JP2005294617A - Method of manufacturing electronic device - Google Patents

Method of manufacturing electronic device Download PDF

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JP2005294617A
JP2005294617A JP2004108878A JP2004108878A JP2005294617A JP 2005294617 A JP2005294617 A JP 2005294617A JP 2004108878 A JP2004108878 A JP 2004108878A JP 2004108878 A JP2004108878 A JP 2004108878A JP 2005294617 A JP2005294617 A JP 2005294617A
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substrate
mother
cover
blade
crystal resonator
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JP4493382B2 (en
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Toshio Nakazawa
利夫 中澤
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Kyocera Corp
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Kyocera Corp
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Priority to CN2005100095820A priority patent/CN1670978B/en
Priority to US11/069,766 priority patent/US8056198B2/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93Batch processes
    • H01L2224/95Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161Cap
    • H01L2924/1615Shape
    • H01L2924/16195Flat cap [not enclosing an internal cavity]

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  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing electronic devices which can improve productivity by simplifying assembling steps. <P>SOLUTION: The electronic device is manufactured through a stage A where a ceramic-made master substrate 15 having a plurality of substrate areas arranged in a matrix shape is prepared and an electronic component element 5 is mounted in each of the substrate areas of the master substrate 15; a stage B where a main cover 16 made of a metal having a plurality of cover areas having a one-to-one correspondence with the substrate areas is placed on the master substrate, and the master substrate and main cover are joined together at outer peripheral parts of the respective substrate areas; and a stage C where the main cover 16 is together cut with a 1st blade 12 along the outer periphery of each of the cover areas to form a through groove 13 penetrating the main cover 16 along the thickness in the joined body composed of the main cover and master substrate, and then a 2nd blade 14 having a wider blade width than the 1st blade 12 is inserted into the through hole 13 to cut the master substrate 15 into a plurality of electronic devices. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、携帯用通信機器や電子計算機等の電子機器に用いられる水晶振動子等の電子装置に関するものである。   The present invention relates to an electronic device such as a crystal resonator used in an electronic device such as a portable communication device or an electronic computer.

従来より、携帯用通信機器や電子計算機等の電子機器には、所定の共振周波数を発生する水晶振動子が用いられている。   Conventionally, a crystal resonator that generates a predetermined resonance frequency has been used in electronic devices such as portable communication devices and electronic computers.

従来の水晶振動子としては、例えば図4に示す如く、板状絶縁層21a、21bと枠状絶縁層21cとを積層してなる絶縁基板21は、その上面であって枠状絶縁層21cで囲まれる領域に一対の接続パッドを有し、該接続パッドに導電性接着材を介して電気的に接続される一対の振動電極を有した水晶振動素子25を取着させるとともに、前記枠状絶縁層21cの上部に金属製の蓋体27をロウ材を介して接合することにより水晶振動素子25の搭載領域を気密封止した構造のものが知られている(例えば、特許文献1参照。)。   As a conventional crystal resonator, for example, as shown in FIG. 4, an insulating substrate 21 formed by laminating plate-like insulating layers 21a and 21b and a frame-like insulating layer 21c is an upper surface of the substrate, and the frame-like insulating layer 21c. A crystal vibrating element 25 having a pair of connection pads in a region surrounded and having a pair of vibration electrodes electrically connected to the connection pads via a conductive adhesive is attached, and the frame-shaped insulation There is known a structure in which the mounting region of the crystal resonator element 25 is hermetically sealed by bonding a metal lid 27 to the upper portion of the layer 21c via a brazing material (see, for example, Patent Document 1). .

かかる水晶振動子は、絶縁基体21の下面に設けられる入出力端子を介して水晶振動素子25の振動電極間に外部からの変動電圧が印加されると、水晶振動素子25の特性に応じた所定の周波数で厚みすべり振動を起こすようになっており、その共振周波数に基づいて外部の発振回路で所定周波数の基準信号が発振・出力される。このような基準信号は、例えば携帯用通信機器等の電子機器におけるクロック信号として利用されることとなる。   Such a crystal resonator has a predetermined value corresponding to the characteristics of the crystal resonator element 25 when an external variable voltage is applied between the vibration electrodes of the crystal resonator element 25 via an input / output terminal provided on the lower surface of the insulating base 21. The thickness-shear vibration is caused at the frequency, and a reference signal having a predetermined frequency is oscillated and output by an external oscillation circuit based on the resonance frequency. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.

