JP2010011172A - Base aggregate and method of manufacturing piezoelectric device using the base aggregate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a base aggregate enabling reliable and stable cutting, and to provide a method of manufacturing a piezoelectric device which uses the base aggregate. <P>SOLUTION: In the base aggregate 100 formed with a series of bases 2 having annular bank sections 200 for surrounding an opening 8, a cutting line L for separation into the series of bases is set at the boundary of the adjacent bases in the base aggregate. A two-step hole in a plan view is formed on the periphery surface of the bank section at the long side of each base in the width direction of the bank section; the hole is formed at a position including the cutting line L; and a side conductor M is deposited, in a region that is on the inner wall of the hole and that does not interfere with the cutting line. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a base assembly used for manufacturing a piezoelectric device used in electronic equipment and the like, and a method for manufacturing a piezoelectric device using the base assembly.

  Quartz resonators are widely used as piezoelectric devices mounted on various electronic devices. For example, a surface-mount crystal unit is made of a ceramic material, and a crystal diaphragm is mounted inside a concave base (container body) having an opening at the top, and the opening is sealed with a flat lid. The structure is hermetically sealed. As a means for efficiently manufacturing a crystal resonator in response to miniaturization of a piezoelectric device, for example, there is a manufacturing method using a base aggregate in which a large number of bases are integrally formed in a matrix form ( For example, see Patent Document 1).

  According to the manufacturing method of Patent Document 1, a large number of crystal resonators can be obtained simultaneously by batch processing. In this method, the adjacent ceramic bases are cut with a blade in order to divide and cut into a large number of crystal resonators. In such a manufacturing method, when an arc-shaped cutout portion (so-called castellation) extending in the vertical direction is formed at the four corners of the base, for example, there are the following methods. First, in the base aggregate before firing, a through-hole having a radius spanning the corner portion of the adjacent base is formed with the intersection of the boundary lines of adjacent bases as the center. Next, a metal conductor is formed (metallized) on the inner wall surface of the through hole. Then, by cutting the adjacent bases with a blade in the vertical and horizontal directions, the through holes in which the metal conductors are formed are divided into substantially quarter circles in plan view, and four castellations are formed. Become.

  However, since the blade comes into contact with the metal conductor on the inner wall surface of the through-hole during the cutting, the cutting material may be clogged as the cutting progresses, which causes deterioration in cutting efficiency. . When a crystal oscillator is manufactured using a base aggregate, in addition to the castellations at the corners, there is a castellation in which information write terminals (metals) to the electronic component elements inside the base are formed on the inner wall surface at the sides. It is formed. However, since the blade interferes with the writing terminal at the time of cutting, the blade becomes clogged.

JP-A-2005-294617

  The present invention has been made in view of such points, and an object thereof is to provide a base assembly capable of performing reliable and stable cutting, and a method for manufacturing a piezoelectric device using the base assembly. It is.

  In order to achieve the above object, according to the first aspect of the present invention, a plurality of bases each having a rectangular shape in plan view, each having an opening at an upper portion and an annular bank portion surrounding the opening, are formed in series. A cutting line or a planned cutting line for separating a plurality of bases is set at the boundary between adjacent bases of the base group, and the corners of the ridges of the respective bases are set. A hole having at least one step in the width direction of the bank portion is formed in both or one of the portions and the side portion, and the hole is formed at a position including the cutting line or the planned cutting line. In addition, a side conductor is formed on the inner wall of the hole and in a region that does not interfere with the cutting line or the planned cutting line.

  According to the above configuration, the metal conductor is formed on the inner wall surface of the hole on the cutting line or the planned cutting line when the base assembly is divided and cut into a plurality of piezoelectric vibrating devices by dicing, for example. Therefore, the dicing blade does not come into contact with the metal material, and the blade can be prevented from being clogged. Therefore, reliable and stable cutting can be performed without reducing the cutting efficiency.

  Also, in the process of manufacturing a piezoelectric vibration device using a base assembly, in order to measure the frequency and the like of each device, the base assembly is partially cut in the thickness direction and a large number of bases are electrically independent. It is necessary to. Even in such a case, since the metal conductor is not formed on the cutting line or the planned cutting line, the dicing blade does not come into contact with the metal material, and the blade can be prevented from being clogged.

