JP2008252780A - Method of manufacturing piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a piezoelectric oscillator which is easy in handling during manufacturing and improves productivity. <P>SOLUTION: A manufacturing method of the present invention includes: a terminal part forming step of forming metal film layers on surfaces, turned toward the same direction as both principal surfaces of a substrate, of a plurality of terminal parts extending from side surfaces of a plurality of openings provided in the substrate, and being provided at positions corresponding to an electrode terminal for terminal part connections formed on another principal surface of a container body; an integrated circuit element connecting step of electrically and mechanically connecting an integrated circuit element to an integrated circuit element packaging pad provided on the other principal surface of the container body so as to package the integrated circuit element thereon; a terminal part connecting step of connecting the metal film layers of the terminal parts 41 with the electrode terminal for terminal part connection of the container body; a substrate inverting step of inverting the substrate such that its surface to which the container body is connected, comes down; and a cutting and separating step of simultaneously obtaining a plurality of piezoelectric oscillators by cutting the substrate on boundaries of the openings and the terminal parts. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a piezoelectric oscillator used in electronic equipment and the like.

FIG. 12 is a cross-sectional view showing a conventional piezoelectric oscillator. As shown in FIG. 12, a conventional piezoelectric oscillator 200 has a concave space 205 formed on one main surface of a substantially rectangular parallelepiped container body 201 made of a ceramic material or the like, and a piezoelectric vibration element formed on the bottom surface of the concave space 205. The piezoelectric vibration element 202 is mounted on the mounting pad 206.
Furthermore, a metal lid 204 is placed so as to cover the recessed space 205 of the container body 201 and is fixed to the top of the side wall of the container body 201, whereby the inside of the recessed space 205 is hermetically sealed.
Further, a structure in which the conductor 204 and the integrated circuit element 203 are bonded to the other main surface of the container body 201 by a conductive bonding material 207 is known. The conductor 204 is used as an external connection electrode terminal (see, for example, Patent Document 1).

Note that a conductor connecting electrode terminal 208 is provided on the other main surface of the container body 201. The conductor connecting electrode terminal 208 and the conductor 204 are connected to a conductive adhesive or solder or the like. The conductive body 204 is bonded to the container body 201 by conducting and fixing through the conductive bonding material 207.
As a method of bonding the conductor 204 to the container body 201, a conductive bonding material 207 such as a conductive adhesive or solder is applied to the conductor connection electrode terminal 208 formed on the other main surface of the container body 201. The conductor 204 was bonded to the conductor connecting electrode terminal 208 by applying, mounting one conductor 204 on each conductor connecting electrode terminal 208 of the container body 201, and performing heat treatment.

JP 2003-46251 A

  However, in the conventional method of manufacturing a piezoelectric oscillator, a conductive bonding material 207 such as a conductive adhesive or solder is applied to the conductor connection electrode terminal 208 formed on the other main surface of the container body 201, Since one conductor 204 is mounted on each conductor connection electrode terminal 208 of the container body 201 and heat treatment is performed after mounting all of the conductors 204, the conductor 204 is joined to the conductor connection electrode terminal. A complicated and highly accurate conductor mounting process for mounting one conductor 204 on each of the plurality of conductor connection electrode terminals 208 provided in each container body 201 is required, which decreases the productivity of the piezoelectric oscillator. There was a problem such as.

  Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a piezoelectric oscillator that is easy to handle during manufacture and improves productivity.

  The method for manufacturing a piezoelectric oscillator according to the present invention is made to solve the above-mentioned problems. A piezoelectric vibration element is mounted on a container body having a recessed space on one main surface, and a lid is formed in the recessed space. A piezoelectric oscillator manufacturing method in which an integrated circuit element is mounted on an integrated circuit element mounting pad provided on the other main surface of the container body, and a terminal portion for mounting is provided. Both main parts of the substrate of the plurality of terminal portions provided at positions corresponding to the electrode terminals for terminal portion connection provided on the other main surface of the container body extending from the side surfaces of the plurality of through-hole portions provided on the substrate A metal film layer forming step of forming a metal film layer on a surface facing the same direction as the surface, an integrated circuit element connecting step of mounting an integrated circuit element on an integrated circuit element mounting pad, a metal film layer of a terminal portion, and a container body Terminal portion connection step for connecting terminal portion connection electrode terminals, and container body A substrate reversing step for inverting the substrate so that the connected surface is down, and a surface different from the surface to which the container body is connected are cut at the boundary between the through-hole portion of the substrate and the terminal portion. And a cutting and separating step of simultaneously obtaining a plurality of piezoelectric oscillators.

