JP5075417B2 - Method for manufacturing piezoelectric oscillator - Google Patents

Description

  The present invention relates to a method for manufacturing a piezoelectric oscillator used in electronic equipment and the like.

FIG. 9 is a cross-sectional view showing a conventional piezoelectric oscillator. In the following description, the back side is “up” and the near side is “bottom”.
As shown in FIG. 9, in the conventional piezoelectric oscillator, a piezoelectric vibration element 202 is accommodated inside a container body 201, and the piezoelectric vibration element 202 and a piezoelectric vibrator which is hermetically sealed by a lid are electrically connected to the lower surface side of the piezoelectric vibrator. A structure in which the conductor 204 and the integrated circuit element 203 are joined by a material is known. The conductor 204 is used as an external connection electrode terminal (see, for example, Patent Document 1).

The container body 201 is usually made of a ceramic material such as alumina ceramics, and a predetermined wiring pattern is formed inside and on the surface thereof. The container body 201 is manufactured by employing a conventionally known green sheet laminating method or the like. . And the conductor connection electrode terminal is provided in the lower surface side of such a container body 201, and these conductor connection electrode terminals and the conductor 204 are connected by conductive bonding, such as conductive adhesive and solder. The conductor 204 was joined to the container body 201 by conducting and fixing through the material.
As a method of joining the conductor 204 to the container body 201, a conductive bonding material such as a conductive adhesive or solder is applied to the electrode terminal for conductor connection formed on the lower surface side of the container body 201. The conductor 204 was joined to the conductor connection electrode terminal by mounting the body 204 one by one on each conductor connection electrode terminal of the container body 201 and performing heat treatment.

The following prior art is disclosed about the piezoelectric oscillator of the above forms.
JP 2003-46251 A

  In addition, other than the prior art documents specified by the prior art document information described above, other than the prior art documents related to the present invention have not been found by the time of filing of the present application.

  In the above-described conventional method for manufacturing a piezoelectric oscillator, a conductive bonding material such as a conductive adhesive or solder is applied to the electrode terminal for connecting a conductor formed on the lower surface side of the container body, and the conductor is placed in the container body. One conductor is mounted on each conductor connection electrode terminal, and the conductor is joined to the conductor connection electrode terminal by performing a heat treatment after mounting all of the conductor connection electrode terminals. There is a problem that a complicated process of mounting one by one is required and productivity is lowered.

  The present invention has been devised in view of the above problems, and an object of the present invention is to provide a method of manufacturing a piezoelectric oscillator that is easy to handle at the time of manufacture and improves productivity.

A method for manufacturing a piezoelectric oscillator according to the present invention is made to solve the above-described problems. An integrated circuit element is mounted on a piezoelectric vibrator that is mounted in a container and hermetically sealed with a lid. A method of manufacturing a piezoelectric oscillator having a mounting portion provided on a piezoelectric vibrator, wherein the piezoelectric oscillator is formed on a lower surface of a container body extending from side surfaces of a plurality of openings provided in a flat insulating substrate. and a terminal forming step of forming a metal film layer on the terminal portion connection electrode terminals on both principal surfaces and the surface facing the same direction of the insulating substrate of the plurality of terminal portions provided at positions corresponding the piezoelectric vibrating element is housed An integrated circuit element connecting step for mounting the integrated circuit element electrically and mechanically in a form in which the connection pads corresponding to the integrated circuit element mounting pad formed on the lower surface side of the container body face each other, and piezoelectric An oscillating element is housed and an integrated circuit The container body child has been taken deposition mounting an insulating substrate, combined as an integrated circuit device is inserted into the opening of the insulating substrate, and a terminal portion for connecting the electrode terminals of the metal film layer and the container body of the terminal portion A terminal part connecting step of connecting, and a cutting and separating step of simultaneously obtaining a plurality of piezoelectric oscillators by cutting at the boundary between the opening of the insulating substrate and the terminal part.

  Further, a step of covering the periphery of the integrated circuit element with an insulating resin may be provided after the terminal portion bonding step.

  Furthermore, at least two of the plurality of terminal portions of the piezoelectric oscillator are used as data write terminals, and temperature compensation data is input to the integrated circuit element via the data write terminal, A step of storing the temperature compensation data in a memory may be provided after the cutting and separating step.