  In order to achieve the above object, according to the invention of claim 2, the hole comprises a through hole or a bottomed hole, a wide area in the bank width direction, and a narrow area in the bank width direction. And a step portion is provided between the wide region and the narrow region, and the narrow region is formed at a position including the cutting line or the planned cutting line, and is formed on an inner wall of the wide region. The base assembly according to claim 1, wherein a side conductor is formed.

  According to the above configuration, a metal conductor is not formed on the hole on the cutting line or the line to be cut, that is, the inner wall surface of the narrow region. Therefore, a large number of pieces are removed from the base assembly by cutting means such as dicing. The dicing blade does not come into contact with the metal material when divided and cut into piezoelectric vibration devices. Thereby, clogging of the blade can be prevented.

  Moreover, according to the said structure, in addition to the said effect, the conductor of the inner wall face of a hole can be formed stably. Specifically, since the metal conductor is formed only on the inner wall surface of the region that is wide in the width direction of the bank portion, the thinning in the width direction of the bank portion due to drilling is suppressed, and the entire piezoelectric vibrating device is reduced. The strength can be maintained.

  In order to achieve the above object, according to a third aspect of the present invention, there is provided a method for producing a base aggregate according to claim 1, wherein the base aggregate is a laminate of a plurality of sheets, In the state before the body is fired, the long hole or the long axis of the first aggregate having a substantially rectangular or substantially elliptical shape across the bank portions of the adjacent bases of the base assembly, A first drilling step of penetrating through to intersect the cutting line or a planned cutting line, a conductor depositing step of depositing a metal conductor on the inner wall surface of the first hole, and straddling the bank portions of the adjacent bases And a second drilling step of penetrating and drilling a second hole having a shape wider than the first hole and having a reduced width in the bank portion width direction so as to partially overlap the first hole. It is a manufacturing method.

  According to such a method for manufacturing a base assembly, two types of holes are perforated so that the respective long dimensions intersect each other, whereby a metal conductor is formed on the inner wall surface on the back side (first hole). A notch can be formed. Thereby, the notch part in which a metal conductor does not exist on a cutting line or a cutting planned line can be formed.

  Moreover, according to such a manufacturing method, the conductor of the inner wall surface of the notch obtained by cutting | disconnecting the said hole can be formed stably. Specifically, since the metal conductor is formed only on the inner wall surface of the first hole (first notch), which is a region wide in the width direction of the bank portion, the width direction of the bank portion by drilling Therefore, the strength of the entire piezoelectric vibration device can be maintained.

  In order to achieve the above object, according to a fourth aspect of the present invention, the base aggregate according to any one of the first to second aspects is used, and a piezoelectric vibrating piece or a piezoelectric vibration is provided inside each base of the base aggregate. A piece and an electronic component element are mounted, and the opening of each base is hermetically sealed on a one-to-one basis using a flat lid, and then the base aggregate is cut along the cutting line or the planned cutting line. This is a method of manufacturing a piezoelectric device in which a large number of piezoelectric devices each having a notch formed by the cutting of the hole are collectively formed.

  According to such a manufacturing method, a piezoelectric vibrating piece or a piezoelectric vibrating piece and an electronic component element are mounted inside each base while handling the base in the state of a collective substrate, and then hermetically sealed one-on-one with a lid. Then, since the cutting is performed along the cutting line or the planned cutting line, a large number of piezoelectric devices having notches formed by the cutting of the holes at the same time can be obtained. In addition, since the side conductor is formed on the inner wall surface of the hole in a region that does not interfere with the cutting line or the planned cutting line, stable cutting is possible, and a highly efficient and highly reliable piezoelectric device is manufactured. be able to.

  As described above, according to the present invention, it is possible to provide a base assembly that can perform reliable and stable cutting, and a method for manufacturing a piezoelectric device using the same.

-First embodiment-
A first embodiment according to the present invention will be described below with reference to FIGS. In the present embodiment, an example in which a surface-mounted crystal oscillator is used for the piezoelectric device is shown. 1 is a perspective view of a base showing a first embodiment of the present invention, FIG. 2 is an enlarged view of a portion A in FIG. 1, FIG. 3 is a plan view of a second layer in FIG. 2, and FIG. The top view of the base aggregate which shows 1st Embodiment of this is represented. 5 to 9 are partial plan views of the base assembly showing the method of forming the notches, and FIG. 10 is a cross-sectional view in the long side direction of the crystal oscillator according to the present invention. 1 to 2, the external connection terminals formed on the bottom surface (back surface) side of the base are not shown, and the metal patterns formed on the bottom surface inside the base are omitted in FIGS. 1 and 4 to 9. Further, in FIG. 10, illustration of various electrodes such as excitation electrodes formed on the front and back surfaces of the crystal diaphragm is omitted. Furthermore, in FIG. 6 thru | or FIG. 9, description inside a base is abbreviate | omitted.

