JP2008289055A - Sheet substrate and method of manufacturing piezoelectric vibration device employing sheet substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet substrate which can be cut by stable dicing, and a method of manufacturing a piezoelectric vibration device employing the relevant sheet substrate. <P>SOLUTION: In a sheet substrate 11, a plurality of housing units 3 and bases 2 are integrally formed in a matrix shape, each base 2 comprising an annular frame body 4 which surrounds the relevant housing unit 3 and on an upper surface of which, a metal film layer 41 is formed. The relevant sheet substrate 11 includes, between adjacent bases, a wiring pattern P1 electrically connecting the bases 2 with each other and a dicing line L for dividing the bases 2 into individuals. Then, no wiring pattern P1 is formed at least on front and rear sides of the dicing line L1. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a sheet substrate in which a plurality of bases are integrated, and a method for manufacturing a piezoelectric vibration device using the sheet substrate, which are used in the manufacture of a piezoelectric vibration device.

Quartz crystal resonators are widely used as piezoelectric vibration devices built into electronic devices.
The surface-mount type crystal resonator is a crystal resonator having a form corresponding to low profile and space saving. A conventional surface-mount type crystal resonator includes a rectangular parallelepiped crystal resonator element, a storage unit for storing the crystal resonator element, and an annular shape surrounding the storage unit and having a metal film layer formed on the upper surface. The frame includes a base made of an insulator having a rectangular shape in plan view, and a metallic lid having a rectangular shape in plan view. After mounting the quartz crystal resonator element in the storage portion, the metal film layer and the lid are joined via a brazing material. Here, the base is manufactured in a collective substrate (sheet substrate) state in which a plurality of bases are integrally formed by aligning in a matrix, and is divided into individual states before the crystal resonator is assembled. Also, the lid is generally divided into a solid state from a sheet substrate state in advance, like the base.

  However, in response to the further miniaturization of crystal units in recent years, it has become difficult to cope with the conventional method of manufacturing a surface-mount type crystal unit. From the point of view of sexuality, there was a problem of inefficiency.

  For such problems, the crystal resonator piece is mounted on each of the base storage parts using the base of the sheet substrate state without being divided into the individual state before the assembly of the crystal resonator, For example, Patent Document 1 discloses a manufacturing method for obtaining a plurality of piezoelectric vibrating devices by joining a plurality of bases in a sheet substrate in a one-to-one manner with a plurality of lid bodies in a state, and dividing the base substrate into pieces.

JP 2005-079658 A

  In Patent Document 1, wirings made of metal for electrically connecting bases are formed on the front and back surfaces of a sheet substrate mainly made of ceramic, and a desired wiring pattern is plated using the wirings. Formed by law. However, after mounting the crystal resonator element on the base and joining with the lid, when the sheet substrate is divided and cut by dicing, metal burrs are generated from the wiring pattern in the cutting region. This burr becomes a cause of problems such as a short circuit and outflow of the brazing material. In addition, there is a method (so-called chocolate break) in which a groove for dividing and dividing in advance is provided on the base boundary line adjacent to the sheet substrate without using dicing, and the outer shape of the base is divided. As the dimensions are further reduced, it becomes difficult to produce a sheet substrate corresponding to this method.

  The present invention has been made in view of such points, and an object of the present invention is to provide a sheet substrate that can be cut into pieces by stable dicing, and a method for manufacturing a piezoelectric vibration device using the sheet substrate. To do.

  In order to achieve the above object, the invention of claim 1 is characterized in that a rectangular base in plan view comprising a storage portion and an annular frame surrounding the storage portion and having a metal film layer formed on the upper surface is a matrix. A sheet substrate made of a ceramic laminate, which is formed in a plurality of and integrally with each other, and has a wiring pattern that electrically connects the bases and a dicing line for cutting the bases individually between adjacent bases. Since the sheet pattern is characterized in that the wiring pattern is not formed at least on the front and back surfaces on the dicing line, there is no wiring pattern on the front and back surfaces on the dicing line. Further, it is possible to suppress the occurrence of metal burrs when cutting by cutting by dicing.

  In addition, since the wiring pattern is not formed on the front and back surfaces on the planned dicing line, the molten brazing material does not flow out on the planned dicing line when the lid and the base are joined by heating and melting the brazing material. Therefore, it is possible to suppress the occurrence of metal burrs during the cutting by dicing.

