JP4384546B2 - Method of manufacturing electronic parts - Google Patents

Method of manufacturing electronic parts Download PDF

Info

Publication number
JP4384546B2
JP4384546B2 JP2004158728A JP2004158728A JP4384546B2 JP 4384546 B2 JP4384546 B2 JP 4384546B2 JP 2004158728 A JP2004158728 A JP 2004158728A JP 2004158728 A JP2004158728 A JP 2004158728A JP 4384546 B2 JP4384546 B2 JP 4384546B2
Authority
JP
Japan
Prior art keywords
mother
cover
blade
substrate
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004158728A
Other languages
Japanese (ja)
Other versions
JP2005340558A (en
Inventor
利夫 中澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2004158728A priority Critical patent/JP4384546B2/en
Publication of JP2005340558A publication Critical patent/JP2005340558A/en
Application granted granted Critical
Publication of JP4384546B2 publication Critical patent/JP4384546B2/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

Description

本発明は、携帯用通信機器や電子計算機等の電子機器に用いられる電子部品の製造方法に関するものである。   The present invention relates to a method of manufacturing an electronic component used in an electronic device such as a portable communication device or an electronic computer.

従来より、携帯用通信機器や電子計算機等の電子機器には、所定の共振周波数を発生する水晶振動子等の電子部品が用いられている。   2. Description of the Related Art Conventionally, electronic devices such as a crystal resonator that generates a predetermined resonance frequency are used in electronic devices such as portable communication devices and electronic computers.

従来の水晶振動子としては、例えば図4に示す如く、板状絶縁層21a、21bと枠状絶縁層21cとを積層してなる絶縁基板上面の枠状絶縁層21cで囲まれる領域に一対の接続パッドを有し、該接続パッドに導電性接着材を介して電気的に接続される一対の振動電極を有した水晶振動素子25を取着させるとともに、前記枠状絶縁層21cの上部に金属製の蓋体27をロウ材を介して接合することにより水晶振動素子25の搭載領域を気密封止した構造のものが知られている(例えば、特許文献1参照。)。   As a conventional quartz resonator, for example, as shown in FIG. 4, a pair of regions are surrounded by a frame-like insulating layer 21c on the upper surface of an insulating substrate formed by laminating plate-like insulating layers 21a, 21b and a frame-like insulating layer 21c. A crystal resonator element 25 having a connection pad and having a pair of vibration electrodes electrically connected to the connection pad via a conductive adhesive is attached, and a metal is formed on the frame-like insulating layer 21c. There is known a structure in which the mounting region of the crystal resonator element 25 is hermetically sealed by bonding a lid 27 made of solder through a brazing material (see, for example, Patent Document 1).

かかる水晶振動子は、絶縁基体21の下面に設けられる入出力端子を介して水晶振動素子25の振動電極間に外部からの変動電圧が印加されると、水晶振動素子25の特性に応じた所定の周波数で厚みすべり振動を起こすようになっており、その共振周波数に基づいて外部の発振回路で所定周波数の基準信号が発振・出力される。このような基準信号は、例えば携帯用通信機器等の電子機器におけるクロック信号として利用されることとなる。   Such a crystal resonator has a predetermined value corresponding to the characteristics of the crystal resonator element 25 when an external variable voltage is applied between the vibration electrodes of the crystal resonator element 25 via an input / output terminal provided on the lower surface of the insulating base 21. The thickness-shear vibration is caused at the frequency, and a reference signal having a predetermined frequency is oscillated and output by an external oscillation circuit based on the resonance frequency. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.

また、上述した水晶振動子の絶縁基体21は、通常、複数個の絶縁基体21を切り出すことができる大型の母基板を分割して個片を得る“多数個取り”の手法によって形成されており、得られた個片(絶縁基体21)に水晶振動素子25を個々に取着させた上、枠状絶縁層21cの上部に蓋体27を個々の個片ごとに接合することによって水晶振動子が製作される。   Further, the above-described insulating base 21 of the crystal resonator is usually formed by a “multi-piece” technique in which a large mother substrate from which a plurality of insulating bases 21 can be cut is divided to obtain individual pieces. Then, the crystal resonator element 25 is individually attached to the obtained piece (insulating base 21), and the lid 27 is joined to the upper part of the frame-like insulating layer 21c for each piece. Is produced.

更に、蓋体27も絶縁基体21と同様に、複数個の蓋体27を切り出すことができる大型の金属板(母カバー)を分割することによって得られ、水晶振動子の使用時、この蓋体27をグランド電位に保持しておくことにより外部からのノイズが遮蔽される。このような蓋体27は、絶縁基体21を介してグランド端子に電気的に接続される。
特開2001−274649号公報
Further, similarly to the insulating base 21, the lid 27 is obtained by dividing a large metal plate (mother cover) from which a plurality of lids 27 can be cut out. By keeping 27 at the ground potential, noise from the outside is shielded. Such a lid 27 is electrically connected to the ground terminal via the insulating base 21.
JP 2001-274649 A

しかしながら、上述した従来の水晶振動子においては、その組み立てに先立って、大型の母基板を分割することにより絶縁基体21を、また大型の母カバーを分割することにより蓋体27を予め得ておく必要があり、この2種類の部材をそれぞれ別個の分割工程で得るようにしていたことから、水晶振動子の組み立て工程が煩雑なものとなり、生産性の向上に供しないという欠点を有していた。   However, in the above-described conventional crystal resonator, prior to the assembly, the insulating base 21 is obtained by dividing the large mother substrate, and the lid 27 is obtained in advance by dividing the large mother cover. Since these two types of members are obtained in separate division steps, the crystal resonator assembly process becomes complicated and has the disadvantage of not contributing to productivity. .

また上述したように、個片の絶縁基体21と個片の蓋体27とを事前に準備してから水晶振動子を組み立てる場合、複数個の絶縁基体21を個々にキャリアに保持させるための作業が必要となり、またキャリアに保持させた個々の絶縁基体21上には蓋体27を個々に位置合わせをして取り付けなければならず、これによっても水晶振動子の組み立て工程が煩雑になる欠点を有していた。   In addition, as described above, when assembling a crystal resonator after preparing the individual insulating base 21 and the individual lid body 27 in advance, an operation for individually holding the plurality of insulating bases 21 on the carrier. In addition, the lid 27 must be individually aligned and mounted on the individual insulating bases 21 held by the carrier, and this also disadvantageously complicates the assembly process of the crystal unit. Had.