  As shown in FIG. 10, the crystal oscillator 1 of the present invention includes a base 2 having a rectangular shape in plan view provided with an opening 8 at the top, an annular bank portion 200 surrounding the opening 8, and a step portion of the base A quartz crystal plate 3 that is cantilevered and supported on a pair of mounting pads 21 and 21 formed on the upper surface of 24 via a conductive adhesive 6, and an IC (integrated circuit) mounted on the inner bottom surface of the base 4) and the lid 5 that hermetically seals the opening 8 are the main members.

  First, the single base 2 will be described with reference to FIG. The base 2 is an insulating box-shaped body made of a ceramic material, and has a structure having an opening 8 at the top. The base 2 is integrally formed by firing after laminating three ceramic green sheets (first layer 201, second layer 202, and third layer 203).

  On the inner bottom surface 211 of the base 2 (the upper surface of the first layer 201), a plurality of metal patterns (not shown) having a predetermined shape connected to the connection terminals of the IC are disposed. In addition, external connection terminals (not shown) that are bonded to an internal substrate of an electronic device or the like by solder or the like are formed near the four corners of the lower surface (back surface) of the first layer 201. The external connection terminal is in a state of being electrically connected to some of the plurality of metal patterns described above via an internal wiring conductor (via) formed inside the base.

  The base 2 includes a stepped portion 24 therein, and a pair of mounting pads 21 and 21 joined to one end side of the crystal diaphragm 3 (details will be described later) are provided on the upper surface of the stepped portion 24 on one end side of the base. Is formed. In the present embodiment, the mounting pad 21 has a structure in which metal films are laminated in the order of tungsten metallization, nickel plating, and gold plating. The IC is accommodated in the opening region of the second layer 202. The pair of mounting pads 21 and 21 are in a state of being electrically connected to some of the plurality of metal patterns connected to the IC through through conductors (via holes) penetrating the step portion 24 in the thickness direction. ing.

  As shown in FIGS. 1 and 2, cutout portions (hereinafter referred to as side castellations) 25, 25 are opposed to opposing long-side dam outer walls 22, 22 of a rectangular base 2 in plan view. Is formed. Specifically, side castellations 25 that are notched in two steps in the width direction of the bank are formed on the outer surface of the center part of the bank facing the long side. As shown in FIGS. 2 to 3, the side castellation 25 includes a region that is wide in the width direction of the bank portion (first notch portion 251) and a region that is narrow in the width direction of the bank portion (second cut portion). A notch 252) and a stepped portion between the wide region and the narrow region. The narrow region is formed at a position including a cutting line (described later). FIG. 3 shows only the second layer 202 which is an intermediate layer among the three ceramic green sheets constituting the base 1.

  Side side conductors M are formed only on the portion of the second layer 202 in the inner wall surface of the first notch. The two side surface conductors M and M are electrically connected to the pair of mounting pads 21 and 21, respectively. That is, since the side surface conductor M is electrically connected to the quartz plate inside the base, the measurement probe is brought into contact with the side surface conductor M from the outside of the base to adjust the frequency of the quartz plate. Can be measured. Further, the information of the measurement result can be written in the IC bonded to the inner bottom surface of the base via the side surface side conductor M.

  In the present embodiment, the notch portion has a structure formed in the long side portion of the bank portion of the base 2, but is not limited to this embodiment, for example, the outer periphery of the bank portion of the base 2 Cutouts (abbreviated as corner castellations) may be formed in the vertical direction of the four corners. Moreover, you may form a notch in both the edge part and corner part of a bank part. In this case, for example, side conductors may be formed on the inner wall surface of the first layer 201 or the inner wall surfaces of the first layer 201 and the second layer 202 in the inner wall surface of the corner castellation. By forming the side conductors, a solder fillet is formed from the side conductors to the land pattern when the external connection terminals are fixed to the land pattern of the board by solder melting. Can be joined.

