JP2008187577A - Manufacturing method of piezoelectric oscillator - Google Patents

Manufacturing method of piezoelectric oscillator Download PDF

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JP2008187577A
JP2008187577A JP2007020542A JP2007020542A JP2008187577A JP 2008187577 A JP2008187577 A JP 2008187577A JP 2007020542 A JP2007020542 A JP 2007020542A JP 2007020542 A JP2007020542 A JP 2007020542A JP 2008187577 A JP2008187577 A JP 2008187577A
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terminal
terminal portion
integrated circuit
circuit element
piezoelectric oscillator
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JP5075417B2 (en
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Toshio Nakazawa
利夫 中澤
Hiroyuki Miura
浩之 三浦
Riyouma Sasagawa
亮磨 笹川
Yasushi Mochinaga
康司 持永
Seiya Manko
晴也 万江
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Kyocera Crystal Device Corp
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Kyocera Crystal Device Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide the effect that a manufacturing method of a piezoelectric oscillator is provided to simplify handling, to improve productivity and further to deal with reduction in height. <P>SOLUTION: The present invention relates to a manufacturing method of a piezoelectric oscillator including: a terminal portion forming step of forming a metal film layer on a surface of each terminal portion of an insulated substrate comprising a plurality of openings so as to position the terminal portions at positions corresponding to terminal portion connecting electrode terminals formed on a lower surface side of a container body and comprising the plurality of terminal portions on side surfaces of these openings; an integrated circuit element connecting step of packaging an integrated circuit element by electrically and mechanically connecting it to an integrated circuit element packaging pad formed on the lower surface side of the container body; a terminal portion connecting step of connecting the metal film layers of the terminal portions with the terminal portion connecting electrode terminals of the container body; and a cutting/separating step of cutting the insulated substrate on the boundaries of the openings and the terminal portions thereof to simultaneously obtain a plurality of piezoelectric oscillators. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、電子機器等に用いられる圧電発振器の製造方法に関するものである。   The present invention relates to a method for manufacturing a piezoelectric oscillator used in electronic equipment and the like.

図9は、従来の圧電発振器を示す断面図である。尚、紙面に対して奥側を「上」、手前側を「下」として説明する。
図9に示すように従来の圧電発振器は、容器体201の内部に圧電振動素子202が収容され、蓋体により圧電振動素子202及び気密封止されている圧電振動子の下面側に導電性接合材によって導電体204と集積回路素子203とが接合されている構造が知られている。この導電体204は、外部接続用電極端子として用いられる(例えば、特許文献1を参照)。
FIG. 9 is a cross-sectional view showing a conventional piezoelectric oscillator. In the following description, the back side is “up” and the near side is “bottom”.
As shown in FIG. 9, in the conventional piezoelectric oscillator, a piezoelectric vibration element 202 is accommodated inside a container body 201, and the piezoelectric vibration element 202 and a piezoelectric vibrator which is hermetically sealed by a lid are electrically connected to the lower surface side of the piezoelectric vibrator. A structure in which the conductor 204 and the integrated circuit element 203 are joined by a material is known. The conductor 204 is used as an external connection electrode terminal (see, for example, Patent Document 1).

尚、前記容器体201は、通常、アルミナセラミックス等のセラミック材料から成り、その内部及び表面には所定の配線パターンが形成され、従来周知のグリーンシート積層法等を採用することによって製作されている。そして、このような容器体201の下面側には導電体接続用電極端子が設けられており、これらの導電体接続用電極端子と導電体204を、導電性接着剤や半田等の導電性接合材を介して導通固着することにより、容器体201に導電体204が接合されていた。
導電体204を容器体201に接合する方法としては、前記容器体201の下面側に形成されている導電体接続用電極端子に導電性接着剤や半田等の導電性接合材を塗布し、 導電体204を容器体201の各導電体接続用電極端子に1つずつ搭載して、熱処理をすることで、導電体接続用電極端子に導電体204が接合されていた。
The container body 201 is usually made of a ceramic material such as alumina ceramics, and a predetermined wiring pattern is formed inside and on the surface thereof. The container body 201 is manufactured by employing a conventionally known green sheet laminating method or the like. . And the conductor connection electrode terminal is provided in the lower surface side of such a container body 201, and these conductor connection electrode terminals and the conductor 204 are connected by conductive bonding, such as conductive adhesive and solder. The conductor 204 was joined to the container body 201 by conducting and fixing through the material.
As a method of joining the conductor 204 to the container body 201, a conductive bonding material such as a conductive adhesive or solder is applied to the electrode terminal for conductor connection formed on the lower surface side of the container body 201. The conductor 204 was joined to the conductor connection electrode terminal by mounting the body 204 one by one on each conductor connection electrode terminal of the container body 201 and performing heat treatment.

前記のような形態の圧電発振器については、以下のような先行技術が開示されている。
特開2003−46251号公報
The following prior art is disclosed about the piezoelectric oscillator of the above forms.
JP 2003-46251 A

尚、前記した先行技術文献情報で特定される先行技術文献以外には、本発明に関連する先行技術文献以外を、本件出願時までに発見するに至らなかった。   In addition, other than the prior art documents specified by the prior art document information described above, other than the prior art documents related to the present invention have not been found by the time of filing of the present application.

前記した従来の圧電発振器の製造方法においては、容器体の下面側に形成されている導電体接続用電極端子に導電性接着剤や半田等の導電性接合材を塗布し、導電体を容器体の各導電体接続用電極端子に1つずつ搭載して、すべてを搭載後に熱処理をすることで、導電体接続用電極端子に導電体が接合されるので、個々の容器体に導電体を1つずつ搭載するような煩雑な工程が必要となり、生産性が低下してしまうといった課題があった。   In the above-described conventional method for manufacturing a piezoelectric oscillator, a conductive bonding material such as a conductive adhesive or solder is applied to the electrode terminal for connecting a conductor formed on the lower surface side of the container body, and the conductor is placed in the container body. One conductor is mounted on each conductor connection electrode terminal, and the conductor is joined to the conductor connection electrode terminal by performing a heat treatment after mounting all of the conductor connection electrode terminals. There is a problem that a complicated process of mounting one by one is required and productivity is lowered.

本発明は前記課題に鑑み案出されたもので、その目的は、製造時の取り扱いが簡便で、生産性を向上させる圧電発振器の製造方法を提供することにある。   The present invention has been devised in view of the above problems, and an object of the present invention is to provide a method of manufacturing a piezoelectric oscillator that is easy to handle at the time of manufacture and improves productivity.