  Furthermore, a part of the terminal portion of the insulating substrate may be a data write terminal, and the height of the terminal portion that becomes the data write terminal may be lower than the height of the other terminal portions.

  Furthermore, the material of the insulating substrate may be any one of silicon, glass, and glass epoxy resin.

  According to the method for manufacturing a piezoelectric oscillator of the present invention, a position corresponding to the terminal portion connection electrode terminal formed on the lower surface of the container body extending from the side surface of the plurality of openings provided in the flat insulating substrate. By connecting the metal film layer formed on the plurality of provided terminal portions and the electrode terminal for connecting the terminal portion of the container body, all the terminal portions are mounted on the container body at the same time. This eliminates the need for cumbersome processes for mounting one by one, improving productivity.

  Further, by filling the periphery of the integrated circuit element including a part of the surface of the terminal portion with an insulating resin, when the terminal portion is cut and separated from the insulating substrate, the stress generated in the terminal portion at the time of cutting the insulating resin is reduced. Since it becomes a buffer material, it becomes possible to further reduce problems such as peeling between the terminal portion and the terminal portion connecting electrode terminal due to stress during cutting.

  In addition, since a part of the terminal portion of the piezoelectric oscillator becomes a data write terminal and the height of the terminal portion that becomes the data write terminal is lower than the height of the other terminal portions, the piezoelectric oscillator and the external electric Even when mounted on a circuit, the wiring pattern formed on the surface of the mother board and the data write terminal are not unnecessarily brought into contact with each other, so that a stable oscillation frequency can be output.

  Therefore, the present invention has an effect of providing a method for manufacturing a piezoelectric oscillator that is easy to handle, has excellent productivity, and can cope with a low profile.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. In the following description, the piezoelectric material is quartz. Therefore, the piezoelectric vibrator is described as a crystal vibrator.

(First embodiment)
FIG. 1 is an exploded perspective view showing an example of a piezoelectric oscillator formed by a method for manufacturing a piezoelectric oscillator according to an embodiment of the present invention. FIG. 2 is a cross-sectional view showing an example of a piezoelectric oscillator formed by a method for manufacturing a piezoelectric oscillator according to an embodiment of the present invention. FIG. 3A is a perspective view of the piezoelectric vibrator as viewed from the integrated circuit element mounting side main surface (one main surface). FIG. 3B is a perspective view of the piezoelectric oscillator formed by the piezoelectric oscillator manufacturing method of the present invention as seen from the mounting side.
In FIG. 1 to FIG. 3, the explanation will be made assuming that the back side is “up” and the near side is “down” with respect to the page. Moreover, in each figure, the same code | symbol is attached | subjected to the same component and the overlapping description is abbreviate | omitted. For the sake of clarity, some of the structures that are unnecessary for the description are not shown. Further, the illustrated dimensions are partially exaggerated.

  A piezoelectric oscillator 100 shown in FIGS. 1 to 3 has a quartz resonator element 20 accommodated in a container body 10 whose main surface outer shape is rectangular, and an integrated circuit is formed on one main surface of the container body 10. The element 50 is connected, and a terminal portion 41 to be an external connection electrode terminal 41a and a data write terminal 41b is connected.

  The container body 10 is made of, for example, a ceramic material such as alumina ceramics or glass-ceramics, and has an electronic circuit network mounted in the integrated circuit element 50 on one main surface (the lower main surface in FIG. 2) as described above. The integrated circuit element mounting pad 15 for mechanically joining the integrated circuit element 50 and the terminal part connection for mechanically joining the terminal part 41 to the central part of the container body 10. Electrode terminals 12 are provided at the four corners of the container body 10. Further, the other main surface (the upper main surface in FIG. 2) is formed with a recessed space 14 in a rectangular shape in the central area. An annular sealing conductor pattern 11 is formed on the top surface of the side wall surrounding the recessed space 14.

  When the terminal portion 41 is attached and fixed to the terminal portion connecting electrode terminal 12 of the container body 10, the metal film layer 43 a formed on the upper surface of the terminal portion 41 and the terminal portion provided on the container body 10. The connection electrode terminal 12 is mechanically and electrically bonded to the connection electrode terminal 12 by a conductive bonding material 60 such as solder or a conductive adhesive. Further, the container body 10 is for housing the crystal resonator element 20 in the recess space 14, and is provided on the bottom surface of the recess space 14 for excitation formed on both the front and back main surfaces of the crystal resonator element 20. A piezoelectric vibration element mounting pad 13 that is electrically connected to each electrode 21 is deposited.