  Further, a step of covering the periphery of the integrated circuit element with an insulating resin may be provided after the terminal portion bonding step.

  Further, the integrated circuit element includes a memory for storing temperature compensation data, and at least two of the plurality of terminal portions of the piezoelectric oscillator are data write terminals for writing temperature compensation data, and the data writing A step of inputting temperature compensation data to the integrated circuit element via a built-in terminal and storing the temperature compensation data in a memory in the integrated circuit element may be provided after the cutting and separating step.

  Further, a part of the terminal portion of the substrate may be a data write terminal, and the height of the terminal portion that becomes the data write terminal may be lower than the height of the other terminal portions.

  The material of the substrate may be any one of silicon, glass, and glass epoxy resin, which are insulating materials.

  Further, the substrate material may be any one of copper, SUS, and aluminum, which are metal materials.

  In addition, a stepped portion having a step height higher than the height of the integrated circuit element is formed in the terminal portion toward the container body, and a middle flat surface of the stepped portion is formed in a form facing the integrated circuit element. May be.

  According to the piezoelectric oscillator manufacturing method of the present invention, it corresponds to the terminal portion connection electrode terminal formed on the other main surface of the container body extending from the side surface of the plurality of openings provided in the flat substrate. By connecting the metal film layer formed on the plurality of terminal portions provided at the position and the terminal portion connection electrode terminals of the container body, all the terminal portions can be mounted on the container body at the same time. A piezoelectric oscillator can be easily manufactured without having to perform a complicated process of mounting conductors one by one on the container body. Therefore, the productivity of the piezoelectric oscillator can be improved.

  Also, after inverting the substrate so that the surface to which the container body is connected is down, cut from the surface different from the surface to which the container body is connected at the boundary between the through-hole portion and the terminal portion of the substrate Thus, by simultaneously obtaining a plurality of piezoelectric oscillators, it is possible to prevent burrs from being generated at the edge of the terminal portion on the piezoelectric oscillator mounting side. When mounted on an external electric circuit, it can be mounted stably.

  In addition, by filling the periphery of the integrated circuit element including a part of the surface of the terminal portion with an insulating resin, when the terminal portion is cut and separated from the substrate, the insulating resin absorbs stress generated in the terminal portion at the time of cutting. Since it becomes a material, it becomes possible to reduce problems such as peeling between the terminal portion and the terminal portion connecting electrode terminal due to stress at the time of cutting.

  In addition, a part of the terminal portion of the piezoelectric oscillator serves as a data write terminal, and the height of the terminal portion that serves as the data write terminal is lower than the height of the other terminal portions. Even when mounted, the wiring pattern formed on the surface of the mother board and the data write terminal do not contact each other, so that a stable oscillation frequency can be output.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. A case where quartz is used for the piezoelectric vibration element will be described.

(First embodiment)
FIG. 1 is an exploded perspective view showing an example of a piezoelectric oscillator formed by a method for manufacturing a piezoelectric oscillator according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing an example of a piezoelectric oscillator formed by a method for manufacturing a piezoelectric oscillator according to an embodiment of the present invention. Fig.3 (a) is the perspective view which looked at the container body used with the manufacturing method of the piezoelectric oscillator which concerns on embodiment of this invention from one main surface. FIG. 3B is a perspective view of the piezoelectric oscillator formed by the piezoelectric oscillator manufacturing method of the present invention as seen from the other main surface.
For the sake of clarity, a part of the structure unnecessary for the description is not shown. Further, the illustrated dimensions are partially exaggerated.

  The piezoelectric oscillator 100 shown in FIG. 1 to FIG. 3 mainly includes a piezoelectric vibrator 90 including a container body 10, a piezoelectric vibration element 20, and a lid body 30, an integrated circuit element 50, and a terminal portion 41. In the piezoelectric oscillator 100, a concave space 14 is formed on one main surface of the container body 10, a piezoelectric vibration element 20 is mounted in the concave space 14 of the container body 10, and the other main surface of the container body 10. In the structure, the integrated circuit element 50 is mounted and the terminal portion 41 is provided.

The piezoelectric vibration element 20 is formed by depositing an excitation electrode 21 on a quartz base plate. When an alternating voltage from the outside is applied to the quartz base plate via the excitation electrode 21, a predetermined vibration mode and An excitation is generated at a frequency.
The quartz base plate is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to external processing, and has a planar shape of, for example, a quadrangle.
The excitation electrode 21 is deposited and formed on both the front and back main surfaces of the quartz base plate.
Such a piezoelectric vibration element 20 includes an excitation electrode 21 attached to both main surfaces of the piezoelectric vibration element 20 and a piezoelectric vibration element mounting pad 13 formed in the recessed space 14 via a conductive adhesive 70. It is mounted in the recessed space 14 by being electrically and mechanically connected.