本発明の圧電発振器の製造方法は、前記課題を解決するために成されたものであり、容器体内に圧電振動素子を搭載して、蓋体で気密封止した圧電振動子に集積回路素子を搭載し、圧電振動子に搭載用の端子部を設けた圧電発振器の製造方法であって、平板状の絶縁基板に設けられた複数の開口部の側面から延出して容器体の下面に形成された端子部接続用電極端子に対応した位置に設けられる複数の端子部の絶縁基板の両主面と同一方向を向く面に金属膜層を形成する端子部形成工程と、容器体の下面側に形成された集積回路素子搭載パッドに対応する接続パッドを向かい合わせた形態で集積回路素子を電気的且つ機械的に接続することで搭載する集積回路素子接続工程と、端子部の金属膜層と容器体の端子部接続用電極端子とを接続する端子部接続工程と、 絶縁基板の開口部と端子部との境目で切断して複数個の圧電発振器を同時に得る切断分離工程と、を具備することを特徴とするものである。   A method for manufacturing a piezoelectric oscillator according to the present invention is made to solve the above-described problems. An integrated circuit element is mounted on a piezoelectric vibrator that is mounted in a container and hermetically sealed with a lid. A method of manufacturing a piezoelectric oscillator having a mounting portion provided on a piezoelectric vibrator, wherein the piezoelectric oscillator is formed on a lower surface of a container body extending from side surfaces of a plurality of openings provided in a flat insulating substrate. A terminal portion forming step of forming a metal film layer on a surface facing the same direction as both main surfaces of the insulating substrate of the plurality of terminal portions provided at positions corresponding to the terminal portion connecting electrode terminals; and on the lower surface side of the container body Integrated circuit element connection step for mounting integrated circuit elements electrically and mechanically in a form in which connection pads corresponding to the formed integrated circuit element mounting pads face each other, and metal film layer of terminal portion and container Connect the electrode terminal for connecting the terminal part of the body And the child unit connecting step, is characterized in that it comprises a and a cutting and separating step of obtaining a plurality of piezoelectric oscillators at the same time by cutting at the boundary between the opening portion and the terminal portion of the insulating substrate.

また、集積回路素子の周囲を絶縁性樹脂により覆う工程を端子部接合工程後に具備しても良い。   Further, a step of covering the periphery of the integrated circuit element with an insulating resin may be provided after the terminal portion bonding step.

更に、圧電発振器の前記複数の端子部のうち少なくとも2つをデータ書込端子とすると共に、前記データ書込端子を介して前記集積回路素子に温度補償データを入力し、前記集積回路素子内のメモリに前記温度補償データを格納する工程を前記切断分離工程後に具備しても良い。   Furthermore, at least two of the plurality of terminal portions of the piezoelectric oscillator are used as data write terminals, and temperature compensation data is input to the integrated circuit element via the data write terminal, A step of storing the temperature compensation data in a memory may be provided after the cutting and separating step.

また更に、絶縁基板の端子部の一部がデータ書込端子となり、データ書込端子となる端子部の高さが他の端子部の高さより低くても良い   Furthermore, a part of the terminal portion of the insulating substrate may be a data write terminal, and the height of the terminal portion that becomes the data write terminal may be lower than the height of the other terminal portions.

更にまた、絶縁基板の材質がシリコン、ガラス、ガラスエポキシ樹脂のうちいずれか1つであっても良い。   Furthermore, the material of the insulating substrate may be any one of silicon, glass, and glass epoxy resin.

本発明の圧電発振器の製造方法によれば、平板状の絶縁基板に設けられた複数の開口部の側面から延出して容器体の下面に形成された端子部接続用電極端子に対応した位置に設けられる複数の端子部に形成された金属膜層と容器体の端子部接続用電極端子とを接続することによって、すべての端子部を容器体へ同時に搭載するので、個々の容器体に導電体を1つずつ搭載するような煩雑な工程が必要なく、生産性が向上されるようになる。   According to the method for manufacturing a piezoelectric oscillator of the present invention, a position corresponding to the terminal portion connection electrode terminal formed on the lower surface of the container body extending from the side surface of the plurality of openings provided in the flat insulating substrate. By connecting the metal film layer formed on the plurality of provided terminal portions and the electrode terminal for connecting the terminal portion of the container body, all the terminal portions are mounted on the container body at the same time. This eliminates the need for cumbersome processes for mounting one by one, improving productivity.

また、端子部の表面の一部を含む集積回路素子の周囲を絶縁性樹脂で充填することにより、端子部を絶縁基板から切断分離する際に、絶縁性樹脂が切断時に端子部に生じるストレスの緩衝材となるので、切断時のストレスによる端子部と端子部接続用電極端子との剥がれなどの不具合を更に低減することが可能となる。   In addition, by filling the periphery of the integrated circuit element including a part of the surface of the terminal portion with an insulating resin, when the terminal portion is cut and separated from the insulating substrate, the stress generated in the terminal portion at the time of cutting the insulating resin Since it becomes a buffer material, it becomes possible to further reduce problems such as peeling between the terminal portion and the terminal portion connecting electrode terminal due to stress during cutting.

また、圧電発振器の端子部の一部がデータ書込端子となり、データ書込端子となる端子部の高さが他の端子部の高さより低くしたことから、圧電発振器とマザーボード等の外部の電気回路に搭載した場合でも、マザーボード表面に形成されている配線パターンとデータ書込端子が不要に接触することがなくなるため、安定した発振周波数を出力することが可能となる。   In addition, since a part of the terminal portion of the piezoelectric oscillator becomes a data write terminal and the height of the terminal portion that becomes the data write terminal is lower than the height of the other terminal portions, the piezoelectric oscillator and the external electric Even when mounted on a circuit, the wiring pattern formed on the surface of the mother board and the data write terminal are not unnecessarily brought into contact with each other, so that a stable oscillation frequency can be output.

よって、本発明は、取り扱いが簡便で、生産性に優れ、更に低背化に対応可能な圧電発振器の製造方法を提供する効果を奏する。   Therefore, the present invention has an effect of providing a method for manufacturing a piezoelectric oscillator that is easy to handle, has excellent productivity, and can cope with a low profile.

以下、本発明を添付図面に基づいて詳細に説明する。尚、圧電材料を水晶として説明する。よって圧電振動子を水晶振動子として説明する。   Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In the following description, the piezoelectric material is quartz. Therefore, the piezoelectric vibrator is described as a crystal vibrator.

(第一の実施形態)
図1は、本発明の実施形態に係る圧電発振器の製造方法で形成された圧電発振器の一例を示す分解斜視図である。図2は、本発明の実施形態に係る圧電発振器の製造方法で形成された圧電発振器の一例を示す断面図である。図3(a)は、圧電振動子を集積回路素子搭載側主面(一方の主面)よりみた斜視図である。図3(b)は、本発明の圧電発振器の製造方法で形成された圧電発振器を実装側よりみた斜視図である。
尚、図1〜図3では、紙面に対して、紙面に対して奥側を「上」、手前側を「下」として説明する。また、各図では、同じ構成要素には同じ符号を付し、重複する説明を省略する。説明を明りょうにするため説明に不必要な構造体の一部は図示していない。さらに図示した寸法も一部誇張して示している。
(First embodiment)
FIG. 1 is an exploded perspective view showing an example of a piezoelectric oscillator formed by a method for manufacturing a piezoelectric oscillator according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing an example of a piezoelectric oscillator formed by a method for manufacturing a piezoelectric oscillator according to an embodiment of the present invention. FIG. 3A is a perspective view of the piezoelectric vibrator as viewed from the integrated circuit element mounting side main surface (one main surface). FIG. 3B is a perspective view of the piezoelectric oscillator formed by the piezoelectric oscillator manufacturing method of the present invention as seen from the mounting side.
In FIG. 1 to FIG. 3, the explanation will be made assuming that the back side is “up” and the near side is “down” with respect to the page. Moreover, in each figure, the same code | symbol is attached | subjected to the same component and the overlapping description is abbreviate | omitted. For the sake of clarity, some of the structures that are unnecessary for the description are not shown. Further, the illustrated dimensions are partially exaggerated.