また、上述した水晶振動子の絶縁基体21は、通常、複数個の絶縁基体21を切り出すことができる大型の母基板を分割して個片を得る“多数個取り”の手法によって形成されており、得られた個片(絶縁基体21)に水晶振動素子25を個々に取着させた上、枠状絶縁層21cの上部に蓋体27を接合することによって水晶振動子が製作される。   Further, the above-described insulating base 21 of the crystal resonator is usually formed by a “multi-piece” technique in which a large mother substrate from which a plurality of insulating bases 21 can be cut is divided to obtain individual pieces. Then, the crystal resonator element 25 is individually attached to the obtained piece (insulating base member 21), and the crystal unit is manufactured by bonding the lid 27 to the upper part of the frame-like insulating layer 21c.

尚、上述した水晶振動子の蓋体27も、絶縁基体21と同様に、複数個の蓋体27を切り出すことができる大型の金属板(母カバー)を分割することによって得られ、水晶振動子の使用時、この蓋体27をグランド電位に保持しておくことにより外部からのノイズが遮蔽される。このような蓋体27は、絶縁基体21を介してグランド端子に電気的に接続される。
特開2001−274649号公報
The crystal resonator lid 27 described above is also obtained by dividing a large metal plate (mother cover) from which a plurality of lids 27 can be cut out, similarly to the insulating base 21. During use, external noise is shielded by holding the lid 27 at the ground potential. Such a lid 27 is electrically connected to the ground terminal via the insulating base 21.
JP 2001-274649 A

しかしながら、上述した従来の水晶振動子においては、その組み立てに先立って、大型の母基板を分割することにより絶縁基体21を、また大型の母カバーを分割することにより蓋体27を得ておく必要があり、この2種類の部材をそれぞれ別個の分割工程で得るようにしていたことから、水晶振動子の組み立て工程が煩雑なものとなり、生産性の向上に供しないという欠点を有していた。   However, in the above-described conventional crystal resonator, it is necessary to obtain the insulating base 21 by dividing the large mother substrate and the lid 27 by dividing the large mother cover prior to assembly. Since these two types of members are obtained in separate dividing steps, the assembly process of the crystal resonator becomes complicated, and there is a disadvantage that the productivity is not improved.

また上述したように、個片の絶縁基体21と個片の蓋体27とを事前に準備してから水晶振動子を組み立てる場合、複数個の絶縁基体21を個々にキャリアに保持させるための作業が必要となり、またキャリアに保持させた個々の絶縁基体21上には蓋体27を個々に位置合わせをして取り付けなければならず、これによっても水晶振動子の組み立て工程が煩雑になる欠点を有していた。   In addition, as described above, when assembling a crystal resonator after preparing the individual insulating base 21 and the individual lid body 27 in advance, an operation for individually holding the plurality of insulating bases 21 on the carrier. In addition, the lid 27 must be individually aligned and mounted on the individual insulating bases 21 held by the carrier, and this also disadvantageously complicates the assembly process of the crystal unit. Had.

本発明は上述の欠点に鑑み案出されたもので、その目的は、組み立て工程を簡略化して生産性を向上させることができる電子装置の製造方法を提供することにある。   The present invention has been devised in view of the above-described drawbacks, and an object of the present invention is to provide a method of manufacturing an electronic device that can simplify an assembly process and improve productivity.