  Next, a method for forming the base aggregate will be described with reference to FIGS. Each of the three layers (201, 202, 203) constituting the base assembly 100 is a single ceramic green sheet.

  First, as shown in FIGS. 5 to 6, a plurality of substantially rectangular first holes 250 having a constant curvature at the corners in plan view are drilled at predetermined positions of the second layer 202 serving as an intermediate layer (first drilling). Process). At this time, the first hole 250 is drilled so that a part of the two adjacent base bank portions remains. As shown in FIGS. 5 to 6, the above-mentioned predetermined position intersects with a boundary line between two bases whose long sides are adjacent (substantially coincides with a planned cutting line that is a virtual line) (substantially orthogonal in this embodiment), It is a position straddling the bank portion area of the two adjacent bases. Specifically, the first hole 250 having a substantially rectangular shape in a plan view is perforated so that the long side of the hole intersects the predetermined cutting line L in a substantially orthogonal direction as shown in FIG. Note that the intersection is not limited to the orthogonal state, and may intersect at an angle other than 90 degrees with respect to the planned cutting line.

  On the other hand, also in each of the first layer 201 and the third layer 203, the first hole 250 having the same shape as described above is punched at a predetermined position. Here, the predetermined position refers to the first hole 250 having a plurality of through holes formed in the second layer 202 when the three ceramic green sheets (201, 202, 203) are stacked so that the outer peripheral edges thereof coincide with each other. And a position that substantially coincides with the plane view.

  Next, as shown in FIG. 7, the side conductors M are attached to the inner wall surfaces of all the first holes 250 formed in a predetermined position on the second layer 202 (conductor attaching step). In this embodiment, tungsten is used as the metal conductor.

  Then, as shown in FIG. 8, the upper side of the first hole 250 formed in the second layer 202 intersects with the long side of the first hole with reference to the approximate center of the first hole 250 (substantially orthogonal). Thus, the second hole 254 (indicated by the dotted line in FIG. 6) having a substantially rectangular shape in plan view is punched through (second drilling step). Specifically, the second hole 254 passes through the planned cutting line, straddles the bank portions of the adjacent bases, is wider than the first hole 250, and has a shape narrowed in the bank portion width direction. And is perforated so as to partially overlap the first hole.

  In the present embodiment, both the first hole 250 and the second hole 254 are substantially rectangular in plan view, but the second hole 254 has a shape that is longer and narrower than the first hole 250. By overlapping and punching two holes having different shapes in this way, the metal conductor on the inner wall surface of the first hole 250 is partially removed, and a through hole having a two-stage shape in plan view is formed (FIG. 9). . The first hole and the second hole may be rectangular with the same shape. This is because even if they have the same shape, it is possible to remove regions other than the vicinity of both ends of the long side of the first hole by overlapping and drilling so as to cross each other. In the present embodiment, both the first hole 250 and the second hole 254 are substantially rectangular in plan view, but both the first hole 250 and the second hole 254 may be substantially elliptical in plan view. In this case, the long side portion described above may be replaced with the long axis and drilled.

  As described above, by punching the second hole 254, the side conductor M formed across the cutting line and straddling the two adjacent bank portions is partially removed. In other words, since the metal conductor remains only in the part (in the vicinity of both ends of the long side of the first hole) separated from the cutting line in the direction toward the inside of the base, it does not interfere with the cutting line. In the present invention, the side conductors M are formed at positions spaced in the direction toward the inside of the base by the width of the dicing blade passing through the cutting line.

  On the other hand, each of the first layer 201 and the third layer 203 also has the same shape as the hole drilled in the second layer 202 from above the first hole 250 drilled as described above. Two holes 254 are drilled by punching. Here, the second hole 254 has a perforation position in which the second ceramic layer (201, 202, 203) is overlapped so that the outer peripheral edges of the two ceramic green sheets (201, 202, 203) coincide with each other. The hole 254 and the position substantially coincide with each other in plan view.

  In a state before firing (raw sheet state), each of the three ceramic green sheets is subjected to a metallization process of a predetermined pattern by screen printing. In the present embodiment, tungsten (W) is used for the metallization. In addition to tungsten, molybdenum (Mo) may be used.