  In addition, the sealing conductor pattern 11 formed on the top surface of the opening side of the recess space 14 on the side wall of the container body 10 is made of nickel (on the surface of a base layer made of tungsten (W), molybdenum (Mo), etc., for example. A Ni) layer and a gold (Au) layer are sequentially deposited in a form surrounding the opening of the recess space 14 in an annular shape, thereby forming a thickness of 10 μm to 25 μm. Further, the inner peripheral edge of the sealing conductor pattern 11 is exposed on the inner wall surface of the recessed space 14, and the outer peripheral edge is exposed on the outer surface of the container body 10. The conductive pattern 11 for sealing improves the airtight reliability and productivity of the piezoelectric vibration element mounting space by improving the wettability of the sealing member 31 formed on the lid 30 for the lid 30 described later. Can do.

  The piezoelectric vibration element mounting pad 13 provided on the bottom surface in the concave space 14 on the side wall of the container body 10 is configured by a part of the terminal portion connection electrode terminal 12 provided on the container body 10 and the container body 10. They are electrically connected via wiring patterns on the surface of each layer and via conductors that penetrate each layer. Further, the piezoelectric vibration element mounting pad 13 is electrically and mechanically connected to an excitation electrode 21 of a crystal vibration element 20 described later via a conductive adhesive 70 on the upper surface side.

  The piezoelectric vibration element 20 made of crystal accommodated in the recessed space 14 of the container body 10 is a substantially flat plate-shaped crystal element plate having a rectangular main surface shape that is cut from the artificial crystal lens at a predetermined cut angle and is subjected to outer shape processing. The main structure. By applying and forming a pair of excitation electrodes 21 on both the front and back main surfaces of the crystal base plate, when an alternating voltage from the outside is applied to the crystal base plate via the excitation electrode 21, a predetermined vibration is generated. Excitation can be caused by mode and frequency. Such a crystal resonator element 20 has a lead electrode drawn out from the excitation electrode 21 applied to both main surfaces thereof to one short side of the crystal base plate and a corresponding piezoelectric vibration in the bottom surface of the recessed space 14. The element mounting pad 13 is mounted on the bottom surface in the recessed space 14 of the container body 10 by electrically and mechanically connecting the element mounting pad 13 via the conductive contact adhesive 70.

  The conductive adhesive 70 is obtained by adding and mixing a predetermined amount of conductive particles made of Ag or the like into a resin material made of silicon resin or polyimide resin.

  Further, the lid 30 disposed on the container body 10 is manufactured by adopting a conventionally known metal processing method and shaping a metal such as 42 alloy into a predetermined shape. A nickel (Ni) layer is formed on the upper surface of the lid body 30, and further, gold tin (Au—Sn) which is a sealing member 31 at least at a location facing the sealing conductor pattern 11 on the upper surface of the nickel (Ni) layer. ) Layer is formed. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin. Moreover, such a sealing member 31 can relieve unevenness on the surface of the sealing conductor pattern 11 and prevent a decrease in hermeticity. Such a lid 30 is disposed on the sealing conductor pattern 11 formed on the top of the side wall portion surrounding the recessed space 14 in which the crystal resonator element 20 is mounted so as to cover the opening of the recessed space 14. The sealing member 31 and the sealing conductor pattern 11 are melt-bonded to hermetically seal the inside of the recessed space 14 to constitute the piezoelectric vibrator 90.

The terminal portion 41 is formed by integrally forming an insulating substrate 40 that is a single plate of silicon, glass, glass epoxy resin or the like by a conventionally known punching method or etching method.
The terminal portion 41 has a columnar shape having a height dimension higher than that of the integrated circuit element 50.
The terminal portion 41 extends from the side surface of the plurality of openings provided on the flat insulating substrate, and corresponds to the terminal portion connecting electrode terminal 12 formed on the lower surface of the container body 10 of the piezoelectric vibrator 80. The metal film layers 43a and 43b plated with Ni and Au are formed on the surfaces of the plurality of terminal portions 41 provided at positions facing the main surfaces of the insulating substrate, and the terminal portions 41 are separated from each other. Is done.

