of the upper plate substrate 16, the piezoelectric vibrator 12, the seal ring 3, and the lid 4 constituting the piezoelectric oscillator A are provided. The lower plate-like substrate 26 includes an integrated circuit 22, legs 21 a and 21 b, and a resin 28 that covers the entire surface of the integrated circuit 22. The frame 51 and the signal input terminal 27 formed on the edge of the lower plate-like substrate 26 side outer frame 51 are configured. Further, the signal input terminal 27 formed on the outer frame 51 and the edge of the outer frame 51 on the lower plate-like substrate 26 side is formed in the disposal area 40, and when the piezoelectric oscillator A is cut into pieces. Will be discarded.

  Next, a manufacturing method of the above-described piezoelectric oscillator A will be described with reference to FIG. 2 which is the first embodiment of the present invention. First, as shown in FIG. 2, an upper plate substrate 16 having a plurality of concave openings 10 arranged in a matrix of m columns × n rows (n and m are natural numbers of 2 or more). And a sheet type substrate 50 composed of the lower plate-like substrate 26 is prepared. Next, the piezoelectric vibrator 12 and the seal ring 3 surrounding the piezoelectric vibrator 12 are mounted in each concave opening 10 of the upper plate substrate 16. Here, the upper plate-like substrate 16 is formed by laminating a plurality of insulating layers made of a ceramic material such as glass-ceramic or alumina ceramic with a conductor pattern therebetween, and each concave opening The part 10 is provided with a pair of connection pads (not shown) and a conductor layer for bonding on the upper surface thereof. Further, external terminal electrodes 9a and 9b such as input / output terminals and ground terminals are formed on the lower surface side of the bottom surface 20 of each container of the lower plate substrate 26 as shown in FIG.

  Such an upper plate-like substrate 16 and lower plate-like electrode 26 are connected to the surface of a ceramic green sheet obtained by adding an appropriate organic solvent to a ceramic material powder made of, for example, alumina ceramic and mixing them. A conductor paste to be used as pads, external terminal electrodes 9a, 9b, etc. is printed and applied in a predetermined pattern, and a plurality of these are laminated, press-molded, and then fired at a high temperature. The upper plate-like substrate 16 and the lower plate-like electrode 26 are provided with predetermined throw-away areas 40 as shown in FIG. 2 between the individual piezoelectric oscillators arranged in a matrix. Then, the seal ring 3 made of 42 alloy or the like formed on the upper plate substrate 16 having the concave opening 10 is mounted on each bonding region of the upper plate substrate 16 through a bonding material such as Au-Ni. In addition, the lower surface of the seal ring 3 is bonded to the conductor layer on the upper surface of the upper plate-like substrate 16 by heating and melting the bonding material at a high temperature, and then the piezoelectric vibrator 12 is placed inside each seal ring 3. Mount one by one. The piezoelectric vibrator 12 is electrically and mechanically connected to the upper plate substrate 16 via a conductive adhesive (bump) 13 with its vibration electrode and a corresponding mounting pad on the upper surface of the upper plate substrate 16. Installed.

  Further, in the present embodiment, a plurality of seal rings 3 are not mounted on the concave opening 10 one by one, but a plurality of seal rings 3 arranged in a matrix are connected to each other and integrated. A plurality of seal rings 3 are mounted on the corresponding concave opening 10 of the upper plate substrate 16 at a time by mounting and mounting the formed one on the upper plate substrate 16. Such a connection type seal ring 3 is formed by subjecting a metal plate made of a metal such as 42 alloy, Kovar, phosphor bronze or the like to a thickness of 150 μm to 250 μm, and performing a well-known punching process on the upper plate-shaped substrate 16. It is manufactured by drilling a plurality of through-holes corresponding to the portion 10 on a one-to-one basis.

  Next, a metal lid 4 having a plurality of cover (lid) regions corresponding to the concave openings 10 of the upper plate substrate 16 is sealed so that the piezoelectric vibrator 12 is sealed. Place and join on ring 3. As the lid 4, for example, a metal plate having a thickness of 60 μm to 100 μm made of metal such as 42 alloy, Kovar, phosphor bronze or the like is used, and the above-described upper plate-like substrate is also used for the lid 4. Similar to 16, a predetermined throw-away area 40 is provided between the cover areas.

