JP2018142888A - Piezoelectric oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator capable of reducing non-oscillation and occurrence of problems in the electrical characteristics, by suppressing creeping up of a conductive bonding material to a via conductor, thereby suppressing short circuit of the conductive bonding material and the conductive pattern, even if miniaturization and low profile are advanced.SOLUTION: A piezoelectric oscillator includes an element mounting member having a board 111, a first frame 112, and a second frame 113 provided on the lower surface of the board 111 and forming a second recess 119, a piezoelectric oscillation element 130, multiple conductor patterns 120, external connection electrode pads 115 provided at four corners of the lower surface of the second frame 113, a via conductor 123 provided on the inside surface of the second frame 113, for electrically connecting the external connection electrode pads 115 and a specific conductor pattern 120, an integrated circuit element 150, and a bonding material creeping up prevention region 124 provided in each via conductor 123.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a piezoelectric oscillator which is one of electronic components used in electronic equipment and the like.

  A piezoelectric oscillator is mounted and used as a reference signal source or a clock signal source as an electronic component in an electronic device such as a computer, a mobile phone, or a small information device. Hereinafter, a conventional piezoelectric oscillator will be described in which a piezoelectric vibration element having a rectangular shape in plan view using a crystal as a piezoelectric material and an integrated circuit element incorporating an oscillation circuit are mounted therein.

  A conventional piezoelectric oscillator oscillates and outputs a signal having a specific frequency by using a piezoelectric effect of a piezoelectric vibration element such as a crystal. For example, a substrate is formed by a second frame having a first recess provided on the upper surface side of the substrate by a first frame provided on the upper surface of the substrate and an external connection electrode pad provided on the lower surface of the substrate. The element mounting member provided with the second recess on the lower surface side, the piezoelectric vibration element mounted on the first electrode pad provided on the upper surface of the substrate exposed in the first recess, and the first recess hermetically sealed There has been proposed a piezoelectric oscillator that includes a lid member to be mounted and an integrated circuit element mounted on a second electrode pad constituting a conductor pattern provided on the lower surface of the substrate.

  The conductor pattern provided on the lower surface of the substrate includes a second electrode pad and a wiring portion extending from the second electrode pad toward the inner surface of the second frame. The end portion on the inner surface side of the second frame body of the wiring portion of the predetermined conductor pattern and the external connection electrode pad are electrically connected by a via conductor provided on the inner surface of the second frame body ( For example, refer to Patent Document 1 or 2 below).

JP, 2006-208192, A JP 2013-219539 A

  In the above-described piezoelectric oscillator, when the size is reduced, particularly, the height is lowered, the height dimension of the second frame constituting the element mounting member is similarly lowered. In such a configuration, when the piezoelectric oscillator is mounted on an external mounting board, the solder provided for electrically connecting and fixing the external connection electrode pad formed on the piezoelectric oscillator and the mounting electrode pad formed on the mounting board. When a conductive bonding material such as squirts up the via conductor, reaches the lower surface of the substrate where the conductor pattern is provided, and flows out onto the lower surface of the substrate, the conductive bonding material comes into contact with other conductive patterns to cause a short circuit. There was a risk of waking up. When a short circuit between the conductive bonding material and the conductive pattern occurs, there is a risk of causing non-oscillation as a piezoelectric oscillator or causing a problem in electrical characteristics.

  The present invention has been made in view of the above problems, and suppresses the creeping of the conductive bonding material to the via conductor, and even if the miniaturization and the low profile are advanced, the conductive bonding material and the conductive pattern are short-circuited or conductive. It is an object of the present invention to provide a piezoelectric oscillator that can suppress a short circuit between a bonding material and a conductive pattern, and reduce occurrence of defects in non-oscillation and electrical characteristics.