本発明の電子装置の製造方法は、マトリクス状に配列された複数個の基板領域を有するセラミック製の母基板を準備し、該母基板の各基板領域に電子部品素子を搭載する工程Aと、前記基板領域と1対1に対応する複数個のカバー領域を有する金属製の母カバーを前記母基板上に配置し、該母基板と前記母カバーとを各基板領域の外周部において接合する工程Bと、前記母カバーを各基板領域の外周に沿って第1のブレードにて切断することにより前記母カバー及び母基板から成る接合体に、母カバーを厚み方向に貫通する貫通溝を形成し、しかる後、前記第1のブレードよりも刃幅の狭い第2のブレードを貫通溝内に挿入して母基板を切断・分割することにより複数個の電子装置を得る工程Cと、を含むことを特徴とするものである。   A method of manufacturing an electronic device according to the present invention includes a step A of preparing a ceramic mother board having a plurality of substrate regions arranged in a matrix, and mounting an electronic component element on each substrate region of the mother substrate; A step of disposing a metal mother cover having a plurality of cover areas corresponding to the board area on a one-to-one basis on the mother board, and joining the mother board and the mother cover at an outer periphery of each board area. B and a through groove that penetrates the mother cover in the thickness direction is formed in the joined body composed of the mother cover and the mother substrate by cutting the mother cover with a first blade along the outer periphery of each substrate region. And thereafter, a step C of obtaining a plurality of electronic devices by inserting a second blade having a narrower blade width than the first blade into the through groove and cutting and dividing the mother substrate. It is characterized by.

また本発明の電子装置の製造方法は、前記電子部品素子が水晶振動素子であることを特徴とするものである。   The electronic device manufacturing method of the present invention is characterized in that the electronic component element is a crystal resonator element.

本発明の電子装置の製造方法によれば、マトリクス状に配列された複数個の基板領域を有するセラミック製の母基板を準備し、該母基板の各基板領域に電子部品素子を搭載する工程Aと、前記基板領域と1対1に対応する複数個のカバー領域を有する金属製の母カバーを前記母基板上に配置し、該母基板と前記母カバーとを各基板領域の外周部において接合する工程Bと、前記母カバーを各基板領域の外周に沿って第1のブレードにて切断することにより前記母カバー及び母基板から成る接合体に、母カバーを厚み方向に貫通する貫通溝を形成し、しかる後、前記第1のブレードよりも刃幅の狭い第2のブレードを貫通溝内に挿入して母基板を切断・分割することにより複数個の電子装置を得る工程Cとを含むことから、電子装置の組み立てに先立って、基板やカバーを予め個片に分割しておく必要はなく、予め一体化された基板及びカバーを2種のブレードにより分割することによって基板とカバーとを一括的に切断することができる。   According to the method for manufacturing an electronic device of the present invention, a process A is provided in which a ceramic mother board having a plurality of substrate areas arranged in a matrix is prepared, and an electronic component element is mounted on each board area of the mother board. And a metal mother cover having a plurality of cover areas corresponding to the board area on a one-to-one basis is disposed on the mother board, and the mother board and the mother cover are joined to each other at the outer periphery of each board area. And a through-groove that penetrates the mother cover in the thickness direction in the joined body composed of the mother cover and the mother substrate by cutting the mother cover with a first blade along the outer periphery of each substrate region. Forming a plurality of electronic devices by inserting a second blade having a blade width narrower than that of the first blade into the through groove and then cutting and dividing the mother substrate. From the assembly of electronic equipment It is not necessary to divide the substrate and cover into individual pieces in advance, and the substrate and cover can be cut together by dividing the pre-integrated substrate and cover with two types of blades. .

しかもこの場合、電子装置の組み立てに際して、母基板そのものがキャリアとして機能するようになっていることから、母基板より分割した個片を個々にキャリアに保持させたり、或いは、各個片にカバーを個々に取り付けるといった煩雑な作業は一切不要となる。   In addition, in this case, when the electronic device is assembled, the mother board itself functions as a carrier. Therefore, the individual pieces divided from the mother board are individually held by the carrier, or each individual piece is provided with a cover. There is no need for complicated work such as attaching to the camera.

これにより、電子装置の組み立て工程が大幅に簡素化されるようになり、電子装置の生産性向上に供することが可能となる。   As a result, the assembly process of the electronic device is greatly simplified, and the productivity of the electronic device can be improved.