  Further, the integrated circuit element 50 is provided with an oscillation circuit or the like for generating an oscillation output from the piezoelectric vibration element 20 on a circuit forming surface, and an output signal generated by the oscillation circuit is a predetermined signal in the terminal portion 41. Are output to the outside of the piezoelectric oscillator 100 and used as a reference signal such as a clock signal, for example. The integrated circuit element 50 is mounted on an integrated circuit element mounting pad 15 formed on the other main surface of the container body 10.

The container body 10 is formed, for example, by laminating a plurality of insulating layers made of a ceramic material such as alumina ceramics or glass-ceramic, and one main surface of the container body 10 has a rectangular shape that opens to a central region. A recessed space 14 having a shape is formed. Further, an annular sealing conductor pattern 11 is formed on the entire circumference of the opening side top surface of the side wall portion of the container body 10 surrounding the recessed space 14. A piezoelectric vibration element mounting pad 13 is provided in the recessed space 14.
On the other main surface of the container body 10, an integrated circuit element mounting pad 15 for mechanically bonding the integrated circuit element 50 is connected to the central portion, and a terminal portion connection for mechanically bonding the terminal portion 41. Electrode terminals 12 are provided at a total of six locations between the four corners of the other main surface of the container body 10 and the four corners.

The sealing conductor pattern 11 is formed on the top surface of the side wall portion that forms the recessed space 14 of the container body 10.
Further, the inner peripheral edge of the sealing conductor pattern 11 is exposed on the inner wall surface of the recessed space 14, and the outer peripheral edge is exposed on the outer surface of the container body 10. The conductive pattern 11 for sealing improves the airtight reliability and productivity of the piezoelectric vibration element mounting space by improving the wettability of the sealing member 31 formed on the lid 30 for the lid 30 described later. Can do.

The piezoelectric vibration element mounting pad 13 is deposited on the bottom surface of the recessed space 14 and connected to the excitation electrode 21 of the piezoelectric vibration element 20.
In addition, the piezoelectric vibration element mounting pad 13 is electrically connected to the integrated circuit element 50 via the wiring conductor and via-hole conductor inside the container body 10 and the integrated circuit element connection electrode pad 14 formed on the bottom surface in the recessed space 11. Connected.

  The integrated circuit element mounting pad 15 is formed at the center of the other main surface of the container body 10. In addition, the integrated circuit element mounting pad 15 is electrically and mechanically connected to the connection pad formed on the integrated circuit element 50 via a conductive bonding material 60 such as solder or conductive adhesive. An electronic circuit in the integrated circuit element 50 is electrically connected to the crystal resonator element 20 and the terminal portion 41 via a wiring conductor, a via-hole conductor, and the like formed inside.

The terminal portion connection electrode terminals 12 are provided at a total of six locations between the four corners of the other main surface of the container body 10 and the four corners.
Further, the terminal connection electrode terminal 12 is mechanically and electrically bonded to the metal film layer 43a formed on the upper surface of the terminal portion 41 by a conductive bonding material 60 such as solder or a conductive adhesive. .

The terminal portion 41 is formed by integrally forming a substrate 40 that is a single plate of silicon, glass, glass epoxy resin, or the like by a conventionally known punching method or etching method.
The terminal portion 41 has a columnar shape having a height dimension higher than that of the integrated circuit element 50.
The terminal portion 41 extends from the side surfaces of the plurality of through-hole portions provided on the flat substrate toward the inner surface of the opposing through-hole portion, and is formed on the other main surface of the container body 10 of the piezoelectric vibrator 90. The metal film layers 43a and 43b, which are plated with Ni and Au on the surfaces of the plurality of terminal portions 41 provided at positions corresponding to the terminal connection electrode terminals 12 that face the same main surfaces of the substrate, are provided. It is formed by separating the terminal part 41.
The metal film layer 43a and the metal film layer 43b are electrically connected to each other by wirings or via holes formed inside or on the surface of the terminal portion 41.

  As described above, since the terminal portion 41 is formed by processing the substrate, when mounting on an external electric circuit such as a mother board as an external connection electrode terminal of the container body 10, a conductive bonding material such as solder is used. Even when electrically connected to the circuit wiring of the external electric circuit, the conductive bonding material does not crawl onto the surface of the terminal portion 41, so that it is possible to prevent a short circuit with other terminal portions or the integrated circuit element 50. .