図1〜図3に示す圧電発振器100は、主面外形形状が矩形状の容器体10の内部に水晶振動素子20を収容されており、この容器体10の一方の主面には、集積回路素子50が接続されると共に、外部接続用電極端子41aやデータ書込端子41bとなる端子部41が接続されている。   A piezoelectric oscillator 100 shown in FIGS. 1 to 3 has a quartz resonator element 20 accommodated in a container body 10 whose main surface outer shape is rectangular, and an integrated circuit is formed on one main surface of the container body 10. The element 50 is connected, and a terminal portion 41 to be an external connection electrode terminal 41a and a data write terminal 41b is connected.

容器体10は、例えば、アルミナセラミックス、ガラス−セラミックス等のセラミック材料から成り、前記のとおり一方の主面(図2では下主面)には、集積回路素子50内に搭載した電子回路網との電気的接続を取ると共に集積回路素子50を機械的に接合するための集積回路素子搭載パッド15が容器体10の中央部に、また端子部41を機械的に接合するための端子部接続用電極端子12が容器体10の4隅に設けられている。また、他方の主面(図2では上主面)には、その中央域に矩形状に凹部空間14が形成されている。凹部空間14を囲繞する側壁の頂面には、環状の封止用導体パターン11が形成されている。   The container body 10 is made of, for example, a ceramic material such as alumina ceramics or glass-ceramics, and has an electronic circuit network mounted in the integrated circuit element 50 on one main surface (the lower main surface in FIG. 2) as described above. The integrated circuit element mounting pad 15 for mechanically joining the integrated circuit element 50 and the terminal part connection for mechanically joining the terminal part 41 to the central part of the container body 10. Electrode terminals 12 are provided at the four corners of the container body 10. Further, the other main surface (the upper main surface in FIG. 2) is formed with a recessed space 14 in a rectangular shape in the central area. An annular sealing conductor pattern 11 is formed on the top surface of the side wall surrounding the recessed space 14.

また、端子部41を容器体10の端子部接続用電極端子12に取着固定する際は、端子部41の上面に形成された金属膜層43aと、容器体10に設けられている端子部接続用電極端子12とが、半田や導電性接着剤等の導電性接合材60によって機械的且つ電気的に接合している。更に、容器体10は、凹部空間14の内部に水晶振動素子20を収容するためのものであり、凹部空間14内の底面には、水晶振動素子20の表裏両主面に形成された励振用電極21と各個電気的に接続される圧電振動素子搭載パッド13が被着形成されている。   When the terminal portion 41 is attached and fixed to the terminal portion connecting electrode terminal 12 of the container body 10, the metal film layer 43 a formed on the upper surface of the terminal portion 41 and the terminal portion provided on the container body 10. The connection electrode terminal 12 is mechanically and electrically bonded to the connection electrode terminal 12 by a conductive bonding material 60 such as solder or a conductive adhesive. Further, the container body 10 is for housing the crystal resonator element 20 in the recess space 14, and is provided on the bottom surface of the recess space 14 for excitation formed on both the front and back main surfaces of the crystal resonator element 20. A piezoelectric vibration element mounting pad 13 that is electrically connected to each electrode 21 is deposited.

また、容器体10の側壁部の凹部空間14開口部側頂面に形成された封止用導体パターン11は、例えば、タングステン(W)、モリブデン(Mo)、等から成る基層の表面にニッケル(Ni)層及び金(Au)層を順次、凹部空間14開口部を環状に囲繞する形態で被着させることによって、10μm〜25μmの厚みに形成されている。また、その封止用導体パターン11の内周側縁部は凹部空間14の内壁面に、外周側縁部は容器体10の外側面にそれぞれ露出されている。この封止用導体パターン11は、後述する蓋体30を、蓋体30に形成された封止部材31の濡れ性を良好とし、圧電振動素子搭載空間の気密信頼性及び生産性を向上させることができる。   In addition, the sealing conductor pattern 11 formed on the top surface of the opening side of the recess space 14 on the side wall of the container body 10 is made of nickel (on the surface of a base layer made of tungsten (W), molybdenum (Mo), etc., for example. A Ni) layer and a gold (Au) layer are sequentially deposited in a form surrounding the opening of the recess space 14 in an annular shape, thereby forming a thickness of 10 μm to 25 μm. Further, the inner peripheral edge of the sealing conductor pattern 11 is exposed on the inner wall surface of the recessed space 14, and the outer peripheral edge is exposed on the outer surface of the container body 10. The conductive pattern 11 for sealing improves the airtight reliability and productivity of the piezoelectric vibration element mounting space by improving the wettability of the sealing member 31 formed on the lid 30 for the lid 30 described later. Can do.

かかる容器体10の側壁部の凹部空間14内底面に設けられている圧電振動素子搭載パッド13は、容器体10に設けられた端子部接続用電極端子12の一部と容器体10に構成されている各層表面の配線パターンや各層を貫通するビア導体を介して電気的に接続されている。また圧電振動素子搭載パッド13は、その上面側で、後述する水晶振動素子20の励振用電極21に導電性接着剤70を介して電気的且つ機械的に接続されている。   The piezoelectric vibration element mounting pad 13 provided on the bottom surface in the concave space 14 on the side wall of the container body 10 is configured by a part of the terminal portion connection electrode terminal 12 provided on the container body 10 and the container body 10. They are electrically connected via wiring patterns on the surface of each layer and via conductors that penetrate each layer. Further, the piezoelectric vibration element mounting pad 13 is electrically and mechanically connected to an excitation electrode 21 of a crystal vibration element 20 described later via a conductive adhesive 70 on the upper surface side.

容器体10の凹部空間14内に収容される水晶からなる圧電振動素子20は、人工水晶体から所定のカットアングルで切断し外形加工を施した概略平板状で主面形状が四角形の水晶素板を主構造体としている。その水晶素板の表裏両主面に一対の励振用電極21を被着・形成することで、外部からの交番電圧が励振用電極21を介して水晶素板に印加されると、所定の振動モード及び周波数で励振を起こさせることができる。このような水晶振動素子20は、その両主面に被着されている励振用電極21から水晶素板の一方の短辺側に引き出した引き出し電極と、凹部空間14内底面の対応する圧電振動素子搭載パッド13とを導電性接接着剤70を介して電気的・機械的に接続することによって容器体10の凹部空間14内底面に搭載される。   The piezoelectric vibration element 20 made of crystal accommodated in the recessed space 14 of the container body 10 is a substantially flat plate-shaped quartz base plate that is cut from the artificial crystal at a predetermined cut angle and is subjected to external processing. The main structure. By applying and forming a pair of excitation electrodes 21 on both the front and back main surfaces of the crystal base plate, when an alternating voltage from the outside is applied to the crystal base plate via the excitation electrode 21, a predetermined vibration is generated. Excitation can be caused by mode and frequency. Such a crystal resonator element 20 has a lead electrode drawn out from the excitation electrode 21 applied to both main surfaces thereof to one short side of the crystal base plate and a corresponding piezoelectric vibration in the bottom surface of the recessed space 14. The element mounting pad 13 is mounted on the bottom surface in the recessed space 14 of the container body 10 by electrically and mechanically connecting the element mounting pad 13 via the conductive contact adhesive 70.