本発明は上述の欠点に鑑み案出されたもので、その目的は、組み立て工程を簡略化して生産性を向上させることができる電子部品の製造方法を提供することにある。   The present invention has been devised in view of the above-described drawbacks, and an object of the present invention is to provide a method of manufacturing an electronic component that can simplify an assembly process and improve productivity.

本願発明の一つの態様によれば、電子装置の製造方法は、マトリクス状に配列された複数個の基板領域を有するセラミック製の母基板を準備し、該母基板の各基板領域に電子部品素子を搭載する工程Aと、前記基板領域と1対1に対応する複数個のカバー領域を有する金属製の母カバーを前記母基板上に配置し、該母基板と前記母カバーとを各基板領域の外周部において接合する工程Bと、前記母カバーの表面を各カバー領域の外周に沿って第1のブレードにて切削することにより、前記母カバーの上面に開口する溝部を、該溝部の最深部が前記母カバーの下面に到達しないように形成する工程Cと、前記第1のブレードよりも刃幅の狭い第2のブレードを前記溝部内に挿入し、該第2のブレードにて前記溝部の直下に位置する母カバーと母基板とを切断・分割することにより複数個の電子部品を得る工程Dとを含んでおり、前記母カバーの厚み方向にかかる前記溝部の最深部から前記母カバーの下面までの寸法Xと、前記溝部の最深部から開口面までの寸法Yとが、関係式「0.1≦(X/(X+Y))≦0.3」を満足するように設定されていることを特徴とする。According to one aspect of the present invention, a method for manufacturing an electronic device includes preparing a ceramic mother board having a plurality of substrate areas arranged in a matrix, and providing an electronic component element in each board area of the mother board. A metal mother cover having a plurality of cover areas corresponding to the board area on a one-to-one basis, and the mother board and the mother cover are arranged in each board area. The groove B opened on the upper surface of the mother cover is formed at the deepest depth of the groove by cutting the surface of the mother cover with a first blade along the outer periphery of each cover region. Step C is formed so that the portion does not reach the lower surface of the mother cover, and a second blade having a blade width narrower than that of the first blade is inserted into the groove portion, and the groove portion is formed by the second blade. Mother cover and mother located directly under A step D of obtaining a plurality of electronic components by cutting and dividing the plate, and the dimension X from the deepest part of the groove part to the lower surface of the mother cover in the thickness direction of the mother cover, The dimension Y from the deepest part of the groove part to the opening surface is set so as to satisfy the relational expression “0.1 ≦ (X / (X + Y)) ≦ 0.3”.

本発明の電子部品の製造方法によれば、マトリクス状に配列された複数個の基板領域を有するセラミック製の母基板を準備し、該母基板の各基板領域に電子部品素子を搭載する工程と、前記基板領域と1対1に対応する複数個のカバー領域を有する金属製の母カバーを前記母基板上に配置し、該母基板と前記母カバーとを各基板領域の外周部において接合する工程と、前記母カバーの表面を各カバー領域の外周に沿って第1のブレードにて切削することにより、前記母カバーの上面に開口する溝部を、該溝部の最深部が前記母カバーの下面に到達しないように形成する工程と、前記第1のブレードよりも刃幅の狭い第2のブレードを前記溝部内に挿入し、該第2のブレードにて前記溝部の直下に位置する母カバーと母基板とを切断・分割することにより複数個の電子部品を得る工程と、を含むようにして電子部品を製造するようにしたことから、電子部品の組み立てに先立って、基板やカバーを個片に分割しておく必要はなく、予め一体化された母基板及び母カバーを2種のブレードにより分割することによって基板とカバーとを一括的に切断することができる。   According to the method of manufacturing an electronic component of the present invention, a step of preparing a ceramic mother board having a plurality of substrate regions arranged in a matrix and mounting an electronic component element on each substrate region of the mother substrate; A metal mother cover having a plurality of cover areas corresponding one-to-one with the board area is disposed on the mother board, and the mother board and the mother cover are joined to each other at the outer periphery of each board area. Cutting the surface of the mother cover with a first blade along the outer periphery of each cover region, so that the groove portion opened in the upper surface of the mother cover has a deepest portion of the groove portion on the lower surface of the mother cover. A second blade having a narrower blade width than the first blade is inserted into the groove, and the mother cover is located directly below the groove with the second blade; Cutting and dividing the mother board And the step of obtaining a plurality of electronic components, the electronic component is manufactured so that it is not necessary to divide the substrate and the cover into pieces prior to the assembly of the electronic component. By dividing the integrated mother board and mother cover with two kinds of blades, the board and the cover can be cut together.

しかもこの場合、電子部品の組み立てに際して、母基板そのものがキャリアとして機能するようになっていることから、母基板より分割した個片を個々にキャリアに保持させたり、或いは、各個片にカバーを個々に取り付けるといった煩雑な作業は一切不要となる。   In addition, in this case, when assembling the electronic components, the mother board itself functions as a carrier. Therefore, the individual pieces divided from the mother board are individually held by the carrier, or each individual piece is provided with a cover. There is no need for complicated work such as attaching to the camera.

これにより、電子部品の組み立て工程が大幅に簡素化されるようになり、電子部品の生産性向上に供することが可能となる。   As a result, the assembly process of the electronic component is greatly simplified, and it is possible to improve the productivity of the electronic component.

