JP4262117B2 - Manufacturing method of electronic device - Google Patents

Description

  The present invention relates to an electronic device such as a crystal resonator used in an electronic device such as a portable communication device or an electronic computer.

  Conventionally, crystal resonators have been used in electronic devices such as portable communication devices and electronic computers.

  As such a conventional crystal resonator, for example, as shown in FIG. 7, a pair of electrodes electrically connected to the connection pads via a conductive adhesive on the upper surface of an insulating substrate 21 provided with a pair of connection pads. A crystal resonator element 25 having a plurality of vibration electrodes and a seal ring 26 surrounding the crystal resonator element 25 are attached, and a metal lid 27 is joined to the upper portion of the seal ring 26 by seam welding or the like. Thus, there is known a structure in which the mounting area of the crystal resonator element 25 is hermetically sealed (see, for example, Patent Document 1). The crystal resonator includes input / output terminals provided on the lower surface of the insulating base 21. When a fluctuation voltage from the outside is applied between the vibrating electrodes of the crystal resonator element 25, thickness shear vibration is caused at a predetermined frequency according to the characteristics of the crystal resonator element 25. Reference signal having a predetermined frequency is oscillated and output by the external oscillation circuit based on the frequency. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.

  Further, the above-described insulating base 21 of the crystal resonator is formed by a multi-cavity technique in which a large mother substrate from which a plurality of insulating bases 21 can be cut is obtained to obtain individual pieces. Then, the quartz resonator element 25 and the seal ring 26 are attached to the obtained piece (insulating base member 21), and the lid 27 is joined to the upper portion of the seal ring 26, whereby the crystal resonator is manufactured.

The lid 27 of the crystal resonator element described above is also generally obtained by dividing a large metal plate from which a plurality of lids 27 can be cut out, like the insulating base 21. During use, external noise is shielded by holding the lid 27 at the ground potential. Such a lid 27 is electrically connected to the ground terminal on the lower surface of the insulating base via the seal ring 26 and the conductor pattern of the insulating base 21.
JP 2001-274649 A

  However, in the above-described conventional crystal resonator, it is necessary to obtain the insulating base 21 by dividing the large mother substrate and the lid 27 by dividing the large metal plate prior to the assembly. Since these two types of members are obtained in separate dividing steps, the assembly process of the crystal resonator becomes complicated, and there is a disadvantage that the productivity is not improved.

  Further, as described above, when assembling a crystal resonator after preparing the insulating base 21 and the lid 27 in advance, it is necessary to perform a work for holding the plurality of insulating bases 21 individually on the carrier. Further, the lid bodies 27 must be individually attached on the individual insulating bases 21 held in this manner, and this also has the disadvantage that the assembling process of the crystal unit becomes complicated.

  The present invention has been devised in view of the above-described drawbacks, and an object of the present invention is to provide an electronic device that can simplify an assembly process and improve productivity.

The electronic device manufacturing method of the present invention includes a step A in which a mother board having a plurality of substrate areas arranged in a matrix is prepared, and an electronic component element is mounted on each board area of the mother board; And a plurality of recesses corresponding one-to-one with a groove provided between the plurality of recesses, and a mother cover formed by processing a metal plate into each substrate region in each recess The electronic component element is placed on the mother board so as to be disposed, and the periphery of each recess of the mother cover is annularly joined to each board region of the mother board by applying heat energy; and And a step C of simultaneously obtaining a plurality of electronic devices by cutting the mother substrate and the mother cover along the groove .

  The electronic device manufacturing method of the present invention is characterized in that the electronic component element is a crystal resonator element.

  Further, the electronic device manufacturing method of the present invention is characterized in that in step C, the mother substrate and the mother cover are simultaneously cut using a dicer.

  Furthermore, the method for manufacturing an electronic device according to the present invention is characterized in that a bonding material for bonding both of the mother substrate and the mother cover is not present at the cut portion of the mother substrate and the mother cover in the step C.

  Furthermore, in the method of manufacturing an electronic device according to the present invention, a concave groove is inserted into the main surface of the mother board in the step B, and is fitted into the concave groove at a lower portion of the mother cover so as to come into contact with the bottom surface of the concave groove. A contact leg portion is provided.