  Each terminal portion 41 is used as a data write terminal 41b in addition to the external connection electrode terminal 41a (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control terminal) for each function. When the piezoelectric oscillator is mounted on an external electric circuit such as a mother board, the external connection electrode terminal 41a is electrically connected to the circuit wiring of the external electric circuit by soldering or the like. Further, the data write terminal 41b applies the probe needle of the temperature compensation data writing device and writes temperature compensation data corresponding to the temperature characteristics of the crystal resonator element 20, whereby the temperature compensation data is stored in the memory of the integrated circuit element 50. Stored. In addition, the terminal part 41 used as each electrode terminal is provided with a difference in outer shape depending on the use of the electrode terminal.

  Here, of the four external connection electrode terminals 41a, if the ground terminal and the oscillation output terminal are arranged close to each other, it is possible to effectively prevent noise from interfering with the oscillation signal output from the oscillation output terminal. be able to. Therefore, it is preferable to arrange the ground terminal and the oscillation output terminal close to each other.

The lid 30 is disposed and joined on the recessed space of the container body 10. The lid body 30 is provided with a sealing member 31 at a location facing the recessed space 11.
Moreover, such a sealing member 31 can relieve unevenness on the surface of the sealing conductor pattern 11 and prevent a decrease in hermeticity.

Next, a method for manufacturing the piezoelectric oscillator will be described with reference to FIGS.
Here, FIG. 4A is a cross-sectional view of the substrate showing the terminal portion forming step of the piezoelectric oscillator manufacturing method, and FIG. 4B is a cross-sectional view showing the integrated circuit element connecting step of the piezoelectric oscillator manufacturing method. FIG. 4C is a cross-sectional view showing a terminal portion connection step in the method for manufacturing a piezoelectric oscillator. FIG. 5A is a cross-sectional view showing a substrate inversion step of the method for manufacturing a piezoelectric oscillator, and FIG. 5B is a cross-sectional view showing a cutting and separating step of the method for manufacturing a piezoelectric oscillator. FIG. 6 is an external perspective view showing a state before the piezoelectric vibrator is mounted on the substrate. FIG. 7 is a plan view showing a state after the piezoelectric vibrator is mounted on the substrate.

The substrate 40 has a wafer shape, and has a configuration in which a substrate region X having terminal portions 41 and an abandoned region Y are adjacent to each other, and a plurality of these are arranged in a matrix. A through-hole portion 42 is provided in the 40 substrate regions X.
The terminal portion 41 corresponds to the terminal portion connecting electrode terminal 12 formed on the other main surface of the container body 10 so as to have a rectangular parallelepiped shape having a height dimension h higher than the height dimension of the integrated circuit element 50. A plurality of terminal portions 41 are arranged in series in such a manner that they are connected to the side surfaces in the through-hole portion 42 at the positions. By doing so, the integrated circuit element 50 does not come into contact with the motherboard or the like.
Such a substrate 40 is a conventionally known punching method or photo-etching process, which is a single plate formed of an insulating material such as silicon, glass, glass epoxy resin, or a metal material of copper, SUS, or aluminum. It is formed by law.

When the substrate 40 is made of silicon, a single crystal silicon ingot is sliced to a predetermined thickness to form a silicon wafer. The terminal portion 41 of each substrate region X of the silicon wafer is provided with a through hole (not shown), and a conductive material is provided in the through hole to form a metal formed on the upper and lower surfaces of the terminal portion. It is electrically connected to the film layers 43a and 43b.
In this case, the metal film layers 43a and 43b formed on the upper and lower surfaces of the terminal portion 41 are conductively connected through the through holes. The through hole can be formed by filling a conductive paste such as gold tin (Au—Sn).

When the substrate 40 is made of a glass material of borosilicate glass or soda glass, a corrosion-resistant film corresponding to the terminal portion 41 of each substrate region X of the substrate 40 is formed in advance, and then by a photoetching method or the like, Opening 42 is formed.
The corrosion resistant film corresponding to the terminal portion 41 of each substrate region X is peeled off to provide a through hole, and metal film layers 43 a and 43 b are formed on the upper and lower surfaces of the terminal portion 41.

  When the substrate 40 is made of a glass cloth base epoxy resin, a glass cloth base formed by weaving glass yarn is impregnated with a liquid precursor of epoxy resin, and the base is formed by polymerizing the precursor at a high temperature. The metal film layers 43a and 43b made of metal foil are formed by processing a metal foil such as a copper foil adhered to the base into a predetermined pattern using a conventionally known photo-etching method. Thereafter, an opening 42 is formed in the substrate region X of the substrate 40 by a conventionally known punching process or the like.