また本発明の電子部品の製造方法によれば、前記溝部の最深部から前記母カバーの下面までの寸法Xと、前記溝部の最深部から開口面までの寸法Yとが、関係式「0.1≦(X/(X+Y))≦0.3」を満足するようにして、金属製の母基板の表面に溝部を形成するようにしていることから、第2のブレードにより母カバーを切断する際に生成される母カバーの切断屑を、第2のブレードの切断効率を低下させない程度に抑えることができるとともに、第2のブレードにより前記母基板を切断する際、第1のブレードにより切削されずに残った母カバーの薄肉部分が、第1のブレードと母基板との間で緩衝材として機能し、絶縁基板にクラック等が発生するのを有効に防止することができるようになる。   Further, according to the method for manufacturing an electronic component of the present invention, the dimension X from the deepest part of the groove part to the lower surface of the mother cover and the dimension Y from the deepest part of the groove part to the opening surface are expressed by the relational expression “0. 1 ≦ (X / (X + Y)) ≦ 0.3 ”is satisfied, and the groove is formed on the surface of the metal mother substrate, so the mother cover is cut by the second blade. The cutting waste of the mother cover generated at the time can be suppressed to the extent that the cutting efficiency of the second blade is not lowered, and when the mother substrate is cut by the second blade, it is cut by the first blade. The remaining thin portion of the mother cover functions as a cushioning material between the first blade and the mother substrate, and it is possible to effectively prevent cracks and the like from occurring on the insulating substrate.

以下、本発明を添付図面に基づいて詳細に説明する。   Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

図1は、本発明の電子部品の製造方法を適用して製造された電子部品を示す断面図であり、図2は図1に示す電子部品の分解斜視図である。同図に示す電子部品は、大略的に、絶縁基体1と、電子部品素子5と、カバー部材8とで構成されている。尚、本実施形態においては、電子部品素子5として水晶振動素子を用いた電子部品である水晶振動子を例に説明する。   FIG. 1 is a cross-sectional view showing an electronic component manufactured by applying the electronic component manufacturing method of the present invention, and FIG. 2 is an exploded perspective view of the electronic component shown in FIG. The electronic component shown in the figure is generally composed of an insulating substrate 1, an electronic component element 5, and a cover member 8. In the present embodiment, a crystal resonator that is an electronic component using a crystal resonator element as the electronic component element 5 will be described as an example.

絶縁基体1は、例えば、ガラス−セラミック、アルミナセラミックス等のセラミック材料から成る板状絶縁層1a、1bと枠状絶縁層1cとを積層して形成されており、その上面であって枠状絶縁層1cで囲まれる領域には一対の接続パッド2が設けられ、また、下面には入力端子、出力端子、グランド端子等の外部端子3が設けられている。   The insulating substrate 1 is formed by laminating plate-like insulating layers 1a and 1b made of a ceramic material such as glass-ceramic or alumina ceramic and a frame-like insulating layer 1c, and is frame-shaped insulating on the upper surface thereof. A pair of connection pads 2 are provided in a region surrounded by the layer 1c, and external terminals 3 such as an input terminal, an output terminal, and a ground terminal are provided on the lower surface.

かかる絶縁基体1に設けられている一対の接続パッド2は、その上面側で水晶振動素子5の振動電極に導電性接着材7を介して電気的に接続され、下面側で絶縁基体1上の導体パターンや絶縁基体内部のビア導体等を介して絶縁基体下面の入出力端子(入力端子、出力端子)に電気的に接続される。   The pair of connection pads 2 provided on the insulating base 1 is electrically connected to the vibration electrode of the crystal resonator element 5 on the upper surface side via the conductive adhesive 7 and on the insulating base 1 on the lower surface side. It is electrically connected to an input / output terminal (input terminal, output terminal) on the lower surface of the insulating base via a conductor pattern or a via conductor inside the insulating base.

尚、上述した外部端子3は、水晶振動子をマザーボード等の外部電気回路に搭載する際、外部電気回路の回路配線と半田等の導電性接着材を介して電気的に接続されることとなる。   The external terminal 3 described above is electrically connected to the circuit wiring of the external electric circuit via a conductive adhesive such as solder when the crystal resonator is mounted on an external electric circuit such as a mother board. .

また、絶縁基体1の上面に搭載される水晶振動素子5は、所定の結晶軸でカットした、厚み30μm〜160μmの水晶片の両主面に一対の振動電極を被着・形成してなり、外部からの変動電圧が一対の振動電極を介して水晶片に印加されると、所定の周波数で厚みすべり振動を起こすようになっている。   The quartz resonator element 5 mounted on the upper surface of the insulating substrate 1 is formed by attaching and forming a pair of vibrating electrodes on both main surfaces of a crystal piece having a thickness of 30 μm to 160 μm cut along a predetermined crystal axis. When a fluctuation voltage from the outside is applied to the crystal piece via a pair of vibrating electrodes, thickness shear vibration is caused at a predetermined frequency.

このような水晶振動素子5は、その両主面に被着されている振動電極と絶縁基体上面の対応する接続パッド2とを導電性接着材7を介して電気的・機械的に接続することによって絶縁基体1の上面の所定位置に搭載される。   Such a quartz-crystal vibrating element 5 is electrically and mechanically connected via a conductive adhesive 7 to the vibrating electrodes attached to both main surfaces thereof and the corresponding connection pads 2 on the upper surface of the insulating base. Is mounted at a predetermined position on the upper surface of the insulating substrate 1.

上述の枠状絶縁層1cは、絶縁基体1と後述するカバー部材8との間に水晶振動素子5が配置される所定の空間を確保するためのスペーサとして機能するものであり、その上面にはカバー部材8が取着され、該カバー部材8によって枠状絶縁層1cの内周面と絶縁基体1の上面とで囲まれる水晶振動素子5の収納領域が気密封止される。   The frame-shaped insulating layer 1c described above functions as a spacer for securing a predetermined space in which the crystal resonator element 5 is disposed between the insulating base 1 and a cover member 8 described later. The cover member 8 is attached, and the housing region of the crystal resonator element 5 surrounded by the inner peripheral surface of the frame-shaped insulating layer 1c and the upper surface of the insulating base 1 is hermetically sealed by the cover member 8.