  According to the method of manufacturing an electronic device of the present invention, first, a metal substrate having a plurality of recesses corresponding to a mother board on which an electronic component element is mounted in each board area and a board area of the mother board. The mother cover is placed on the mother board so that the electronic component elements of each board area are arranged in each recess, and the periphery of each recess is applied by applying heat energy to the mother cover. Since a plurality of electronic devices are obtained at the same time by annularly bonding to each substrate region of the substrate, and then cutting the mother substrate and the mother cover along the outer periphery of each substrate region. Prior to assembling the electronic device, it is not necessary to divide the substrate and the cover into pieces in advance, and the substrate and the cover can be cut simultaneously by batch division.

  In addition, in this case, when the electronic device is assembled, the mother board itself functions as a carrier. Therefore, the individual pieces divided from the mother board are individually held by the carrier, or each individual piece is provided with a cover. There is no need for complicated work such as attaching to the camera.

  As a result, the assembly process of the electronic device is greatly simplified, and the productivity of the electronic device can be improved.

  According to the method for manufacturing an electronic device of the present invention, the above-described metal mother cover is provided with a plurality of recesses corresponding to the substrate area of the mother substrate in a one-to-one correspondence. Even if thermal energy is applied to the mother board and then cooled to room temperature, the stress caused by the difference in thermal shrinkage between the mother cover and the mother board can be absorbed and relaxed well by the deformation of the recess. ing. Therefore, the mother board and the mother cover integrated in the process B are not greatly warped by the stress, and the lower surface of the mother board on which the external terminals are provided is maintained substantially flat. It is possible to obtain an electronic device that is excellent in mountability when mounted on.

  Furthermore, according to the method for manufacturing an electronic device of the present invention, if a groove portion is formed along the outer periphery of the substrate region in the mother cover, the mother cover and the mother substrate are simply cut along the groove portion. The substrate can be accurately divided along the outer periphery of the substrate region. This also improves the productivity of the electronic device and can provide an electronic device with high dimensional accuracy.

  Furthermore, according to the method for manufacturing an electronic device of the present invention, if the bonding material for bonding the mother substrate and the mother cover is not present at the cut portion of the mother substrate and the mother cover in Step C, the mother substrate and the mother cover can be cut. Dicers rarely come into contact with the bonding material, which can effectively prevent defects such as cracks in the bonding material due to contact with the dicer.

  Furthermore, according to the method for manufacturing an electronic device of the present invention, if the contact leg portion to be inserted into the groove on the main surface of the mother board is provided in the lower part of the mother cover in Step B, the mother cover is removed from the mother cover. Positioning of the mother cover when placed on the substrate is facilitated, and there is an advantage that workability for assembling the electronic device is improved.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a cross-sectional view of a crystal resonator obtained when the manufacturing method of the present invention is applied to manufacture of a crystal resonator. The crystal resonator shown in FIG. It is composed of a crystal resonator element 5 as an element and a cover member 8.

  The insulating base 1 is formed in a rectangular shape with a ceramic material such as glass-ceramic or alumina ceramic, for example, and the upper surface thereof is annularly formed along the outer periphery of the pair of connection pads 2 and the insulating base 1. A bonding conductor layer 4 is disposed, and external terminals 3 such as an input terminal, an output terminal, and a ground terminal are provided on the lower surface.

  A pair of connection pads 2 provided on the upper surface of the insulating base 1 are electrically connected to a vibration electrode 6 of a crystal vibration element 5 described later on the upper surface side through a conductive adhesive, and insulated on the lower surface side. It is electrically connected to input / output terminals (input terminal, output terminal) on the lower surface of the insulating base via a conductor pattern on the base 1 and a via conductor inside the insulating base.

  On the other hand, the conductor layer 4 is electrically connected to a cover member 8 to be described later on the upper surface side via a bonding material 9, and on the lower surface side to a ground terminal on the lower surface of the insulating base via a via conductor inside the insulating base. Electrically connected.

  The external terminals described above are electrically connected to the circuit wiring of the external electric circuit via a conductive adhesive such as solder when the crystal resonator is mounted on an external electric circuit such as a mother board. Yes.

  In addition, the crystal resonator element 5 is mounted on the upper surface of the insulating base 1 described above.

