JP2006129303A - Manufacturing method of piezoelectric oscillator - Google Patents

Manufacturing method of piezoelectric oscillator Download PDF

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JP2006129303A
JP2006129303A JP2004317209A JP2004317209A JP2006129303A JP 2006129303 A JP2006129303 A JP 2006129303A JP 2004317209 A JP2004317209 A JP 2004317209A JP 2004317209 A JP2004317209 A JP 2004317209A JP 2006129303 A JP2006129303 A JP 2006129303A
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oscillator
substrate
piezoelectric
integrated circuit
main surface
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Toshio Nakazawa
利夫 中澤
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Kyocera Crystal Device Corp
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Kyocera Crystal Device Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a piezoelectric oscillator providing a small-sized piezoelectric oscillator with simple handling and excellent productivity. <P>SOLUTION: The manufacturing method of the piezoelectric oscillator includes steps of: preparing a mother substrate comprising a plurality of oscillator substrate regions and marginal substrate regions and forming monitor electrode pads for measuring piezoelectric vibration elements to the oscillator substrate regions and the marginal substrate regions respectively; mounting the piezoelectric vibration elements on a front principal side of the oscillator substrate regions, measuring the frequency characteristics of the piezoelectric vibration elements, finely adjusting the frequency of the piezoelectric vibration elements and thereafter cutting off wiring patterns from the monitor electrodes formed to the marginal substrate regions of the mother substrate; placing and joining covers sealing the piezoelectric vibration elements onto the oscillator substrate regions and mounting spacer members and oscillation integrated circuit elements on a rear principal substrate of the oscillator substrate regions; and obtaining a plurality of the piezoelectric oscillators by cutting off the oscillator substrate regions along their outer circumferences. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、携帯用通信機器等の電子機器に用いられる圧電発振器の製造方法に関するものである。   The present invention relates to a method for manufacturing a piezoelectric oscillator used in an electronic device such as a portable communication device.

従来より、携帯用通信機器等の電子機器に使用する電子部品の一つとして圧電発振器が用いられている。かかる従来の圧電発振器の一つとして、例えば図5に示す如く、内部に水晶振動素子(図示せず)が収容されている第1の容器体23を、キャビティ部25内に前記水晶振動素子の振動に基づいて発振出力を制御する集積回路素子26やコンデンサ等の電子部品素子(図示せず)が収容されている第2の容器体21上に取着させた構造のものが知られており、かかる温度補償型水晶発振器をマザーボード等の外部配線基板上に載置させた上、第2の容器体21の下面に設けられている外部端子(図示せず)を外部配線基板の配線に半田接合することにより外部配線基板上に実装される。   Conventionally, a piezoelectric oscillator has been used as one of electronic components used in electronic devices such as portable communication devices. As one of such conventional piezoelectric oscillators, for example, as shown in FIG. 5, a first container body 23 in which a crystal resonator element (not shown) is housed is disposed in a cavity portion 25 of the crystal resonator element. An integrated circuit element 26 that controls oscillation output based on vibration and a structure attached to a second container body 21 in which an electronic component element (not shown) such as a capacitor is accommodated are known. The temperature compensated crystal oscillator is placed on an external wiring board such as a mother board, and an external terminal (not shown) provided on the lower surface of the second container body 21 is soldered to the wiring of the external wiring board. It is mounted on the external wiring board by bonding.

尚、第1の容器体23や第2の容器体21は、通常、セラミック材料によって形成されており、その内部や表面には配線導体が形成され、従来周知のセラミックグリーンシ一ト積層法等を採用することにより製作される。   Note that the first container body 23 and the second container body 21 are usually formed of a ceramic material, and a wiring conductor is formed inside or on the surface thereof, and a conventionally known ceramic green sheet lamination method or the like is used. It is manufactured by adopting.

また、前記集積回路素子26の内部には、水晶振動素子の温度特性に応じて作成された温度補償データに基づいて水晶発振器の発振出力を補正するための温度補償回路が設けられており、温度補償型水晶発振器を組み立てた後、上述の温度補償データを集積回路素子26のメモリ内に格納すべく、第2の容器体21の下面や外側面等には温度補償データ書込用の書込制御端子27が設けられていた。この書込制御端子27に温度補償データ書込装置のプローブ針を当てて集積回路素子26内のメモリに温度補償データを入力することにより、温度補償データが集積回路素子26のメモリ内に格納される。   The integrated circuit element 26 is provided with a temperature compensation circuit for correcting the oscillation output of the crystal oscillator based on the temperature compensation data created according to the temperature characteristics of the crystal resonator element. After assembling the compensation type crystal oscillator, in order to store the above-mentioned temperature compensation data in the memory of the integrated circuit element 26, writing for temperature compensation data writing is performed on the lower surface and the outer surface of the second container body 21. A control terminal 27 was provided. The temperature compensation data is stored in the memory of the integrated circuit element 26 by applying the probe needle of the temperature compensation data writing device to the write control terminal 27 and inputting the temperature compensation data to the memory in the integrated circuit element 26. The

このような圧電発振器については、下記のような先行技術文献が開示されている。   The following prior art documents are disclosed about such a piezoelectric oscillator.

特許第2960374号公報Japanese Patent No. 2960374

なお、出願人は前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献を、本件出願時までに発見するに至らなかった。   The applicant has not found any prior art documents related to the present invention other than the prior art documents specified by the prior art document information described above by the time of filing of the present application.

しかしながら、上述した従来の圧電発振器においては、通常、第1の容器体23と第2の容器体21だけを“複数個取り″の手法によって製作し、分割後に得られた個片(第1の容器体23、第2の容器体21)に水晶振動素子や集積回路素子26を個別に搭載した上、両者を接合して製品を組み立てていた。   However, in the above-described conventional piezoelectric oscillator, usually, only the first container body 23 and the second container body 21 are manufactured by the “multiple picking” technique, and the individual pieces (the first pieces obtained after the division) A crystal resonator element and an integrated circuit element 26 are individually mounted on the container body 23 and the second container body 21), and both are joined to assemble a product.