  In this step, the lid 4 is mounted on the seal ring 3 on the upper surface of the upper plate-like substrate 16 so that the piezoelectric vibrator 12 is disposed in the concave opening 10 region corresponding to the inside of each cover (lid) region. After that, the lid 4 is attached and fixed to the upper surface of the seal ring 3 by joining the two together by well-known seam welding (resistance welding) or the like. In addition, it is preferable to perform the series of bonding steps described above in an inert gas atmosphere such as nitrogen gas or argon gas, and the space in which the piezoelectric vibrator 12 is accommodated is thereby filled with an inert gas. The possibility that the piezoelectric vibrator 12 is corroded and deteriorated by oxygen or moisture in the atmosphere can be effectively prevented.

  FIG. 3 is a schematic cross-sectional view seen from the side surface for explaining the manufacturing method according to the second embodiment of the present invention. Similar to the first embodiment, the lower plate-like substrate 26 having the container bottom surface 20 has one integrated circuit 22 and one chip-type electronic component 24 mounted inside each container bottom surface 20. The integrated circuit 22 and the chip-type electronic component 24 are electrically connected to the corresponding mounting pads on the lower surface of the lower plate-like substrate 26 by electrically and mechanically connecting the lower electrodes by a conductive adhesive (bump) 23. It is mounted on the plate substrate 26. Further, in order to protect the surface of the integrated circuit 22 and the chip-type electronic component 24, a resin 28 is applied so as to cover the entire surface of the integrated circuit 22 and the chip-type electronic component 24. And it has the temperature compensation data which compensates the temperature characteristic of the temperature sensing element (thermistor) which detects the ambient temperature state, and the piezoelectric vibrator 12, and changes the temperature of the vibration characteristic of the piezoelectric vibrator 12 based on the temperature compensation data. The bit data is input from the signal input / output terminal 27 and the temperature compensation data is written so that the frequency temperature characteristic of the piezoelectric oscillator A is adjusted to the desired frequency temperature characteristic to the integrated circuit 22 having the temperature compensation circuit that is corrected according to the above. Do. In FIG. 2 showing the first embodiment of the present invention, since the signal input / output terminal 27 is in the throw-away area 40 of the outer frame portion 51, the signal input / output terminal after data writing to the integrated circuit 22 is completed. Since 27 can be discarded, the piezoelectric oscillator A can be further downsized.

  Finally, the sheet type substrate 50 is collectively divided and cut (diced) along the outer periphery of each substrate region, whereby a plurality of piezoelectric oscillators A are manufactured simultaneously. Further, the cutting (dicing) of the sheet-type substrate 50 is performed by collectively cutting (dicing) these members from the upper plate-like substrate 16 side using a dicer or the like. The piezoelectric oscillator A is obtained at the same time.

  When the piezoelectric oscillator A is manufactured by the process as described above, it is not necessary to divide the base body 2, the seal ring 3, and the cover body 4 into individual pieces prior to the assembly of the piezoelectric oscillator A. Thus, the base body 2, the sealing 3 and the lid body 4 can be cut simultaneously. In addition, in this case, when the piezoelectric oscillator A is assembled, the sheet-type substrate 50 itself can function as a carrier. Therefore, individual pieces divided from the sheet-type substrate 50 are individually held by the carrier, or each piece is covered with a lid. There is an effect that no complicated work such as attaching the bodies 4 individually is required.

  Thereby, the assembly process of the piezoelectric oscillator A is greatly simplified, and the productivity of the piezoelectric oscillator A can be remarkably improved. It should be noted that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made without departing from the spirit of the present invention. These cases are also included in the technical scope of the present invention. Needless to say. For example, in the above-described embodiment, a plurality of seal rings 3 connected to each other are mounted on the upper plate-shaped substrate 16 and further mounted. A plurality of seal rings 3 may be individually mounted on each substrate region of the upper plate substrate 16.

  Further, in this embodiment, the discard area 40 is provided between the substrate 2 areas of the upper plate substrate 16 and the lower plate substrate 26. However, the substrate 2 area is not provided without the discard area 40. They may be arranged close to each other. This also applies to the lid body 4, and it goes without saying that these cases are also included in the technical scope of the present invention.

  FIG. 4 is a schematic cross-sectional view of a conventional piezoelectric oscillator viewed from the side. In the conventional piezoelectric oscillator 100, prior to assembling the individual piezoelectric oscillators 100, the container 101 is divided by dividing the large mother board, and the individual cover bodies are divided by dividing the large mother cover (lid body). 130 is obtained, and these two types of members are obtained in separate division steps, so that the assembly process of the piezoelectric oscillator becomes complicated and there is a problem that the productivity is not improved. It was.