  The crystal resonator element 5 is formed by attaching and forming a pair of vibration electrodes 6 on both main surfaces of a crystal piece cut along a predetermined crystal axis, and a variable voltage from the outside is connected to the crystal through the pair of vibration electrodes 6. When applied to the strip, it causes thickness shear vibration at a predetermined frequency.

  Such a quartz-crystal vibrating element 5 electrically and mechanically connects the vibrating electrode 6 attached to both main surfaces thereof and the corresponding connection pad 2 on the upper surface of the insulating base via the conductive adhesive 7. This is mounted on the upper surface of the insulating substrate 1.

  Further, a cover member 8 made of metal is attached to the upper surface of the insulating base 1.

  The cover member 8 is formed by processing and forming a plate body made of a metal such as 42 alloy, Kovar, phosphor bronze or the like into a predetermined shape by a conventionally well-known sheet metal working, and a concave portion 11 opening downward is formed in the center portion thereof. The contact leg 10 is annularly provided on the outer periphery.

  In this cover member 8, the lower end portion of the contact leg 10 is brazed to the conductor layer 4 via a bonding material 9 such as Au—Ni, Au—Sn, and the insulating base 1 is formed along the outer peripheral portion of the cover member 8. It is attached to the upper surface of the insulating substrate 1 by being joined to the upper surface of the substrate in an annular shape.

  The cover member 8 accommodates the crystal resonator element 5 by accommodating the crystal resonator element 5 in the recess 11, specifically, in a region surrounded by the inner surface of the recess 11 and the upper surface of the insulating base 1. It is for hermetically sealing, and is electrically connected to the ground terminal on the lower surface of the insulating base via the conductor layer 4 described above. Therefore, when the crystal resonator is used, the cover member 8 is held at the ground potential, and the crystal resonator element 5 is well protected from unnecessary external electrical action such as noise due to the shielding effect of the cover member 8. Is done.

  Thus, the crystal resonator described above applies a variable voltage from the outside to the inter-vibration electrodes 6-6 of the crystal resonator element 5 via the input / output terminals provided on the lower surface of the insulating base 1, thereby obtaining the characteristics of the crystal resonator element 5. A thickness-shear vibration is caused at a predetermined frequency according to the function of the crystal resonator, and a reference signal having a predetermined frequency is oscillated and output by an external oscillation circuit based on the resonance frequency of the crystal resonator. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.

  Next, a manufacturing method of the above-described crystal resonator will be described with reference to FIG.

(Process A)
First, as shown in FIG. 2A, a mother substrate 15 having a plurality of substrate regions arranged in a matrix is prepared, and the crystal resonator element 5 is mounted on each substrate region of the mother substrate 15.

  The mother substrate 15 is made of a ceramic material such as glass-ceramic or alumina ceramic, and is arranged in a matrix, that is, in a matrix of m columns × n rows (n and m are natural numbers of 2 or more). In each region, the connection pad 2 and the annular conductor layer 4 are attached and formed on the upper surface side, and the external terminal 3 such as an input / output terminal and a ground terminal is attached and formed on the lower surface side.

  Such a mother substrate 15 is, for example, connected to the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent to a ceramic material powder made of alumina ceramics, etc. The conductor paste is printed and applied in a predetermined pattern, and a plurality of the pastes are stacked, press-molded, and then fired at a high temperature.

  In addition, one crystal resonator element 5 is mounted on each substrate region of the obtained mother substrate 15, and the vibration electrode 6 of the crystal resonator element 5 and the mounting pad 2 on the upper surface of the mother substrate are interposed through the conductive bonding material 9. Connected electrically and mechanically.

  In the present embodiment, as shown in FIG. 3, a predetermined separation area is provided between the substrate areas arranged in a matrix.

(Process B)
Next, as shown in FIG. 2 (b), a mother cover 16 having a plurality of recesses 11 corresponding to the substrate region of the mother substrate 15 in a one-to-one relationship is provided in each recess region 11 and the crystal resonator element of each substrate region. 5 is placed on the mother substrate 15 and the periphery of each recess 11 of the mother cover 16 is annularly joined to each substrate region of the mother substrate 15 by applying heat energy.