このようなカバー部材8は、例えば42アロイやコバール,リン青銅等の金属からなり、その全体構造は略平板形状をなしている。また、カバー部材8の上面にはその外周に沿って凹み部17が形成されている。この凹み部は、例えば階段状の段差部から成り、その幅は20μm〜40μmである。この凹み部17が形成される理由は、後述する水晶振動子の製造方法の説明において明らかになる。   Such a cover member 8 is made of, for example, a metal such as 42 alloy, Kovar, or phosphor bronze, and the entire structure thereof has a substantially flat plate shape. A recess 17 is formed on the upper surface of the cover member 8 along the outer periphery thereof. This dent part consists of a step-shaped step part, for example, and the width | variety is 20 micrometers-40 micrometers. The reason why the recess 17 is formed will become clear in the description of the method for manufacturing a crystal resonator described later.

カバー部材8の下面には接合材9が被着されている。この接合材9は、カバー部材8側からNi層及びAu−Sn層が順に積層されてなるものであり、その厚みは、Ni層が2μm〜8μm、Au−Sn層が10μm〜30μmである。   A bonding material 9 is attached to the lower surface of the cover member 8. The bonding material 9 is formed by sequentially laminating a Ni layer and an Au—Sn layer from the cover member 8 side, and the thickness thereof is 2 μm to 8 μm for the Ni layer and 10 μm to 30 μm for the Au—Sn layer.

このような接合材9が下面に形成されたカバー部材8は、枠状絶縁層1cの上面に形成されている導体層4を介して、絶縁基体1上に絶縁基体の開口部を覆うようにして載置され、接合材9を溶融・硬化させることにより絶縁基体1に接合される。   The cover member 8 having the bonding material 9 formed on the lower surface covers the opening of the insulating substrate on the insulating substrate 1 via the conductor layer 4 formed on the upper surface of the frame-shaped insulating layer 1c. And bonded to the insulating substrate 1 by melting and curing the bonding material 9.

前記導体層4としては、例えば、タングステンやモリブデン等からなるメタライズ層、Ni層及びAu層を順に積層してなる3層構造のものが用いられ、その厚みは、例えばメタライズ層が10μm〜20μm、Ni層が2μm〜8μm、Au層が0.7μm〜1.4μmに設定される。この導体層4は、その外周辺が枠状絶縁層1cの外周辺との間に、例えば10μm〜30μmの間隔を設けるようにして形成されており、前記接合材9が導体層4の外周部にかけてフィレットを形成するようになっている。   As the conductor layer 4, for example, a three-layer structure in which a metallized layer made of tungsten, molybdenum or the like, a Ni layer, and an Au layer are sequentially laminated is used, and the thickness thereof is, for example, 10 μm to 20 μm for the metallized layer, The Ni layer is set to 2 μm to 8 μm, and the Au layer is set to 0.7 μm to 1.4 μm. The conductor layer 4 is formed so that the outer periphery thereof is provided with an interval of, for example, 10 μm to 30 μm between the outer periphery of the frame-like insulating layer 1 c, and the bonding material 9 is an outer peripheral portion of the conductor layer 4. In order to form a fillet.

尚、前記カバー部材8は、絶縁基体1とで囲まれる領域に水晶振動素子5を収容して気密封止するためのものであり、導体層4や基板内部に設けたビアホール導体などを介して絶縁基体下面のグランド端子に電気的に接続されており、これによって、カバー部材8は、水晶振動子の使用時、グランド電位に保持され、水晶振動素子5がカバー部材8のシールド効果によって外部からの不要な電気的作用、例えばノイズ等から良好に保護される。   The cover member 8 is for accommodating the quartz vibrating element 5 in a region surrounded by the insulating base 1 and hermetically sealing the cover member 8 via a conductor layer 4 or a via hole conductor provided inside the substrate. The cover member 8 is electrically connected to the ground potential when the crystal resonator is used, and the crystal vibrating element 5 is externally applied by the shielding effect of the cover member 8. It is well protected from unwanted electrical effects such as noise.

かくして上述した水晶振動子は、絶縁基体1の下面に設けられる入出力端子を介して水晶振動素子5の振動電極−振動電極間に外部からの変動電圧を印加し、水晶振動素子5の特性に応じた所定の周波数で厚みすべり振動を起こさせることによって水晶振動子として機能し、かかる水晶振動子の共振周波数に基づいて外部の発振回路で所定周波数の基準信号が発振・出力される。そして、このような基準信号は携帯用通信機器等の電子機器にお
けるクロック信号として利用されることとなる。
Thus, the crystal resonator described above applies a variable voltage from the outside between the vibration electrode and the vibration electrode of the crystal vibration element 5 via the input / output terminal provided on the lower surface of the insulating base 1, and the characteristics of the crystal vibration element 5 are obtained. A thickness-shear vibration is caused at a predetermined frequency according to the function of the crystal resonator, and a reference signal having a predetermined frequency is oscillated and output by an external oscillation circuit based on the resonance frequency of the crystal resonator. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.

次に、上述した水晶振動子の製造方法について図3を用いて説明する。   Next, a method for manufacturing the above-described crystal resonator will be described with reference to FIG.

(工程A)
まず、縦m列×横n行(m,nは2以上の自然数)のマトリクス状に配列された複数個の基板領域を有する母基板15を準備し、母基板15の各基板領域に水晶振動素子5を搭載する(図3(a))。
(Process A)
First, a mother substrate 15 having a plurality of substrate regions arranged in a matrix of m columns × n rows (m and n are natural numbers of 2 or more) is prepared. The element 5 is mounted (FIG. 3A).

母基板15は、例えば、ガラス−セラミック、アルミナセラミックス等のセラミック材料からなる板状絶縁基体15a、15b及び枠状絶縁基体15cを間に導体パターン等を介して積層することによって形成されており、各基板領域には、その上面側に一対の接続パッド2が被着・形成され、下面側には入出力端子やグランド端子等の外部端子3が被着・形成されている。   The mother board 15 is formed by, for example, laminating plate-like insulating bases 15a and 15b and a frame-like insulating base 15c made of a ceramic material such as glass-ceramic or alumina ceramic with a conductor pattern or the like interposed therebetween, In each substrate region, a pair of connection pads 2 are attached and formed on the upper surface side, and external terminals 3 such as input / output terminals and ground terminals are attached and formed on the lower surface side.