  When the substrate 40 is made of a metal material such as copper, SUS, or aluminum, a single plate made of this metal material is applied from a side surface of a plurality of openings provided in the substrate 40 by employing a well-known photo-etching process. Thus, the terminal portion 41 is provided at a position corresponding to the terminal portion connecting electrode terminal 12 formed on the other main surface of the container body 10.

(Metal film forming process)
First, in the terminal portion forming step shown in FIGS. 4A, 6, and 7, the other main surface of the container body 41 extends from the side surfaces of the plurality of openings 42 provided in the flat substrate 40. Metal film layers 43a and 43b are formed on the surfaces of the plurality of terminal portions 41 provided at positions corresponding to the terminal portion connection electrode terminals 12 formed in the same direction as both main surfaces of the substrate 40.
The cross-sectional view of the substrate 40 shown in FIG. 4A is a partial cross-sectional view taken along the virtual cutting line AA shown in FIG.

On the upper and lower surfaces of the terminal part 41, metal film layers 43a and 43b subjected to Ni plating and Au plating are formed. The metal film layers 43a and 43b formed on the upper and lower surfaces of the terminal portion 41 electrically connect the metal film layer 43a formed on the upper surface and the metal film layer 43b formed on the lower surface by wiring and via holes.
Moreover, in this embodiment, this board | substrate 40 is cut | disconnected from the terminal part 41 and the surplus area | region Y by the cutting | disconnection separation process mentioned later.

(Integrated circuit element connection process)
As shown in FIG. 4B, the integrated circuit element connecting step is a step of mounting and connecting an integrated circuit element on the integrated circuit element mounting pad.
The integrated circuit element 50 is electrically and mechanically connected in a form in which the connection pads corresponding to the functions determined by the integrated circuit element mounting pad 15 formed on the other main surface of the container body 10 face each other. Mount.
As the integrated circuit element 50, a rectangular flip-chip type integrated circuit element having a plurality of connection pads on the bonding surface is used. The integrated circuit element 50 is mounted such that a plurality of connection pads provided on the bonding surface thereof are in contact with each integrated circuit element mounting pad 15 of the container body 10 via a conductive bonding material. Then, the integrated circuit element 50 is connected to the container body 10 by melting the conductive bonding material by applying heat and then solidifying by cooling.

(Terminal connection process)
The terminal portion connecting step is a step of connecting the metal film layer 43a of the terminal portion 41 and the terminal portion connecting electrode terminal 12 of the container body 10 as shown in FIGS. 4 (c), 6 and 7.
The container body 10 in which the piezoelectric vibration element 20 made of crystal is accommodated and the integrated circuit element 50 is mounted is inserted so that the integrated circuit element 50 mounted and mounted in the opening 42 of the substrate 40 is inserted. The electrode part 12 for terminal part connection formed on the other main surface of the container body 10 constituting the piezoelectric vibrator 90 and the metal film layer 43a on the upper surface of each terminal part 41 formed on the substrate 40 are converted into a metal film. Piezoelectric vibrator constituted by the container body 10 on a plurality of predetermined terminal portions 41 of the substrate 40 by bonding to the layer 43a with a conductive bonding material 60 such as solder or conductive adhesive formed in a lump by a printing means. 90 is installed.

(Substrate reversal process)
The substrate reversing step is a step of reversing the substrate 40 so that the surface to which the container body 10 is connected faces downward, as shown in FIG.
The container body 10 mounted on a predetermined plurality of terminal portions 41 of the substrate 40 is turned over so that the container body 10 faces down. At that time, the lid 30 of the container body 10 is attached to the dicing tape 110.
The dicing tape 110 fixes the substrate 40 on the stage of the dicing apparatus and prevents the individual substrates 40 from scattering during the cutting and separating process. The dicing tape 110 was mounted on the substrate 40 by placing the substrate 40 at a predetermined position on the stage to which the dicing tape 110 was attached, with the lid 30 of the container body 10 facing downward. Attached to the lid 30 of the container body 10.