導電性接着剤70は、シリコン樹脂やポリイミド樹脂等から成る樹脂材料中にAg等から成る導電性粒子を所定量、添加、混合してなるものである。   The conductive adhesive 70 is obtained by adding and mixing a predetermined amount of conductive particles made of Ag or the like into a resin material made of silicon resin or polyimide resin.

また、容器体10上に配置される蓋体30は、従来周知の金属加工法を採用し、42アロイ等の金属を所定形状に整形することによって製作される。蓋体30の上面には、ニッケル(Ni)層が形成され、更にニッケル(Ni)層の上面に少なくとも封止用導体パターン11に相対する箇所に封止部材31である金錫(Au−Sn)層が形成される。金錫(Au−Sn)層の厚みは、10μm〜40μmである。例えば、成分比率が、金が80%、錫が20%のものが使用されている。また、このような封止部材31は、封止用導体パターン11表面の凹凸を緩和し、気密性の低下を防ぐことが可能となる。このような蓋体30を水晶振動素子20が内部に搭載された凹部空間14を囲繞する側壁部頂部に形成した封止用導体パターン11上に、凹部空間14の開口部を覆う形態で配置され、封止部材31と封止用導体パターン11とを溶融接合することにより、凹部空間14内を気密に封止し、圧電振動子90を構成している。   Further, the lid 30 disposed on the container body 10 is manufactured by adopting a conventionally known metal processing method and shaping a metal such as 42 alloy into a predetermined shape. A nickel (Ni) layer is formed on the upper surface of the lid body 30, and further, gold tin (Au—Sn) which is a sealing member 31 at least at a location facing the sealing conductor pattern 11 on the upper surface of the nickel (Ni) layer. ) Layer is formed. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin. Moreover, such a sealing member 31 can relieve unevenness on the surface of the sealing conductor pattern 11 and prevent a decrease in hermeticity. Such a lid 30 is disposed on the sealing conductor pattern 11 formed on the top of the side wall portion surrounding the recessed space 14 in which the crystal resonator element 20 is mounted so as to cover the opening of the recessed space 14. The sealing member 31 and the sealing conductor pattern 11 are melt-bonded to hermetically seal the inside of the recessed space 14 to constitute the piezoelectric vibrator 90.

端子部41は、シリコンやガラス、ガラスエポキシ樹脂等の一枚板である絶縁基板40を従来周知の打ち抜き加工法やエッチング加工法等により一体で形成する。
端子部41は、集積回路素子50の高さ寸法よりも高い高さ寸法を有する柱状形状となっている。
端子部41は、平板状の絶縁基板に設けられた複数の開口部の側面から延出して、圧電振動子80の前記容器体10の下面に形成された端子部接続用電極端子12に対応した位置に設けられる複数の端子部41の前記絶縁基板の両主面と同一方向を向く面にNiメッキ、Auメッキを施した金属膜層43a、43bを形成し、前記端子部41を切り離して形成される。
The terminal portion 41 is formed by integrally forming an insulating substrate 40 that is a single plate of silicon, glass, glass epoxy resin or the like by a conventionally known punching method or etching method.
The terminal portion 41 has a columnar shape having a height dimension higher than that of the integrated circuit element 50.
The terminal portion 41 extends from the side surface of the plurality of openings provided on the flat insulating substrate, and corresponds to the terminal portion connecting electrode terminal 12 formed on the lower surface of the container body 10 of the piezoelectric vibrator 80. The metal film layers 43a and 43b plated with Ni and Au are formed on the surfaces of the plurality of terminal portions 41 provided at positions facing the main surfaces of the insulating substrate, and the terminal portions 41 are separated from each other. Is done.

尚、金属膜層43aと金属膜層43bは、端子部41の内部又は、表面に形成された配線やビアホールにより、導通がとられている。
又、各端子部41の上面に形成された金属膜層43aと、容器体10に設けられた端子部接続用電極端子12は半田や導電性接着剤等の導電性接合材60によって接合されている。
The metal film layer 43a and the metal film layer 43b are electrically connected to each other by wirings or via holes formed inside or on the surface of the terminal portion 41.
Further, the metal film layer 43a formed on the upper surface of each terminal portion 41 and the terminal portion connecting electrode terminal 12 provided on the container body 10 are joined together by a conductive bonding material 60 such as solder or conductive adhesive. Yes.

このように端子部41は絶縁基板を加工して形成されたものであるため、容器体の外部接続用電極端子として、マザーボード等の外部電気回路に搭載する際、半田等の導電性接合材によって外部電気回路の回路配線と電気的に接続されても、導電性接合材が端子部41の表面に這い上がらないため、他の端子部や集積回路素子50と短絡を防止することが可能となる。   As described above, since the terminal portion 41 is formed by processing the insulating substrate, when mounting on an external electric circuit such as a mother board as an electrode terminal for external connection of the container body, a conductive bonding material such as solder is used. Even when electrically connected to the circuit wiring of the external electric circuit, the conductive bonding material does not crawl onto the surface of the terminal portion 41, so that it is possible to prevent a short circuit with other terminal portions or the integrated circuit element 50. .

また、各端子部41は、機能毎に外部接続用電極端子41a(電源電圧端子、グランド端子、発振出力端子、発振制御端子)の他にデータ書込端子41bとして用いられる。外部接続用電極端子41aは、圧電発振器をマザーボード等の外部電気回路に搭載する際、半田付け等によって外部電気回路の回路配線と電気的に接続されることとなる。また、データ書込端子41bは、温度補償データ書込装置のプローブ針を当て、水晶振動素子20の温度特性に応じた温度補償データを書き込むことによって集積回路素子50のメモリ内に温度補償データが格納される。尚、それぞれの電極端子として使用される端子部41は、その電極端子の用途によって外形形状に差異が設けられている。   Each terminal portion 41 is used as a data write terminal 41b in addition to the external connection electrode terminal 41a (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control terminal) for each function. When the piezoelectric oscillator is mounted on an external electric circuit such as a mother board, the external connection electrode terminal 41a is electrically connected to the circuit wiring of the external electric circuit by soldering or the like. Further, the data write terminal 41b applies the probe needle of the temperature compensation data writing device and writes temperature compensation data corresponding to the temperature characteristics of the crystal resonator element 20, whereby the temperature compensation data is stored in the memory of the integrated circuit element 50. Stored. In addition, the terminal part 41 used as each electrode terminal is provided with a difference in outer shape depending on the use of the electrode terminal.

ここで、4つの外部接続用電極端子41aのうち、グランド端子と発振出力端子を近接に配置するようにすれば、発振出力端子より出力される発振信号にノイズが干渉するのを有効に防止することができる。従って、グランド端子と発振出力端子は近接させて配置することが好ましい。   Here, of the four external connection electrode terminals 41a, if the ground terminal and the oscillation output terminal are arranged close to each other, it is possible to effectively prevent noise from interfering with the oscillation signal output from the oscillation output terminal. be able to. Therefore, it is preferable to arrange the ground terminal and the oscillation output terminal close to each other.