  The piezoelectric oscillator according to the present invention includes a substrate, a first frame provided on the upper surface of the substrate and forming a first recess, and a second frame provided on the lower surface of the substrate and forming a second recess. A member, a piezoelectric vibration element mounted in the first recess, a plurality of conductor patterns provided on the lower surface of the substrate exposed in the second recess and including a second electrode pad and a wiring portion; External connection electrode pads provided at the four corners of the lower surface of the two frames, and side surfaces exposed in the second recesses of the second frame to electrically connect the external connection electrode pads and a predetermined conductor pattern An integrated circuit element disposed in the second recess and electrically connected to the second electrode pad of the conductor pattern by a solder bump, and a bonding material provided on each via conductor. And a prevention area. .

  The piezoelectric oscillator according to the present invention includes a substrate, a first frame provided on the upper surface of the substrate and forming a first recess, and a second frame provided on the lower surface of the substrate and forming a second recess. A member, a piezoelectric vibration element mounted in the first recess, a plurality of conductor patterns provided on the lower surface of the substrate exposed in the second recess and including a second electrode pad and a wiring portion; External connection electrode pads provided at the four corners of the lower surface of the two frames, and side surfaces exposed in the second recesses of the second frame to electrically connect the external connection electrode pads and a predetermined conductor pattern An integrated circuit element disposed in the second recess and electrically connected to the second electrode pad of the conductor pattern by a solder bump, and a bonding material provided in each via conductor And a scooping prevention area.

  With such a configuration, when the piezoelectric oscillator is mounted on an external mounting substrate, the conductive bonding material that has crawled up to the via conductor can be suppressed in the middle of the via conductor by the bonding material crawl prevention region. The conductive bonding material scooped up is prevented from coming into contact with other conductor patterns from the conductor pattern provided on the lower surface of the substrate, and a short circuit between the conductive patterns can be reduced.

  Therefore, the present invention suppresses the creeping of the conductive bonding material to the via conductor, and even if the miniaturization and the height reduction progress, the short circuit between the conductive bonding material and the conductive pattern or the short circuit between the conductive bonding material and the conductive pattern. It is possible to provide a piezoelectric oscillator that can suppress non-oscillation and occurrence of defects in electrical characteristics.

It is the disassembled perspective view which showed the piezoelectric oscillator which concerns on embodiment of this invention from the downward direction. It is the top view which showed the element mounting member which comprises the piezoelectric oscillator which concerns on embodiment of this invention from the downward direction. It is sectional drawing when cut | disconnecting by the virtual cutting line AA shown in FIG. It is the enlarged view which expanded and showed the virtual circle B part of FIG. It is sectional drawing when cut | disconnecting by the virtual cutting line CC of FIG. It is sectional drawing which showed the modification of the piezoelectric oscillator which concerns on embodiment of this invention.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing a piezoelectric oscillator according to an embodiment of the present invention from below. FIG. 2 is a plan view showing the element mounting member constituting the piezoelectric oscillator according to the embodiment of the present invention from below. 3 is a cross-sectional view taken along the virtual cutting line AA shown in FIG. FIG. 4 is an enlarged view showing the virtual circle B portion shown in FIG. 3 in an enlarged manner. FIG. 5 is a cross-sectional view taken along the virtual cutting line CC shown in FIG. FIG. 6 is a sectional view showing a modification of the piezoelectric oscillator according to the embodiment of the present invention.

  In each drawing, for clarity of explanation, a part of the structure is not shown, and some dimensions are exaggerated. For ease of explanation in each drawing, in FIGS. 1 and 2, the illustrated surface is described as the piezoelectric oscillator and the lower surface of each component constituting it, and the opposite surface is described as the upper surface. 3 and 6, the upper side of the sheet on which the drawings are described is described as the upper side of the piezoelectric oscillator and each component constituting the piezoelectric oscillator.

(Embodiment)
A piezoelectric oscillator 100 according to an embodiment of the present invention will be described. As shown in FIG. 1, the piezoelectric oscillator 100 mainly includes an element mounting member 110, a piezoelectric vibration element 130, a lid member 140, and an integrated circuit element 150. Such a piezoelectric oscillator 100 is used to generate and output a reference signal used in an electronic device or the like.

  The element mounting member 110 is for stably mounting a piezoelectric vibration element 130 and an integrated circuit element 150 described later. 1, 2 and 3, the element mounting member 110 includes a substrate 111, a first frame body 112, a second frame body 113, a first electrode pad 114, an external connection electrode pad 115, and a conductor. The pattern 120, the via conductor 123, and the bonding material scooping prevention region 124 are provided.