(Cutting and separation process)
In the cutting and separating step, as shown in FIGS. 5B and 7, cutting is performed at a boundary between the opening 42 of the substrate 40 and the terminal portion 41 from a surface different from the surface to which the container body 10 is connected. Thus, a plurality of piezoelectric oscillators 100 are obtained simultaneously.
By disconnecting the connecting portion (two-dot chain line portion) between the separation region Y of each substrate 40 and the terminal portion 41 of the substrate region X, each terminal portion 41 is separated from the separation region Y, and a plurality of piezoelectric oscillators 100 are separated. Get at the same time. The substrate 40 is cut by dicing using a dicer or the like, and through the cutting step, a plurality of piezoelectric oscillators in which the terminal portion 41 forms various functions of the external connection electrode terminal 41a and the data writing terminal 41b. 100 is obtained simultaneously.
In this way, after the substrate 40 is inverted so that the surface to which the container body 10 is connected is downward, the boundary between the opening 42 and the terminal portion 41 of the substrate 40 from the surface to which the terminal portion is connected. By cutting at the same time and obtaining a plurality of piezoelectric oscillators 100, it is possible to prevent burrs from being generated on the surface of the terminal portion 41 connected to an external electric circuit such as a mother board, and to connect the terminal portion 41 to the container body 10 externally. As the electrode terminal 41a, it can be stably mounted when mounted on an external electric circuit such as a mother board. In addition, the substrate 40 needs to be inverted in order for the dicer to descend from above.

  In the case where the piezoelectric oscillator 100 has a temperature compensation function, the temperature compensation data is supplied to the integrated circuit element 50 via the data write terminal 41b of the terminal portion 41 obtained by cutting and separating each terminal portion 41 from the separation region Y. The temperature compensation data is input and stored in the memory in the integrated circuit element 50. In such temperature compensation data writing operation, the temperature compensation data created in accordance with the temperature characteristics of the crystal resonator element 20 is applied to the integrated circuit by applying the probe needle of the temperature compensation data writing device to the data write terminal 41b. This is performed by inputting to a memory provided in the temperature compensation circuit of the element 50 and storing it. Here, the temperature compensation data written in the integrated circuit element 50 is for correcting the temperature characteristic variation for each crystal oscillation element 20, and the temperature of the crystal oscillation element 20 used in the temperature compensation type crystal oscillator. It is obtained by measuring the characteristics in advance.

(Second embodiment)
FIG. 8 is a cross-sectional view showing an example of a piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator according to the second embodiment of the present invention.
After the through-hole portion 42 is formed in the substrate 40 at the time of the terminal portion forming step, the step of reducing the thickness of the terminal portion 41b by a photo-etching method or the like is performed again only on the terminal portion 41b that becomes the data writing terminal. This is different from the first embodiment. Therefore, the height of the terminal portion 41b serving as the data write terminal is lower than the height of the other terminal portions 41a.
In this way, even when the piezoelectric oscillator 100 is mounted on an external electric circuit such as a mother board, the wiring pattern formed on the mother board surface and the data writing terminal are not unnecessarily brought into contact with each other. It is possible to output the oscillation frequency.

(Third embodiment)
FIG. 9 is a cross-sectional view showing an example of a piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator according to the third embodiment of the present invention.
It differs from the first embodiment in that an insulating resin forming step is performed between the terminal portion connecting step and the cutting and separating step.
In the insulating resin forming step, the periphery of the integrated circuit element 50 is covered with the insulating resin 80 by applying the insulating resin 80 into the opening 42 of the substrate 41 and curing it.
The insulating resin 80 is often made of epoxy, polyimide, or the like, and is made of a thermoplastic resin that has the property of flowing when softened or melted by heating.
As described above, since the periphery of the integrated circuit element 50 is covered and protected by the insulating resin 80, it is possible to prevent the frequency from fluctuating due to the influence of foreign matter or the like.
In addition, since the periphery of the integrated circuit element 50 is covered with the insulating resin 80 when the terminal portion 41 is cut and separated from the discarded region Y of the substrate 40, the insulating resin 80 becomes the terminal portion 41 at the time of cutting. Since it becomes a buffer material for the generated stress, it is possible to further reduce problems such as peeling between the terminal portion 41 and the terminal portion connection electrode terminal 12 due to stress at the time of cutting.