ところが、第2の容器体21を個片に分割した後で集積回路素子26や第1の容器体23等を第2の容器体21上に搭載する場合、その作業が完了するまでの間、第2の容器体21を個々にキャリア等で保持しておく必要があり、組み立て作業が煩雑である上に、キャリア等の製造設備が別途必要になり、これによっても圧電発振器の生産性が低下するという欠点を有していた。   However, when the integrated circuit element 26, the first container body 23, and the like are mounted on the second container body 21 after the second container body 21 is divided into pieces, until the operation is completed, It is necessary to individually hold the second container body 21 with a carrier or the like, and the assembling work is complicated, and additional manufacturing equipment such as a carrier is required, which also reduces the productivity of the piezoelectric oscillator. Had the disadvantage of

また、しかし、上述した圧電発振器において、その平面形状が7mm×5mmから5mm×3mm、さらに、3mm×2mmと小型化され、それに伴い集積回路素子26の小型化が強く求められる。その結果、集積回路素子26の配置領域が小さくなり、各電極パッド28の間隔も狭くしなくてはならず、接合信頼性が低下して、さらに、電極パッド28に接続する引き回し配線導体29の自由度が制約を受けてしまうという問題があった。   However, in the above-described piezoelectric oscillator, the planar shape is reduced from 7 mm × 5 mm to 5 mm × 3 mm, and further 3 mm × 2 mm, and accordingly, the integrated circuit element 26 is strongly required to be reduced in size. As a result, the arrangement region of the integrated circuit element 26 is reduced, the interval between the electrode pads 28 must be reduced, the bonding reliability is lowered, and the routing wiring conductor 29 connected to the electrode pad 28 is further reduced. There was a problem that the degree of freedom was restricted.

更に、水晶振動素子24の固有温度特性に応じて、集積回路素子26の発振制御により発振出力を平坦化させるために、集積回路素子26を配置する前に、予め水晶振動素子2 4の固有の温度特性を測定しておく必要がある。この電極パッドの小型化によってこの測定を行うことも困難となり、生産性が大きく低下してしまう。   Further, in order to flatten the oscillation output by the oscillation control of the integrated circuit element 26 according to the specific temperature characteristic of the crystal vibrating element 24, before the integrated circuit element 26 is arranged, the specific characteristic of the crystal vibrating element 24 is previously set. It is necessary to measure temperature characteristics. It is difficult to perform this measurement due to the miniaturization of the electrode pad, and the productivity is greatly reduced.

本発明は上記欠点に鑑み案出されたもので、その目的は、取り扱いが簡便で、かつ、生産性にも優れた小型の圧電発振器を得ることができる圧電発振器の製造方法を提供することにある。   The present invention has been devised in view of the above-mentioned drawbacks, and an object of the present invention is to provide a method of manufacturing a piezoelectric oscillator capable of obtaining a small piezoelectric oscillator that is easy to handle and excellent in productivity. is there.

本発明の圧電発振器は、矩形且つ平板形状の発振器基板の一方の主面の辺縁部には直立した側壁部が形成し、この側壁部内壁面及び一方の主面に囲まれた凹部空間に圧電振動素子を搭載し、凹部空間を蓋体により気密封止した後、発振器基板の他方の主面側に、圧電振動素子と電気的に接続する集積回路素子及びチップ型電子素子を配置し、発振器基板の他方の主面の辺縁部に、外部接続用電極端子が形成された基体を形成した後、集積回路素子に外部より制御信号を入出力し圧電発振器の仕様数値を所望の数値に合わせる圧電発振器の製造方法において、
発振器基板領域の外周側面に捨代基板領域を一体形成し、この発振器基板領域及び捨代基板領域の他方の主面のそれぞれに、圧電振動素子の表裏主面上に形成した励振電極膜と電気的に接続した1対のモニタ電極パッドのうち1個ずつを形成し、且つ捨代基板領域を外周に形成した発振器基板領域が複数個マトリックスに配列されて一体に構成されている母基板を形成する工程と、
各々の発振器基板領域の一方の主面の辺縁部及び捨代基板領域の一方の主面に形成した側壁部と基板発振器領域の一方の主面とから形成される凹部空間内に圧電振動素子を搭載し、側壁部の頂部に母基板の個々の発振器基板領域及び捨代基板領域に相似する外周形状の複数個の蓋領域を一体で有する母蓋体を配置し、個々の凹部空間を母蓋体で気密封止する工程と、
モニタ電極パッドから各々の圧電振動素子の諸特性を測定し、所望の特性数値にある圧電振動素子が搭載されている母基体の個々の発振器基板領域の他方の主面に各々集積回路素子を配置固着し、更に発振器基板領域の他方の主面に外部接続用電極パッドを形成したスペーサ部材を配置固着し、集積回路素子の各外部接続端子、圧電振動素子及び外部接続用電極パッドとを電気的に接続する工程と、
一体化した母基板、母蓋体を、基体発振器領域と基体捨代基板領域との境界線に沿って、個々の圧電発振器に切断分割する工程とを具備することを特徴とする圧電発振器の製造方法である。
In the piezoelectric oscillator of the present invention, an upstanding side wall is formed at the edge of one main surface of a rectangular and flat oscillator substrate, and piezoelectric is formed in the inner wall of the side wall and the recessed space surrounded by the one main surface. After mounting the vibration element and hermetically sealing the recessed space with a lid, an integrated circuit element and a chip-type electronic element that are electrically connected to the piezoelectric vibration element are arranged on the other main surface side of the oscillator substrate, and the oscillator After forming a base on which the external connection electrode terminal is formed at the edge of the other main surface of the substrate, control signals are input / output from / to the integrated circuit element to match the specified numerical values of the piezoelectric oscillator to the desired numerical values. In the manufacturing method of the piezoelectric oscillator,
A replacement substrate region is integrally formed on the outer peripheral side surface of the oscillator substrate region, and an excitation electrode film and an electric electrode formed on the front and back main surfaces of the piezoelectric vibration element are respectively formed on the other main surface of the oscillator substrate region and the replacement substrate region. Each of a pair of monitor electrode pads connected in series is formed, and a plurality of oscillator substrate regions each having a discarded substrate region formed on the outer periphery are arranged in a matrix to form a single substrate. And a process of
Piezoelectric vibration element in a recessed space formed by a side wall portion formed on one main surface of each of the oscillator substrate regions and one main surface of the discarded substrate region and one main surface of the substrate oscillator region Is mounted on the top of the side wall, and a mother lid body integrally including a plurality of outer peripheral lid areas similar to the individual oscillator board areas and discarded board areas of the mother board is disposed, and each concave space is formed as a mother board. A process of hermetically sealing with a lid,
Various characteristics of each piezoelectric vibration element are measured from the monitor electrode pad, and an integrated circuit element is arranged on the other main surface of each oscillator substrate region of the mother substrate on which the piezoelectric vibration element having a desired characteristic value is mounted. Further, a spacer member in which an external connection electrode pad is formed on the other main surface of the oscillator substrate region is disposed and fixed, and each external connection terminal of the integrated circuit element, the piezoelectric vibration element, and the external connection electrode pad are electrically connected. Connecting to
And a step of cutting and dividing the integrated mother substrate and mother lid into individual piezoelectric oscillators along a boundary line between the base oscillator region and the base discarding substrate region. Is the method.