  The substrate 111 functions as a mounting member for mounting the piezoelectric vibration element 130 on the upper surface and mounting the integrated circuit element 150 on the lower surface. The substrate 111 is a flat plate having a rectangular shape in plan view, and a first electrode pad 114 for inputting / outputting a signal to / from the piezoelectric vibration element 130 is provided on the upper surface thereof, and a lower surface to the integrated circuit element 150 is provided on the lower surface. A conductor pattern 120 for inputting and outputting signals is provided. In addition, a third electrode pad 116 electrically connected to the first electrode pad 114 is provided on the lower surface of the substrate 111. The third electrode pad 116 is used for measuring frequency characteristics and electrical characteristics of the piezoelectric vibration element 130 after mounting a lid member 140 described later. On the surface and inside of the substrate 111, a wiring pattern (not shown) for electrically connecting the first electrode pad 114, the third electrode pad 116, and a conductor pattern 120 described later is provided. A wiring pattern (not shown) for electrically connecting the conductor pattern 120 and an external connection electrode pad 115 described later is also provided on the surface and inside of the substrate 111. The substrate 111 is made of, for example, a ceramic material such as alumina ceramic or glass-ceramic, or an insulating material that is glass-epoxy.

  The first frame body 112 is provided along the outer peripheral edge of the upper surface of the substrate 111, and is used to form the first recess 117 on the upper surface side of the substrate 111. The first frame body 112 is made of, for example, a ceramic material such as alumina ceramics or glass-ceramics, or an insulating material that is glass-epoxy. The size of the inner periphery of the first frame body 112, that is, the size of the opening of the first recess 117 is such that the piezoelectric vibration element 130 can be mounted in the first recess 117 in the lateral direction. A bonding material 118 is provided on the upper end face of the first frame body 112 on the opening side of the first recess 117.

  The second frame 113 is provided along the outer peripheral edge of the lower surface of the substrate 111, and is for forming the second recess 119 on the lower surface side of the substrate 111. The second frame 113 is made of, for example, a ceramic material such as alumina ceramic or glass-ceramic, or an insulating material that is glass-epoxy. The size of the inner periphery of the second frame 113, that is, the size of the opening of the second recess 119 is such that the integrated circuit element 150 can be mounted in the second recess 119 in the lateral direction. An external connection electrode pad 115 described later is provided on the lower end surface of the second frame 113 on the opening side of the second recess 119. A via conductor 123 for electrically connecting the conductor pattern 120 and the external connection electrode pad 115 is provided on the inner side surface of the second frame 113.

  The first electrode pad 114 holds and conducts the piezoelectric vibration element 130 using a conductive adhesive, and inputs and outputs signals to the piezoelectric vibration element 130. Each of the first electrode pads 114 is two in total, and is provided side by side along one short side of the upper surface of the substrate 111 exposed in the first recess 117. The first electrode pad 114 is electrically connected to the predetermined conductor pattern 120 and the third electrode pad 116 by a wiring pattern (not shown) provided in the substrate 111 and the second frame body 112. The first electrode pad 114 is formed by metallizing a conductive metal such as gold.

  The conductor pattern 120 holds and conducts an integrated circuit element 150 described later using solder or the like, and inputs / outputs signals to / from the integrated circuit element 150. The conductor pattern 120 includes a second electrode pad 121 and a wiring part 122. For example, eight second electrode pads 121 are provided, and four second electrode pads 121 are provided side by side along the two long sides of the lower surface of the substrate 111 exposed in the second recess 119. The wiring part 122 extends from each second electrode pad 121 toward the edge part of the lower surface of the substrate 111 exposed in the second recess 119 in the vicinity of the second electrode pad 121. Among the plurality of conductor patterns 120, for example, the wiring portions 122 of the conductor pattern 120 closest to the four corners of the lower surface of the substrate 111 exposed in the second recess 119 are exposed to the substrate 111 exposed in the second recess 119. Is extended toward the short side edge portion of the lower surface, and is electrically connected to a via conductor 123 described later. Among the conductor patterns 120, two conductor patterns 120 other than the above-described conductor pattern 120 electrically connected to the via conductors 123 are formed on the first electrode pad by a wiring pattern (not shown) provided in the substrate 111. 114 is electrically connected. The conductor pattern 120 is formed by metallizing metal.