  Moreover, according to the structure of Claim 2, the said wiring pattern is formed between the lamination | stacking of the said sheet | seat board | substrate. In cutting a sheet substrate by dicing, if a metal film such as a wiring pattern is present on the front and back of the sheet substrate, the dicing blade cuts the surface layer of the sheet substrate and cuts into the substrate with the dicing blade. Since the cut metal that has been applied tends to scatter toward the surface of the sheet substrate, metal burrs that warp in the direction away from the dicing blade are likely to occur. On the other hand, according to the configuration of claim 2, since the wiring pattern is formed between the laminations of the sheet substrates, the occurrence of metal burrs can be suppressed even when the wiring pattern is cut during cutting by dicing. it can. In addition, since no wiring pattern is formed on the front and back surfaces on the dicing planned line, it is possible to suppress the occurrence of metal burrs when the dicing blade cuts the surface layer of the sheet substrate and enters the substrate. .

  Furthermore, according to the structure of Claim 2, since the said wiring pattern is formed between the lamination | stacking of the said sheet | seat board | substrate, the oxidation of the said wiring pattern can be suppressed.

  Further, in the case of the invention of claim 3, the wiring pattern is formed on the surface of the sheet substrate on the side where the metal film layer is formed, and other than the dicing scheduled line between the adjacent bases. It is formed in the area. In this case, the wiring pattern is formed on the surface of the substrate on the side where the metal film layer is formed, that is, the side bonded to the lid, but is not formed in the region of the dicing scheduled line. Since the wiring pattern, that is, the metal film is not cut at the time of individual cutting by, no metal burrs are generated.

  According to a fourth aspect of the present invention, after the wiring patterns are cut to bring the bases into a non-conductive state, at least a piezoelectric vibration element is accommodated in each of the accommodating portions, and the rectangular lid in plan view A piezoelectric body is obtained by bonding a body and a metal film layer on the upper surface of the frame body of the base in a one-to-one manner by a batch heating process through a brazing material, and then cutting the predetermined dicing line by dicing. It is a manufacturing method of a vibration device.

  According to the manufacturing method, each base can be made electrically independent by cutting in advance a wiring pattern having a role of a common wiring conductor that electrically connects the bases of the sheet substrate. As a result, for example, a piezoelectric vibration element is mounted on a mounting pad provided on the bottom surface of the storage portion, and the piezoelectric vibration element and the mounting pad are fixed to each other with a conductive bonding material, and formed outside the base (bottom surface). It is possible to measure various characteristics of each piezoelectric vibration device after electrically connecting the external connection terminal and the mounting pad, which are electrically connected via a wiring conductor formed inside the base.

  According to a fifth aspect of the present invention, there is provided a sheet substrate in which the wiring pattern is formed on the front and back surfaces on the dicing scheduled line, wherein the wiring pattern is cut in advance and each of the bases is in a non-conductive state. Using the sheet substrate, at least the piezoelectric vibration element is accommodated in each of the accommodating portions, and the lid body having a rectangular shape in plan view and the metal film layer on the upper surface of the frame body of the base are collectively disposed via a brazing material. This is a method for manufacturing a piezoelectric vibration device in which a plurality of piezoelectric vibration devices are obtained by cutting the dicing planned line by dicing after one-to-one bonding by heat treatment. Even if a wiring pattern is formed on the wiring pattern, the wiring pattern is formed on the front and back surfaces on the planned dicing line by cutting the wiring pattern in advance. Therefore, it is possible to suppress the flow of the molten brazing material onto the dicing scheduled line at the time of joining the lid and the base, and to suppress the generation of metal burrs at the time of individual cutting by dicing. Can do.

  As described above, according to the sheet substrate of the present invention and the method for manufacturing a piezoelectric vibration device using the sheet substrate, it is possible to perform individual cutting by stable dicing and to obtain a highly reliable piezoelectric vibration device. it can.

-First embodiment-
Hereinafter, a first embodiment according to the present invention will be described with reference to FIGS. 1 to 7, taking a surface-mounted crystal resonator as an example. FIG. 1 is a cross-sectional view of a crystal resonator showing a first embodiment of the present invention, FIG. 2 is a plan view of a sheet substrate showing the first embodiment of the present invention, and FIG. It is sectional drawing in A line. 4 shows a state in which the wiring pattern on the back side of the sheet substrate is cut in FIG. 3, FIG. 5 shows a state in which a crystal vibrating piece is mounted in FIG. 4, and FIG. FIG. 7 is a diagram showing a state after being cut into pieces in FIG. In FIG. 2, the mounting pad on the inner bottom of the base is not shown.