スペーサ部材が金属ポストから成ることを特徴とする前記記載の圧電発振器の製造方法でもある。   The method of manufacturing a piezoelectric oscillator as described above, wherein the spacer member is made of a metal post.

スペーサ部材が各発振器基板領域の四隅部に配置されていることを特徴とするに前記記載の圧電発振器の製造方法でもある。   The above-described method for manufacturing a piezoelectric oscillator is characterized in that the spacer members are arranged at the four corners of each oscillator substrate region.

母基板上に搭載した集積回路素子が樹脂材によってポッティングされていることを特徴と前記記載の圧電発振器の製造方法でもある。   The integrated circuit element mounted on the mother board is potted with a resin material, and the piezoelectric oscillator manufacturing method is also described above.

本発明によれば、発振用集積回路素子を母基板上に搭載した後で母基板を分割するようにしたことから、製造工程中、母基板自体が発振用集積回路素子や水晶振動素子が収納されている容器体を搭載するためのキャリアとして機能することとなり、母基板の分割によって得られた個々の実装用基体をキャリアで保持するといった煩雑な作業が一切不要となる。これにより、圧電発振器の生産性を向上させることができる。   According to the present invention, since the mother board is divided after the oscillation integrated circuit element is mounted on the mother board, the mother board itself accommodates the oscillation integrated circuit element and the crystal vibration element during the manufacturing process. It functions as a carrier for mounting the container body that is mounted, and there is no need for complicated operations such as holding individual mounting substrates obtained by dividing the mother board with the carrier. Thereby, the productivity of the piezoelectric oscillator can be improved.

更にまた本発明によれば、スペーサ部材が各発振器基板領域の四隅部に配置させておくことにより、分割後、それぞれが端子として使用することができる為、生産性を向上させることが可能となる。   Furthermore, according to the present invention, since the spacer members are arranged at the four corners of each oscillator substrate region, each can be used as a terminal after division, so that productivity can be improved. .

更にまた本発明によれば、捨代基板領域に位置する書込ポストの延在部を母基板の捨代基板領域に埋設させておいたビア導体と接続させておくことにより、書込ポストの延在部を母基板の捨代基板領域に強固に被着させておくことができる。従って、線膨張係数の相違等に起因した書込ポスト延在部の剥離等が有効に防止される。   Furthermore, according to the present invention, the extension portion of the write post located in the replacement substrate region is connected to the via conductor embedded in the replacement substrate region of the mother substrate, so that the write post The extending portion can be firmly attached to the discarded substrate region of the mother substrate. Therefore, peeling of the writing post extension due to a difference in linear expansion coefficient or the like is effectively prevented.

更にまた本発明によれば、工程中において容器体を取着させる前に、母基板上に搭載した発振用集積回路素子の実装面を樹脂材によって被覆することにより、母基板に対する発振用集積回路素子の固着強度を向上させることができるとともに、発振用集積回路素子の回路形成面を良好に被覆し、回路形成面の電子回路が大気中の水分等によって腐食されるのを有効に防止し、圧電発振器の信頼性を高く維持することができる。   Furthermore, according to the present invention, before mounting the container body in the process, the mounting surface of the oscillation integrated circuit element mounted on the mother substrate is covered with a resin material, so that the oscillation integrated circuit on the mother substrate is covered. As well as improving the fixing strength of the element, it satisfactorily covers the circuit forming surface of the oscillation integrated circuit element, effectively preventing the electronic circuit on the circuit forming surface from being corroded by moisture in the atmosphere, High reliability of the piezoelectric oscillator can be maintained.

以下、本発明の実施例を添付図面に基づいて詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

図1は本発明の製造方法によって製作され圧電発振器の一部分解斜視図であり、これらの図に示す圧電発振器は、主面形状が矩形状の容器体1の下面に外部接続用端子として使用する複数個のスペーサ部材9及び発振用集積回路素子7(図1には図示しない)が固着・搭載されており、容器体1の上面に形成した凹部空間内には、水晶振動素子5が収容されている構造を有している。   FIG. 1 is a partially exploded perspective view of a piezoelectric oscillator manufactured by the manufacturing method of the present invention. The piezoelectric oscillator shown in these drawings is used as an external connection terminal on the lower surface of a container body 1 having a rectangular main surface shape. A plurality of spacer members 9 and an oscillation integrated circuit element 7 (not shown in FIG. 1) are fixed and mounted, and a quartz resonator element 5 is accommodated in a recessed space formed on the upper surface of the container body 1. Has the structure.

図2は、スペーサ部材9及び集積回路素子を搭載する方向から見た圧電発振器の製造工程中における平面図を示している。図1に記載内容を含め、前記容器体1は、例えば、ガラスーセラミック、アルミナセラミックス等のセラミック材料から成る基板2(製造工程中の発振器基板領域と同意)と、42アロイやコバール,リン青銅等の金属から成るシールリング3と、シールリング3と同様の金属から成る蓋体4とから成り、前記基板2の上面にシールリング3を取着させ、その上面に蓋体4を載置・固定させることによって容器体1が構成され、シールリング3の内側に位置する基板2の上面に水晶振動素子5が実装される。   FIG. 2 is a plan view of the piezoelectric oscillator during the manufacturing process as viewed from the direction in which the spacer member 9 and the integrated circuit element are mounted. Including the contents shown in FIG. 1, the container body 1 includes, for example, a substrate 2 made of a ceramic material such as glass-ceramic and alumina ceramic (consent to the oscillator substrate region in the manufacturing process), 42 alloy, Kovar, phosphor bronze. And a lid 4 made of the same metal as the seal ring 3, and the seal ring 3 is attached to the upper surface of the substrate 2, and the lid 4 is placed on the upper surface. The container body 1 is configured by being fixed, and the crystal resonator element 5 is mounted on the upper surface of the substrate 2 located inside the seal ring 3.