集積回路素子50は、例えば容器体10の実装面側の集積回路素子搭載パッド15と1対1に対応する複数個の接続パッドを一方の主面に有した矩形状のフリップチップ型集積回路素子等が用いられ、その回路形成面には水晶振動素子20に接続されて所定の発振出力を生成する発振回路等が設けられ、この発振回路で生成された発振出力は、外部に出力された後、例えば、クロック信号等の基準信号として利用されることとなる。   The integrated circuit element 50 is, for example, a rectangular flip-chip integrated circuit element having a plurality of connection pads corresponding to the integrated circuit element mounting pads 15 on the mounting surface side of the container body 10 on one main surface. Etc., and an oscillation circuit or the like that is connected to the crystal resonator element 20 and generates a predetermined oscillation output is provided on the circuit forming surface, and the oscillation output generated by this oscillation circuit is output to the outside For example, it is used as a reference signal such as a clock signal.

又、集積回路素子50に設けた接続パッドを集積回路素子搭載パッド15に導電性接合材60を介して個々に接合させることによって集積回路素子50が容器体10に取着され、これによって集積回路素子50内の電子回路が水晶振動素子20や端子部41に電気的に接続される。   In addition, the integrated circuit element 50 is attached to the container body 10 by individually bonding the connection pads provided on the integrated circuit element 50 to the integrated circuit element mounting pad 15 via the conductive bonding material 60, thereby the integrated circuit. An electronic circuit in the element 50 is electrically connected to the crystal resonator element 20 and the terminal portion 41.

次に前記圧電発振器の製造方法について図6〜図8を用いて説明する。
ここで、図6(a)は、圧電発振器の製造方法の端子部形成工程を示す断面図であり、(b)は、圧電発振器の製造方法の集積回路素子接続工程を示す断面図であり、(c)は、圧電発振器の製造方法の端子部接続工程を示す断面図であり、(d)は、圧電発振器の製造方法の切断分離工程を示す断面図である。図7は、絶縁基板に圧電振動子を搭載する前を示す外観斜視図である。また図8は、絶縁基板に圧電振動子を搭載した後を示す平面図である。
Next, a method for manufacturing the piezoelectric oscillator will be described with reference to FIGS.
Here, FIG. 6A is a cross-sectional view showing a terminal portion forming step of the piezoelectric oscillator manufacturing method, and FIG. 6B is a cross-sectional view showing an integrated circuit element connecting step of the piezoelectric oscillator manufacturing method. (C) is sectional drawing which shows the terminal part connection process of the manufacturing method of a piezoelectric oscillator, (d) is sectional drawing which shows the cutting | disconnection isolation | separation process of the manufacturing method of a piezoelectric oscillator. FIG. 7 is an external perspective view showing a state before the piezoelectric vibrator is mounted on the insulating substrate. FIG. 8 is a plan view showing a state after the piezoelectric vibrator is mounted on the insulating substrate.

(端子部形成工程)
まず、図6(a)、図7、図8に示す端子部形成工程は、平板状の絶縁基板40に設けられた複数の開口部42の側面から延出して前記容器体41の下面に形成された端子部接続用電極端子12に対応した位置に設けられる複数の端子部41の前記絶縁基板40の両主面と同一方向を向く面に金属膜層43a、43bを形成する。
絶縁基板40は、ウエハ形状であり、端子部41を有する基板領域Xと、捨代領域Yとを相互に隣接させて、これらをマトリクス状に複数個ずつ配置した形態を有しており、前記絶縁基板40の基板領域Xには、開口部42が設けられる。
集積回路素子50の高さ寸法よりも高い高さ寸法hを有する直方体形状をした端子部41を、容器体10の下面側に形成された端子部接続用電極端子12に対応した位置に端子部41が位置するように、前記開口部42の側面に接続した形態で複数個直列に配置されており、各端子部41の上面及び下面に金属膜層43a、43bが形成されている。
尚、図6(a)に示した絶縁板40の断面図は、図7に記載の仮想切断線A−Aで切断した場合の部分断面図である。
(Terminal part formation process)
First, in the terminal portion forming step shown in FIGS. 6A, 7, and 8, it is formed on the lower surface of the container body 41 by extending from the side surfaces of the plurality of openings 42 provided in the flat insulating substrate 40. The metal film layers 43a and 43b are formed on the surfaces of the plurality of terminal portions 41 provided at positions corresponding to the terminal portion connection electrode terminals 12 facing the same direction as both main surfaces of the insulating substrate 40.
The insulating substrate 40 has a wafer shape, and has a form in which a substrate region X having a terminal portion 41 and an abandoned region Y are adjacent to each other, and a plurality of these are arranged in a matrix. An opening 42 is provided in the substrate region X of the insulating substrate 40.
A terminal part 41 having a rectangular parallelepiped shape having a height dimension h higher than the height dimension of the integrated circuit element 50 is placed at a position corresponding to the terminal part connection electrode terminal 12 formed on the lower surface side of the container body 10. A plurality of terminals 41 are arranged in series so as to be connected to the side surface of the opening 42, and metal film layers 43 a and 43 b are formed on the upper and lower surfaces of each terminal portion 41.
The cross-sectional view of the insulating plate 40 shown in FIG. 6A is a partial cross-sectional view taken along the virtual cutting line AA shown in FIG.

このような絶縁基板40は、シリコンやガラス、ガラスエポキシ樹脂等の絶縁材料で形成された一枚板である絶縁基板40を従来周知の打ち抜き加工法やフォトエッチング加工法等により形成される。端子部41の上面及び下面には、Niメッキ、Auメッキを施した金属膜層43a、43bが形成されている。
この絶縁基板40のうちの少なくとも端子部41の高さ寸法hは、集積回路素子50の高さ寸法よりも高くなるように形成されている。このようにすることにより、集積回路素子50がマザーボード等に接触することがなくなる。
この端子部41の上面及び下面に金属膜層43a、43bを形成し、配線やビアホールによって上面に形成した金属膜層43aと下面に形成した金属膜層43bを電気的に接続している。
また、この実施形態においては、この絶縁基板40を、後述する工程で、端子部41と捨代領域Yとを切断することになる。
Such an insulating substrate 40 is formed by a conventionally known punching method, photoetching method, or the like, which is a single plate formed of an insulating material such as silicon, glass, or glass epoxy resin. On the upper and lower surfaces of the terminal part 41, metal film layers 43a and 43b subjected to Ni plating and Au plating are formed.
The height dimension h of at least the terminal portion 41 of the insulating substrate 40 is formed to be higher than the height dimension of the integrated circuit element 50. By doing so, the integrated circuit element 50 does not come into contact with the motherboard or the like.
Metal film layers 43a and 43b are formed on the upper and lower surfaces of the terminal portion 41, and the metal film layer 43a formed on the upper surface and the metal film layer 43b formed on the lower surface are electrically connected by wiring or via holes.
Moreover, in this embodiment, the terminal part 41 and the surplus area | region Y will be cut | disconnected by this process at the process of mentioning this insulated substrate 40 later.