  First, the surface-mount type crystal unit applied in the present embodiment is described with reference to FIG. 1, and then a description about the sheet substrate and a method for manufacturing the crystal unit using the sheet substrate. Will be described with reference to FIGS.

  As shown in FIG. 1, the surface-mount type crystal resonator 1 applied in the present embodiment includes, as main components, a rectangular-shaped lid body 10 in a plan view, a rectangular parallelepiped crystal vibrating piece 8, It consists of a base 2 having a rectangular shape in plan view and an upper portion opened.

  The base 2 is made of an alumina ceramic material, has a storage portion 3 for storing the quartz crystal vibrating piece 8, and an annular frame 4 is formed around the storage portion 3.

  A pair of mounting pads 7 is formed on one end side of the inner bottom portion of the base 2, and the mounting pads 7 are subjected to nickel plating after printing and baking tungsten, and further gold plating is performed thereon. Yes.

  An external connection terminal 6 made of metal is formed on the bottom surface of the base 2 and is electrically connected to the mounting pad 7 through a wiring conductor 5 formed inside the base 2. . The electrical connection between the mounting pad 7 and the external connection terminal 6 may be performed by forming castellations at the four corners of the upper and lower parts of the outer periphery of the base 2.

  In FIG. 1, the upper surface of the frame 4 is flat, and a multilayer metal film layer 41 is formed on the upper surface. Here, the metal film layer 41 is composed of three layers, and is laminated in the order of tungsten, nickel, and gold from the bottom. Tungsten is integrally formed during ceramic firing by metallization technology, and the nickel and gold layers are formed by plating technology. Note that molybdenum may be used instead of tungsten.

  In FIG. 1, the quartz crystal vibrating piece 8 is an AT-cut quartz plate having a rectangular shape in plan view, and an excitation electrode (not shown) for driving the quartz crystal vibrating piece 8 is drawn on the front and back surfaces, and is drawn from the excitation electrode. A lead electrode (not shown) and a pair of pad electrodes (not shown) connected to the lead electrode and formed on both sides of one end of the quartz crystal vibrating piece are formed. These electrodes are formed on the quartz in order from the bottom in the form of chromium (Cr), gold (Au), and chromium (Cr) by vapor deposition. The film configuration of the electrode is not limited to this, and other film configurations may be used.

  In FIG. 1, a lid 10 is rectangular in plan view and is made of a metal material. In this embodiment, the lid 10 is formed with a nickel plating layer as an upper layer and a gold flash plating layer as an upper layer on the entire circumference, with Kovar as a base. ing. Here, the thickness of each layer is 1.0 to 4.0 μm for the nickel layer and about 0.01 μm for the gold flash layer. The gold flash plating layer is preferably formed with a thickness of 0.03 μm or less.

  A metal brazing material (not shown) is formed on the gold flash plating layer (not shown) on the sealing joint surface side of the lid 10. In this embodiment, a gold-tin alloy (Au—Sn alloy) is used as the brazing material. Here, the Au—Sn alloy includes a gold flash plating layer formed on the entire crystal unit, that is, the lid body 10 in a state after melting, and a metal film layer 41 formed on the upper surface of the frame body 4. The Au—Sn alloy formed on the sealing joint surface of the lid 10 so as to have a ratio of Au: Sn = 80: 20 or a ratio of Au slightly lower than that including the gold to be formed. The composition is adjusted in advance.

  This completes the description of the main components of a single surface-mount type crystal unit applied in this embodiment. In the present invention, the sheet substrate in which the bases 2 are integrally formed by arranging the base 2 vertically and horizontally in a matrix is used without being divided into individual states before assembling the crystal resonator. Hereinafter, the sheet substrate will be described.

  In FIG. 2, the sheet substrate 11 is integrally formed by arranging bases 2 having a rectangular shape in a plan view in a matrix shape vertically and horizontally. The sheet substrate 11 is integrally formed by laminating two ceramic green sheets (a first layer 1a and a second layer 1b thereon) made of an alumina ceramic material.

  In the description of the embodiment of the present invention, the surface on which the storage portion 3 is formed in FIG. 2 is the “front surface” of the sheet substrate 11, and the surface on which the storage portion 3 is not formed is the “back surface”. It is defined as FIG. 2 is a plan view as viewed from the “surface” of the sheet substrate.