  The via conductors 123 are, for example, the wiring portions 122 of the conductor pattern 120 closest to the four corners of the lower surface of the substrate 111 exposed in the second recess 119 and the external connection provided at the four corners of the lower surface of the second frame 113. It is used to electrically connect the electrode pads 115 to each other. The via conductors 123 are provided in the vicinity of both end portions of the inner side surface on the short side of the inner side surface of the second frame body 113 in a band shape having the length of the second frame body 113 as a length dimension. The lower end of the via conductor 123 is electrically connected to a predetermined external connection electrode pad 115, and the upper end of each via conductor 123 is, for example, each of the four corners of the lower surface of the substrate 111 exposed in the second recess 119. Is electrically connected to the wiring portion 122 of a predetermined conductor pattern among the conductor patterns 120 closest to the. The via conductor 123 is formed by metallizing a metal. For example, as shown in FIG. 5, molybdenum is formed on the first layer 125 on the inner surface side of the second frame 113, and an intermediate second layer is formed. Nickel is formed at 126, and the outermost third layer 127 has a three-layer structure of gold.

  Each via conductor 123 is provided with a bonding material creeping prevention region 124. This bonding material scooping prevention region 124 is used to attach a conductive bonding material such as solder that has crawled up from the external connection electrode pad 115 to the via conductor 123 when the piezoelectric oscillator 100 is mounted on an external mounting substrate. Used to dam the crawl up. As shown in FIGS. 4 and 5, the bonding material scooping prevention region 124 is a metal oxide that has a relatively low wettability between the convex portion 124 a having a height difference that hinders the scooping of the conductive bonding material and the conductive bonding material. It is comprised from the part (not shown) which consists of a thing, or the recessed part 124b where an electroconductive joining material tends to collect. Note that the position where the bonding material scooping prevention region 124 is provided in the via conductor 123 may be any position of the via conductor 123, but in order to prevent scooping as far as possible from the lower surface of the substrate 111, the via conductor 123. It is preferable to be provided at a position offset from the middle in the length dimension toward the external connection electrode pad 115 side.

  The bonding material scooping prevention region 124 is formed by irradiating the via conductor 123 with laser from the opening side of the second recess 119. The convex portion 124a of the scooping prevention region 124 is formed, for example, by irradiating the via conductor 123 with a laser. In addition, the portion made of the metal oxide is generated by reacting with air when the nickel of the second layer 126 of the via conductor 123 is scraped with a laser and generates heat. The recess 124b is formed by removing the nickel of the second layer 126 and the gold of the third layer 127. As described above, the convex portion 124a, the metal oxide, and the concave portion 124b constituting the bonding material scooping prevention region 124 are formed at a time by irradiating the via conductor 123 with laser. For example, a carbon dioxide laser, a YAG laser, a YVO4 laser, a semiconductor laser, or an excimer laser is used as the laser to be irradiated.

  The external connection electrode pad 115 is an electrode pad that is electrically connected and fixed via a conductive bonding material such as solder when the piezoelectric oscillator 100 including the element mounting member 110 is mounted on an external mounting substrate. Function. A total of four external connection electrode pads 115 are provided, one at each of the four corners of the lower main surface of the second frame 113 constituting the element mounting member 110 on the second recess 119 opening side. The external connection electrode pads 115 provided at the four corners of the lower main surface of the second frame 113 on the opening side of the second recess 119 include, for example, a signal input terminal, a signal output terminal, a power supply voltage terminal, and a ground terminal. Yes. Each external connection electrode pad 115 is electrically connected to a predetermined conductor pattern 120 by a via conductor 123 provided with a bonding material scooping prevention region 124. The external connection electrode pad 115 is formed by metallizing a conductive metal such as gold.