(Fourth embodiment)
FIG. 10 is a cross-sectional view showing an example of a piezoelectric oscillator formed by the piezoelectric oscillator manufacturing method according to the fourth embodiment of the present invention.
FIG. 11 is a perspective view of a substrate and a container body showing a state before the piezoelectric vibrator to which the integrated circuit element is connected is mounted on the substrate in the piezoelectric oscillator manufacturing method according to the fourth embodiment of the present invention. It is explanatory drawing shown using.
The first embodiment is different from the first embodiment in that, after the opening 42 is formed in the substrate 40 at the time of the terminal portion forming step, the step portions 44 are formed by performing the photo-etching method again on all the terminal portions 41. Different.
The container body 10 in which the crystal resonator element 20 is accommodated and the integrated circuit element 50 is attached and mounted is formed by the middle flat surface 44b and the step wall 44c of the step portion 44 formed in the opening portion 42 and each terminal portion 41 of the substrate. The integrated circuit element 50 is inserted into the inserted portion 45 so as to face the middle flat surface 44b, and the terminal portion connecting electrode terminal 12 and the metal film 43a formed on the upper flat surface 44a of the stepped portion 44 are connected to each other. The terminal portion 41 is mounted on the terminal portion 41 of the substrate 40 by being bonded to the upper surface of the terminal portion 41 by a conductive bonding material 60 such as solder or conductive adhesive formed in a lump by printing means.
The width size k of the integrated circuit element 50 can be inserted into the stepped wall surface 44c opposite to the surface 44d of the terminal portion where the plurality of terminal portions 41 arranged in series are connected to the discarding portion 42. Leave a good interval.
Since part of the terminal portion 41 can be extended on the main surface opposite to the connection-side main surface of the integrated circuit element 50, even when the piezoelectric oscillator 100 needs to be downsized. It is possible to secure a connection area when connecting to a required external electric circuit such as a mother board of the terminal portion 41.

In addition, this invention is not limited to the said embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
In the above-described embodiment, the crystal resonator element using quartz as the piezoelectric material constituting the piezoelectric resonator element 20 has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is piezoelectric. A piezoelectric vibration element used as a material may be used.
Further, the order of the integrated circuit element connection step and the terminal portion connection step may be changed. By carrying out the terminal portion connection step first, the carrier for mounting the integrated circuit element becomes unnecessary, and it is obtained by dividing the substrate. There is no need for complicated operations such as mounting the individual container bodies 10 on the carrier. This also improves the productivity of the piezoelectric oscillator.

  The conductive adhesive 70 contains a conductive filler in a silicone resin, and examples of the conductive powder include aluminum (Al), molybdenum (Mo), tungsten (W), and platinum (Pt). , Palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or a combination thereof is used.

  When the container body 10 is made of alumina ceramics, a sealing conductor pattern 11 and terminal portion connection electrodes are formed on the surface of a ceramic green sheet obtained by adding and mixing an appropriate organic solvent to a predetermined ceramic material powder. Conductor paste that becomes the terminal 12, the piezoelectric vibration element mounting pad 13, the integrated circuit element mounting pad 15 and the like, and the conductor that becomes the via conductor in the through-hole that has been previously punched by punching the ceramic green sheet The paste is applied by conventionally known screen printing, and a plurality of the pastes are laminated and press-molded, and then fired at a high temperature.

  The sealing conductor pattern 11 includes, for example, a nickel (Ni) layer and a gold (Au) layer sequentially on the surface of a base layer made of tungsten (W), molybdenum (Mo), etc., and surrounds the recess space 14 in an annular shape. By making it adhere in the form which does, it is formed in the thickness of 10 micrometers-25 micrometers.

  Further, the lid 30 disposed on the container body 10 is manufactured by adopting a conventionally known metal processing method and shaping a metal such as 42 alloy into a predetermined shape. A nickel (Ni) layer is formed on the upper surface of the lid body 30, and further, gold tin (Au—Sn) which is a sealing member 31 at least at a location facing the sealing conductor pattern 11 on the upper surface of the nickel (Ni) layer. ) Layer is formed. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin.

  Further, as shown in FIG. 3, the monitor electrode terminal 16 may be formed on the other main surface of the container body 10. The monitor electrode terminal 16 is electrically connected to the piezoelectric vibration element 20 mounted in the container body 10 and is electrically connected to the electro-vibration element 20 such as a CI (crystal impedance) value and a resonance frequency value. Used to measure properties.

It is a disassembled perspective view which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which concerns on embodiment of this invention. It is sectional drawing which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which concerns on embodiment of this invention. (A) is the perspective view which looked at the container body which comprises the crystal oscillator which is an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator of this invention from the other main surface, (b) is the present invention. It is the perspective view which looked at the crystal oscillator which is an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator from the other main surface. (A) is process explanatory drawing which showed the metal film layer formation process of the manufacturing method of the piezoelectric oscillator in this invention using sectional drawing, (b) is a cross-sectional view of the integrated circuit element connection process of the manufacturing method of a piezoelectric oscillator. It is process explanatory drawing shown using the figure, (c) is process explanatory drawing which showed the terminal part connection process of the manufacturing method of a piezoelectric oscillator using sectional drawing. (A) is process explanatory drawing which showed the board | substrate inversion process of the manufacturing method of the piezoelectric oscillator in this invention using sectional drawing, (b) is sectional drawing about the integrated circuit element connection process of the manufacturing method of a piezoelectric oscillator. It is process explanatory drawing shown using. In the method for manufacturing a piezoelectric oscillator according to the present invention, the substrate and the container body showing a state before mounting the piezoelectric vibrator to which the integrated circuit element is connected to the substrate are shown using perspective views. In the manufacturing method of the piezoelectric oscillator in this invention, it is the top view which looked at the form in FIG.4 (c) from the upper direction of the cover body. It is sectional drawing which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which becomes 2nd embodiment of this invention. It is sectional drawing which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which becomes 3rd embodiment of this invention. It is sectional drawing which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator used as 4th embodiment of this invention. In the piezoelectric oscillator manufacturing method according to the fourth embodiment of the present invention, the substrate and the container body showing the state before mounting the piezoelectric vibrator to which the integrated circuit element is connected to the substrate are shown using perspective views. It is explanatory drawing. It is sectional drawing which shows the crystal oscillator which is an example of the conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Container body 11 ... Conductive pattern for sealing 12 ... Electrode terminal for terminal part connection 13 ... Piezoelectric vibration element mounting pad 14 ... Recessed space 15 ... Integrated circuit element mounting pad 16 ... Electrode terminal for monitoring 20 ... Piezoelectric vibration element 21 ... Electrode for excitation 30 ... Lid 31 ... Sealing member 40 ... Substrate 41 ... Terminal part 41a ... External Connection electrode terminal 41b ... Data writing terminal 42 ... Opening 43a, 43b ... Metal film layer 44 ... Step part 44a ... Upper plane 44b ... Middle plane 44c ... Step Wall surface 44d ... Discarded portion connection surface 45 ... Insertion portion 50 ... Integrated circuit element 60 ... Conductive bonding material 70 ... Conductive adhesive 80 ... Insulating resin 90 ... Piezoelectric vibrator 100 ... piezoelectric oscillator 110 ... die Ngutepu X ··· substrate region Y ··· 捨代 area

Claims (7)

An integrated circuit element mounting pad provided on the other main surface of the container body, wherein a piezoelectric vibration element is mounted on a container body having a concave space on one main surface, the inside of the concave space is hermetically sealed with a lid. A method of manufacturing a piezoelectric oscillator having an integrated circuit element mounted thereon and provided with a terminal portion for mounting,
The plurality of terminal portions provided at positions corresponding to the terminal portion connection electrode terminals provided on the other main surface of the container body extending from the side surfaces of the plurality of through-hole portions provided on the flat substrate. A metal film layer forming step of forming a metal film layer on a surface facing the same direction as both main surfaces of the substrate;
An integrated circuit element connecting step of mounting an integrated circuit element on the integrated circuit element mounting pad;
A terminal part connecting step of connecting the metal film layer of the terminal part and a terminal part connecting electrode terminal of the container body; and a substrate reversing step of inverting the substrate so that a surface to which the container body is connected is down. When,
A cutting and separating step of simultaneously obtaining a plurality of piezoelectric oscillators by cutting at a boundary between the through-hole portion and the terminal portion of the substrate from a surface different from the surface to which the container body is connected,
A method for manufacturing a piezoelectric oscillator, comprising:   The method for manufacturing a piezoelectric oscillator according to claim 1, further comprising a step of covering the periphery of the integrated circuit element with an insulating resin after the terminal portion connecting step.   The integrated circuit element includes a memory for storing temperature compensation data, and at least two of the plurality of terminal portions of the piezoelectric oscillator serve as data write terminals for writing temperature compensation data, and the data write terminal 2. The method according to claim 1, further comprising: a step of inputting temperature compensation data to the integrated circuit element via an interface and storing the temperature compensation data in a memory in the integrated circuit element after the cutting and separating step. 3. A method for manufacturing a piezoelectric oscillator according to 2.   4. The method of manufacturing a piezoelectric oscillator according to claim 3, wherein a height of a terminal portion serving as the data writing terminal is lower than a height of other terminal portions.   5. The method for manufacturing a piezoelectric oscillator according to claim 1, wherein a material of the substrate is any one of silicon, glass, and glass epoxy resin, which is an insulating material.   5. The method of manufacturing a piezoelectric oscillator according to claim 1, wherein a material of the substrate is any one of copper, SUS, and aluminum which are metal materials.   A step portion having a step height higher than the height of the integrated circuit element is formed on the terminal portion toward the container body, and a middle plane of the step portion is formed in a form facing the integrated circuit element. The method for manufacturing a piezoelectric oscillator according to claim 6.

Images