また、セラミック製の基板及び金属製のカバーの2種類の部材を接合してなる複合材を、それぞれの材質を切断するのに適した2種のブレードを用いて切断することができるため、1種のブレードを用いて切断する場合に比して、切断により複合材に応力が発生するのを効果的に抑制でき、基板とカバーとが剥がれずに水晶振動素子の気密封止性を保って、共振周波数を一定に保持することができる。   Further, since a composite material formed by joining two types of members, a ceramic substrate and a metal cover, can be cut using two types of blades suitable for cutting the respective materials. Compared to cutting with a seed blade, it is possible to effectively suppress the generation of stress in the composite material by cutting, and keep the hermetic seal of the crystal resonator element without peeling off the substrate and cover. The resonance frequency can be kept constant.

以下、本発明を添付図面に基づいて詳細に説明する。   Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

図1は、本発明の電子装置の製造方法を適用して製造された水晶振動子を示す図であり、(a)は断面図、(b)は分解斜視図である。同図に示す水晶振動子は、大略的に、絶縁基体1と、電子部品素子としての水晶振動素子5と、カバー部材8とで構成されている。   1A and 1B are diagrams showing a crystal resonator manufactured by applying an electronic device manufacturing method according to the present invention, wherein FIG. 1A is a cross-sectional view and FIG. 1B is an exploded perspective view. The crystal resonator shown in the figure is generally composed of an insulating substrate 1, a crystal resonator element 5 as an electronic component element, and a cover member 8.

絶縁基体1は、例えば、ガラス−セラミック、アルミナセラミックス等のセラミック材料から成る板状絶縁層1a、1bと枠状絶縁層1cとを積層して形成されており、その上面であって枠状絶縁層1cで囲まれる領域には一対の接続パッドを設けられ、また、下面には入力端子、出力端子、グランド端子等の外部端子3が設けられている。   The insulating substrate 1 is formed by laminating plate-like insulating layers 1a and 1b made of a ceramic material such as glass-ceramic or alumina ceramic and a frame-like insulating layer 1c, and is frame-shaped insulating on the upper surface thereof. A pair of connection pads are provided in a region surrounded by the layer 1c, and external terminals 3 such as an input terminal, an output terminal, and a ground terminal are provided on the lower surface.

かかる絶縁基体1に設けられている一対の接続パッド2は、その上面側で水晶振動素子5の振動電極に導電性接着材を介して電気的に接続され、下面側で絶縁基体1上の導体パターンや絶縁基体内部のビア導体等を介して絶縁基体下面の入出力端子(入力端子、出力端子)に電気的に接続される。   The pair of connection pads 2 provided on the insulating base 1 are electrically connected to the vibrating electrodes of the crystal resonator element 5 on the upper surface side via a conductive adhesive, and the conductors on the insulating base 1 on the lower surface side. It is electrically connected to an input / output terminal (input terminal, output terminal) on the lower surface of the insulating substrate via a pattern, a via conductor inside the insulating substrate, or the like.

尚、上述した外部端子3は、水晶振動子をマザーボード等の外部電気回路に搭載する際、外部電気回路の回路配線と半田等の導電性接着材を介して電気的に接続されることとなる。   The external terminal 3 described above is electrically connected to the circuit wiring of the external electric circuit via a conductive adhesive such as solder when the crystal resonator is mounted on an external electric circuit such as a mother board. .

また、上述した絶縁基体1の上面に搭載される水晶振動素子5は、所定の結晶軸でカットした、厚み30μm〜160μmの水晶片の両主面に一対の振動電極を被着・形成してなり、外部からの変動電圧が一対の振動電極を介して水晶片に印加されると、所定の周波数で厚みすべり振動を起こすようになっている。   The quartz resonator element 5 mounted on the upper surface of the insulating base 1 described above is formed by attaching and forming a pair of vibrating electrodes on both main surfaces of a crystal piece having a thickness of 30 μm to 160 μm cut along a predetermined crystal axis. Thus, when an externally varying voltage is applied to the crystal piece via a pair of vibrating electrodes, thickness-shear vibration is caused at a predetermined frequency.

このような水晶振動素子5は、その両主面に被着されている振動電極と絶縁基体上面の対応する接続パッド2とを導電性接着材7を介して電気的・機械的に接続することによって絶縁基体1の上面の所定位置に搭載される。   Such a quartz-crystal vibrating element 5 is electrically and mechanically connected via a conductive adhesive 7 to the vibrating electrodes attached to both main surfaces thereof and the corresponding connection pads 2 on the upper surface of the insulating base. Is mounted at a predetermined position on the upper surface of the insulating substrate 1.