  The piezoelectric vibration element 130 generates an electric signal having a desired frequency using, for example, thickness shear vibration. As shown in FIG. 1, the piezoelectric vibration element 130 mainly includes a piezoelectric element 131, an excitation electrode 132 that excites thickness shear vibration provided on the upper and lower surfaces of the piezoelectric element 131, and a connection electrode 133.

  The piezoelectric element 131 is a flat plate having a rectangular shape in plan view, and a thin crystal plate is used that has been subjected to external processing after the cut angle is cut from the artificial crystalline lens by AT. For this outer shape processing, mechanical processing means by polishing such as cutting with a wire saw or lapping is mainly used. The size in plan view of the piezoelectric element 131 formed by the outer shape processing is, for example, 1 mm to 3 mm in the long side dimension in plan view. In the first embodiment, a crystal thin plate is used for the piezoelectric element 131, but a thin plate made of a single crystal material having piezoelectricity such as lithium tantalate or lithium niobate may be used.

  The excitation electrode 132 is for generating a thickness shear vibration in the piezoelectric element 131. One excitation electrode 132 is provided at approximately the center of the upper surface and the lower surface of the piezoelectric element 131 so as to face each other with the piezoelectric element 131 interposed therebetween. For example, the excitation electrodes 132 have the same shape and size as each other, and overlap each other in plan perspective. The shape of the excitation electrode 132 is, for example, a substantially rectangular shape having four sides parallel to the four sides of the main surface of the piezoelectric element 131. The excitation electrode 132 is formed by laminating a conductive metal such as gold, aluminum, nickel, chromium, titanium, or an alloy containing these metals on the upper and lower surfaces of the piezoelectric element 131 in a thin film by vapor deposition or sputtering. Above, it is formed by a manufacturing method such as a photolithography method. For example, the excitation electrode 132 may have a three-layer structure of chromium, nickel, and gold metal in order from the surface side of the piezoelectric element 131.

  The connection electrode 133 is for inputting and outputting signals between the first electrode pad 114 provided on the element mounting member 110 and the excitation electrode 132 of the piezoelectric vibration element 130. The connection electrode 133 is provided at each end portion on the side surface side of the piezoelectric element 131 of the extraction electrode 134 extended from the excitation electrode 132 provided on each of the front and back main surfaces of the piezoelectric element 131. Two in total are formed from the upper surface of both corners of the short side to the lower surface through the side surface. The connection electrode 133 is electrically connected to the first electrode pad 114 provided on the element mounting member 110 by a conductive adhesive. In addition, the connection electrode 133 is formed by depositing or sputtering a conductive metal such as gold, aluminum, nickel, chromium, titanium, or an alloy containing these metals on the upper and lower side surfaces of both corners of one short side of the piezoelectric element 121. The film is formed by a manufacturing method such as a photolithography method after being formed into a thin film by using a method such as photolithography. For example, the connection electrode 133 may have a three-layer structure of chromium, nickel, and gold metal sequentially from the surface side of the piezoelectric element 131.

  The lid member 140 hermetically seals the first recess 117 in the vacuum state of the element mounting member 110 on which the piezoelectric vibration element 130 is mounted, or the first recess 117 filled with an inert gas such as nitrogen, argon, helium. It is for stopping. The lid member 140 has a flat plate shape that is rectangular in plan view, and has the same size in plan view as the size of the outer periphery in plan view of the bonding material 118 while covering and closing the opening of the first recess 117. The lid member 140 is disposed on the bonding material 118 provided on the upper surface of the first frame body 112 so as to cover and close the opening of the first recess 117, and the upper surface of the first frame body 112 and the bonding material 118 are interposed therebetween. Are joined. The lid member 140 is made of, for example, an alloy or ceramic containing at least one of iron, nickel, and cobalt, and has a thickness dimension of, for example, 0.2 to 1.0 mm.