  Next, the above-described three ceramic green sheets (201, 202, 203) are positioned and laminated so that the outer peripheral edges of the respective sheets are substantially aligned in the order of 201, 202, 203 from the bottom. Here, the metal conductor is applied only to the second layer 202 which is an intermediate layer. Then, cutting lines L, L, L... For separating a plurality of bases 2, 2, 2... Between adjacent bases (between the bank portions) are provided on the lower surface side of the first layer 201. They are formed vertically and horizontally on the upper surface side of the third layer 203 (see FIG. 4). Specifically, the cutting line L is formed in a shallow groove state on a substantially center line between adjacent bank portions on the upper surface 204 of the base bank portion connected together. In this embodiment, the cutting line is formed in a shallow groove state. However, the cutting line is not necessarily in a shallow groove state, and a planned cutting line may be set. That is, the present invention is applicable even when the cutting line is not visible.

  The above steps are all performed in a state before firing, and the base aggregate 100 is integrally formed by firing in a state where the three ceramic green sheets (201, 202, 203) are laminated.

  Next, electrolytic plating is performed through metal wirings N (in a state of being electrically connected to the respective bases) formed circumferentially on the periphery of the base aggregate 100 shown in FIG. A metal conductor portion exposed on the surface of the base aggregate by the electrolytic plating, for example, an upper layer such as a tungsten metallized layer on the top surface 204 (the top surface of the third layer 203) of each base 2, 2, 2,. Then, a nickel (Ni) film is formed. Further, a gold (Au) film is collectively formed on the nickel film by electrolytic plating. Through the above steps, a base assembly 100 in which a large number of bases 2, 2, 2,.

  In the present embodiment, the second hole is formed in each of the three ceramic green sheets (201, 202, 203), and then the three sheets are stacked and fired. A method may be used in which the first hole is punched in each sheet, the three sheets are stacked, and the second hole is punched through in a lump.

  The method for forming the base aggregate 100 has been described above. Hereinafter, a method for manufacturing a crystal oscillator using the base aggregate 100 will be described.

  First, an ICB (not shown in FIG. 4) is placed on the inner bottom surface 211 of each base 2, 2, 2,... Of the base assembly 100 formed as described above, and FCB method (Flip) using gold bumps. The bonding terminals of the IC and a plurality of metal patterns formed on the inner bottom surface of the base are bonded by chip bonding.

  Next, the quartz diaphragm is cantilever-supported and bonded to the pair of mounting pads 21 and 21 formed in the step portion 24 inside each of the bases 2, 2, 2. Due to the bonding, the quartz diaphragm is disposed above the IC. The crystal diaphragm is an AT-cut crystal piece having a rectangular shape in a plan view, the thickness of which is adjusted to have a predetermined frequency. A pair of excitation electrodes are disposed opposite to each other at the center of the front and back surfaces of the crystal diaphragm. Further, a pair of extraction electrodes are extracted from the excitation electrode in the direction of one end (short side) of the crystal diaphragm, and are connected to the pad electrode formed on the one end.

  Next, a large number of flat lids are placed one-on-one on the metal film on the top surface 204 of each bank 2, 2,. Note that a sealing material made of metal is formed on the side of the joint surface with the base of the lid. Here, the outer dimension of the lid is slightly smaller than the outer dimension of the base.

  As described above, after a large number of lids are placed on the top surface 204 of each base of the base assembly, the sealing material and the metal film on the top surface of the base are melted and integrated by atmospheric heating. The lid and the base are hermetically joined. As described above, it is formed in a state where a large number of crystal oscillators are connected.

  After hermetically sealing the lid and the base, the base aggregate 100 is cut with a dicing blade along cutting lines L, L, L. By this cutting, a large number of crystal oscillators can be obtained simultaneously. At this time, the cut surface of the bank part cut | disconnected along the cutting line L becomes the outer wall surface (bank part outer wall 22) of each base as it is. A straight solid portion in which the second layer 202 and the third layer 203 are stacked serves as the bank portion 200. In the present embodiment, the lid body is handled in the state of an individual piece. However, the lid body is not limited to this embodiment, and a lid body assembly in which a large number of lid bodies are integrally formed may be used.

  The first hole 250 is also divided by the cutting. Specifically, the first hole 250 is divided into two parts by passing a dicing blade along a cutting line L parallel to the longitudinal direction of the first hole 250 and extending laterally in FIG. Thus, two side castellations are formed from one first hole 250.