The metal film layer 43a and the metal film layer 43b are electrically connected to each other by wirings or via holes formed inside or on the surface of the terminal portion 41.
Further, the metal film layer 43a formed on the upper surface of each terminal portion 41 and the terminal portion connecting electrode terminal 12 provided on the container body 10 are joined together by a conductive bonding material 60 such as solder or conductive adhesive. Yes.

  As described above, since the terminal portion 41 is formed by processing the insulating substrate, when mounting on an external electric circuit such as a mother board as an electrode terminal for external connection of the container body, a conductive bonding material such as solder is used. Even when electrically connected to the circuit wiring of the external electric circuit, the conductive bonding material does not crawl onto the surface of the terminal portion 41, so that it is possible to prevent a short circuit with other terminal portions or the integrated circuit element 50. .

  Each terminal portion 41 is used as a data write terminal 41b in addition to the external connection electrode terminal 41a (power supply voltage terminal, ground terminal, oscillation output terminal, oscillation control terminal) for each function. When the piezoelectric oscillator is mounted on an external electric circuit such as a mother board, the external connection electrode terminal 41a is electrically connected to the circuit wiring of the external electric circuit by soldering or the like. Further, the data write terminal 41b applies the probe needle of the temperature compensation data writing device and writes temperature compensation data corresponding to the temperature characteristics of the crystal resonator element 20, whereby the temperature compensation data is stored in the memory of the integrated circuit element 50. Stored. In addition, the terminal part 41 used as each electrode terminal is provided with a difference in outer shape depending on the use of the electrode terminal.

  Here, of the four external connection electrode terminals 41a, if the ground terminal and the oscillation output terminal are arranged close to each other, it is possible to effectively prevent noise from interfering with the oscillation signal output from the oscillation output terminal. be able to. Therefore, it is preferable to arrange the ground terminal and the oscillation output terminal close to each other.

  The integrated circuit element 50 is, for example, a rectangular flip-chip integrated circuit element having a plurality of connection pads corresponding to the integrated circuit element mounting pads 15 on the mounting surface side of the container body 10 on one main surface. Etc., and an oscillation circuit or the like that is connected to the crystal resonator element 20 and generates a predetermined oscillation output is provided on the circuit forming surface, and the oscillation output generated by this oscillation circuit is output to the outside For example, it is used as a reference signal such as a clock signal.

  In addition, the integrated circuit element 50 is attached to the container body 10 by individually bonding the connection pads provided on the integrated circuit element 50 to the integrated circuit element mounting pad 15 via the conductive bonding material 60, thereby the integrated circuit. An electronic circuit in the element 50 is electrically connected to the crystal resonator element 20 and the terminal portion 41.

Next, a method for manufacturing the piezoelectric oscillator will be described with reference to FIGS.
Here, FIG. 6A is a cross-sectional view showing a terminal portion forming step of the piezoelectric oscillator manufacturing method, and FIG. 6B is a cross-sectional view showing an integrated circuit element connecting step of the piezoelectric oscillator manufacturing method. (C) is sectional drawing which shows the terminal part connection process of the manufacturing method of a piezoelectric oscillator, (d) is sectional drawing which shows the cutting | disconnection isolation | separation process of the manufacturing method of a piezoelectric oscillator. FIG. 7 is an external perspective view showing a state before the piezoelectric vibrator is mounted on the insulating substrate. FIG. 8 is a plan view showing a state after the piezoelectric vibrator is mounted on the insulating substrate.

(Terminal part formation process)
First, in the terminal portion forming step shown in FIGS. 6A, 7, and 8, it is formed on the lower surface of the container body 41 by extending from the side surfaces of the plurality of openings 42 provided in the flat insulating substrate 40. The metal film layers 43a and 43b are formed on the surfaces of the plurality of terminal portions 41 provided at positions corresponding to the terminal portion connection electrode terminals 12 facing the same direction as both main surfaces of the insulating substrate 40.
The insulating substrate 40 has a wafer shape, and has a form in which a substrate region X having a terminal portion 41 and an abandoned region Y are adjacent to each other, and a plurality of these are arranged in a matrix. An opening 42 is provided in the substrate region X of the insulating substrate 40.
A terminal part 41 having a rectangular parallelepiped shape having a height dimension h higher than the height dimension of the integrated circuit element 50 is placed at a position corresponding to the terminal part connection electrode terminal 12 formed on the lower surface side of the container body 10. A plurality of terminals 41 are arranged in series so as to be connected to the side surface of the opening 42, and metal film layers 43 a and 43 b are formed on the upper and lower surfaces of each terminal portion 41.
The cross-sectional view of the insulating plate 40 shown in FIG. 6A is a partial cross-sectional view taken along the virtual cutting line AA shown in FIG.