  As the integrated circuit element 150, for example, a flip chip type integrated circuit element having a rectangular shape in plan view and having a plurality of connection pads 151 on the main surface facing the substrate 111 constituting the element mounting member 110 is used. Are provided with a combination of a predetermined electronic circuit and electronic elements, for example, an oscillation circuit for exciting the piezoelectric vibration element 130, a waveform shaping circuit, a temperature compensation circuit, and the like. The integrated circuit element 150 is formed by bonding and fixing the connection pads 151 and the second electrode pads 121 constituting the conductor pattern 120 provided on the lower surface of the substrate 111 by soldering or the like. Mounted in. As a result, the piezoelectric vibration element 130 mounted on the first electrode pad 114 and the second electrode pad 121 are connected by the conductor pattern 120 and the wiring pattern (not shown) provided on the surface and inside of the substrate 111. The integrated circuit element 150 is electrically connected.

  As described above, the piezoelectric oscillator 100 according to the embodiment of the present invention includes the substrate 111, the first frame 112 that is provided on the upper surface of the substrate 111 and forms the first recess 117, and the second that is provided on the lower surface of the substrate 111. Provided on the lower surface of the substrate 111 exposed in the second recess 119, the element mounting member including the second frame 113 forming the recess 119, the piezoelectric vibration element 130 mounted in the first recess 117, and the second recess 119; A plurality of conductor patterns 120 including the second electrode pad 121 and the wiring part 122; external connection electrode pads 115 provided at the four corners of the lower surface of the second frame 113; In order to electrically connect the conductor pattern 120, the via conductor 123 provided on the inner surface exposed in the second recess 119 of the second frame 113, and the conductor disposed in the second recess 119 and guided. Includes a electrically connected to the integrated circuit device 150 by solder bumps to the second electrode pad 121 of the pattern 120, the migration prevention region 124 creep bonding material provided in each of the via conductors 123, the.

  With such a configuration, when the piezoelectric oscillator 100 is mounted on an external mounting substrate, the conductive bonding material that climbs up to the via conductor 123 can be suppressed in the middle of the via conductor 123 by the bonding material creeping prevention region 124. Therefore, it is possible to prevent the conductive bonding material climbing up the via conductor 123 from coming into contact with the other conductor pattern 120 from the conductor pattern 120 provided on the lower surface of the substrate 111, thereby reducing short circuit between the conductive patterns 120. Is possible.

  In the piezoelectric oscillator 100 of the present invention, the bonding material scooping prevention region 124 is provided at a position offset from the middle of the length of the via conductor 123 toward the external connection electrode pad 115 side. With such a configuration, when the piezoelectric oscillator 100 is mounted on an external mounting substrate, the conductive bonding material scooped up to the via conductor 123 is provided at a position offset toward the external connection electrode pad 115 side. The bonding material creeping prevention region 124 can suppress the via conductor 123 at a position further away from the substrate 111. Accordingly, the conductive bonding material that has been rolled up the via conductor 123 is remarkably prevented from contacting the other conductive pattern 120 from the conductive pattern 120 provided on the lower surface of the substrate 111, and the short circuit between the conductive patterns 120 is further reduced. It becomes possible to do.

  Furthermore, the piezoelectric oscillator 100 of the present invention is characterized in that the bonding material scooping prevention region 124 is formed by irradiating the via conductor 123 with a laser. With this configuration, the third layer 127 on the surface layer of the via conductor 123 can be removed by the laser, and the removed layer can be formed in the vicinity of the portion where the third layer 127 is removed to form a raised protrusion 124a. Since at least the surface portion of the convex portion 124a is made of a metal oxide having low solder wettability such as nickel, for example, the bonding material scooping prevention region 124 formed by laser spreads the conductive bonding material such as solder. Can be stopped.

(Modification)
Next, a modified example of the piezoelectric oscillator according to the embodiment of the present invention will be described. In the modification of the piezoelectric oscillator according to this embodiment, the same reference numerals as those assigned to the respective components of the piezoelectric oscillator 100 are given to the same components as those of the piezoelectric oscillator 100 according to this embodiment. The description is omitted. A piezoelectric oscillator 200 that is a modification of the present embodiment is different from the piezoelectric oscillator 100 of the present embodiment in that an insulating resin is provided in the second recess 119.