  In FIG. 2, the wiring pattern P is formed in an annular shape at a position that surrounds the region where the base 2 is arranged in a matrix and is spaced inward from the periphery of the sheet substrate 11. The wiring pattern P is provided with a plurality of marks M, and the formation positions thereof connect a virtual line passing through the center between adjacent bases and extend to the periphery of the sheet substrate 11, The position is orthogonal to the wiring pattern P. The wiring pattern P is formed on both the front and back surfaces of the sheet substrate 11.

  On the surface of the sheet substrate 11, a dicing planned line L is set vertically and horizontally between adjacent bases so as to define one base region. In addition, the said dicing plan line L is a line which connected the two said mark M which opposes with the straight line. The dicing schedule line L has a function as a positioning line when the dicing is divided into a plurality of crystal resonators.

  The dicing planned line L may be formed by providing a shallow kerf by means such as dicing, but can be handled even when a kerf is not formed. For example, the position of a pair of marks M facing each other can be recognized by the image recognition device, a dicing planned line can be calculated, and position information of a plurality of dicing planned lines can be recorded in a storage device.

  In FIG. 3, an external connection terminal 6 made of metal is formed on the first layer 1a, and a wiring conductor 5 connected to the external connection terminal 6 is formed in the layer of the first layer 1a. ing.

  Further, on the back side of the first layer 1a, a wiring pattern P1 is formed so as to electrically connect adjacent bases. In this embodiment, no wiring pattern is formed on the surface side of the dicing planned line L.

  Next, a method for manufacturing a crystal resonator according to the present invention using the sheet substrate 11 will be described with reference to FIGS.

  Since the sheet substrate 11 needs to confirm various characteristics of each crystal resonator 1 during the manufacturing process, as shown in FIG. 4, before mounting the crystal resonator element 8 in the storage portion 3, The wiring pattern P1 formed on the back surface side of the sheet substrate 11 is cut to make the individual bases 2 electrically independent (back surface wiring cutting step). In addition, it is preferable to implement the said back surface wiring cut process using techniques, such as a laser.

  Using the sheet substrate in which the adjacent bases are electrically independent by the backside wiring cutting step, the crystal vibrating pieces 8 are mounted one-on-one in the storage portions 3 of the respective bases 2 and are made conductive. It joins via the joining material 9 (refer FIG. 5).

  The base 2 and the crystal vibrating piece 8 are bonded by the conductive bonding material 9 to the pad electrode formed on both sides of one end of the crystal vibrating piece 8 and the mounting pad 7 on the inner bottom portion of the base 2. Bonded via the conductive bonding material 9. In the present embodiment, a silicone-based conductive resin bonding material is used as the conductive bonding material 9. However, the conductive bonding material 9 is not limited to the silicone type, and an epoxy type conductive resin bonding material may be used in addition to the silicone type.

  After mounting the crystal vibrating piece 8 in all the base storage parts 3, the conductive bonding material 9 is collectively cured in an atmosphere controlled to a predetermined temperature profile, and the pad electrode of the crystal vibrating piece 8; The mounting pad 7 is joined. In the present embodiment, a conductive bonding material is used as a bonding means between the crystal vibrating piece and the base, but the present invention is not limited to this, and for example, a FCB (Flip Chip Bonding) method using metal bumps. Thus, the crystal vibrating piece and the base may be joined.

  After the crystal vibrating pieces 8 are mounted on all the storage units 3 and bonded with a conductive bonding material, the oscillation frequency of each of the crystal vibrating pieces 8 is finely adjusted. After the fine adjustment, the lid 10 is placed on the metal film layer 41 on the upper surface of each frame 4 on a one-to-one basis. When the placement of the lid body 10 is completed, the lid body 10 and the base 2 are collectively brazed and hermetically sealed by atmospheric heating using a heating furnace (see FIG. 6).

  When the hermetic sealing is completed, the sheet substrate 11 formed by connecting a plurality of crystal resonators is divided and cut into individual crystal resonators 1 by dicing (individual dividing step). By dividing into pieces, a plurality of crystal resonators can be obtained collectively, and the crystal resonator 1 is completed (see FIG. 7).

  The dividing process is performed by bringing a dicing blade into contact with the dicing scheduled line L from two orthogonal directions. At this time, since the wiring pattern, that is, the metal film is not formed on the surface side of the dicing planned line L from the beginning, the brazing material eluted at the time of heating and melting is washed away to cover the dicing planned line L. There is nothing. Therefore, since the dicing blade does not cut the metal film, the generation of metal burrs when cutting the sheet substrate can be suppressed.