Such an insulating substrate 40 is formed by a conventionally known punching method, photoetching method, or the like, which is a single plate formed of an insulating material such as silicon, glass, or glass epoxy resin. On the upper and lower surfaces of the terminal part 41, metal film layers 43a and 43b subjected to Ni plating and Au plating are formed.
The height dimension h of at least the terminal portion 41 of the insulating substrate 40 is formed to be higher than the height dimension of the integrated circuit element 50. By doing so, the integrated circuit element 50 does not come into contact with the motherboard or the like.
Metal film layers 43a and 43b are formed on the upper and lower surfaces of the terminal portion 41, and the metal film layer 43a formed on the upper surface and the metal film layer 43b formed on the lower surface are electrically connected by wiring or via holes.
Moreover, in this embodiment, the terminal part 41 and the surplus area | region Y will be cut | disconnected by this process at the process mentioned later of this insulated substrate 40.

When the insulating substrate 40 is made of silicon, a silicon wafer is formed by slicing an ingot of single crystal silicon to a predetermined thickness. A through hole is provided in the terminal portion 41 of each substrate region X of the silicon wafer, and metal film layers 43a and 43b are formed on the upper and lower surfaces of the terminal portion.
In this case, the metal film layers 43a and 43b formed on the upper and lower surfaces of the terminal portion 41 are conductively connected through the through holes. The through hole can be formed by filling a conductive paste such as gold tin (Au—Sn).

When the insulating substrate 40 is made of a glass material such as borosilicate glass or soda glass, a corrosion-resistant film corresponding to the terminal portion 41 of each substrate region X of the insulating substrate 40 is formed in advance, and then a photoetching method or the like Thus, the opening 42 is formed.
The corrosion resistant film corresponding to the terminal portion 41 of each substrate region X is peeled off to provide a through hole, and metal film layers 43 a and 43 b are formed on the upper and lower surfaces of the terminal portion 41.

  When the insulating substrate 40 is made of glass cloth base epoxy resin, a glass cloth base formed by weaving glass yarn is impregnated with a liquid precursor of epoxy resin, and the base is formed by polymerizing the precursor at a high temperature. Then, metal foil layers 43a and 43b made of metal foil are formed by processing a metal foil such as a copper foil adhered to the base into a predetermined pattern using a conventionally known photo-etching method. Thereafter, the opening 42 is formed in the substrate region X of the insulating substrate 40 by a conventionally known punching process or the like.

(Integrated circuit element connection process)
As shown in FIG. 6B, the integrated circuit element 50 is electrically connected in such a manner that connection pads corresponding to functions determined by the integrated circuit element mounting pad 15 formed on the lower surface side of the container body 10 face each other. And it is mounted by mechanically connecting.
As the integrated circuit element 50, a rectangular flip-chip type integrated circuit element having a plurality of connection pads on the bonding surface is used. The integrated circuit element 50 is placed such that a plurality of connection pads provided on the bonding surface thereof are in contact with each integrated circuit element mounting pad 15 of the container body 10 via a conductive bonding material. Thereafter, the conductive bonding material is melted by application of heat and then solidified by cooling, and the integrated circuit element 50 is contained in the container by bonding the connection pad and the integrated circuit element mounting pad 15 via the conductive bonding material. It is mounted on the body 10.

(Terminal connection process)
As shown in FIGS. 6C, 7, and 8, the metal film layer 43 a of the terminal portion 41 and the terminal portion connecting electrode terminal 12 of the container body 10 are connected.
The integrated circuit element 50 attached and mounted in the opening 42 of the insulating substrate 40 is inserted into the container body 10 in which the piezoelectric vibration element 20 made of crystal is accommodated and the integrated circuit element 50 is attached and mounted. The terminal portion connection electrode terminal 12 formed on the lower surface of the container body 10 constituting the piezoelectric vibrator 90 and the metal layer 43a on the upper surface of each terminal portion 41 formed on the insulating substrate 40 are combined with the metal film layer 43a. The piezoelectric vibrators are mounted on a plurality of predetermined terminal portions 41 of the insulating substrate 40 by bonding with a conductive bonding material 60 such as solder or conductive adhesive formed in a batch by a printing means.