前記容器体1は、その内部、具体的には、基板2の上面とシールリング3の内面と蓋体4の下面とで囲まれる空間内に水晶振動素子5を収容して気密封止するためのものであり、基板2の上面には水晶振動素子5の表裏主面上に形成した励振電極膜に接続される一対の素子接続用電極パッドが、基板2の下面にはスペーサ部材9がそれぞれ設けられ、これらのパッドや電極は基板2表面の配線パターンや基板2内部に埋設されているビアホール導体等を介して、対応するもの同士、相互に電気的に接続されている。   The container body 1 is for hermetically sealing the quartz resonator element 5 in its interior, specifically, in a space surrounded by the upper surface of the substrate 2, the inner surface of the seal ring 3, and the lower surface of the lid body 4. A pair of element connection electrode pads connected to the excitation electrode films formed on the front and back main surfaces of the crystal resonator element 5 are provided on the upper surface of the substrate 2, and a spacer member 9 is provided on the lower surface of the substrate 2. These pads and electrodes are electrically connected to each other through wiring patterns on the surface of the substrate 2 and via hole conductors embedded in the substrate 2.

一方、前記容器体1の内部に収容される水晶振動素子5は、所定の結晶軸でカットした水晶片の両主面に一対の励振電極膜を被着・形成してなり、外部からの変動電圧が一対の励振電極膜を介して水晶片に印加されると、所定の周波数で厚みすべり振動を起こす。前記水晶振動素子5は、一対の励振電極膜を、導電性接着剤を介して基板2上面の対応する素子接続用電極パッドに電気的に接続させることによって基板2の上面に固着搭載され、これによって水晶振動素子5と容器体1との電気的接続及び機械的接続が同時になされる。   On the other hand, the crystal resonator element 5 accommodated in the container body 1 is formed by depositing and forming a pair of excitation electrode films on both main surfaces of a crystal piece cut along a predetermined crystal axis, so that the fluctuation from the outside When a voltage is applied to the crystal piece via a pair of excitation electrode films, thickness shear vibration is caused at a predetermined frequency. The crystal resonator element 5 is fixedly mounted on the upper surface of the substrate 2 by electrically connecting a pair of excitation electrode films to corresponding element connection electrode pads on the upper surface of the substrate 2 through a conductive adhesive. Thus, the electrical connection and the mechanical connection between the crystal resonator element 5 and the container body 1 are simultaneously made.

ここで容器体1の蓋体4を容器体1の配線導体8を介して後述するグランド端子用のスペーサ部材9に接続させておけば、その使用時、金属から成る蓋体4が基準電位に接続されてシールド機能が付与されることとなるため、水晶振動素子5や発振用集積回路素子7を外部からの不要な電気的作用より良好に保護することができる。従って、容器体1の蓋体4は容器体1の配線導体8を介してグランド端子用のスペーサ部材9に接続させておくことが好ましい。   Here, if the lid body 4 of the container body 1 is connected to a spacer member 9 for a ground terminal, which will be described later, via the wiring conductor 8 of the container body 1, the lid body 4 made of metal is set to the reference potential during use. Since the shield function is provided by being connected, the crystal resonator element 5 and the oscillation integrated circuit element 7 can be protected better than unnecessary electrical effects from the outside. Therefore, the lid body 4 of the container body 1 is preferably connected to the ground terminal spacer member 9 via the wiring conductor 8 of the container body 1.

前記容器体1は、その下面の四隅角部にスペーサ部材9を配置させ、4つの外部接続用端子(電源電圧端子、グランド端子、発振出力端子、発振制御端子)として使用する。下面の中央域にはフリップチップ型の発振用の集積回路素子7が配設されている。前記容器体1の下面に設けられている4つの外部接続用端子に用いるスペーサ部材9は、圧電発振器をマザーボード等の外部配線基板に接続するための端子として機能するものであり、圧電発振器を外部配線基板上に搭載する際、外部配線基板の回路配線と半田等の導電性接合材を介して電気的に接続されるようになっている。   The container body 1 has spacer members 9 arranged at the four corners on the lower surface thereof, and is used as four external connection terminals (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control terminal). A flip-chip type integrated circuit element 7 for oscillation is disposed in the central area of the lower surface. The spacer member 9 used for the four external connection terminals provided on the lower surface of the container body 1 functions as a terminal for connecting the piezoelectric oscillator to an external wiring board such as a mother board. When mounted on a wiring board, it is electrically connected to the circuit wiring of the external wiring board via a conductive bonding material such as solder.

また、前記容器体1の下面に設けられる複数個のスペーサ部材9は、外部配線基板と容器体1との間に、発振用集積回路素子7を配置させるのに必要な所定の間隔を確保する機能も有するようになっている。更に、上述した容器体1の下面には、複数個の集積回路素子接続用電極パッドが設けられており、これら集積回路素子接続用電極パッドに集積回路素子7の外部接続端子をAuバンプや半田、異方性導電接着材等の導電性接合材を介して電気的・機械的に接続させることによって集積回路素子7が容器体下面の所定位置に取着される。   Further, the plurality of spacer members 9 provided on the lower surface of the container body 1 ensure a predetermined interval necessary for arranging the oscillation integrated circuit element 7 between the external wiring board and the container body 1. It also has a function. Furthermore, a plurality of integrated circuit element connection electrode pads are provided on the lower surface of the container body 1 described above, and external connection terminals of the integrated circuit element 7 are connected to these integrated circuit element connection electrode pads by Au bumps or solder. The integrated circuit element 7 is attached to a predetermined position on the lower surface of the container body by being electrically and mechanically connected through a conductive bonding material such as an anisotropic conductive adhesive.