  A piezoelectric oscillator 200 that is a modification of the present embodiment is mainly composed of an element mounting member 110, a piezoelectric vibration element 130, a lid member 140, an integrated circuit element 150, and an insulating resin 260. Such a piezoelectric oscillator 200 is used to generate and output a reference signal used in an electronic device or the like.

  As shown in FIG. 6, a via conductor 123 in which a bonding material scooping prevention region 124 is formed is provided, and an insulating resin 260 is placed in the second recess 119 in which the integrated circuit element 150 is mounted. Filled. The insulating resin 260 is made of an epoxy resin or a polyimide resin. After the liquid insulating resin 260 is caused to flow into the second recess 119 by a dispenser, the insulating resin 260 is solidified and filled by heating or the like. ing. In addition, the amount of the insulating resin 260 does not interfere with the function of the bonding material scooping prevention region 124 from the bottom surface of the substrate 111 in the second recess 119, so that the insulating resin 260 is applied to the bonding material scooping prevention region 124. It is the amount that fills up to a height that does not contact.

  As described above, the piezoelectric oscillator 200 according to the embodiment of the present invention includes the second recessed portion in which the inner surface of the second frame 113 provided with the via conductor 123 in which the bonding material scooping prevention region 124 is formed is exposed. Insulating resin 260 is filled in 119. With such a configuration, for example, the conductive bonding material blocked by the foreign matter from the outside or the bonding material scooping prevention region 124 is peeled off and enters the lower surface direction of the substrate 111 in the second recess 119, so that the conductor It is possible to prevent the pattern 120 and the integrated circuit element 150 from adhering to the circuit formation surface. Therefore, it is possible to reduce the short circuit of the conductor pattern 120 provided on the lower surface of the substrate 111 and the short circuit of the electronic circuit formed on the circuit formation surface of the integrated circuit element 150 due to the foreign matter or the like. Become.

  The present invention is not limited to the above-described embodiments and modifications, and various changes and improvements can be made without departing from the scope of the present invention. For example, in the above-described embodiment, the piezoelectric vibration element having a rectangular shape in plan view is exemplified as the frequency determining element mounted in the piezoelectric device. However, a tuning fork type piezoelectric vibration element or a surface acoustic wave element in plan view is also used. It doesn't matter.

DESCRIPTION OF SYMBOLS 100, 200 ... Piezoelectric oscillator 110 ... Element mounting member 111 ... Substrate 112 ... First frame 113 ... Second frame 114 ... First electrode pad 115 ... External connection Electrode pad 116 ... Third electrode pad 117 ... First recess 118 ... Bonding material 119 ... Second recess 120 ... Conductor pattern 121 ... Second electrode pad 122 ... Wiring part 123: Via conductor 124 ... Bonding material creeping prevention region 130 ... Piezoelectric vibration element 140 ... Lid member 150 ... Integrated circuit element 260 ... Insulating resin

Claims (4)

An element mounting member comprising: a substrate; a first frame that is provided on an upper surface of the substrate to form a first recess; and a second frame that is provided on a lower surface of the substrate to form a second recess;
A piezoelectric vibration element mounted in the first recess;
A plurality of conductor patterns provided on the lower surface of the substrate exposed in the second recess and including a second electrode pad and a wiring portion;
External connection electrode pads provided at the four corners of the lower surface of the second frame,
A via conductor provided on an inner surface exposed in the second recess of the second frame to electrically connect the external connection electrode pad and the predetermined conductor pattern;
An integrated circuit element disposed in the second recess and electrically connected to the second electrode pad of the conductor pattern by a solder bump;
A bonding material creeping prevention region provided in each of the via conductors;
A piezoelectric oscillator comprising:   2. The piezoelectric oscillator according to claim 1, wherein the bonding material scooping prevention region is provided at a position offset from the middle of the length of the via conductor toward the external connection electrode pad.   3. The piezoelectric oscillator according to claim 1, wherein the bonding material scooping prevention region is formed by irradiating a laser to the via conductor.   An insulating resin is filled in the second recess in which the inner surface of the second frame body provided with the via conductor in which the bonding material scooping prevention region is formed is exposed. The piezoelectric oscillator according to claim 1.

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