(Cutting and separation process)
As shown in FIGS. 6D and 8, a plurality of piezoelectric oscillators 100 are obtained simultaneously by cutting at the boundary between the opening 42 and the terminal portion 41 of the insulating substrate 40.
A plurality of piezoelectric oscillators are formed by cutting each terminal portion 41 from the separation region Y by cutting a connecting portion (two-dot chain line portion) between the separation region Y of each insulating substrate 40 and the terminal portion 41 of the substrate region X. Get 100 at the same time. The insulating substrate 40 is cut by dicing using a dicer or the like, and through such a cutting process, a plurality of piezoelectric elements having a form in which the terminal portion 41 performs various functions of the external connection electrode terminal 41a and the data writing terminal 41b. The oscillator 100 is obtained at the same time.

  In the case where the piezoelectric oscillator 100 has a temperature compensation function, the temperature compensation data is supplied to the integrated circuit element 50 via the data write terminal 41b of the terminal portion 41 obtained by cutting and separating each terminal portion 41 from the separation region Y. The temperature compensation data is input and stored in the memory in the integrated circuit element 50. In such temperature compensation data writing operation, the temperature compensation data created in accordance with the temperature characteristics of the crystal resonator element 20 is applied to the integrated circuit by applying the probe needle of the temperature compensation data writing device to the data write terminal 41b. This is performed by inputting to a memory provided in the temperature compensation circuit of the element 50 and storing it. Here, the temperature compensation data written in the integrated circuit element 50 is for correcting the temperature characteristic variation for each crystal oscillation element 20, and the temperature of the crystal oscillation element 20 used in the temperature compensation type crystal oscillator. It is obtained by measuring the characteristics in advance.

(Second embodiment)
FIG. 4 is a cross-sectional view showing an example of a piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator according to the second embodiment of the present invention.
The first embodiment is different from the first embodiment in that after the opening is formed in the insulating substrate during the terminal portion forming step, only the terminal portion 41b serving as the data writing terminal is subjected to the photoetching method or the like again. Therefore, the height of the terminal portion 41b serving as the data write terminal is lower than the height of the other terminal portions 41a.
In this way, even when mounted on an external electric circuit such as a piezoelectric oscillator and a mother board, the wiring pattern formed on the mother board surface and the data writing terminal are not unnecessarily contacted, so stable oscillation It becomes possible to output the frequency.

(Third embodiment)
FIG. 5 is a cross-sectional view showing an example of a piezoelectric oscillator formed by the method for manufacturing a piezoelectric oscillator according to the third embodiment of the present invention.
It differs from the first embodiment in that an insulating resin forming step is performed between the terminal portion connecting step and the cutting and separating step.
In the insulating resin forming step, the periphery of the integrated circuit element 50 is covered with the insulating resin 80 by applying and curing the insulating resin 80 in the opening 42 of the insulating substrate 41. .
The insulating resin 80 is often made of epoxy, polyimide, or the like, and is made of a thermoplastic resin that has the property of flowing when softened or melted by heating.
As described above, since the periphery of the integrated circuit element 50 is covered and protected by the insulating resin 80, it is possible to prevent the frequency from fluctuating due to the influence of foreign matter or the like.
Further, since the periphery of the integrated circuit element 50 is covered with the insulating resin 80 when the terminal portion 41 is cut and separated from the discarded region Y of the insulating substrate 40, the insulating resin 80 is cut when the terminal portion 41 is cut. Therefore, it is possible to further reduce problems such as peeling between the terminal portion 41 and the terminal portion connecting electrode terminal 12 due to stress at the time of cutting.

The present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention.
In the above-described embodiment, the quartz resonator element using quartz as the piezoelectric material constituting the piezoelectric resonator element has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element used as the above may be used.
Further, the order of the integrated circuit element connection step and the terminal portion connection step may be changed. By carrying out the terminal portion connection step first, the carrier for mounting the integrated circuit element becomes unnecessary, and it is obtained by dividing the substrate. There is no need for complicated operations such as mounting individual substrates on the carrier. This also improves the productivity of the piezoelectric oscillator.