前記発振用集積回路素子7は、その回路形成面(下面)に、周囲の温度状態を検知する感温素子(サーミスタ)、水晶振動素子5の温度特性を補償する温度補償データを格納するメモリ、メモリ内の温度補償データに基づいて水晶振動素子5の振動特性を温度変化に応じて補正する温度補償回路、該温度補償回路に接続されて所定の発振出力を生成する発振回路等が設けられており、該発振回路で生成された発振出力は、外部に出力された後、例えば、クロック信号等の基準信号として利用される。   The oscillation integrated circuit element 7 has, on its circuit forming surface (lower surface), a temperature sensing element (thermistor) for detecting the ambient temperature state, a memory for storing temperature compensation data for compensating the temperature characteristics of the crystal resonator element 5, A temperature compensation circuit that corrects the vibration characteristics of the crystal resonator element 5 according to a temperature change based on the temperature compensation data in the memory, an oscillation circuit that is connected to the temperature compensation circuit and generates a predetermined oscillation output, and the like are provided. The oscillation output generated by the oscillation circuit is output to the outside and then used as a reference signal such as a clock signal.

尚、上述した容器体1下面とスペーサ部材9により形成された集積回路素子7搭載空間にはエポキシ樹脂等から成る樹脂材14が介在されている。これにより、容器体1に対する集積回路素子7の固着強度が向上されるとともに、発振用集積回路素子7の回路形成面が樹脂材14によって良好に被覆され、回路形成面の電子回路が大気中の水分等によって腐食されるのを有効に防止することができる。   A resin material 14 made of epoxy resin or the like is interposed in the space for mounting the integrated circuit element 7 formed by the lower surface of the container body 1 and the spacer member 9 described above. Thereby, the fixing strength of the integrated circuit element 7 to the container body 1 is improved, the circuit forming surface of the oscillation integrated circuit element 7 is satisfactorily covered with the resin material 14, and the electronic circuit on the circuit forming surface is in the atmosphere. Corrosion due to moisture or the like can be effectively prevented.

次に上述した圧電発振器の製造方法について図2を用いて説明する。ここで、図3(a),図3(b),図4(a)及び図4(b)は、この順番で本発明における製造方法の実施例を説明するための斜視図である。   Next, a manufacturing method of the above-described piezoelectric oscillator will be described with reference to FIG. Here, FIG. 3 (a), FIG. 3 (b), FIG. 4 (a) and FIG. 4 (b) are perspective views for explaining an embodiment of the manufacturing method according to the present invention in this order.

(工程A)
まず、図3(a)に示す如く、最終製品形態において水晶振動素子5が収納される容器体1となる発振器基板領域Aとその周囲に一体形成した捨代基板領域Bより構成する母基板10とを準備する。尚、前記母基板10は、ガラスーセラミック等のセラミック材料から成る場合、例えば、セラミック材料粉末に適当な有機溶剤等を添加・混合して得たセラミックグリーンシ一トの表面等に配線導体となる導体ペーストを従来周知のスクリーン印刷等によって塗布するとともに、これを複数枚積層してプレス成形した後、高温で焼成することによって製作される。図3(b)は、図3(a)を裏側から見た斜視図であるが、この発振器基板領域A及び捨代基板領域Bの裏主面のそれぞれに、圧電振動素子5の表裏主面上に形成した励振電極膜と電気的に接続する1対のモニタ電極パッド11のうち1個ずつを形成する。
(Process A)
First, as shown in FIG. 3A, in the final product form, a mother board 10 constituted by an oscillator board area A to be a container body 1 in which the crystal resonator element 5 is housed and an abandon board area B integrally formed therearound. And prepare. When the mother substrate 10 is made of a ceramic material such as glass-ceramic, for example, a wiring conductor and a surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent or the like to the ceramic material powder. The conductive paste is applied by screen printing or the like known in the art, and a plurality of the pastes are laminated and press-molded, and then fired at a high temperature. FIG. 3B is a perspective view of FIG. 3A viewed from the back side. The front and back main surfaces of the piezoelectric vibration element 5 are respectively formed on the back main surfaces of the oscillator substrate area A and the discarded substrate area B. One of the pair of monitor electrode pads 11 electrically connected to the excitation electrode film formed above is formed.

(工程B)
前記母基板10は、矩形状の発振器基板領域Aを相互に隣接させて複数個ずつ配置させてなり、その表主面には、水晶振動素子5を各々の発振器基板領域Aに形成した凹部空間内に搭載する。前記水晶振動素子5は、一対の励振用電極膜を導電性接着剤を介して凹部空間内底面(図1の基板2の上面と同意)の対応する素子接続用電極パッドに電気的に接続させることによって各々の凹部空間内に搭載され、これによって水晶振動素子5と発振器基板領域Aとの電気的接続及び機械的接続が同時になされる。次に、図3(b)に示す如く、前記モニタ電極パッド11に周波数測定装置を接続し、搭載した水晶振動素子5の周波数測定を行い、イオンビーム等を使用することにより、水晶振動素子5の励振用電極膜の膜厚を調整することにより、該水晶振動素子5の発振周波数を所望の周波数へ微調整する。
(Process B)
The mother substrate 10 is formed by arranging a plurality of rectangular oscillator substrate regions A adjacent to each other, and a concave space in which a crystal resonator element 5 is formed in each oscillator substrate region A on the front main surface thereof. Install in. In the crystal resonator element 5, a pair of excitation electrode films are electrically connected to corresponding element connection electrode pads on the inner bottom surface of the recess space (the same as the upper surface of the substrate 2 in FIG. 1) via a conductive adhesive. Accordingly, the quartz resonator element 5 and the oscillator substrate region A are electrically connected and mechanically connected at the same time. Next, as shown in FIG. 3 (b), a frequency measuring device is connected to the monitor electrode pad 11, the frequency of the mounted crystal vibrating element 5 is measured, and an ion beam or the like is used. By adjusting the film thickness of the excitation electrode film, the oscillation frequency of the crystal resonator element 5 is finely adjusted to a desired frequency.