1 is a schematic cross-sectional view of a piezoelectric oscillator (crystal oscillator) manufactured by a manufacturing method of the present invention as viewed from the side surface direction. It is the schematic sectional drawing seen from the side surface for explaining the manufacturing method concerning a 1st embodiment of the present invention. It is schematic sectional drawing seen from the side surface for demonstrating the manufacturing method concerning the 2nd Embodiment of this invention. It is the schematic sectional drawing which looked at the conventional piezoelectric oscillator from the side.

Explanation of symbols

A: Piezoelectric oscillator 1 ... Container 2 ... Substrate 3 ... Seal ring 4 ... Lid 9a, 9b ... External terminal electrode 10 ... Concave opening 12 ... Piezoelectric Crystal unit
13 ... Conductive adhesive (bump)
DESCRIPTION OF SYMBOLS 15 ... Upper inner layer wiring 16 ... Upper plate-shaped board | substrate 20 ... Container bottom surface 21a, 21b ... Leg part 22 ... Integrated circuit
23 ... Conductive adhesive (bump)
24: Chip-type electronic component 25: Lower inner layer wiring 26 ... Lower plate substrate 27 ... Signal input / output terminal 28 ... Resin 40 ... Throw away area 50 ... Sheet type substrate DESCRIPTION OF SYMBOLS 51 ... Outer frame part 100 ... Piezoelectric oscillator 101 ... Container 130 ... Lid body 110 ... Concave opening part 112 ... Piezoelectric vibrator (crystal oscillator)
DESCRIPTION OF SYMBOLS 120 ... Board | substrate 121 ... Leg part 122 ... Integrated circuit 124 ... Chip-type electronic component 126 ... External terminal electrode

Claims (2)

A plurality of concave openings are formed on a sheet-type substrate connected to each other on the side of the container, and each of the containers having the concave openings is mounted with a piezoelectric vibrator, and the concave openings The container having a sheet-type substrate large lid placed on the concave opening is integrally and hermetically sealed, and a pair of walls in the opposite direction to the concave opening of each container are provided. A chip-type electronic component covered with a plurality of resins including at least one integrated circuit that conducts with the piezoelectric vibrator placed through the substrate on the bottom of the container having the pair of walls is placed on the bottom of the container The signal input / output terminals used when signals are input / output from / to the integrated circuits and the frequency characteristics of the piezoelectric oscillator are adjusted to the desired frequency characteristics are provided on the side of the integrated circuit. The pair of Is on the said integrated circuit signal input and output terminal sides of the discarded white of the piezoelectric oscillator outer frame portion provided in a region opening direction edge of the container having a sheet-type substrate characterized by having a large number of piezoelectric oscillator .
Formed on sheet-type substrates that are connected to each other at the side of the container having a plurality of concave openings, each of the containers having the concave openings is mounted with a piezoelectric vibrator, and the concave openings are provided. After the container is hermetically sealed by the lid placed on the concave opening, the container having the pair of walls on the bottom surface of the container having the pair of walls opposite to the concave opening of the container A plurality of chip-type electronic components including at least one integrated circuit that conducts with the piezoelectric vibrator placed through the bottom substrate are placed, and each of the containers and the piezoelectric vibration facing the container bottom face In a method for manufacturing a piezoelectric oscillator, a piezoelectric oscillator comprising a plurality of chip-type electronic components including at least one integrated circuit that is electrically connected to a child is separated from the sheet-type substrate.

Mounting a piezoelectric vibrator on a container having each concave opening on one main surface of the sheet-type substrate in the state of the sheet-type substrate ;
A step of hermetically sealing at one time by all the concave the sheet-type substrate size of the lid to be placed the container the concave-shaped opening with an opening on the sheet-type substrate,
The bottom of the container having a pair of walls of the other main surface of the opposite direction of the sheet-type substrate with concave-shaped opening of the container, the piezoelectric placed over the substrate of the vessel bottom with said pair of walls Placing a plurality of chip-type electronic components including at least one integrated circuit in electrical communication with the vibrator;
Covering each chip-type electronic component with a resin;
Each of the integrated circuits is on the edge in the opening direction of the outer frame portion of the piezoelectric oscillator provided on the immediate outer side on the integrated circuit signal input / output terminal side of the container having the pair of walls on the integrated circuit side. the signal input and output terminal, a step of inputting and outputting a signal to, matching the frequency-temperature characteristic of the piezoelectric oscillator to a desired frequency-temperature characteristics,
Method of manufacturing a piezoelectric oscillator, characterized by comprising the piezoelectric oscillator from the steps of singulation from the sheet-type substrate.

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