上述の枠状絶縁層1cは、絶縁基体1と後述するカバー部材8との間に水晶振動素子5が配置される所定の空間を確保するためのスペーサとして機能するものであり、その上面にはカバー部材8が取着され、該カバー部材8によって枠状絶縁層1cの内周面と絶縁基体1の上面とで囲まれる水晶振動素子5の収納領域が気密封止される。   The frame-shaped insulating layer 1c described above functions as a spacer for securing a predetermined space in which the crystal resonator element 5 is disposed between the insulating base 1 and a cover member 8 described later. The cover member 8 is attached, and the housing region of the crystal resonator element 5 surrounded by the inner peripheral surface of the frame-shaped insulating layer 1c and the upper surface of the insulating base 1 is hermetically sealed by the cover member 8.

このようなカバー部材8は、例えば42アロイやコバール,リン青銅等の金属によって平板状をなすように形成されており、その下面には接合材9が形成される。接合材9は、カバー部材8側からNi層及びAu−Sn層が順に積層されてなるものであり、その厚みは、Ni層が2μm〜8μm、Au−Sn層が10μm〜30μmである。   Such a cover member 8 is formed to have a flat plate shape with a metal such as 42 alloy, Kovar, or phosphor bronze, for example, and a bonding material 9 is formed on the lower surface thereof. The bonding material 9 is formed by sequentially laminating a Ni layer and an Au—Sn layer from the cover member 8 side, and the thickness is 2 μm to 8 μm for the Ni layer and 10 μm to 30 μm for the Au—Sn layer.

この接合材9が下面に形成されたカバー部材8は、枠状絶縁層1cの上面に形成されている導体層4を介して、絶縁基体1上に配置・接合される。   The cover member 8 having the bonding material 9 formed on the lower surface is disposed and bonded onto the insulating substrate 1 via the conductor layer 4 formed on the upper surface of the frame-shaped insulating layer 1c.

導体層4としては、例えば、タングステンやモリブデン等からなるメタライズ層、Ni層及びAu層を順に積層してなる3層構造のものを用いる。厚みは、メタライズ層を10μm〜20μmとし、Ni層を2μm〜8μmとし、Au層を0.7μm〜1.4μmとすれば良い。   As the conductor layer 4, for example, a three-layer structure in which a metallized layer made of tungsten, molybdenum, or the like, a Ni layer, and an Au layer are sequentially laminated is used. The thickness may be 10 μm to 20 μm for the metallized layer, 2 μm to 8 μm for the Ni layer, and 0.7 μm to 1.4 μm for the Au layer.

尚、前記カバー部材8は、絶縁基体1とで囲まれる領域に水晶振動素子5を収容して気密封止するためのものであり、前述した枠状絶縁層1c(導体層4)を介して絶縁基体下面のグランド端子に電気的に接続されており、これによって、カバー部材8は、水晶振動子の使用時、グランド電位に保持され、水晶振動素子5がカバー部材8のシールド効果によって外部からの不要な電気的作用、例えばノイズ等から良好に保護される。   The cover member 8 is for accommodating the quartz vibrating element 5 in a region surrounded by the insulating base 1 and hermetically sealing it, and through the frame-shaped insulating layer 1c (conductor layer 4) described above. The cover member 8 is electrically connected to the ground potential when the crystal resonator is used, and the crystal vibrating element 5 is externally applied by the shielding effect of the cover member 8. It is well protected from unwanted electrical effects such as noise.