このような母基板15は、例えば、アルミナセラミックス等から成るセラミック材料粉末に適当な有機溶剤等を添加・混合して得たセラミックグリーンシートの表面等に接続パッド2や外部端子3等となる導体ペーストを所定パターンに印刷・塗布するとともに、これを複数枚積層してプレス成形した後、高温で焼成することによって製作される。   Such a mother substrate 15 is a conductor that becomes a connection pad 2, an external terminal 3, etc. on the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent or the like to a ceramic material powder made of alumina ceramics, for example. The paste is printed and applied in a predetermined pattern, and a plurality of the pastes are stacked, press-molded, and then fired at a high temperature.

そして、各枠状絶縁層1cの内側に水晶振動素子5を1個ずつ搭載する。水晶振動素子5は、その振動電極と母基板上面の対応する搭載パッド2とを導電性接着剤7を介して電気的・機械的に接続することによって母基板15上に搭載される。   Then, one crystal resonator element 5 is mounted inside each frame-like insulating layer 1c. The crystal resonator element 5 is mounted on the mother substrate 15 by electrically and mechanically connecting the vibration electrode and the corresponding mounting pad 2 on the upper surface of the mother substrate via the conductive adhesive 7.

また、本実施形態においては、複数個の枠状絶縁層1cを1個ずつ基板領域に搭載するのではなく、マトリクス状に配列された複数個の板状絶縁層1a、1bを相互に連結して一体化した絶縁基体15a、15bを積層し、その上面に、マトリクス状に配列された複数個の枠状絶縁層1cを相互に連結して一体化した枠状絶縁基体15cを載置・搭載することによって複数個の枠状絶縁層1cが対応する基板領域に一括的に取着されるようにして母基板15を形成している。   In the present embodiment, a plurality of frame-like insulating layers 1c are not mounted on the substrate region one by one, but a plurality of plate-like insulating layers 1a, 1b arranged in a matrix are connected to each other. A plurality of frame-like insulating layers 1c arranged in a matrix are connected to each other, and an integrated frame-like insulating substrate 15c is placed and mounted on the upper surface. Thus, the mother substrate 15 is formed so that the plurality of frame-like insulating layers 1c are collectively attached to the corresponding substrate regions.

(工程B)
次に、図3(b)に示す如く、母基板15の基板領域と1対1に対応する複数個のカバー領域11を有する金属製の母カバー16を、水晶振動素子5が封止されるようにして枠状絶縁層15c上に載置・接合する。
(Process B)
Next, as shown in FIG. 3B, the quartz crystal resonator element 5 is sealed with a metal mother cover 16 having a plurality of cover regions 11 corresponding to the substrate region of the mother substrate 15 on a one-to-one basis. Thus, it mounts and joins on the frame-shaped insulating layer 15c.

前記母カバー16としては、例えば、42アロイやコバール,リン青銅等の金属から成る、厚み60μm〜100μmの平板状の金属板が用いられている。   As the mother cover 16, for example, a flat metal plate having a thickness of 60 μm to 100 μm made of metal such as 42 alloy, Kovar, phosphor bronze or the like is used.

この工程Bでは、母カバー16を、各カバー領域11の内側に対応する基板領域の水晶振動素子5が配されるようにして各枠状絶縁層1c上に形成されている導体層4に載置させ、しかる後、これを例えば、300℃〜350℃の温度に保たれた加熱炉の中に入れ、母カバー16の下面全体にわたって被着された接合材9を高温で加熱・溶融させることによって母カバー16が枠状絶縁基体15cの上面に形成されている導体層4に取着・固定される。その後、一体化された母基板15と母カバー16は徐々に室温まで冷却される。   In this step B, the mother cover 16 is mounted on the conductor layer 4 formed on each frame-like insulating layer 1c so that the crystal resonator elements 5 in the substrate region corresponding to the inside of each cover region 11 are arranged. Then, this is put into a heating furnace maintained at a temperature of 300 ° C. to 350 ° C., for example, and the bonding material 9 applied over the entire lower surface of the mother cover 16 is heated and melted at a high temperature. Thus, the mother cover 16 is attached and fixed to the conductor layer 4 formed on the upper surface of the frame-shaped insulating base 15c. Thereafter, the integrated mother board 15 and mother cover 16 are gradually cooled to room temperature.

尚、上述した一連の接合工程は、窒素ガスやアルゴンガス等の不活性ガス雰囲気中で行うのが好ましく、これによって水晶振動素子5が収納される空間には不活性ガスが充満されるため、水晶振動素子5が酸素や大気中の水分等によって腐食・劣化するのを有効に防止することができる。   In addition, it is preferable to perform a series of joining processes mentioned above in inert gas atmosphere, such as nitrogen gas and argon gas, and since the space in which the crystal vibration element 5 is accommodated by this is filled with inert gas, It is possible to effectively prevent the quartz vibrating element 5 from being corroded and deteriorated by oxygen, moisture in the atmosphere, or the like.

(工程C)
そして、図3(c)に示す如く、母カバー16の表面を各カバー領域の外周に沿って第1のブレード12にて切削することにより、母カバー16の上面に開口する溝部13を、該溝部13の最深部が母カバー16の下面に到達しないようにして形成する。
(Process C)
Then, as shown in FIG. 3C, by cutting the surface of the mother cover 16 with the first blade 12 along the outer periphery of each cover region, the groove portion 13 opened on the upper surface of the mother cover 16 is The deepest portion of the groove 13 is formed so as not to reach the lower surface of the mother cover 16.

第1のブレード12としては、母カバー16の材質として用いられる金属材を切断するのに適したものが用いられ、例えば、ダイヤモンド砥粒などを電鋳により固定した円板状の電鋳ブレードが使用され、その刃幅は、例えば、40μm〜80μmである。   As the first blade 12, one suitable for cutting a metal material used as a material of the mother cover 16 is used. For example, a disk-shaped electroformed blade in which diamond abrasive grains are fixed by electroforming is used. The blade width is 40 μm to 80 μm, for example.