  According to the above configuration, since the metal conductor is not formed on the inner wall surface of the through hole on the cutting line, that is, the second hole 254 constituting the second notch 252, the base assembly is formed by the cutting means. The dicing blade does not come into contact with the metallic material when the body is divided into a large number of piezoelectric vibrating devices. Thereby, clogging of the blade can be prevented.

  Moreover, according to the said structure, in addition to the said effect, the conductor of the inner wall face of a hole can be formed stably. Specifically, since the metal conductor is formed only on the inner wall surface of the first cutout portion 251 that is wide in the width direction of the bank portion, the thinning in the width direction of the bank portion due to drilling is suppressed, The strength of the entire piezoelectric vibration device can be maintained.

  In addition, according to the manufacturing method of the present invention, while the bases are handled in the collective substrate state, the piezoelectric vibrating reeds and the electronic component elements are mounted inside each base, and then sealed one-on-one using the lid. Then, since the cutting is performed along the cutting line, a large number of piezoelectric devices can be obtained simultaneously. Further, since the side conductor is formed on the inner wall surface of the notch in a region that does not interfere with the cutting line, clogging of the dicing blade can be prevented and stable cutting can be performed. Therefore, a highly efficient and highly reliable piezoelectric device can be manufactured.

-Second Embodiment-
Hereinafter, a second embodiment of the present invention will be described with reference to FIG. In this embodiment as well, an example is shown in which a surface-mounted crystal oscillator is used as the piezoelectric device. FIG. 11 shows a plan view of the holes drilled in the second layer 202 among the three layers constituting the base assembly showing the second embodiment of the present invention. Hereinafter, differences from the first embodiment will be mainly described, and the same configuration as the first embodiment omits the description, and has the same effect as the first embodiment.

  In the present embodiment, as shown in FIG. 11, the holes (two side castellations after cutting) formed in the bank on the long side of the adjacent base have a three-stage shape in plan view. Specifically, from the outer wall side of the bank portion, the third cutout portion 253 is cut out so that the second cutout portion 252 is further formed on the back side and the first cutout portion 251 is further reduced on the back side. .

  Such a three-stage side castellation 25 has a first hole (first notch after cutting by dicing) for each of the first, second and third layers before firing the base assembly. 251) is drilled at a predetermined position. Similar to the first embodiment, the predetermined position is a position that is approximately in the middle of the bank portion on the long side of the adjacent base and straddles both bank portions and intersects the planned cutting line or the planned cutting line.

  Next, the side conductor M is attached to the inner wall surface of the first hole drilled in the second layer 202. Then, a substantially rectangular second hole (a hole that becomes the second cutout portion 252 after cutting by dicing) that is horizontally longer in plan view than the first hole and reduced in the width direction of the bank is overlapped with the first hole. To do. Specifically, the second hole is drilled so that the long side passes through the line to be cut and is substantially orthogonal to the long side of the first hole.

  Similarly, for each of the first and third layers, as described above, the second hole (same as the second hole) has the long side of the second hole passing through the cutting line, and the first hole Perforate so that it is almost perpendicular to the long side.

  The side conductor M is also attached to the inner wall surface of the second hole (excluding the inner wall surface of the first hole) drilled in the second layer 202, and the second conductor M is attached. From the second hole of the layer 202, a third hole having a substantially rectangular shape that is laterally longer than the second hole in plan view and reduced in the bank width direction (a hole that becomes the third notch 253 after cutting by dicing) ) Is overlaid on the second hole.

  Similarly, a third hole (same as the second hole) is drilled in each of the first and third layers in the same manner that the second layer 202 is drilled.

  And after laminating | stacking said three layers so that the outer periphery of each layer may correspond substantially, a base aggregate is shape | molded by package baking.

  As described above, the side conductor M is formed only in the portion of the second layer 202 in the inner wall surface of the side castellation in the vertical direction (depth direction). On the other hand, in the horizontal direction, a metal conductor is deposited on the second cutout portion 252 and the first cutout portion 251.

  When the base assembly is cut, when the dicing blade is brought into contact with the cutting line L, the side conductor M is not touched with the dicing blade, that is, separated from the dicing blade width (blade width) toward the inside of the base. It is formed at the position. Thereby, interference with the metal substance of a dicing blade can be prevented, and clogging of the dicing blade can be prevented. The formation position of the side conductor M is only an example, and the side conductor M may be formed at an arbitrary position on the inner wall surface of the side castellation as long as it is an area that is separated from the cutting line L toward the inside of the base and does not interfere with the dicing blade. .