かくして上述した水晶振動子は、絶縁基体1の下面に設けられる入出力端子を介して水晶振動素子5の振動電極−振動電極間に外部からの変動電圧を印加し、水晶振動素子5の特性に応じた所定の周波数で厚みすべり振動を起こさせることによって水晶振動子として機能し、かかる水晶振動子の共振周波数に基づいて外部の発振回路で所定周波数の基準信号が発振・出力される。そして、このような基準信号は携帯用通信機器等の電子機器におけるクロック信号として利用されることとなる。   Thus, the crystal resonator described above applies a variable voltage from the outside between the vibration electrode and the vibration electrode of the crystal vibration element 5 via the input / output terminal provided on the lower surface of the insulating base 1, and the characteristics of the crystal vibration element 5 are obtained. A thickness-shear vibration is caused at a predetermined frequency according to the function of the crystal resonator, and a reference signal having a predetermined frequency is oscillated and output by an external oscillation circuit based on the resonance frequency of the crystal resonator. Such a reference signal is used as a clock signal in an electronic device such as a portable communication device.

次に、上述した水晶振動子の製造方法について図2を用いて説明する。   Next, a method for manufacturing the above-described crystal resonator will be described with reference to FIG.

(工程A)
まず、縦m列×横n行(m,nは2以上の自然数)のマトリクス状に配列された複数個の基板領域し、該基板領域を囲繞するように配された枠状絶縁層1cを有する母基板15を準備し、母基板15の各基板領域に水晶振動素子5を搭載する(図2(a))。
(Process A)
First, a plurality of substrate regions arranged in a matrix of vertical m columns × horizontal n rows (m and n are natural numbers of 2 or more), and a frame-like insulating layer 1c arranged so as to surround the substrate regions are provided. A mother substrate 15 is prepared, and the crystal resonator element 5 is mounted on each substrate region of the mother substrate 15 (FIG. 2A).

母基板15は、例えば、ガラス−セラミック、アルミナセラミックス等のセラミック材料からなる板状絶縁基体15a、15b及び枠状絶縁基体15cを間に導体パターンを介して積層することによって形成されており、各基板領域には、その上面側に一対の接続パッド2が被着・形成され、下面側には入出力端子やグランド端子等の外部端子3が被着・形成されている。   The mother board 15 is formed, for example, by laminating plate-like insulating bases 15a and 15b and a frame-like insulating base 15c made of a ceramic material such as glass-ceramic and alumina ceramic with a conductor pattern interposed therebetween. In the substrate region, a pair of connection pads 2 are attached and formed on the upper surface side, and external terminals 3 such as input / output terminals and ground terminals are attached and formed on the lower surface side.

このような母基板15は、例えば、アルミナセラミックス等から成るセラミック材料粉末に適当な有機溶剤等を添加・混合して得たセラミックグリーンシートの表面等に接続パッド2や外部端子3等となる導体ペーストを所定パターンに印刷・塗布するとともに、これを複数枚積層してプレス成形した後、高温で焼成することによって製作される。   Such a mother substrate 15 is a conductor that becomes a connection pad 2, an external terminal 3, etc. on the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent to a ceramic material powder made of alumina ceramics, for example. The paste is printed and applied in a predetermined pattern, and a plurality of the pastes are stacked, press-molded, and then fired at a high temperature.

そして、各枠状絶縁層1cの内側に水晶振動素子5を1個ずつ搭載する。水晶振動素子5は、その振動電極と母基板上面の対応する搭載パッド2とを導電性接着剤7を介して電気的・機械的に接続することによって母基板15上に搭載される。   Then, one crystal resonator element 5 is mounted inside each frame-like insulating layer 1c. The crystal resonator element 5 is mounted on the mother substrate 15 by electrically and mechanically connecting the vibration electrode and the corresponding mounting pad 2 on the upper surface of the mother substrate via the conductive adhesive 7.

また、本実施形態においては、複数個の枠状絶縁層1cを1個ずつ基板領域に搭載するのではなく、マトリクス状に配列された複数個の枠状絶縁層1a、1bを相互に連結して一体化した板状絶縁基体15a、15bを積層し、その上面に、マトリクス状に配列された複数個の枠状絶縁層1cを相互に連結して一体化した枠状絶縁基体15cを載置・搭載することによって複数個の枠状絶縁層1cが対応する基板領域に一括的に取着されるようにして母基板15を形成している。   In the present embodiment, the plurality of frame-like insulating layers 1c are not mounted on the substrate region one by one, but a plurality of frame-like insulating layers 1a, 1b arranged in a matrix are connected to each other. The integrated plate-like insulating bases 15a and 15b are stacked, and a plurality of frame-like insulating layers 1c arranged in a matrix are connected to each other on the upper surface of the plate-like insulating bases 15c. The mother substrate 15 is formed so that the plurality of frame-like insulating layers 1c are collectively attached to the corresponding substrate regions by mounting.