このような第1のブレード12を用いて、母カバー16の表面を切削することにより、母カバー16を貫通しない溝部13を形成している。この溝部13は図4に示す如く、母カバー16の溝部13の最深部から母カバー16の下面までの寸法Xと、溝部13の最深部から開口面までの寸法Yとが、関係式「0.1≦(X/(X+Y))≦0.3」を満足するように設定されている。例えば、母カバー16の全体構造が平板形状をなしているときには、上記関係式中の(X+Y)は母カバー16の厚み寸法に等しく、母基板の厚み寸法が100μmのときには、溝部13の最深部から母カバー16の下面までの寸法Xは、10μm〜30μmの範囲に設定される。   By using such a first blade 12 to cut the surface of the mother cover 16, the groove portion 13 that does not penetrate the mother cover 16 is formed. As shown in FIG. 4, the groove 13 has a relational expression “0” between the dimension X from the deepest part of the groove 13 of the mother cover 16 to the lower surface of the mother cover 16 and the dimension Y from the deepest part of the groove 13 to the opening surface. .1 ≦ (X / (X + Y)) ≦ 0.3 ”. For example, when the entire structure of the mother cover 16 has a flat plate shape, (X + Y) in the above relational expression is equal to the thickness dimension of the mother cover 16, and when the thickness dimension of the mother substrate is 100 μm, the deepest portion of the groove 13 The dimension X from the bottom surface of the mother cover 16 to the lower surface of the mother cover 16 is set in the range of 10 μm to 30 μm.

尚、溝部13の断面形状は、使用する第1のブレード12の形状や切削条件により、矩形状、U字状、三角状等、種々のパターンになすことができる。   In addition, the cross-sectional shape of the groove part 13 can be made into various patterns such as a rectangular shape, a U shape, and a triangular shape depending on the shape of the first blade 12 to be used and the cutting conditions.

(工程D)
次に、図3(d)に示す如く、第1のブレード12よりも刃幅の狭い第2のブレード14を溝部内に挿入し、第2のブレード14にて溝部13の直下に位置する母カバー16と母基板15とを切断・分割することにより複数個の水晶振動子が同時に製作される。
(Process D)
Next, as shown in FIG. 3D, a second blade 14 having a narrower blade width than the first blade 12 is inserted into the groove, and the mother positioned directly below the groove 13 with the second blade 14. A plurality of crystal resonators are manufactured simultaneously by cutting and dividing the cover 16 and the mother substrate 15.

第2のブレード14としては、母基板15の材質として用いられるセラミック材料を切断するのに適したものが用いられ、例えば、ダイヤモンド砥粒などを、エポキシ樹脂などの樹脂を結合剤として結合させてなる刃幅が20μm〜40μmの円板状のレジンブレード等が使用される。なお、結合材には各種金属を添加しても良い。また、第2のブレード14は、比較的硬度を低くすることにより、セラミック製の母基板15と摩耗しながら切断するようにすることも可能である。   As the second blade 14, a material suitable for cutting a ceramic material used as a material of the mother substrate 15 is used. For example, diamond abrasive grains are bonded with a resin such as an epoxy resin as a binder. A disc-shaped resin blade having a blade width of 20 μm to 40 μm is used. Various metals may be added to the binder. Further, the second blade 14 can be cut while being worn with the ceramic mother substrate 15 by lowering the hardness relatively.

以上のような工程A〜Dにより水晶振動子を製作する場合、水晶振動子の組み立てに先立って、絶縁基体1やカバー部材8を予め個片に分割しておく必要はなく、一括的な分割によって絶縁基体1とカバー部材8とを同時に切断することができる。しかもこの場合、水晶振動子の組み立てに際して、母基板そのものをキャリアとして機能させることができることから、母基板15より分割した個片を個々にキャリアに保持させたり、或いは、各個片にカバー部材8を個々に取り付けるといった煩雑な作業は一切不要となる。したがって、水晶振動子の組み立て工程が大幅に簡素化されるようになり、水晶振動子の生産性向上に供することが可能となる。   When a crystal resonator is manufactured by the processes A to D as described above, it is not necessary to divide the insulating base 1 and the cover member 8 into pieces prior to the assembly of the crystal resonator. Thus, the insulating substrate 1 and the cover member 8 can be cut simultaneously. In addition, in this case, since the mother substrate itself can function as a carrier when the crystal resonator is assembled, the individual pieces divided from the mother substrate 15 are individually held by the carrier, or the cover member 8 is attached to each individual piece. No complicated work such as individual installation is required. Therefore, the process for assembling the crystal unit is greatly simplified, and it becomes possible to improve the productivity of the crystal unit.