It is a disassembled perspective view which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which concerns on embodiment of this invention. It is sectional drawing which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which concerns on embodiment of this invention. (A) is the perspective view which looked at the container body which comprises the crystal oscillator which is an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator of this invention from the mounting side main surface, (b) is the present invention. It is the perspective view which looked at the crystal oscillator which is an example of the piezoelectric oscillator formed with the manufacturing method of a piezoelectric oscillator from the mounting side main surface. It is sectional drawing which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which becomes 2nd embodiment of this invention. It is sectional drawing which shows an example of the piezoelectric oscillator formed with the manufacturing method of the piezoelectric oscillator which becomes 3rd embodiment of this invention. It is process explanatory drawing which showed the manufacturing method of the piezoelectric oscillator in this invention using the sectional drawing of the piezoelectric oscillator from the form (a) to the form (d) in process. It is explanatory drawing which showed the insulated substrate and container body used with the manufacturing method of the piezoelectric oscillator in this invention using the perspective view. It is process explanatory drawing which showed the manufacturing method of the piezoelectric oscillator in this invention using the top view which looked at the form in FIG.6 (c) from the upper direction of the container body. It is a disassembled perspective view which shows the crystal oscillator which is an example of the conventional piezoelectric oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Container body 11 ... Conductive pattern for sealing 12 ... Electrode terminal for terminal part connection 13 ... Piezoelectric vibration element mounting pad 14 ... Recessed space 15 ... Integrated circuit element mounting pad 16 ... Electrode terminal for monitoring 20 ... Piezoelectric vibration element 21 ... Electrode for excitation 30 ... Lid 31 ... Sealing member 40 ... Insulating substrate 41 ... Terminal part 41a ... External connection electrode terminal 41b ... data writing terminal 42 ... opening 43a, 43b ... metal film layer 50 ... integrated circuit element 60 ... conductive bonding material 70 ... conductive bonding Agent 80 ... Insulating resin 90 ... Piezoelectric vibrator 100 ... Piezoelectric oscillator X ... Substrate area Y ... Disposal area

Claims (5)

A piezoelectric oscillator manufacturing method in which a piezoelectric vibration element is mounted in a container body, an integrated circuit element is mounted on a piezoelectric vibrator hermetically sealed with a lid, and a terminal portion for mounting is provided on the piezoelectric vibrator.
The insulating substrate of the plurality of terminal portions provided from the side surfaces of the plurality of openings provided in the flat insulating substrate and provided at positions corresponding to the terminal portion connecting electrode terminals formed on the lower surface of the container body. A terminal portion forming step of forming a metal film layer on a surface facing the same direction as both main surfaces;
Mounting is performed by electrically and mechanically connecting the integrated circuit elements in a form in which the connection pads corresponding to the integrated circuit element mounting pads formed on the lower surface side of the container body in which the piezoelectric vibration element is accommodated are opposed to each other. An integrated circuit element connecting step;
The container body in which the piezoelectric vibration element is accommodated and the integrated circuit element is attached and mounted are aligned with the insulating substrate so that the integrated circuit element is inserted into the opening of the insulating substrate, and the terminal a terminal portion connecting step of connecting the metal film layer parts and the terminal part connecting electrode terminals of said container body,
A cutting and separating step of simultaneously cutting a plurality of piezoelectric oscillators by cutting at the boundary between the opening and the terminal portion of the insulating substrate;
A method for manufacturing a piezoelectric oscillator, comprising:   2. The method of manufacturing a piezoelectric oscillator according to claim 1, further comprising a step of covering the periphery of the integrated circuit element with an insulating resin after the terminal portion bonding step.   At least two of the plurality of terminal portions of the piezoelectric oscillator are used as data write terminals, and temperature compensation data is input to the integrated circuit element through the data write terminal, and the memory in the integrated circuit element The method for manufacturing a piezoelectric oscillator according to claim 1, further comprising a step of storing the temperature compensation data in the cutting and separating step.   4. The piezoelectric oscillator according to claim 3, wherein a part of the terminal portion of the insulating substrate serves as a data writing terminal, and a height of the terminal portion serving as the data writing terminal is lower than a height of another terminal portion. Production method.   5. The method for manufacturing a piezoelectric oscillator according to claim 1, wherein a material of the insulating substrate is any one of silicon, glass, and glass epoxy resin. 6.

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