  The mother cover 16 is manufactured by processing a metal plate made of metal such as 42 alloy, Kovar, phosphor bronze, etc., having a thickness of 60 μm to 100 μm into a predetermined shape by a conventionally known sheet metal processing. The cover 16 has a plurality of recesses 11 described above arranged in a matrix so as to correspond to the substrate region of the mother board 15 in a one-to-one correspondence. Provided. In the present embodiment, the mother cover 16 is also provided with a predetermined surplus area as in the mother board 15 (see FIG. 3).

  Such a mother cover 16 is provided with the crystal resonator element 5 in the substrate region corresponding to the inside of each concave portion 11, and the contact leg 10 is formed of Au—Ni, Au—Sn on the conductor layer 4 in each substrate region. It is placed on the mother board 15 so as to be brought into contact with the bonding material 9 made of, etc., and then placed in a heating furnace maintained at a temperature of 300 ° C. to 350 ° C., for example. The mother cover 16 is joined to the mother substrate 15 by heating and melting the joining material 9 at a high temperature. Thereafter, the integrated mother board 15 and mother cover 16 are gradually cooled to room temperature.

  At this time, the mother cover 16 is provided with a plurality of concave portions 11 corresponding to the substrate region of the mother substrate 15 in one-to-one correspondence. The mother cover 16 and the mother substrate 15 joined by heating to a high temperature are brought to room temperature. Even when cooled, the stress caused by the difference in thermal shrinkage between the mother cover 16 and the mother substrate 15 is well absorbed and relaxed by the deformation of the recess 11. Therefore, the mother substrate 15 and the mother cover 16 integrated by bonding do not greatly warp due to the stress, and the lower surface of the mother substrate 15 on which the external terminals 3 are provided is maintained substantially flat. A crystal resonator excellent in mountability when a child is mounted on an external circuit board such as a mother board can be obtained.

  The series of bonding steps described above is preferably performed in an inert gas atmosphere such as nitrogen gas or argon gas, whereby the recess 11 in which the crystal resonator element 5 is accommodated is filled with an inert gas. Therefore, it is possible to effectively prevent the quartz resonator element 5 from being corroded or deteriorated by oxygen, moisture in the atmosphere, or the like.

  Further, for example, as shown in FIG. 5, when the mother cover 16 is placed on the mother board 15, predetermined through holes are formed in the four corners of the marginal area provided on the outer periphery of the mother board 15 and the mother cover 16. The mother board 15 and the mother cover 16 may be aligned by inserting positioning pins into these through-holes, and a clip is used as shown in FIG. Then, the mother board 15 and the mother cover 16 may be temporarily fixed and then joined together, and the clip may be attached in a cutting process described later to be used as a fixing jig.

(Process C)
Finally, as shown in FIG. 2C, the mother substrate 15 and the mother cover 16 integrated in the step B are divided and cut along the outer periphery of each substrate region.

  The mother substrate 15 and the mother cover 16 are cut by, for example, cutting the mother substrate 15 and the mother cover 16 at once using a dicer or the like, whereby a plurality of crystal resonators are obtained simultaneously.

  When a crystal resonator is manufactured by such a process, it is not necessary to divide the insulating substrate 1 and the cover member 8 into pieces prior to the assembly of the crystal resonator. And the cover member 8 can be cut simultaneously.

  In addition, in this case, since the mother board itself functions as a carrier when the crystal resonator is assembled, the pieces divided from the mother board 15 are individually held by the carrier, or each piece is covered. The complicated work of attaching the members 8 individually becomes unnecessary.

  As a result, the assembly process of the crystal unit is greatly simplified, and the productivity of the crystal unit can be improved.

  In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

  For example, in the above-described embodiment, as shown in FIG. 4A, if the groove portion 19 is formed in the mother cover 16 along the outer periphery of the substrate region, the mother cover 16 and the mother cover 16 are formed along the groove portion 19. Only by cutting the substrate 15, the mother substrate 15 can be accurately divided along the outer periphery of the substrate region. This also improves the productivity of the crystal unit and provides an electronic device with high dimensional accuracy. Therefore, it is preferable to form a groove 19 along the outer periphery of the substrate region in the mother cover 16.