また、溝部13の最深部から母カバー16の下面までの寸法Xと、溝部13の最深部から開口面までの寸法Yとが、関係式「0.1≦(X/(X+Y))≦0.3」を満足するようにして、金属製の母基板16の表面に溝部13を形成するようにしていることから、第2のブレード14により母カバー16を切断する際に生成される母カバー16の切断屑を第2のブレード14の切断効率を低下させない程度の量に抑えることができるとともに、第2のブレード14により母基板15を切断する際に、第1のブレードにより切削されずに残った母カバー16の薄肉部分が、第1のブレード12と母基板15との間で緩衝材として機能し、母基板15にクラック等が発生するのを有効に抑えることができるようになる。上記XとYとの関係(X/(X+Y))が0.3より大きくなると、溝部直下領域の母カバー16の薄肉部分、すなわち第1のブレード12により切削されずに残る部分が多くなってしまい、この部分をセラミック部材を切断するのに適した第2のブレード14で切断すると、母カバー16の金属屑が第2のブレードに絡まるなどして、切断効率が著しく低下してしまうといった問題が生じ、一方、XとYとの関係(X/(X+Y))が0.1より小さくなると、第2のブレード14により母基板15を切断する際、第2のブレード14が母基板15に最初に接触するときに母基板15に加わる衝撃が大きくなり、母基板15にクラックなどが発生するといった問題が生じる。したがって、溝部13の最深部から母カバー16の下面までの寸法Xと、溝部13の最深部から開口面までの寸法Yとが、関係式「0.1≦(X/(X+Y))≦0.3」を満足するようにして、金属製の母基板16の表面に溝部13を形成することが好ましい。   In addition, the dimension X from the deepest part of the groove 13 to the lower surface of the mother cover 16 and the dimension Y from the deepest part of the groove 13 to the opening surface are expressed by the relational expression “0.1 ≦ (X / (X + Y)) ≦ 0. .3 "so that the groove 13 is formed on the surface of the metal mother board 16, so that the mother cover 16 generated when the mother cover 16 is cut by the second blade 14 is used. 16 cutting scraps can be suppressed to an amount that does not reduce the cutting efficiency of the second blade 14, and when the mother substrate 15 is cut by the second blade 14, it is not cut by the first blade. The remaining thin portion of the mother cover 16 functions as a cushioning material between the first blade 12 and the mother substrate 15, and it is possible to effectively suppress the occurrence of cracks and the like in the mother substrate 15. When the relationship between X and Y (X / (X + Y)) is greater than 0.3, the thin portion of the mother cover 16 in the region immediately below the groove, that is, the portion that remains without being cut by the first blade 12 increases. Therefore, if this portion is cut with the second blade 14 suitable for cutting the ceramic member, the metal scrap of the mother cover 16 becomes entangled with the second blade, and the cutting efficiency is significantly reduced. On the other hand, when the relationship between X and Y (X / (X + Y)) is smaller than 0.1, when the mother blade 15 is cut by the second blade 14, the second blade 14 is attached to the mother substrate 15. When the contact is made for the first time, the impact applied to the mother board 15 becomes large, and there arises a problem that a crack or the like occurs in the mother board 15. Therefore, the dimension X from the deepest part of the groove 13 to the lower surface of the mother cover 16 and the dimension Y from the deepest part of the groove 13 to the opening surface are expressed by the relational expression “0.1 ≦ (X / (X + Y)) ≦ 0. .3 ”is preferably formed on the surface of the metal mother board 16.

尚、本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。   In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

例えば、上述した実施形態においては、電子部品素子5として水晶振動素子を用いることにより水晶振動子を構成するようにしたが、それ以外の電子装置、例えば、電子部品素子としてIC素子や他の圧電素子を用いるようにした電子部品においても本発明は適用可能である。   For example, in the above-described embodiment, a crystal resonator is configured by using a crystal resonator element as the electronic component element 5, but other electronic devices, for example, an IC element or other piezoelectric element as the electronic component element are used. The present invention can also be applied to an electronic component using an element.

また、上述した実施形態においては、母基板15上に母カバー16を載置し、これを300℃〜350℃の温度に保たれた加熱炉の中に入れ、接合材9を溶融させることによって母カバー16を枠状絶縁基体15cの上面に形成されている導体層4に取着・固定するようにしたが、これに代えて、母カバー16を覆うカーボン製のプレートを母カバー16の上面に押し当て、このカーボン製のプレートに電流を流して発熱させることにより、母カバー全体を加熱し、これによって接合材9を溶融させて、母カバー16と導体層4とを取着・固定させるようにしてもよい。この場合、プレートから母カバー16に直に熱を伝えることができるため、伝熱効率が高く、母カバー16と導体層4との接合作業に要する時間を短縮して、電子部品の生産性を向上させることができる。   In the above-described embodiment, the mother cover 16 is placed on the mother board 15, and this is placed in a heating furnace maintained at a temperature of 300 ° C. to 350 ° C. to melt the bonding material 9. The mother cover 16 is attached and fixed to the conductor layer 4 formed on the upper surface of the frame-shaped insulating base 15c. Instead, a carbon plate covering the mother cover 16 is replaced with an upper surface of the mother cover 16. The entire mother cover is heated by causing an electric current to flow through the carbon plate to generate heat, thereby melting the bonding material 9 and attaching and fixing the mother cover 16 and the conductor layer 4. You may do it. In this case, since heat can be directly transferred from the plate to the mother cover 16, the heat transfer efficiency is high, the time required for joining the mother cover 16 and the conductor layer 4 is shortened, and the productivity of electronic parts is improved. Can be made.

本発明の電子部品の製造方法を適用して製造された水晶振動子(電子部品)を示す断面図である。、It is sectional drawing which shows the crystal resonator (electronic component) manufactured by applying the manufacturing method of the electronic component of this invention. , 図1に示す電子部品の分解斜視図である。It is a disassembled perspective view of the electronic component shown in FIG. 本発明の電子装置の製造方法の一実施形態を説明するための断面図である。It is sectional drawing for demonstrating one Embodiment of the manufacturing method of the electronic device of this invention. 図3(d)のZ部分を拡大した図である。It is the figure which expanded the Z part of FIG.3 (d). 従来の水晶振動子の断面図である。It is sectional drawing of the conventional crystal oscillator.

符号の説明Explanation of symbols

1・・・・・・・絶縁基体
1a、1b・・・板状絶縁層
1c・・・・・・枠状絶縁層
2・・・・・・・接続パッド
3・・・・・・・外部端子
4・・・・・・・導体層
5・・・・・・・水晶振動素子(電子部品素子)
6・・・・・・・振動電極
7・・・・・・・導電性接着材
8・・・・・・・カバー部材
9・・・・・・・接合材
10・・・・・・基板領域
11・・・・・・カバー領域
12・・・・・・第1のブレード
13・・・・・・溝部
14・・・・・・第2のブレード
15・・・・・・母基板
15a、15b・板状絶縁基体
15c・・・・・枠状絶縁基体
16・・・・・・母カバー
1 .... Insulating substrate 1a, 1b ... Plate insulating layer 1c ... Frame insulating layer 2 .... Connecting pad 3 .... External Terminal 4 ···· Conductive layer 5 ··········· Quartz resonator element (electronic component element)
6 .... Vibrating electrode 7 .... Conductive adhesive 8 .... Cover member 9 .... Joint 10 ...... Board Area 11 ... Cover area 12 ... First blade 13 ... Groove 14 ... Second blade 15 ... Mother board 15a 15b · Plate-like insulating base 15c · · · Frame-shaped insulating base 16 · · · · Mother cover