-Second Embodiment-
A second embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a plan view seen from the front surface side of the sheet substrate showing the second embodiment of the present invention, and FIG. 9 is a cross-sectional view taken along the line BB of FIG. In addition, about the structure similar to the above-mentioned embodiment, while attaching | subjecting the same number and omitting a part of description, it has an effect similar to the above-mentioned embodiment.

  In the present embodiment, the wiring pattern P3 is embedded between the ceramic green sheet stacks. In FIG. 8, in order to make the formation position of the inter-stack wiring pattern P <b> 3 easy to understand, it is painted and displayed with a dotted line.

  The wiring pattern P3 is connected to a mounting pad 71 on the inner bottom of the base, and the mounting pad 71 is framed via via holes (not shown) formed diagonally in the vertical direction inside the frame 4. While being connected to the metal film layer 41 on the upper surface, the mounting pad 71 and the external connection terminal 6 on the lower surface (bottom surface) of the base are electrically connected via the wiring conductor 5. Each base is electrically connected via the via hole. The straight line portion extending in the long side direction of the base of the mounting pad 71 has a function of adjusting the capacitance of the crystal resonator.

  As shown in FIG. 9, the wiring pattern P <b> 1 on the back surface side of the sheet substrate 12 is formed so as not to be positioned on a perpendicular line that is lowered in the thickness direction of the dicing scheduled line L. This is because, since the wiring pattern P3 is embedded between the laminations of the sheet substrate 12, it is not always necessary to make a common connection on the back side of the sheet substrate on the perpendicular.

  With the configuration as described above, when the wiring cut is performed, the wiring pattern P3 is cut not inside the surface layer of the sheet substrate 12, but inside the sheet substrate 12, so that the generation of metal burrs can be suppressed and the reliability can be further improved. High wiring cut can be performed.

  Further, in the case of the above configuration, the wiring pattern P1 on the back surface side of the sheet substrate 12 is formed so as not to be located on the perpendicular line that is lowered in the thickness direction of the dicing planned line L. Even if wiring cut is performed by dicing, metal burrs do not occur. Therefore, since it is possible to select not only laser but also dicing as the cutting means for the wiring pattern P3, the selection range of the cutting means for the wiring pattern P3 is widened, and more efficient wiring cutting can be performed. .

  Even if the wiring pattern P1 on the back surface side of the sheet substrate is formed in a state where the wiring pattern P1 is positioned on a perpendicular line extending in the thickness direction of the dicing planned line L in the above configuration, the laser is applied from the back surface side of the sheet substrate. By cutting the surface wiring pattern, the generation of metal burrs can be suppressed.

-Third embodiment-
A third embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a plan view of a sheet substrate showing a third embodiment of the present invention, and FIGS. 11 to 15 are diagrams for explaining a manufacturing process of a crystal resonator along the line CC in FIG. In FIG. 13 to FIG. 15, the description of the electrodes formed on the front and back surfaces of the crystal vibrating piece 8 is omitted. Further, the same configurations as those of the above-described embodiment are given the same reference numerals and a part of the description is omitted, and the same effects as those of the above-described embodiment are obtained.

  As shown in FIG. 10, the wiring pattern P <b> 2 formed on the surface side of the sheet substrate 13 is in a state of covering the dicing scheduled line L. Manufacture of the crystal unit 1 using the sheet substrate 13 in the present embodiment is performed as shown in FIGS.

  First, as shown in FIG. 11, simultaneously with the back surface wiring cutting step, the wiring pattern P2 on the front surface side of the sheet substrate 13 is also cut by the laser R along the dicing planned line L. By cutting in this way, the metal film is not formed on the perpendicular line where the planned dicing line L is lowered in the thickness direction of the sheet substrate 13 as shown in FIG.

  After the sheet substrate 13 is brought into the state as described above, the crystal vibrating piece 8 is bonded onto the mounting pad 7 via the conductive bonding material 9 as shown in FIG.

  After the quartz crystal vibrating piece 8 is bonded to all the bases of the sheet substrate 13 via the conductive bonding material 9, the lid 10 is formed as a metal film layer on the upper surface of the frame 4 as shown in FIG. One-to-one is placed on 41 and the brazing material formed on the lid body 10 is melted in a heated atmosphere, and the plurality of bases 2 and the plurality of lid bodies 10 are hermetically sealed together.

  After the sealing and joining, when the sheet substrate 13 is completely cut with a dicing blade along the dicing scheduled line L, a large number of crystal resonators 1 can be obtained in a lump as shown in FIG. In FIG. 14, since no metal film is formed on the vertical line in which the planned dicing line L is lowered in the thickness direction of the sheet substrate 13, it is possible to suppress the generation of metal burrs when the sheet substrate 13 is cut by the dicing blade. Therefore, stable cutting can be performed.

  In the embodiment of the present invention, a gold-tin alloy (Au—Sn alloy) is used as the brazing material, but the present invention is not limited to this. For example, a tin-silver alloy (Sn—Ag alloy), Other metals such as gold-germanium (Au—Ge alloy) may be used.

  In the embodiment of the present invention, a surface-mounted crystal resonator is taken as an example, but it can also be applied to a sheet substrate of a piezoelectric vibration device such as a crystal oscillator mounted with an electronic component such as an IC and a manufacturing method using the sheet substrate. It is.

  The present invention can be implemented in various other forms without departing from the spirit or main features thereof. Therefore, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  It can be applied to mass production of piezoelectric vibration devices.

1 is a cross-sectional view of a crystal resonator showing a first embodiment of the present invention. The top view of the sheet | seat board | substrate which shows the 1st Embodiment of this invention. It is sectional drawing in the AA of FIG. Sectional drawing which shows the state by which the wiring pattern of the sheet | seat board | substrate back surface side was cut | disconnected in FIG. The figure which shows the state in which the quartz crystal vibrating piece was mounted in FIG. The figure which shows the state in which the cover body was joined in FIG. The figure which shows the state after being cut into pieces in FIG. The top view of the sheet | seat board | substrate which shows the 2nd Embodiment of this invention. Sectional drawing in the BB line of FIG. The top view of the sheet | seat board | substrate which shows the 3rd Embodiment of this invention. Sectional drawing in the CC line | wire of FIG. The figure which shows the state by which the wiring pattern of the sheet | seat board | substrate front and back was cut | disconnected in FIG. The figure which shows the state in which the quartz crystal vibrating piece was mounted in FIG. The figure which shows the state in which the cover body was joined in FIG. The figure which shows the state after being cut into pieces in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Crystal resonator 2 Base 3 Storage part 4 Frame 5 Wiring conductor 6 External connection terminal 7 Mounting pad 8 Crystal vibrating piece 9 Conductive bonding material 10 Lid 11 Sheet substrate showing 1st Embodiment 12 2nd Embodiment Sheet substrate representing 13 13 Sheet substrate representing the third embodiment 41 Metal film layer R Laser L Dicing schedule line

Claims (5)

A plurality of rectangular bases in plan view, each including a storage part and an annular frame body that surrounds the storage part and has a metal film layer formed on the upper surface, are integrally formed in a matrix, and the bases are electrically connected to each other. A sheet substrate made of a ceramic laminate having wiring patterns to be connected to each other and a dicing schedule line for cutting the base into individual pieces between adjacent bases,
A sheet substrate, wherein the wiring pattern is not formed on at least the front and back surfaces on the dicing line.   The sheet substrate according to claim 1, wherein the wiring pattern is formed between the stacks of the sheet substrates.   The wiring pattern is formed on the surface of the sheet substrate on the side where the metal film layer is formed, and is formed in a region other than the dicing line between the adjacent bases. The sheet substrate according to claim 1 or 2.   4. A lid body having a rectangular shape in plan view, wherein at least a piezoelectric vibration element is accommodated in each of the accommodating portions after cutting the wiring patterns of the sheet substrate according to claim 1 to make the bases nonconductive. And the metal film layer on the upper surface of the frame body of the base are bonded one-to-one by a batch heat treatment via a brazing material, and then the dicing line is cut by dicing to obtain a plurality of piezoelectric vibration devices Device manufacturing method.   The sheet substrate in which the wiring pattern is formed on the front and back surfaces on the dicing scheduled line, wherein the storage is performed by using the sheet substrate in which the wiring pattern is removed in advance and each of the bases is made non-conductive. After accommodating at least the piezoelectric vibration element in each of the parts, and joining the cover body having a rectangular shape in plan view and the metal film layer on the upper surface of the frame body of the base in a one-to-one manner by a batch heat treatment through a brazing material, A method of manufacturing a piezoelectric vibration device, wherein a plurality of piezoelectric vibration devices are obtained by cutting the dicing line by dicing.

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