(工程C)
水晶振動素子5が搭載されている発振器基板領域Aに形成した凹部空間開口部に形成した42アロイやコバール,リン青銅等の金属から成るシールリング3上面に、該シールリング3と同様の金属から成る蓋体4を配置する。尚、シールリング3及び蓋体4は、従来周知の金属加工法を採用し、42アロイ等の金属を所定形状に成形することによって製作され、前記シールリング3は、発振器基板領域Aの最上面に予め被着させておいた導体層にロウ付けすることによって発振器基板領域Aに固定される。また上述のように、シールリング3と蓋体4とを抵抗溶接によって接合する場合、シールリング3や蓋体4の表面には予めNiメッキ層やAuメッキ層等が被着される。
(Process C)
From the same metal as the seal ring 3 on the upper surface of the seal ring 3 made of a metal such as 42 alloy, Kovar, phosphor bronze or the like formed in the recess space opening formed in the oscillator substrate region A on which the crystal resonator element 5 is mounted. The lid body 4 is arranged. The seal ring 3 and the lid 4 are manufactured by adopting a conventionally known metal processing method and molding a metal such as 42 alloy into a predetermined shape. The seal ring 3 is the uppermost surface of the oscillator substrate region A. Is fixed to the oscillator substrate region A by brazing to a conductor layer previously deposited on the substrate. Further, as described above, when the seal ring 3 and the lid 4 are joined by resistance welding, a Ni plating layer, an Au plating layer, or the like is previously deposited on the surfaces of the seal ring 3 and the lid 4.

次に図4(a)に開示のように、母基板10の各々の発振器基板領域A内で、スペーサ部材9及び発振回路を内蔵した集積回路素子7を搭載する。尚、集積回路素子7は発振器基板領域A裏面に形成したモニタ用電極パッド11のうちの1つの上に配置する形態で搭載している。前記集積回路素子7は、先に述べたように、その接合側の面に複数個の接続端子を有した矩形状のフリップチップ型集積回路素子が用いられる。前記集積回路素子7は、その接合面に設けられている複数個の接続端子が、各々の発振器基板領域A内の対応する集積回路素子接続用電極パッドに半田等の導電性接合材を介して当接されるようにして母基板10の裏面に載置され、しかる後、前記導電性接合材を熱の印加等によって溶融させ、接続端子及び集積回路接続用電極パッドを、導電性接合材を介して接合することによって集積回路素子7が母基板10上に固着・搭載される。このような発振器基板領域Aの裏面には複数個のスペーサ接合用電極パッドが設けられており、これらのスペーサ接合用電極パッドを対応するスペーサ部材11に半田等の導電性接合材を介して当接させ、しかる後、前記導電性接合材を熱の印加等によって溶融させるとともに、スペーサ接合用電極パッド及びスペーサ部材11を導電性接合材を介して接合することによって、各発振器基板領域A裏面に固着される。   Next, as disclosed in FIG. 4A, the integrated circuit element 7 incorporating the spacer member 9 and the oscillation circuit is mounted in each oscillator substrate region A of the mother substrate 10. The integrated circuit element 7 is mounted on one of the monitor electrode pads 11 formed on the back surface of the oscillator substrate area A. As described above, the integrated circuit element 7 is a rectangular flip-chip type integrated circuit element having a plurality of connection terminals on the joint-side surface. In the integrated circuit element 7, a plurality of connection terminals provided on the bonding surface thereof are connected to corresponding integrated circuit element connection electrode pads in each oscillator substrate region A via a conductive bonding material such as solder. The conductive bonding material is placed on the back surface of the mother board 10 so as to come into contact, and then the conductive bonding material is melted by application of heat or the like, and the connection terminals and the integrated circuit connecting electrode pads are bonded to the conductive bonding material. The integrated circuit element 7 is fixed and mounted on the mother board 10 by bonding through the base board 10. A plurality of spacer bonding electrode pads are provided on the back surface of the oscillator substrate region A, and the spacer bonding electrode pads are applied to the corresponding spacer member 11 via a conductive bonding material such as solder. Then, the conductive bonding material is melted by applying heat or the like, and the electrode pad for spacer bonding and the spacer member 11 are bonded to each other through the conductive bonding material. It is fixed.

(工程D)
そして最後に、図4(b)に示す如く、前記母基板10を各発振器基板領域Aの外周に沿って切断することにより、各々の発振器基板領域A及び各々の捨代基板領域Bを分割する。前記母基板10の切断はダイサーを用いたダイシング等によって行なわれ、かかる切断工程を経て母基板10が個々の発振器基板領域A毎(容器体1)に分割される。また本実施形態においては、集積回路素子7を母基板10上に搭載した後で母基板10を分割するようにしたことから、集積回路素子7の搭載時、母基板10自体が集積回路素子7の搭載用のキャリアとして機能することから、従来例の項で説明したような集積回路素子搭載用のキャリアは不要であり、母基板10の分割によって得られた個々の容器体個片をキャリアに搭載するといった煩雑な作業も一切不要となる。これによって圧電発振器の生産性を高く維持することができる。尚、本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。
(Process D)
Finally, as shown in FIG. 4B, the mother board 10 is cut along the outer periphery of each oscillator board area A to divide each oscillator board area A and each discarded board area B. . The mother substrate 10 is cut by dicing using a dicer or the like, and the mother substrate 10 is divided into individual oscillator substrate regions A (containers 1) through such a cutting process. In the present embodiment, since the mother board 10 is divided after the integrated circuit element 7 is mounted on the mother board 10, the mother board 10 itself is integrated with the integrated circuit element 7 when the integrated circuit element 7 is mounted. Therefore, the carrier for mounting an integrated circuit element as described in the section of the conventional example is unnecessary, and individual container body pieces obtained by dividing the mother board 10 are used as carriers. No complicated work such as mounting is required. As a result, the productivity of the piezoelectric oscillator can be kept high. In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

上述した実施形態においては、蓋体4をシールリング3を介して発振器基板領域Aの凹部空間開口部に接合させるようにしたが、これに代えて、発振器基板領域Aの凹部空間開口部に接合用のメタライズパターンを形成しておき、このメタライズパターンに対して蓋体4をダイレクトに溶接するようにしても構わない。また、上述した実施形態においては、一体形成した発振器基板領域Aの凹部空間開口部に直接シールリング3を形成させるようにしたが、これに代えて、発振器基板領域Aを平板状の基板の上面に基板と同材質のセラミック材料等から成る枠体を固着させる形態で形成した上、この枠体の上面にシールリング3を取着させるようにしても構わない。   In the embodiment described above, the lid 4 is joined to the recess space opening in the oscillator substrate region A via the seal ring 3. Instead, the lid 4 is joined to the recess space opening in the oscillator substrate region A. Alternatively, a metallized pattern may be formed and the lid 4 may be directly welded to the metallized pattern. In the above-described embodiment, the seal ring 3 is directly formed in the recessed space opening of the integrally formed oscillator substrate region A. Instead, the oscillator substrate region A is formed on the upper surface of the flat substrate. In addition, a frame made of the same ceramic material as that of the substrate may be fixed, and the seal ring 3 may be attached to the upper surface of the frame.