(工程B)
次に、図2(a)に示す如く、母基板15の基板領域と1対1に対応する複数個のカバー領域11を有する金属製の母カバー16を、水晶振動素子5が封止されるようにして枠状絶縁層1c上に載置・接合する。
(Process B)
Next, as shown in FIG. 2A, the crystal resonator element 5 is sealed with a metal mother cover 16 having a plurality of cover regions 11 corresponding to the substrate region of the mother substrate 15 on a one-to-one basis. Thus, it mounts and joins on the frame-shaped insulating layer 1c.

前記母カバー16としては、例えば、42アロイやコバール,リン青銅等の金属から成る、厚み60μm〜100μmの金属板が用いられている。   As the mother cover 16, for example, a metal plate having a thickness of 60 μm to 100 μm made of a metal such as 42 alloy, Kovar, or phosphor bronze is used.

この工程Bでは、母カバー16を、各カバー領域11の内側に対応する基板領域の水晶振動素子5が配されるようにして母基板15上面の各枠状絶縁層1c上に形成されている導体層4に載置させ、しかる後、これを例えば、300℃〜350℃の温度に保たれた加熱炉の中に入れ、接合材9を高温で加熱・溶融させることによって母カバー16が母基板15上面の枠状絶縁層1cの上面に形成されている導体層4に取着・固定される。その後、一体化された母基板15と母カバー16は徐々に室温まで冷却される。   In this step B, the mother cover 16 is formed on each frame-like insulating layer 1c on the upper surface of the mother substrate 15 so that the crystal resonator elements 5 of the substrate region corresponding to the inside of each cover region 11 are arranged. The mother cover 16 is placed on the conductor layer 4 and then put into a heating furnace maintained at a temperature of 300 ° C. to 350 ° C., for example, and the joining material 9 is heated and melted at a high temperature so that the mother cover 16 becomes the mother cover 16. It is attached and fixed to the conductor layer 4 formed on the upper surface of the frame-like insulating layer 1c on the upper surface of the substrate 15. Thereafter, the integrated mother board 15 and mother cover 16 are gradually cooled to room temperature.

尚、上述した一連の接合工程は、窒素ガスやアルゴンガス等の不活性ガス雰囲気中で行うのが好ましく、これによって水晶振動素子5が収納される空間には不活性ガスが充満されるため、水晶振動素子5が酸素や大気中の水分等によって腐食・劣化するのを有効に防止することができる。   In addition, it is preferable to perform a series of joining processes mentioned above in inert gas atmosphere, such as nitrogen gas and argon gas, and since the space in which the crystal vibration element 5 is accommodated by this is filled with inert gas, It is possible to effectively prevent the quartz vibrating element 5 from being corroded and deteriorated by oxygen, moisture in the atmosphere, or the like.

(工程C)
そして、図2(b)に示す如く、工程Bにおいて一体化した母基板15及び母カバー16からなる接合体を、各基板領域の外周に沿って第1のブレード12にて母カバー16を切断することにより母基板15が一部露出するようにして母カバー16を厚み方向に貫通する貫通溝13を形成する。
(Process C)
Then, as shown in FIG. 2B, the joined body composed of the mother substrate 15 and the mother cover 16 integrated in the step B is cut by the first blade 12 along the outer periphery of each substrate region. By doing so, the through-groove 13 penetrating the mother cover 16 in the thickness direction is formed so that the mother substrate 15 is partially exposed.

第1のブレード12として、例えばダイヤモンド砥粒などを電鋳により固定した円板状の電鋳ブレードを用いる。結合剤としては、Niなどが用いられる。   As the first blade 12, for example, a disk-shaped electroformed blade in which diamond abrasive grains are fixed by electroforming is used. Ni or the like is used as the binder.