絶縁基板40がシリコンから成る場合は、単結晶シリコンのインゴットを所定厚みにスライスしてシリコンウエハを形成する。前記シリコンウエハの各基板領域Xの端子部41には、貫通孔が設けられ、前記端子部の上面と下面に金属膜層43a、43bが形成される。
この場合端子部41の上面と下面に形成した金属膜層43a、43bは、貫通孔により導通接続する。前記貫通孔には、金錫(Au−Sn)等の導体ペーストを充填することによって形成することができる。
When the insulating substrate 40 is made of silicon, a silicon wafer is formed by slicing an ingot of single crystal silicon to a predetermined thickness. A through hole is provided in the terminal portion 41 of each substrate region X of the silicon wafer, and metal film layers 43a and 43b are formed on the upper and lower surfaces of the terminal portion.
In this case, the metal film layers 43a and 43b formed on the upper and lower surfaces of the terminal portion 41 are conductively connected through the through holes. The through hole can be formed by filling a conductive paste such as gold tin (Au—Sn).

絶縁基板40がホウケイ酸ガラス、ソーダガラスのガラス材料から構成されている場合は、絶縁基板40の各基板領域Xの端子部41に対応した耐蝕膜を予め形成し、次にフォトエッチング加工法等により、開口部42を形成する。
各基板領域Xの端子部41に対応した耐蝕膜を剥離して、貫通孔が設けられ、前記端子部41の上面と下面に金属膜層43a、43bが形成される。
When the insulating substrate 40 is made of a glass material such as borosilicate glass or soda glass, a corrosion-resistant film corresponding to the terminal portion 41 of each substrate region X of the insulating substrate 40 is formed in advance, and then a photoetching method or the like Thus, the opening 42 is formed.
The corrosion resistant film corresponding to the terminal portion 41 of each substrate region X is peeled off to provide a through hole, and metal film layers 43 a and 43 b are formed on the upper and lower surfaces of the terminal portion 41.

絶縁基板40がガラス布基材エポキシ樹脂から成る場合は、ガラス糸を編み込んで形成したガラス布基材にエポキシ樹脂の液状前駆体を含浸させるとともに、前駆体を高温で重合させることによってベースが形成され、ベースに貼着される銅箔等の金属箔を従来周知のフォトエッチング加工法を採用し、所定パターンに加工することによって金属箔からなる金属膜層43a、43bが形成される。その後、従来周知の打ち抜き加工等で、絶縁基板40の基板領域Xに開口部42を形成する。   When the insulating substrate 40 is made of glass cloth base epoxy resin, a glass cloth base formed by weaving glass yarn is impregnated with a liquid precursor of epoxy resin, and the base is formed by polymerizing the precursor at a high temperature. Then, metal foil layers 43a and 43b made of metal foil are formed by processing a metal foil such as a copper foil adhered to the base into a predetermined pattern using a conventionally known photo-etching method. Thereafter, the opening 42 is formed in the substrate region X of the insulating substrate 40 by a conventionally known punching process or the like.

(集積回路素子接続工程)
図6(b)に示すように、前記容器体10の下面側に形成された集積回路素子搭載パッド15に決められた機能に対応する接続パッドを向かい合わせた形態で集積回路素子50を電気的且つ機械的に接続することで搭載する。
集積回路素子50としては、接合面に複数個の接続パッドを有した矩形状のフリップチップ型集積回路素子が用いられる。前記集積回路素子50は、その接合面に設けられている複数個の接続パッドが、容器体10の各集積回路素子搭載パッド15に導電性接合材を介して当接されるようにして載置され、しかる後、この導電性接合材を熱の印加によって溶融した後冷却固化し、接続パッドと集積回路素子搭載パッド15とを導電性接合材を介して接合することによって集積回路素子50が容器体10に取着搭載される。
(Integrated circuit element connection process)
As shown in FIG. 6B, the integrated circuit element 50 is electrically connected in such a manner that connection pads corresponding to functions determined by the integrated circuit element mounting pad 15 formed on the lower surface side of the container body 10 face each other. And it is mounted by mechanically connecting.
As the integrated circuit element 50, a rectangular flip-chip type integrated circuit element having a plurality of connection pads on the bonding surface is used. The integrated circuit element 50 is placed such that a plurality of connection pads provided on the bonding surface thereof are in contact with each integrated circuit element mounting pad 15 of the container body 10 via a conductive bonding material. Thereafter, the conductive bonding material is melted by application of heat and then solidified by cooling, and the integrated circuit element 50 is contained in the container by bonding the connection pad and the integrated circuit element mounting pad 15 via the conductive bonding material. It is mounted on the body 10.

(端子部接続工程)
図6(c)、図7、図8に示す如く、前記端子部41の金属膜層43aと容器体10の端子部接続用電極端子と12を接続する。
水晶からなる圧電振動素子20が収容され、集積回路素子50が取着搭載されている容器体10を、絶縁基板40の開口部42に取着搭載された集積回路素子50が挿入するようにして、圧電振動子90を構成する容器体10の下面に形成された端子部接続用電極端子12と絶縁基板40に形成された個々の端子部41の上面の金属層43aとを、金属膜層43aに印刷手段により一括で形成した半田や導電性接着剤などの導電性接合材60で接合することにより、絶縁基板40の所定の複数の端子部41に圧電振動子を搭載する。
(Terminal connection process)
As shown in FIGS. 6C, 7, and 8, the metal film layer 43 a of the terminal portion 41 and the terminal portion connecting electrode terminal 12 of the container body 10 are connected.
The integrated circuit element 50 attached and mounted in the opening 42 of the insulating substrate 40 is inserted into the container body 10 in which the piezoelectric vibration element 20 made of crystal is accommodated and the integrated circuit element 50 is attached and mounted. The terminal portion connection electrode terminal 12 formed on the lower surface of the container body 10 constituting the piezoelectric vibrator 90 and the metal layer 43a on the upper surface of each terminal portion 41 formed on the insulating substrate 40 are combined with the metal film layer 43a. The piezoelectric vibrators are mounted on a plurality of predetermined terminal portions 41 of the insulating substrate 40 by bonding with a conductive bonding material 60 such as solder or conductive adhesive formed in a batch by a printing means.

(切断分離工程)
図6(d)及び図8に示す如く、前記絶縁基板40の前記開口部42と前記端子部41との境目で切断して複数個の圧電発振器100を同時に得る。
各絶縁基板40の捨代領域Yと基板領域Xの端子部41との接続部分(二点鎖線部分)を切断することにより、各端子部41を捨代領域Yより切り離し、複数個の圧電発振器100を同時に得る。絶縁基板40の切断は、ダイサーを用いたダイシング等によって行なわれ、かかる切断工程を経て、端子部41が外部接続用電極端子41aやデータ書込端子41bの各種機能をなす形態の複数個の圧電発振器100が同時に得られる。
(Cutting and separation process)
As shown in FIGS. 6D and 8, a plurality of piezoelectric oscillators 100 are obtained simultaneously by cutting at the boundary between the opening 42 and the terminal portion 41 of the insulating substrate 40.
A plurality of piezoelectric oscillators are formed by cutting each terminal portion 41 from the separation region Y by cutting a connecting portion (two-dot chain line portion) between the separation region Y of each insulating substrate 40 and the terminal portion 41 of the substrate region X. Get 100 at the same time. The insulating substrate 40 is cut by dicing using a dicer or the like, and through such a cutting process, a plurality of piezoelectric elements having a form in which the terminal portion 41 performs various functions of the external connection electrode terminal 41a and the data writing terminal 41b. The oscillator 100 is obtained at the same time.

尚、圧電発振器100に温度補償機能を有する場合は、各端子部41を捨代領域Yより切断分離した端子部41のうちのデータ書込端子41bを介して集積回路素子50に温度補償データを入力し、集積回路素子50内のメモリに温度補償データを格納する。このような温度補償データの書込作業は、温度補償データ書込装置のプローブ針をデータ書込端子41bに当てて、水晶振動素子20の温度特性に応じて作成された温度補償データを集積回路素子50の温度補償回路内に設けられているメモリに入力し、これを記憶させることによって行なわれる。尚、ここで集積回路素子50に書き込まれる温度補償データは、水晶振動素子20毎の温度特性バラツキを補正するためのものであり、その温度補償型水晶発振器に使用される水晶振動素子20の温度特性を事前に測定しておくことにより得られるものである。   In the case where the piezoelectric oscillator 100 has a temperature compensation function, the temperature compensation data is supplied to the integrated circuit element 50 via the data write terminal 41b of the terminal portion 41 obtained by cutting and separating each terminal portion 41 from the separation region Y. The temperature compensation data is input and stored in the memory in the integrated circuit element 50. In such temperature compensation data writing operation, the temperature compensation data created in accordance with the temperature characteristics of the crystal resonator element 20 is applied to the integrated circuit by applying the probe needle of the temperature compensation data writing device to the data write terminal 41b. This is performed by inputting to a memory provided in the temperature compensation circuit of the element 50 and storing it. Here, the temperature compensation data written in the integrated circuit element 50 is for correcting the temperature characteristic variation for each crystal oscillation element 20, and the temperature of the crystal oscillation element 20 used in the temperature compensation type crystal oscillator. It is obtained by measuring the characteristics in advance.

(第二の実施形態)
図4は、本発明の第二の実施形態となる圧電発振器の製造方法で形成された圧電発振器の一例を示す断面図である。
端子部形成工程時の絶縁基板に開口を形成した後、データ書き込み端子となる端子部41bのみに再度フォトエッチング加工法等を行なっている点で、第一の実施形態とは異なる。よって、データ書込端子となる端子部41bの高さが他の端子部41aの高さより低くなる。
このようにすることで、圧電発振器とマザーボード等の外部の電気回路に搭載した場合でも、マザーボード表面に形成されている配線パターンとデータ書込端子が不要に接触することがなくなるため、安定した発振周波数を出力することが可能となる。
(Second embodiment)
FIG. 4 is a cross-sectional view showing an example of a piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator according to the second embodiment of the present invention.
The first embodiment is different from the first embodiment in that after the opening is formed in the insulating substrate during the terminal portion forming step, only the terminal portion 41b serving as the data writing terminal is subjected to the photoetching method or the like again. Therefore, the height of the terminal portion 41b serving as the data write terminal is lower than the height of the other terminal portions 41a.
In this way, even when mounted on an external electric circuit such as a piezoelectric oscillator and a mother board, the wiring pattern formed on the mother board surface and the data writing terminal are not unnecessarily contacted, so stable oscillation It becomes possible to output the frequency.

(第三の実施形態)
図5は、本発明の第三の実施形態となる圧電発振器の製造方法で形成された圧電発振器の一例を示す断面図である。
端子部接続工程と切断分離工程との間に絶縁性樹脂形成工程を行っている点で、第一の実施形態とは異なる。
絶縁性樹脂形成工程は、前記絶縁性樹脂80を前記絶縁基板41の開口部42内に塗布し、硬化させることによって、集積回路素子50の周囲が絶縁性樹脂80により覆われているようになる。
絶縁性樹脂80は、エポキシやポリイミドなどが多く用いられ、加熱により軟化あるいは溶融することで流動する特性を持つ熱可塑性樹脂により構成されている。
このように絶縁性樹脂80により集積回路素子50の周囲を被覆保護されることになるので、異物等の影響により周波数が変動することを防止することが可能となる。
また、端子部41を絶縁基板40の捨代領域Yから切断分離する際に、集積回路素子50の周囲を絶縁性樹脂80で覆うようにしたことから、絶縁性樹脂80が切断時に端子部41に生じるストレスの緩衝材となるので、切断時のストレスによる端子部41と端子部接続用電極端子12との剥がれなどの不具合を更に低減することが可能となる。
(Third embodiment)
FIG. 5 is a cross-sectional view showing an example of a piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator according to the third embodiment of the present invention.
It differs from the first embodiment in that an insulating resin forming step is performed between the terminal portion connecting step and the cutting and separating step.
In the insulating resin forming step, the periphery of the integrated circuit element 50 is covered with the insulating resin 80 by applying and curing the insulating resin 80 in the opening 42 of the insulating substrate 41. .
The insulating resin 80 is often made of epoxy, polyimide, or the like, and is made of a thermoplastic resin that has the property of flowing when softened or melted by heating.
As described above, since the periphery of the integrated circuit element 50 is covered and protected by the insulating resin 80, it is possible to prevent the frequency from fluctuating due to the influence of foreign matter or the like.
Further, since the periphery of the integrated circuit element 50 is covered with the insulating resin 80 when the terminal portion 41 is cut and separated from the discarded region Y of the insulating substrate 40, the insulating resin 80 is cut when the terminal portion 41 is cut. Therefore, it is possible to further reduce problems such as peeling between the terminal portion 41 and the terminal portion connecting electrode terminal 12 due to stress at the time of cutting.

尚、本発明は前記の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。
尚、前記した本実施例では、圧電振動素子を構成する圧電素材として水晶を用いた水晶振動素子を説明したが、他の圧電素材として、ニオブ酸リチウム、タンタル酸リチウムまたは、圧電セラミックスを圧電素材として用いた圧電振動素子でも構わない。
また、集積回路素子接続工程と端子部接続工程の順序を入れ替えても良く、端子部接続工程を先にすることで、集積回路素子搭載用のキャリアは不要になり、基板の分割によって得られた個々の基体をキャリアに搭載するといった煩雑な作業も一切不要となる。これによっても、圧電発振器の生産性が向上されるようになる。
The present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention.
In the above-described embodiment, the quartz resonator element using quartz as the piezoelectric material constituting the piezoelectric resonator element has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element used as the above may be used.
Further, the order of the integrated circuit element connection step and the terminal portion connection step may be changed. By carrying out the terminal portion connection step first, the carrier for mounting the integrated circuit element becomes unnecessary, and it is obtained by dividing the substrate. There is no need for complicated operations such as mounting individual substrates on the carrier. This also improves the productivity of the piezoelectric oscillator.

本発明の実施形態に係る圧電発振器の製造方法で形成された圧電発振器の一例を示す分解斜視図である。It is a disassembled perspective view which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which concerns on embodiment of this invention. 本発明の実施形態に係る圧電発振器の製造方法で形成された圧電発振器の一例を示す断面図である。It is sectional drawing which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which concerns on embodiment of this invention. (a)は、本発明の圧電発振器の製造方法で形成された圧電発振器の一例である水晶発振器を構成する容器体を実装側主面からみた斜視図であり、(b)は、本発明の圧電発振器の製造方法で形成された圧電発振器の一例である水晶発振器を実装側主面からみた斜視図である。(A) is the perspective view which looked at the container body which comprises the crystal oscillator which is an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator of this invention from the mounting side main surface, (b) is the present invention. It is the perspective view which looked at the crystal oscillator which is an example of the piezoelectric oscillator formed with the manufacturing method of a piezoelectric oscillator from the mounting side main surface. 本発明の第二の実施形態となる圧電発振器の製造方法で形成された圧電発振器の一例を示す断面図である。It is sectional drawing which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which becomes 2nd embodiment of this invention. 本発明の第三の実施形態となる圧電発振器の製造方法で形成された圧電発振器の一例を示す断面図である。It is sectional drawing which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which becomes 3rd embodiment of this invention. 本発明における圧電発振器の製造方法を、工程中の形態(a)から形態(d)を圧電発振器の断面図を用いて示した工程説明図である。It is process explanatory drawing which showed the manufacturing method of the piezoelectric oscillator in this invention using the sectional drawing of the piezoelectric oscillator from the form (a) to the form (d) in process. 本発明における圧電発振器の製造方法で用いられる絶縁基板並びに容器体を斜視図を用いて示した説明図である。It is explanatory drawing which showed the insulated substrate and container body used with the manufacturing method of the piezoelectric oscillator in this invention using the perspective view. 本発明における圧電発振器の製造方法を、図6(c)における形態を容器体の上方から見た平面図を用いて示した工程説明図である。It is process explanatory drawing which showed the manufacturing method of the piezoelectric oscillator in this invention using the top view which looked at the form in FIG.6 (c) from the upper direction of the container body. 従来における圧電発振器の一例である水晶発振器を示す分解斜視図である。It is a disassembled perspective view which shows the crystal oscillator which is an example of the conventional piezoelectric oscillator.

符号の説明Explanation of symbols

10・・・容器体
11・・・封止用導体パターン
12・・・端子部接続用電極端子
13・・・圧電振動素子搭載パッド
14・・・凹部空間
15・・・集積回路素子搭載パッド
16・・・モニタ用電極端子
20・・・圧電振動素子
21・・・励振用電極
30・・・蓋体
31・・・封止部材
40・・・絶縁基板
41・・・端子部
41a・・・外部接続用電極端子
41b・・・データ書込端子
42・・・開口部
43a、43b・・・金属膜層
50・・・集積回路素子
60・・・導電性接合材
70・・・導電性接着剤
80・・・絶縁性樹脂
90・・・圧電振動子
100・・・圧電発振器
X・・・基板領域
Y・・・捨代領域
DESCRIPTION OF SYMBOLS 10 ... Container body 11 ... Conductive pattern for sealing 12 ... Electrode terminal for terminal part connection 13 ... Piezoelectric vibration element mounting pad 14 ... Recessed space 15 ... Integrated circuit element mounting pad 16 ... Electrode terminal for monitoring 20 ... Piezoelectric vibration element 21 ... Electrode for excitation 30 ... Lid 31 ... Sealing member 40 ... Insulating substrate 41 ... Terminal part 41a ... External connection electrode terminal 41b ... data writing terminal 42 ... opening 43a, 43b ... metal film layer 50 ... integrated circuit element 60 ... conductive bonding material 70 ... conductive bonding Agent 80 ... Insulating resin 90 ... Piezoelectric vibrator 100 ... Piezoelectric oscillator X ... Substrate area Y ... Disposal area

Claims (5)

容器体内に圧電振動素子を搭載して、蓋体で気密封止した圧電振動子に集積回路素子を搭載し、圧電振動子に搭載用の端子部を設けた圧電発振器の製造方法であって、
平板状の絶縁基板に設けられた複数の開口部の側面から延出して前記容器体の下面に形成された端子部接続用電極端子に対応した位置に設けられる複数の端子部の前記絶縁基板の両主面と同一方向を向く面に金属膜層を形成する端子部形成工程と、
前記容器体の下面側に形成された集積回路素子搭載パッドに対応する接続パッドを向かい合わせた形態で集積回路素子を電気的且つ機械的に接続することで搭載する集積回路素子接続工程と、
前記端子部の金属膜層と容器体の端子部接続用電極端子とを接続する端子部接続工程と、 前記絶縁基板の前記開口部と前記端子部との境目で切断して複数個の圧電発振器を同時に得る切断分離工程と、
を具備することを特徴とする圧電発振器の製造方法。
A piezoelectric oscillator manufacturing method in which a piezoelectric vibration element is mounted in a container body, an integrated circuit element is mounted on a piezoelectric vibrator hermetically sealed with a lid, and a terminal portion for mounting is provided on the piezoelectric vibrator.
The insulating substrate of the plurality of terminal portions provided from the side surfaces of the plurality of openings provided in the flat insulating substrate and provided at positions corresponding to the terminal portion connecting electrode terminals formed on the lower surface of the container body. A terminal portion forming step of forming a metal film layer on a surface facing the same direction as both main surfaces;
An integrated circuit element connecting step of mounting by connecting the integrated circuit element electrically and mechanically in a face-to-face connection pad corresponding to the integrated circuit element mounting pad formed on the lower surface side of the container body;
A terminal part connection step of connecting the metal film layer of the terminal part and the terminal part connection electrode terminal of the container body; and a plurality of piezoelectric oscillators cut at a boundary between the opening part and the terminal part of the insulating substrate. Cutting and separating step to obtain simultaneously,
A method for manufacturing a piezoelectric oscillator, comprising:
前記集積回路素子の周囲を絶縁性樹脂により覆う工程を前記端子部接合工程後に具備することを特徴とする請求項1記載の圧電発振器の製造方法。   2. The method of manufacturing a piezoelectric oscillator according to claim 1, further comprising a step of covering the periphery of the integrated circuit element with an insulating resin after the terminal portion bonding step. 前記圧電発振器の前記複数の端子部のうち少なくとも2つをデータ書込端子とすると共に、前記データ書込端子を介して前記集積回路素子に温度補償データを入力し、前記集積回路素子内のメモリに前記温度補償データを格納する工程を前記切断分離工程後に具備することを特徴とする請求項1又は2記載の圧電発振器の製造方法。   At least two of the plurality of terminal portions of the piezoelectric oscillator are used as data write terminals, and temperature compensation data is input to the integrated circuit element through the data write terminal, and the memory in the integrated circuit element The method for manufacturing a piezoelectric oscillator according to claim 1, further comprising a step of storing the temperature compensation data in the cutting and separating step. 前記絶縁基板の端子部の一部がデータ書込端子となり、前記データ書込端子となる端子部の高さが他の端子部の高さより低いことを特徴とする請求項3記載の圧電発振器の製造方法。   4. The piezoelectric oscillator according to claim 3, wherein a part of the terminal portion of the insulating substrate serves as a data writing terminal, and a height of the terminal portion serving as the data writing terminal is lower than a height of another terminal portion. Production method. 前記絶縁基板の材質がシリコン、ガラス、ガラスエポキシ樹脂のうちいずれか1つであることを特徴とする請求項1乃至4のいずれか一項に記載の圧電発振器の製造方法。   5. The method for manufacturing a piezoelectric oscillator according to claim 1, wherein a material of the insulating substrate is any one of silicon, glass, and glass epoxy resin. 6.
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