  Further, in the step C of the above-described embodiment, as shown in FIG. 4B, if the bonding material 9 for bonding the mother substrate 15 and the mother cover 16 is not present at the cut portions of the mother substrate 15 and the mother cover 16, the mother substrate 15 In addition, when the mother cover 16 is cut, the dicer rarely comes into contact with the bonding material 9, and this effectively prevents the sealing material from being deteriorated due to a defect such as a crack in the bonding material 9 due to the contact with the dicer. Can do. Accordingly, it is preferable that the bonding material 9 for bonding the mother substrate 15 and the mother cover 16 is not present at the cut portions of the mother substrate 15 and the mother cover 16 in the process C.

  Furthermore, in the step B of the above-described embodiment, as shown in FIG. 4C, if the contact leg 10 to be inserted into the groove on the main surface of the mother board is provided at the lower part of the mother cover 16, Positioning of the mother cover 16 when placing the mother cover 16 on the mother substrate 15 is facilitated, and there is an advantage that workability for assembling the crystal resonator is improved. Therefore, in the step B, the groove 20 is provided on the main surface of the mother board 15, and the contact legs 10 that are fitted into the groove 20 and are brought into contact with the bottom surface of the groove are provided below the mother cover 16. It is preferable to keep it.

  Furthermore, in the above-described embodiment, the surplus areas are provided between the substrate areas of the mother board 15, but the board areas may be arranged close to each other without providing any surplus areas. Absent. The same can be said for the mother cover 16.

  Furthermore, in the above-described embodiment, the integrated mother board 15 and the mother cover 16 are collectively cut by a dicer. Instead, the integrated mother board 15 and the mother cover 16 are moved up and down. You may make it cut | disconnect using a separate cutting means from both sides.

  Further, in the above-described embodiment, the crystal resonator is configured by using a crystal resonator element as an electronic component element. However, other electronic devices, for example, an IC element or other piezoelectric element as an electronic component element are used. The present invention can also be applied to an electronic apparatus using the above.

It is sectional drawing of the crystal oscillator (electronic device) manufactured by the manufacturing method of this invention. (A) thru | or (c) are sectional drawings for demonstrating the manufacturing method concerning one Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method concerning one Embodiment of this invention. (A) thru | or (c) is sectional drawing for demonstrating the manufacturing method concerning other embodiment of this invention. It is a perspective view for demonstrating the manufacturing method concerning other embodiment of this invention. It is a perspective view for demonstrating the manufacturing method concerning other embodiment of this invention. It is sectional drawing of the conventional crystal oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulation base | substrate 2 ... Connection pad 3 ... External terminal 5 ... Crystal oscillation element (electronic component element)
DESCRIPTION OF SYMBOLS 6 ... Vibration electrode 7 ... Conductive adhesive material 8 ... Cover member 9 ... Joining material 10 ... Contact leg part 11 ... Recessed part 15 ... Mother board 16 ... Mother Cover 19 ... groove 20 ... concave groove

Claims (5)

Preparing a mother board having a plurality of substrate areas arranged in a matrix and mounting electronic component elements on each board area of the mother board; and
A plurality of recesses corresponding to the substrate region and a groove portion provided between the plurality of recesses, and a mother cover formed by sheet metal processing in each recess is provided in each recess. The electronic component elements of each board region are placed on the mother board so as to be arranged, and the periphery of each recess of the mother cover is annularly joined to each board area of the mother board by applying heat energy. Step B,
And a step C of simultaneously obtaining a plurality of electronic devices by cutting the mother substrate and the mother cover along the groove .   The method of manufacturing an electronic device according to claim 1, wherein the electronic component element is a crystal resonator element.   3. The method of manufacturing an electronic device according to claim 1, wherein the mother substrate and the mother cover are simultaneously cut using a dicer in the step C. 4. Manufacturing of the electronic device according to any one of claims 1 to 3, wherein the step is not bonding material for bonding both the cut portion of the mother substrate and the mother cover in C is present Method. In the step B, a concave groove is provided on the main surface of the mother board, and a contact leg portion that is fitted into the concave groove and is brought into contact with the bottom surface of the concave groove is provided at a lower portion of the mother cover. The method for manufacturing an electronic device according to any one of claims 1 to 4.

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