更に、上述した実施形態においては、例えば、シールリング3を用いて蓋体4を容器体1上に取り付けるようにしているが、これに代えて容器体上面のAu−Sn等の接合用導体に対して蓋体4を直接、接合することにより蓋体4を容器体1上に取り付けるようにしても構わず、この場合も本発明の技術的範囲に含まれることは言うまでも無い。また更に、圧電発振器を温度補償発振器として使用する為に、前記容器体1の下面に前記複数の書込ポストを設け、前記複数個の書込ポストは容器体の平行な2辺に沿って2個ずつ、前記2辺と平行な中心線に対して線対称に配置されており、その一端は容器体の配線導体を介して集積回路素子7の接続パッドと電気的に接続されているようにしても構わない。又、上記実施例では母基板の個々の発振器基板領域に形成した凹部空間開口部に蓋体を被せ気密封止する工程を開示したが、個々の凹部空間開口部に蓋体をそれぞれ配置するのではなく、個々の該発振器基板領域及び該捨代基板領域に相似する外周形状の複数個の蓋領域を一体で有するような母蓋体を、母基板の主面へ被せ個々に封止し母基板と一体化した後に母基板と一緒に所望の切断箇所で切断する工程でも構わない。   Further, in the embodiment described above, for example, the lid 4 is attached on the container body 1 using the seal ring 3, but instead of this, a bonding conductor such as Au—Sn on the upper surface of the container body is used. On the other hand, the lid body 4 may be directly attached to the container body 1 by bonding, and this case is also included in the technical scope of the present invention. Furthermore, in order to use a piezoelectric oscillator as a temperature compensated oscillator, the plurality of writing posts are provided on the lower surface of the container body 1, and the plurality of writing posts are arranged along two parallel sides of the container body. Each is arranged symmetrically with respect to the center line parallel to the two sides, and one end thereof is electrically connected to the connection pad of the integrated circuit element 7 through the wiring conductor of the container body. It doesn't matter. In the above embodiment, the process of covering the recess space openings formed in the individual oscillator substrate regions of the mother board with the lids and sealing hermetically is disclosed. However, the lids are respectively arranged in the respective recess space openings. Rather, a mother lid that integrally has a plurality of outer peripherally shaped lid regions similar to the individual oscillator substrate regions and the discarded substrate regions is placed on the main surface of the mother substrate and individually sealed. After the integration with the substrate, it may be a step of cutting at a desired cutting location together with the mother substrate.

更にまた、前記集積回路素子7の実装面が絶縁性樹脂によって被覆しても構わず、この場合も本発明の技術的範囲に含まれることは言うまでもない。また、更に工程Bにおいて、捨代基板領域Bに形成されているモニタ用電極パッド11からの配線パターンを切断しているが、工程Cにおいて、蓋体4を配置接合後、再度水晶振動子5の測定をした後に、当該配線パターンを切断する工程にしても構わない。   Furthermore, the mounting surface of the integrated circuit element 7 may be covered with an insulating resin, and this case is also included in the technical scope of the present invention. Further, in step B, the wiring pattern from the monitor electrode pad 11 formed in the discarded substrate region B is cut. In step C, after the lid 4 is disposed and joined, the crystal resonator 5 is again formed. After the above measurement, the wiring pattern may be cut.

図1は、本発明の製造方法によって製作した圧電発振器の分解斜視図である。FIG. 1 is an exploded perspective view of a piezoelectric oscillator manufactured by the manufacturing method of the present invention. 図2は、本発明の製造方法によって製作中の圧電発振器を集積回路素子搭載面側からみた平面図である。FIG. 2 is a plan view of the piezoelectric oscillator being manufactured by the manufacturing method of the present invention as viewed from the side of the integrated circuit element mounting surface. 図3(a)は、本発明の圧電発振器の製造方法を説明するための斜視図である。 図3(b)は、本発明の圧電発振器の製造方法における図3(a)の次の工程を説明するための斜視図である。FIG. 3A is a perspective view for explaining the method for manufacturing the piezoelectric oscillator of the present invention. FIG. 3B is a perspective view for explaining the next step of FIG. 3A in the method for manufacturing a piezoelectric oscillator of the present invention. 図4(a)は、本発明の圧電発振器の製造方法における図3(b)の次の工程を説明するための斜視図である。 図4(b)は、本発明の圧電発振器の製造方法における図4(a)の次の工程を説明するための斜視図である。FIG. 4A is a perspective view for explaining the next step of FIG. 3B in the method for manufacturing a piezoelectric oscillator of the present invention. FIG. 4B is a perspective view for explaining the next step of FIG. 4A in the method for manufacturing a piezoelectric oscillator of the present invention. 図5は、従来の圧電発振器の一形態を示す分解斜視図である。FIG. 5 is an exploded perspective view showing one embodiment of a conventional piezoelectric oscillator.

符号の説明Explanation of symbols

1・・・容器体
4・・・蓋体
5・・・水晶振動素子
7・・・集積回路素子
9・・・スペーサ部材
10・・・母基板
11・・・モニタ用電極パッド
12・・・樹脂材
A・・・発振器基板領域
B・・・捨代基板領域
DESCRIPTION OF SYMBOLS 1 ... Container body 4 ... Cover body 5 ... Crystal oscillation element 7 ... Integrated circuit element 9 ... Spacer member 10 ... Mother board 11 ... Monitor electrode pad 12 ... Resin material A ・ ・ ・ Oscillator board area B ・ ・ ・ Disposal board area

Claims (4)

矩形且つ平板形状の発振器基板の一方の主面の辺縁部には直立した側壁部が形成し、該側壁部及び該主面に囲まれた凹部空間に圧電振動素子を搭載し、該凹部空間を蓋体により気密封止した後、該発振器基板の他方の主面側に、該圧電振動素子と電気的に接続する集積回路素子及びチップ型電子素子を配置し、該発振器基板の他方の主面の辺縁部に、外部接続用電極端子が形成された基体を形成した後、該集積回路素子に外部より制御信号を入出力し圧電発振器の仕様数値を所望の数値に合わせる圧電発振器の製造方法において、
発振器基板領域の外周側面に捨代基板領域を一体形成し、該発振器基板領域及び捨代基板領域の他方の主面のそれぞれに、該圧電振動素子の表裏主面上に形成した励振電極膜と電気的に接続した1対のモニタ電極パッドのうち1個ずつを形成し、且つ該捨代基板領域を外周に形成した該発振器基板領域が複数個マトリックスに配列されて一体に構成されている母基板を形成する工程と、
各々の該発振器基板領域の一方の主面の辺縁部及び該捨代基板領域の一方の主面に形成した側壁部と該基板発振器領域の一方の主面とから形成される凹部空間内に圧電振動素子を搭載し、該側壁部の頂部に蓋体を配置し、個々の該凹部空間を該蓋体で気密封止する工程と、
該モニタ電極パッドから各々の該圧電振動素子の諸特性を測定し、所望の特性数値にある圧電振動素子が搭載されている該母基体の個々の該発振器基板領域の他方の主面に各々集積回路素子を配置固着し、更に該発振器基板領域の他方の主面に外部接続用電極パッドを形成したスペーサ部材を配置固着し、該集積回路素子の各外部接続端子と、該圧電振動素子、該外部接続用電極パッドとを電気的に接続する工程と、
一体化した該母基板、該母蓋体を、該基体発振器領域と該基体捨代基板領域との境界線に沿って、個々の圧電発振器に切断分割する工程と
を具備することを特徴とする圧電発振器の製造方法。
An upstanding side wall is formed on the edge of one main surface of the rectangular and flat oscillator substrate, and a piezoelectric vibration element is mounted in the recess space surrounded by the side wall and the main surface. Is hermetically sealed with a lid, and an integrated circuit element and a chip-type electronic element that are electrically connected to the piezoelectric vibration element are disposed on the other main surface side of the oscillator substrate, and the other main surface of the oscillator substrate is disposed. Manufacturing a piezoelectric oscillator that forms a base on which external connection electrode terminals are formed on the edge of the surface, and then inputs / outputs control signals to / from the integrated circuit element from the outside to match the specified numerical value of the piezoelectric oscillator to a desired value In the method
An exciter substrate region is integrally formed on the outer peripheral side surface of the oscillator substrate region, and an excitation electrode film formed on each of the other main surfaces of the oscillator substrate region and the surrogate substrate region on the front and back main surfaces of the piezoelectric vibration element; A mother comprising a plurality of oscillator substrate regions, each of which is formed of a pair of electrically connected monitor electrode pads and in which a plurality of the oscillator substrate regions are formed on the outer periphery. Forming a substrate;
In a recess space formed by a side wall portion formed on one main surface of each oscillator substrate region and one main surface of the discarded substrate region, and one main surface of the substrate oscillator region Mounting a piezoelectric vibration element, disposing a lid on the top of the side wall, and hermetically sealing each of the recessed spaces with the lid;
Various characteristics of each piezoelectric vibration element are measured from the monitor electrode pad, and are integrated on the other main surface of each oscillator substrate region of the mother board on which the piezoelectric vibration element having a desired characteristic value is mounted. A circuit element is arranged and fixed, and a spacer member having an external connection electrode pad formed on the other main surface of the oscillator substrate region is arranged and fixed, each external connection terminal of the integrated circuit element, the piezoelectric vibration element, Electrically connecting the electrode pad for external connection;
A step of cutting and dividing the integrated mother substrate and the mother lid into individual piezoelectric oscillators along a boundary line between the base oscillator region and the base replacement substrate region. A method for manufacturing a piezoelectric oscillator.
前記スペーサ部材が金属ポストから成ることを特徴とする請求項1に記載の圧電発振器の製造方法。   The method for manufacturing a piezoelectric oscillator according to claim 1, wherein the spacer member is made of a metal post. 前記スペーサ部材が各発振器基板領域の四隅部に配置されていることを特徴とする請求項1及び請求項2に記載の圧電発振器の製造方法。   3. The method of manufacturing a piezoelectric oscillator according to claim 1, wherein the spacer members are arranged at four corners of each oscillator substrate region. 4. 前記母基板上に搭載した集積回路素子が樹脂材によってポッティングされていることを特徴とする請求項1又は請求項3に記載の圧電発振器の製造方法。   4. The method for manufacturing a piezoelectric oscillator according to claim 1, wherein the integrated circuit element mounted on the mother substrate is potted with a resin material.
JP2004317209A 2004-10-29 2004-10-29 Manufacturing method of piezoelectric oscillator Pending JP2006129303A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008113234A (en) * 2006-10-30 2008-05-15 Kyocera Kinseki Corp Crystal oscillator
JP2008136169A (en) * 2006-10-24 2008-06-12 Epson Toyocom Corp Piezoelectric device manufacturing method, piezoelectric device, and electronic apparatus
JP2008187577A (en) * 2007-01-31 2008-08-14 Kyocera Kinseki Corp Manufacturing method of piezoelectric oscillator
JP2008252780A (en) * 2007-03-30 2008-10-16 Kyocera Kinseki Corp Method of manufacturing piezoelectric oscillator
JP2012238987A (en) * 2011-05-11 2012-12-06 Seiko Epson Corp Manufacturing method of oscillator

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008136169A (en) * 2006-10-24 2008-06-12 Epson Toyocom Corp Piezoelectric device manufacturing method, piezoelectric device, and electronic apparatus
JP2008113234A (en) * 2006-10-30 2008-05-15 Kyocera Kinseki Corp Crystal oscillator
JP2008187577A (en) * 2007-01-31 2008-08-14 Kyocera Kinseki Corp Manufacturing method of piezoelectric oscillator
JP2008252780A (en) * 2007-03-30 2008-10-16 Kyocera Kinseki Corp Method of manufacturing piezoelectric oscillator
JP2012238987A (en) * 2011-05-11 2012-12-06 Seiko Epson Corp Manufacturing method of oscillator

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