  With such a structure, when the base assembly 100 is divided and cut into a large number of piezoelectric devices using a dicing blade, contact with the metal conductor (side conductor on the side portion) of the dicing blade can be prevented. Clogging can be prevented.

  As another modified example, as shown in FIG. 12, a side castellation having a structure in which only the third layer 203 is not cut out may be used. If the side castellation has such a structure, the upper surface of the bank portion to be joined to the lid body does not have a region to be cut off, so that stable sealing joining can be performed.

  In the embodiment of the present invention, a crystal oscillator is described as an example of a piezoelectric device, but the present invention can be applied to the manufacture of a crystal resonator in addition to an oscillator. Furthermore, in the embodiment of the present invention, the internal structure of the crystal oscillator is such that an IC is mounted on the inner bottom portion of the base and a crystal diaphragm is mounted thereon, but the positions of the IC and the crystal diaphragm are as follows. The present invention can also be applied to the manufacture of an oscillator having an upside down structure.

  The present invention can be implemented in various other forms without departing from the spirit or main features thereof. Therefore, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  It can be applied to mass production of piezoelectric vibration devices.

The perspective view of the base which shows the 1st Embodiment of this invention. The A section enlarged view in FIG. The top view in the 2nd layer of FIG. The top view of the base aggregate which shows the 1st Embodiment of this invention. The partial top view of the base aggregate which shows the formation method of a notch part. The partial top view of the base aggregate which shows the formation method of a notch part. The partial top view of the base aggregate which shows the formation method of a notch part. The partial top view of the base aggregate which shows the formation method of a notch part. The partial top view of the base aggregate which shows the formation method of a notch part. The long side direction sectional view of the crystal oscillator in the present invention. The top view of the notch part of the base aggregate which shows the 2nd Embodiment of this invention. The perspective view of the base which shows the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Crystal oscillator 100 Base assembly 2 Base 200 Bank part 201 1st layer 202 2nd layer 203 3rd layer 204 Bank part upper surface 25 Side castellation 250 1st hole 251 1st notch part 252 2nd notch Part 253 Third cutout part 254 Second hole 3 Crystal diaphragm 8 Opening L Cutting line M Side conductor

Claims (4)

A base assembly formed by connecting a plurality of rectangular bases in plan view, each having an opening in the upper part and an annular bank part surrounding the opening,
At the boundary between adjacent bases of the base assembly, a cutting line or a cutting line for separating into a plurality of bases is set,
A hole having at least one step in the width direction of the bank is formed in both or one or both of the corners and sides of the bank of each base, and the hole is the cutting line or It is formed at a position that includes the planned cutting line,
A base assembly in which a side conductor is formed in an inner wall of the hole and in an area that does not interfere with the cutting line or the planned cutting line. The hole includes a through hole or a bottomed hole, and has a wide region in the bank portion width direction and a narrow region in the bank portion width direction, and a step is provided between the wide region and the narrow region. Have
The base assembly according to claim 1, wherein the narrow region is formed at a position including the cutting line or the planned cutting line, and a side conductor is formed on an inner wall of the wide region. It is a manufacturing method of the base aggregate according to claim 1,
The base assembly is a laminate of a plurality of sheets, and in a state before firing the base assembly,
A first hole having a substantially rectangular shape or a substantially elliptical shape straddling the bases of adjacent bases of the base assembly so that the long side or long axis of the hole intersects the cutting line or the planned cutting line. A first drilling step for drilling through
A conductor deposition step of depositing a metal conductor on the inner wall surface of the first hole;
A second hole having a shape wider than the first hole and reduced in the width direction of the bank is penetrated through the adjacent bases so as to partially overlap the first hole. 2 drilling steps;
A method for producing a base assembly including Using the base assembly according to claim 1, a piezoelectric vibrating piece or a piezoelectric vibrating piece and an electronic component element are mounted inside each base of the base assembly,
After hermetically sealing the opening of each base on a one-to-one basis using a flat lid,
Cutting the base assembly along the cutting line or cutting line,
A method for manufacturing a piezoelectric device, wherein a large number of piezoelectric devices each having a notch formed by the cutting of the hole are collectively formed.

Images