Claims (2)

マトリクス状に配列された複数個の基板領域を有するセラミック製の母基板を準備し、該母基板の各基板領域に電子部品素子を搭載する工程Aと、
前記基板領域と1対1に対応する複数個のカバー領域を有する金属製の母カバーを前記母基板上に配置し、該母基板と前記母カバーとを各基板領域の外周部において接合する工程Bと、
前記母カバーの表面を各カバー領域の外周に沿って第1のブレードにて切削することにより、前記母カバーの上面に開口する溝部を、該溝部の最深部が前記母カバーの下面に到達しないように形成する工程Cと、
前記第1のブレードよりも刃幅の狭い第2のブレードを前記溝部内に挿入し、該第2のブレードにて前記溝部の直下に位置する母カバーと母基板とを切断・分割することにより複数個の電子部品を得る工程Dとを含んでおり、
前記母カバーの厚み方向にかかる前記溝部の最深部から前記母カバーの下面までの寸法Xと、前記溝部の最深部から開口面までの寸法Yとが、関係式「0.1≦(X/(X+Y))≦0.3」を満足するように設定されていることを特徴とする電子部品の製造方法。
Preparing a ceramic mother substrate having a plurality of substrate regions arranged in a matrix, and mounting electronic component elements on each substrate region of the mother substrate; and
A step of disposing a metal mother cover having a plurality of cover areas corresponding to the board area on a one-to-one basis on the mother board, and joining the mother board and the mother cover at an outer periphery of each board area. B and
By cutting the surface of the mother cover with the first blade along the outer periphery of each cover region, the deepest part of the groove does not reach the lower surface of the mother cover. Forming step C,
By inserting a second blade having a narrower blade width than the first blade into the groove, and cutting and dividing the mother cover and the mother substrate located immediately below the groove with the second blade. and a step D for obtaining a plurality of electronic components and Nde including,
The dimension X from the deepest part of the groove part to the lower surface of the mother cover in the thickness direction of the mother cover and the dimension Y from the deepest part of the groove part to the opening surface are expressed by a relational expression “0.1 ≦ (X / (X + Y)) ≦ 0.3 ”is set to satisfy the manufacturing method.
前記電子部品素子が水晶振動素子であることを特徴とする請求項1に記載の電子部品の製造方法。 The method of manufacturing an electronic component according to claim 1, wherein the electronic component element is a crystal resonator element.
JP2004158728A 2004-05-28 2004-05-28 Method of manufacturing electronic parts Expired - Fee Related JP4384546B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004158728A JP4384546B2 (en) 2004-05-28 2004-05-28 Method of manufacturing electronic parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004158728A JP4384546B2 (en) 2004-05-28 2004-05-28 Method of manufacturing electronic parts

Publications (2)

Publication Number Publication Date
JP2005340558A JP2005340558A (en) 2005-12-08
JP4384546B2 true JP4384546B2 (en) 2009-12-16

Family

ID=35493766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004158728A Expired - Fee Related JP4384546B2 (en) 2004-05-28 2004-05-28 Method of manufacturing electronic parts

Country Status (1)

Country Link
JP (1) JP4384546B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051253A (en) * 2014-06-19 2014-09-17 广州市鸿利光电股份有限公司 Method for mixed cutting of ceramic substrate LED based on combined cutter

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006128517A (en) * 2004-10-29 2006-05-18 Kyocera Kinseki Corp Method for manufacturing electronic component
JP2007234834A (en) * 2006-02-28 2007-09-13 Kyocera Kinseki Corp Piezoelectric device
WO2010074127A1 (en) * 2008-12-24 2010-07-01 株式会社大真空 Piezoelectric oscillation device, method for manufacturing a piezoelectric oscillation device, and etching method of structural components forming a piezoelectric oscillation device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104051253A (en) * 2014-06-19 2014-09-17 广州市鸿利光电股份有限公司 Method for mixed cutting of ceramic substrate LED based on combined cutter
CN104051253B (en) * 2014-06-19 2017-01-18 鸿利智汇集团股份有限公司 Method for mixed cutting of ceramic substrate LED based on combined cutter

Also Published As

Publication number Publication date
JP2005340558A (en) 2005-12-08

Similar Documents

Publication Publication Date Title
US8056198B2 (en) Method of manufacturing electronic device
JP2006129417A (en) Piezoelectric oscillator
JP2011147054A (en) Electronic apparatus, and method of manufacturing the same
JP4493382B2 (en) Manufacturing method of electronic device
JP2007060593A (en) Piezoelectric device and manufacturing method thereof
JP4384546B2 (en) Method of manufacturing electronic parts
JP4380419B2 (en) Manufacturing method of electronic device
JP4512186B2 (en) Method for manufacturing piezoelectric vibrator
JP4262116B2 (en) Manufacturing method of electronic device
JP4585908B2 (en) Method for manufacturing piezoelectric device
JP4409361B2 (en) Manufacturing method of electronic device
JP4673670B2 (en) Method for manufacturing piezoelectric device
JP2012142688A (en) Piezoelectric device and method of manufacturing the same
JP4262117B2 (en) Manufacturing method of electronic device
JP4549158B2 (en) Method for manufacturing crystal oscillator
JP2005347881A (en) Manufacturing method of piezoelectric oscillator
JP4578231B2 (en) Piezoelectric oscillator and manufacturing method thereof
JP4113459B2 (en) Manufacturing method of temperature compensated crystal oscillator
JP4512185B2 (en) Manufacturing method of piezoelectric oscillator and sheet type substrate thereof
JP4384567B2 (en) Manufacturing method of temperature compensated crystal oscillator
JP2013140874A (en) Electronic device, ceramic substrate, manufacturing method, and piezoelectric oscillator
JP4443306B2 (en) Manufacturing method of crystal unit
JP5220584B2 (en) Piezoelectric oscillator and manufacturing method thereof
JP2010177674A (en) Method of manufacturing electronic device
JP2009065205A (en) Method of manufacturing electronic apparatus

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070411

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090511

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090602

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090803

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090901

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090925

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121002

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4384546

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131002

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees