JP2007043462A - Piezoelectric oscillator and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator and electronic equipment which are easily manufactured, are thin, and have small plain surface size. <P>SOLUTION: The piezoelectric oscillator 10 has a piezoelectric vibrator 20 and an IC chip 40 equipped with a circuit for oscillating the piezoelectric vibrator 20. A mount electrode part 50 having a step part 52 is joined to each angle part on one surface of the electric vibrator 20, the IC chip 40 and the step part 52 are electrically connected, and the piezoelectric oscillator 20, the IC chip 40, and the mount electrode part 50 are covered with a sealing body, while exposing a mount surface 58 provided to the lower surface of the mount electrode part 50. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a piezoelectric oscillator and an electronic apparatus, and more particularly to a piezoelectric oscillator and an electronic apparatus in which an IC chip including a piezoelectric vibrator and a circuit for oscillating the piezoelectric vibrator is covered with a sealing body.

  Piezoelectric oscillators have a piezoelectric vibrator mounted with a piezoelectric vibrating piece and a circuit that oscillates this piezoelectric vibrator with leads and the periphery of which is sealed with resin, or provided in a ceramic package There is a configuration in which a piezoelectric vibrating piece and a circuit for oscillating the piezoelectric vibrating piece are mounted in the recessed portion, and the recessed portion is sealed with a lid. A specific configuration of a piezoelectric oscillator in which a piezoelectric vibrator and a circuit are connected with leads and these are sealed with resin is as follows.

  That is, in the piezoelectric oscillator, an IC chip including a circuit for oscillating the piezoelectric vibrator is provided on the back surface of the piezoelectric vibrator in which the piezoelectric vibrating piece is mounted, and a lead portion is provided at a position overlapping the external terminal of the piezoelectric vibrator. Insulated and fixed, the piezoelectric vibrator and the IC chip, and the lead portion and the IC chip are connected by wires. The piezoelectric oscillator is configured by resin molding so as to cover the piezoelectric vibrator, the IC chip, the inner lead portion of the lead portion, and the like, and bending the lead portion protruding from the resin mold (for example, see Patent Document 1). reference).

In addition, there is a piezoelectric oscillator having a structure in which a laminated lead frame composed of an upper lead frame and a lower lead frame is disposed below the piezoelectric vibrator, and an IC is mounted on the lower lead frame (for example, (See Patent Document 2).
JP 2004-297770 A JP 2005-33755 A

In recent years, as electronic devices on which piezoelectric oscillators are mounted have been reduced in size, piezoelectric oscillators are also required to be thinner and smaller in plane size. For this reason, there is a demand for piezoelectric oscillators to reduce the thickness and the planar size even with a few millimeters of commas. However, each component that constitutes a piezoelectric oscillator, such as a package, lead, and IC chip, has a thickness that is limited to ensure the minimum strength of each component, and is limited to ensure the function of the component. Therefore, it is difficult to reduce the thickness and the planar size easily.
And in piezoelectric oscillators with a configuration where the periphery of the piezoelectric vibrator, IC chip, etc. is sealed with resin, the thickness of mounting the IC chip is obtained by bending the lead or using a laminated frame, so the thickness is reduced It was difficult to do.

  Also, in a piezoelectric oscillator in which a piezoelectric vibrating piece or IC chip is mounted on a ceramic package, after mounting the piezoelectric vibrating piece and IC chip on the recessed portion of the package, the recessed portion is hermetically sealed. There is a risk of it. That is, for example, since the piezoelectric vibrating piece cannot be oscillated due to the influence of air resistance or the like unless it is hermetically sealed, it is possible to inspect whether the piezoelectric vibrating piece is good or defective before the hermetic sealing. There is a risk that a defective product may be mounted on the package.

If a defective piezoelectric vibrator and a non-defective IC chip are mounted in a recessed portion of the package and the recessed portion is hermetically sealed, and the piezoelectric oscillator is determined to be defective, the piezoelectric oscillator is discarded. Will be. For this reason, a good IC chip is also discarded, and there is a problem that the cost of the piezoelectric oscillator is increased.
An object of the present invention is to provide a piezoelectric oscillator and an electronic device that can be easily manufactured and are thin and have a small plane size.

  In order to achieve the above object, a piezoelectric oscillator according to the present invention includes a piezoelectric vibrator and an IC chip including a circuit for oscillating the piezoelectric vibrator, and each angle on one surface of the piezoelectric vibrator. Bonding the mounting electrode part having a step part to the part, electrically connecting the IC chip and the step part, and exposing the mounting surface provided on the lower surface of the mounting electrode part, The IC chip and the mounting electrode part are covered with a sealing body. In this case, the step portion is formed by half etching or press working.

  Since the mounting electrode portion is formed of a single lead frame that is slightly thicker than the height of the IC chip and the wire, the piezoelectric oscillator can be thinned. Further, the stepped portion is formed by notching the mounting electrode portion along the vertical direction by using half etching or pressing, so that the planar size can be reduced. Therefore, the planar size of the piezoelectric oscillator can be reduced. Further, since the step portion is formed by half etching or press working, it can be easily formed. Furthermore, since the piezoelectric oscillator is formed by combining the already-completed piezoelectric vibrator and the IC chip, the piezoelectric vibrator and the IC chip before joining the piezoelectric vibrator, the IC chip, and the mounting electrode portion. If a defective product is removed by inspecting the operation and the like, a piezoelectric oscillator can be manufactured by combining only good products. Therefore, waste due to the use of defective products is eliminated, and the cost of the piezoelectric oscillator can be reduced.

  The piezoelectric oscillator according to the present invention includes a piezoelectric vibrator, an IC chip including a circuit for oscillating the piezoelectric vibrator, and an upper step surface and a lower step surface connected by a surface along the vertical direction, A mounting electrode portion having a step portion electrically connected to the IC chip, having a mounting surface on a lower surface, and having an upper surface fixed to one surface of the piezoelectric vibrator, and the piezoelectric while exposing the mounting surface And a sealing body that covers the vibrator, the IC chip, and the mounting electrode portion.

  Since the mounting electrode portion is formed of a single lead frame that is slightly thicker than the height of the IC chip and the wire, the piezoelectric oscillator can be thinned. Further, since the step portion is formed by connecting the upper step surface and the lower step surface by a surface along the vertical direction, the size in the planar direction can be reduced. Therefore, the planar size of the piezoelectric oscillator can be reduced. Further, since the step portion is formed by half etching or press working, it can be easily formed. Furthermore, since the piezoelectric oscillator is formed by combining the already-completed piezoelectric vibrator and the IC chip, the piezoelectric vibrator and the IC chip before joining the piezoelectric vibrator, the IC chip, and the mounting electrode portion. If a defective product is removed by inspecting the operation and the like, a piezoelectric oscillator can be manufactured by combining only good products. Therefore, waste due to the use of defective products is eliminated, and the cost of the piezoelectric oscillator can be reduced.

  In this case, the IC chip is fixed to one surface of the piezoelectric vibrator, a wire is bonded to the IC chip and the piezoelectric vibrator, and the step portion is provided on the mounting electrode part. A wire is bonded to the surface of the step portion opposite to the piezoelectric vibrator and the IC chip. Since the piezoelectric vibrator and the IC chip are directly fixed, the piezoelectric oscillator can be thinned.

  The step portion is provided between an upper surface and a lower surface of the mounting electrode portion, a die pad to which the IC chip is fixed is disposed in a gap between the mounting electrode portions, and a wire is provided between the step portion and the IC chip. It is characterized by being joined. Since the height from the upper surface of the mounting electrode portion to the upper surface of the stepped portion should be slightly higher than the sum of the height of the IC chip and the height of the wire, the piezoelectric oscillator can be made thinner. In addition, since the lower surface of the step portion is also cut away, the bonding area between the mounting electrode portion and the sealing body is increased, and the mounting electrode portion can be prevented from falling off the sealing body.

  In addition, a writing terminal is provided between the mounting electrode portions, and a step portion where a wire conducting with the IC chip is joined is provided at a tip portion of the writing terminal. Thus, even after the piezoelectric oscillator is formed, data can be written to the IC chip via the write terminal, so that a piezoelectric oscillator with desired characteristics can be obtained.

  Further, the mounting electrode portion is provided with a notch portion. Since the notched portion can increase the bonding area between the mounting electrode portion and the sealing body, the mounting electrode portion can be prevented from falling off the sealing body. Further, by providing a notch according to the planar size of the IC chip fixed to one surface of the piezoelectric vibrator, an IC chip having a large planar size can be fixed to one surface of the piezoelectric vibrator.

  The mounting electrode portion is formed of a lead frame. As a result, the piezoelectric oscillator uses a lead frame in which a step portion is formed by half etching or press working, and therefore can be manufactured easily and inexpensively.

  Hereinafter, the best embodiments of the piezoelectric oscillator and the electronic apparatus according to the present invention will be described. First, the first embodiment will be described. FIG. 1 is an explanatory diagram of the piezoelectric oscillator according to the first embodiment. 1A is a schematic plan view of the piezoelectric oscillator, FIG. 1B is a schematic cross-sectional view taken along line AA of FIG. 1C, and FIG. 1C is a schematic bottom view. is there. Note that the sealing body is not illustrated in FIGS. 1A and 1C. FIG. 2 is a schematic sectional view of the piezoelectric vibrator.

  A piezoelectric oscillator 10 shown in FIG. 1 has a piezoelectric vibrator 20, and an integrated circuit (IC) chip 40 is disposed on one surface of the piezoelectric vibrator 20, and each angle on the one surface is arranged. The mounting electrode part 50 provided with the step part 52 is joined to the part, and the IC chip 40 and the step part 52 are electrically connected.

  Specifically, the configuration is as follows. That is, the piezoelectric vibrator 20 shown in FIG. 2 includes a package base 22, and an external terminal 24 is provided on the back surface. The external terminal 24 is provided at a position where it does not overlap with the IC chip 40 and the mounting electrode section 50, that is, at a position excluding the corner and center of the package base 22. Further, the package base 22 is provided with a recessed portion 26 inside, and a connection electrode 28 is provided on the bottom surface thereof. The connection electrode 28 is electrically connected to the external terminal 24. In addition, a piezoelectric vibrating piece 32 is bonded to the connection electrode 28 using a conductive adhesive 30. The piezoelectric vibrating piece 32 may be a piezoelectric vibrating piece such as an AT cut, a tuning fork type piezoelectric vibrating piece, a surface acoustic wave element piece, or the like. A lid 34 that hermetically seals the recessed portion 26 is joined to the upper portion of the package base 22.

  An IC chip 40 having a circuit that oscillates the piezoelectric vibrator 20 is fixed to the back surface of the piezoelectric vibrator 20 as shown in FIG. More specifically, the IC chip 40 is fixed to the central portion of the piezoelectric vibrator 20 with the active surface provided with the pads 42 facing away from the piezoelectric vibrator 20. The IC chip 40 includes a circuit that performs temperature compensation in order to increase the stability of the frequency output from the piezoelectric vibrator 20 and a circuit that controls the frequency output from the piezoelectric vibrator 20 according to the set voltage. You can also.

  The mounting electrode portion 50 is formed of a lead frame, and the lower surface serves as a mounting surface 58 when bonded to a mounting substrate (not shown). A part of the upper surface of the mounting electrode unit 50 is fixed to the corner of the piezoelectric vibrator 20. That is, as shown in FIGS. 1A and 1C, the mounting electrode unit 50 is provided at each corner of the piezoelectric oscillator 10, and the piezoelectric vibrator 20 is provided at the center of the piezoelectric oscillator 10. . Further, a stepped portion 52 formed by half etching or pressing is provided in a part of the lower side of the mounting electrode portion 50.

More specifically, as shown in FIG. 1C, the mounting electrode unit 50 is provided with a stepped portion 52 on the center side of the piezoelectric oscillator 10. The stepped portion 52 is provided with a cutout portion 54 on the side close to the IC chip 40. Thus, as shown in FIG. 1B, the mounting electrode portion 50 is provided with the step portion 52 so that a part thereof is formed in an L shape in side view. A wire 56 for electrical connection with the IC chip 40 is joined to the step portion 52. The height of the mounting electrode unit 50 is higher than the total height of the IC chip 40 and the wire 56.
The periphery of the piezoelectric vibrator 20, the IC chip 40, and the mounting electrode unit 50 is covered with a sealing body 14 such as a resin while the mounting surface 58 of the mounting electrode unit 50 is exposed.

  Next, a method for manufacturing the piezoelectric oscillator 10 will be described. First, the mounting electrode portion 50 of the piezoelectric oscillator 10 is formed of a lead frame, and a predetermined step portion 52 of the mounting electrode portion 50 is half-etched or pressed to form a stepped portion 52 thinner than the other portions. In the piezoelectric vibrator 20, after the piezoelectric vibrating piece 32 is mounted on the package base 22 using the conductive adhesive 30, the lid 34 is joined on the package base 22 so that the piezoelectric vibrating piece 32 is vacuumed or inactive. It is hermetically sealed with gas. Thereafter, an inspection such as whether or not the piezoelectric vibrator 20 moves normally may be performed.

  Then, the piezoelectric vibrator 20 is fixed on the lead frame. At this time, if the lead frame and the piezoelectric vibrator 20 are joined using a non-conductive adhesive, even if the adhesive flows out from the joint, the mounting electrode parts 50 are short-circuited with each other, A short circuit of the terminal 24 can be prevented. Thereafter, the IC chip 40 is fixed to the back surface of the piezoelectric vibrator 20. For example, a silver paste may be used for joining the piezoelectric vibrator 20 and the IC chip 40. Before the IC chip 40 is fixed to the piezoelectric vibrator 20, it may be inspected whether the IC chip 40 operates normally.

  Thereafter, wire bonding is applied to the pad 42 provided on the active surface of the IC chip 40 and the stepped portion 52 of the mounting electrode portion 50, and these are conducted by the wire 56. Then, the sealing body 14 covers the periphery of the piezoelectric vibrator 20, the IC chip 40, the mounting electrode unit 50, the wire 56, and the like except for the portion that becomes the mounting surface 58 of the mounting electrode unit 50. This sealing body 14 should just be formed, for example with resin. Finally, the lead frame protruding from the sealing body 14 is cut to form the piezoelectric oscillator 10.

  In such a piezoelectric oscillator 10, the mounting electrode unit 50 is formed by a single lead frame that is thicker than the height of the IC chip 40 and the wire 56. There is no need to earn, and the piezoelectric oscillator 10 can be thinned. The portion of the mounting electrode portion 50 where the stepped portion 52 is not provided needs only to be slightly thicker than the height of the IC chip 40 and the wire 56, and the height of the stepped portion 52 may be about the height of the IC chip 40. Therefore, sufficient strength can be secured. Further, since the periphery of the mounting electrode portion 50 and the like is covered with the sealing body 14, the piezoelectric oscillator 10 can obtain sufficient strength. Furthermore, since the piezoelectric oscillator 10 uses the lead frame in which the step portion 52 is formed by half etching or the like, it can be manufactured easily and inexpensively.

  FIG. 3 is a cross-sectional view for explaining that the planar size differs depending on the step of forming the stepped portion. Here, FIG. 3A is a cross-sectional view of a lead frame in which a step portion is formed by bending, and FIG. 3B is a cross-sectional view of a lead frame in which a step portion is formed by half etching. Since the lead frame 60 shown in FIG. 3A is bent to form a stepped portion, a part of the lead frame 60 that is bent obliquely is provided. That is, the upper step surface 62 and the lower step surface 64 are connected by the oblique surface 66. On the other hand, as shown in FIG. 3B, the mounting electrode portion 50 according to the present embodiment has the stepped portion 52 formed by half etching or the like, so the upper stepped surface 68 and the lower stepped surface. 70 (mounting surface 58) can be connected by a surface 72 along the vertical direction. Thereby, in this embodiment, while the planar size of the mounting electrode part 50 can be made small, the level | step-difference part 52 can be formed easily. Accordingly, the plane size of the piezoelectric oscillator 10 can be reduced.

  Further, when the piezoelectric oscillator 10 is manufactured, before the piezoelectric vibrator 20, the IC chip 40, and the mounting electrode unit 50 are joined, the operation of the piezoelectric vibrator 20 or the IC chip 40 is inspected to remove defective products. Since the piezoelectric oscillator 10 can be manufactured by combining only non-defective products, waste due to the use of defective products is eliminated and the cost can be reduced.

  The piezoelectric oscillator 10 exposes the mounting surface 58 of the mounting electrode unit 50 and covers the piezoelectric vibrator 20, the IC chip 40, the wire 56, and the mounting electrode unit 50 with the sealing body 14. It is possible to insulate the whole, and it is possible to prevent a failure such as the wire 56 being cut or a dust from entering inside.

  The piezoelectric oscillator 10 described above can be provided with a write terminal. FIG. 4 is a schematic bottom view of a piezoelectric oscillator provided with a write terminal. In addition, description of the sealing body is abbreviate | omitted in FIG. The write terminal 80 is used when writing data for frequency adjustment or the like to the IC chip 40. The writing terminal 80 is formed of a lead frame, and a stepped portion 82 formed by half etching or pressing is provided at the tip. The write terminal 80 is disposed between the mounting electrode portions 50 on the short side of the piezoelectric oscillator 10 as shown in FIG. 4A, and the piezoelectric oscillator 10 as shown in FIG. 4B. It is arrange | positioned between the mounting electrode parts 50 in the long side. The write terminals 80 can be disposed between the mounting electrode portions 50 on the short side of the piezoelectric oscillator 10 and between the mounting electrode portions 50 on the long side. Further, as shown in FIG. 4B, a plurality of writing terminals 80 can be provided between the mounting electrode portions 50. Note that the position where the write terminal 80 is disposed may be determined as appropriate in consideration of the position of the pad 42 provided on the active surface of the IC chip 40 and the position of the external terminal 24 provided on the piezoelectric vibrator 20. Good.

  Such a write terminal 80 is cut off by projecting from the sealing body 14 after covering the piezoelectric vibrator 20 and the IC chip 40 with the sealing body 14 first. After that, a probe or the like is brought into contact with the writing terminal 80 protruding from the sealing body 14 to write data to the IC chip 40, and then the protruding writing terminal 80 is cut along the surface of the sealing body 14. That's fine. Thereby, the piezoelectric oscillator 10 can obtain desired characteristics.

  The mounting electrode unit 50 of the piezoelectric oscillator 10 may have the following configuration. FIG. 5 is an explanatory diagram of the mounting electrode unit in the first embodiment. Here, FIG. 5A is a plan view according to a first modification of the mounting electrode part, and FIG. 5B is a cross-sectional view according to a second modification of the mounting electrode part. In the mounting electrode portion 50 shown in FIG. 1, even if the IC chip 40 has a large planar size, the cutout portion 84 is provided, so that the IC chip 40 can be mounted on the back surface of the piezoelectric vibrator 20. it can. However, if the planar size of the IC chip 40 is smaller than that of the piezoelectric vibrator 20, the cutout portion 84 may not be provided in the mounting electrode portion 50 as shown in FIG. Thereby, since the contact area of the mounting electrode part 50 and the sealing body 14 increases, joining strength can be increased and it can prevent that the mounting electrode part 50 slips out from the sealing body 14. FIG.

  Further, in order to increase the bonding area between the mounting electrode portion 50 and the sealing body 14, for example, as shown in FIG. 5B, a notch portion 84 is provided on the surface where the wire 56 is bonded in the stepped portion 52. That's fine. Thereby, since the contact area of the mounting electrode part 50 and the sealing body 14 increases, joining strength can be increased and it can prevent that the mounting electrode part 50 slips out from the sealing body 14. FIG. The position where the notch 84 is provided is not limited to the position shown in FIG.

  Next, a second embodiment will be described. In the second embodiment, since a modified example of the piezoelectric oscillator according to the first embodiment will be described, the same components as those of the piezoelectric oscillator according to the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted or omitted. Simplify. FIG. 6 is an explanatory diagram of the piezoelectric oscillator according to the second embodiment. Here, FIG. 6A is a schematic sectional view of the piezoelectric oscillator, and FIG. 6B is a schematic plan view of the lead frame in a portion corresponding to the piezoelectric oscillator.

  The piezoelectric oscillator 90 includes a mounting electrode unit 50 disposed at each corner and a die pad 92 disposed at the center in the planar direction. In the piezoelectric oscillator 90, the IC chip 40 is fixed on the die pad 92, and the piezoelectric vibrator 20 is fixed on the upper surface of the mounting electrode unit 50.

  Specifically, the configuration is as follows. The mounting electrode unit 50 and the die pad 92 are formed from a lead frame. The mounting electrode portion 50 is provided with a step portion 52 by cutting an upper portion and a lower portion on the side in the height direction closest to the center portion of the piezoelectric oscillator 90. The step portion 52 is to which the wire 56 is joined, and is formed by half etching or press working. The height from the upper surface of the mounting electrode portion 50 to the upper surface of the stepped portion 52 is higher than the sum of the height of the IC chip 40 and the height of the wire 56 applied to the IC chip 40. The lower surface of the mounting electrode unit 50 is a mounting surface 58 that is bonded to a mounting substrate (not shown).

  The die pad 92 is provided in the central portion of the piezoelectric oscillator 90 without being in contact with the mounting electrode portion 50 while being adjacent to the step portion 52. That is, the die pad 92 is provided in the gap between the mounting electrode portions 50. An IC chip 40 is fixed on the die pad 92 with the active surface facing upward. A wire 56 is bonded to the pad 42 and the stepped portion 52 provided on the active surface, and the IC chip 40 and the stepped portion 52 are electrically connected.

  The piezoelectric vibrator 20 is fixed to the upper surface of the mounting electrode unit 50. More specifically, the piezoelectric vibrator 20 is disposed in the central portion of the piezoelectric oscillator 90 in the planar direction, and the external terminal 24 and the mounting electrode portion 50 are joined. Except for the mounting surface 58 of the mounting electrode unit 50, the periphery of the piezoelectric vibrator 20, the IC chip 40, the wire 56, and the mounting electrode unit 50 is covered with the sealing body 14.

  Next, a method for manufacturing the piezoelectric oscillator 90 will be described. First, the stepped portion 52 is formed by half-etching or the like at a predetermined position of the piezoelectric oscillator 90. The IC chip 40 is fixed to the upper surface of the die pad 92 with the active surface facing upward. Thereafter, wire bonding is applied to the pad 42 and the stepped portion 52 provided on the active surface of the IC chip 40 to make the IC chip 40 and the stepped portion 52 conductive. Before joining the IC chip 40 to the die pad 92, it may be inspected whether or not the IC chip 40 operates normally.

  Then, the piezoelectric vibrator 20 is fixed on the mounting electrode unit 50. At this time, the external terminal 24 provided on the back surface of the piezoelectric vibrator 20 and the upper surface of the mounting electrode portion 50 are joined. In addition, before joining the piezoelectric vibrator 20 to the mounting electrode part 50, you may test | inspect whether the piezoelectric vibrator 20 operate | moves normally. Thereafter, the sealing body 14 covers the periphery of the piezoelectric vibrator 20, the IC chip 40, the mounting electrode unit 50, the wire 56, etc., except for the part that becomes the mounting surface 58 of the mounting electrode unit 50. Finally, the portion of the lead frame exposed from the sealing body 14 is cut to form the piezoelectric oscillator 90.

  Such a piezoelectric oscillator 90 can achieve the same effects as the piezoelectric oscillator according to the first embodiment. That is, the piezoelectric oscillator 90 can be reduced in thickness and planar size, and can be easily manufactured. The piezoelectric oscillator 90 described above can also include the write terminal described in the first embodiment.

  The mounting electrode unit 50 of the piezoelectric oscillator 90 may have the following configuration. FIG. 7 is an explanatory diagram of a mounting electrode unit in the second embodiment. Here, FIG. 7A is a schematic sectional view of a piezoelectric oscillator according to this modification, and FIGS. 7B to 7E are schematic sectional views showing modifications of the mounting electrode portion. The piezoelectric oscillator 90 shown in FIG. 7A has a configuration in which the lower side of the mounting electrode unit 50 is not cut. As described above, if the lower surface of the mounting electrode unit 50 is not cut, the mounting surface 58 can be increased, and the bonding area between the piezoelectric oscillator 90 and the mounting substrate can be increased. Therefore, the bonding strength between the piezoelectric oscillator 90 and the mounting substrate can be improved.

  Further, in order to increase the bonding area between the mounting electrode part 50 and the sealing body 14, a notch part 84 as shown in FIGS. 7B to 7E may be provided. That is, as shown in FIGS. 7B and 7D, a notch 84 is provided on the surface of the mounting electrode portion 50 above the portion where the stepped portion 52 is provided and on the surface in contact with the sealing body 14. be able to. Further, as shown in FIGS. 7C and 7E, a notch portion 84 may be provided on the surface of the stepped portion 52 where the wire 56 is joined. Thereby, since the contact area of the mounting electrode part 50 and the sealing body 14 increases, joining strength can be increased and it can prevent that the mounting electrode part 50 slips out from the sealing body 14. FIG. The position where the notch 84 is provided is not limited to the position shown in FIGS.

  The piezoelectric oscillators 10 and 90 described in the first and second embodiments are, for example, digital devices such as digital mobile phones, personal computers, workstations, portable information terminals, and the like that require a clock signal for control. Mounted on. When the piezoelectric oscillators 10 and 90 are mounted on a digital mobile phone, the piezoelectric oscillators 10 and 90 are connected to a central processing unit (CPU) that controls, for example, a transmission / reception signal transmission unit and a reception unit. The output frequency of the piezoelectric oscillators 10 and 90 is used as a clock signal suitable for the control content by a predetermined frequency dividing circuit built in the CPU. Further, when a temperature compensation type piezoelectric oscillator is provided by mounting a temperature compensation circuit on the piezoelectric oscillators 10 and 90, the temperature compensation type piezoelectric oscillator is connected to, for example, the output side of the CPU, and is connected to the transmission unit and the reception unit. Connected. Even when the environmental temperature changes and the basic clock from the CPU fluctuates, it is corrected by the temperature-compensated piezoelectric oscillator and is supplied to the transmitting unit and the receiving unit.

It is explanatory drawing of the piezoelectric oscillator which concerns on 1st Embodiment. It is a schematic sectional drawing of the piezoelectric vibrator in 1st Embodiment. It is sectional drawing explaining that a plane size changes with the difference in the process of forming a level | step-difference part. It is a schematic bottom view of the piezoelectric oscillator provided with the write terminal. It is explanatory drawing of a mounting electrode part. It is explanatory drawing of the piezoelectric oscillator which concerns on 2nd Embodiment. It is explanatory drawing of the mounting electrode part in 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ......... Piezoelectric oscillator, 14 ......... Sealing body, 20 ...... Piezoelectric vibrator, 24 ...... External terminal, 40 ...... IC chip, 50 ...... Mounting electrode part, 52 ...... Step Part 58... Mounting surface 80... Writing terminal 90... Piezoelectric oscillator 92.

Claims (9)

A piezoelectric vibrator, and an IC chip including a circuit for oscillating the piezoelectric vibrator;
Bonding a mounting electrode portion having a step portion at each corner portion on one surface of the piezoelectric vibrator,
The IC chip and the stepped portion are electrically connected to cover the piezoelectric vibrator, the IC chip, and the mounting electrode portion with a sealing body while exposing a mounting surface provided on a lower surface of the mounting electrode portion. The
A piezoelectric oscillator characterized by that.   The piezoelectric oscillator according to claim 1, wherein the step portion is formed by half etching or press working. A piezoelectric vibrator;
An IC chip comprising a circuit for oscillating the piezoelectric vibrator;
The upper step surface and the lower step surface are connected by a surface along the vertical direction, and provided with a step portion that is electrically connected to the IC chip, and provided with a mounting surface on the lower surface, and one of the piezoelectric vibrators A mounting electrode part whose upper surface is fixed to the surface;
A sealing body that covers the piezoelectric vibrator, the IC chip, and the mounting electrode part while exposing the mounting surface;
A piezoelectric oscillator comprising: The IC chip is fixed to one surface of the piezoelectric vibrator, and a wire is bonded to the IC chip and the piezoelectric vibrator,
The step portion is provided on the mounting electrode portion, and a wire is bonded to the surface of the step portion opposite to the piezoelectric vibrator and the IC chip.
The piezoelectric oscillator according to claim 1, wherein the piezoelectric oscillator is provided. The step portion is provided between the upper surface and the lower surface of the mounting electrode portion,
A die pad to which the IC chip is fixed is disposed in the gap between the mounting electrode portions,
A wire is bonded to the step portion and the IC chip,
The piezoelectric oscillator according to claim 1, wherein the piezoelectric oscillator is provided.   6. A writing terminal is provided between the mounting electrode portions, and a step portion to which a wire that is electrically connected to the IC chip is joined is provided at a tip portion of the writing terminal. Piezoelectric oscillator.   The piezoelectric oscillator according to claim 1, wherein the mounting electrode portion is provided with a notch portion.   The piezoelectric oscillator according to claim 1, wherein the mounting electrode portion is formed of a lead frame.   An electronic apparatus comprising the piezoelectric oscillator according to claim 1.

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