次に、図2(c)に示す如く、第1のブレード12よりも刃幅の狭い第2のブレード14を貫通溝13内に挿入して母基板15を切断・分割する。これによって、図2(d)に示すように、複数個の水晶振動子が同時に製作される。   Next, as shown in FIG. 2 (c), the second blade 14 having a narrower blade width than the first blade 12 is inserted into the through groove 13 to cut and divide the mother substrate 15. As a result, as shown in FIG. 2D, a plurality of crystal resonators are manufactured simultaneously.

第2のブレード14として、ダイヤモンド砥粒などを、エポキシ樹脂などの樹脂を結合剤として結合させてなる円板状のレジンブレードを用いる。なお、添加物として、各種金属を用いても良い。この第2のブレード14は、比較的硬度を低くすることにより、セラミック製の母基板15と摩耗しながら切断するようにしても良い。   As the second blade 14, a disk-shaped resin blade is used in which diamond abrasive grains and the like are bonded with a resin such as an epoxy resin as a binder. Various metals may be used as additives. The second blade 14 may be cut while being worn with the ceramic mother board 15 by relatively reducing the hardness.

以上のような工程A〜Cにより水晶振動子を製作する場合、水晶振動子の組み立てに先立って、絶縁基体1やカバー部材8を予め個片に分割しておく必要はなく、一括的な分割によって絶縁基体1とカバー部材8とを同時に切断することができる。   In the case of manufacturing a crystal resonator by the processes A to C as described above, it is not necessary to divide the insulating base 1 and the cover member 8 into individual pieces in advance before assembling the crystal resonator. Thus, the insulating substrate 1 and the cover member 8 can be cut simultaneously.

しかもこの場合、水晶振動子の組み立てに際して、母基板そのものがキャリアとして機能させることができることから、母基板15より分割した個片を個々にキャリアに保持させたり、或いは、各個片にカバー部材8を個々に取り付けるといった煩雑な作業は一切不要となる。   In addition, in this case, since the mother substrate itself can function as a carrier when the crystal resonator is assembled, the individual pieces divided from the mother substrate 15 are individually held by the carrier, or the cover member 8 is attached to each individual piece. No complicated work such as individual installation is required.

これにより、水晶振動子の組み立て工程が大幅に簡素化されるようになり、水晶振動子の生産性向上に供することが可能となる。   As a result, the assembly process of the crystal unit is greatly simplified, and the productivity of the crystal unit can be improved.

また、セラミック製の基板及び金属製のカバーの2種類の部材を接合してなる複合材を、それぞれの材質を切断するのに適した2種のブレードを用いて切断することができるため、1種のブレードを用いて切断する場合に比して、切断により複合材に応力が発生するのを効果的に抑制でき、基板とカバーとが剥がれず水晶振動素子5の気密封止性を保って、共振周波数を一定に保持することができる。   Further, since a composite material formed by joining two types of members, a ceramic substrate and a metal cover, can be cut using two types of blades suitable for cutting the respective materials. Compared with the case of cutting with a seed blade, it is possible to effectively suppress the generation of stress in the composite material by cutting, and the substrate and the cover are not peeled off, and the hermetic sealing property of the crystal resonator element 5 is maintained. The resonance frequency can be kept constant.

尚、本発明は上述の実施形態に限定されるものではなく、本発明の要旨を逸脱しない範囲において種々の変更、改良等が可能である。     In addition, this invention is not limited to the above-mentioned embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.

例えば、上述した実施形態においては、電子部品素子として水晶振動素子を用いることにより水晶振動子を構成するようにしたが、それ以外の電子装置、例えば、電子部品素子としてIC素子や他の圧電素子を用いるようにした電子装置においても本発明は適用可能である。   For example, in the above-described embodiment, a crystal resonator is configured by using a crystal resonator element as an electronic component element. However, other electronic devices, for example, an IC element or other piezoelectric element as an electronic component element The present invention can also be applied to an electronic apparatus using the above.

本発明の電子装置の製造方法を適用して製造された水晶振動子(電子装置)を示す図であり、(a)は断面図、(b)は分解斜視図である。It is a figure which shows the crystal resonator (electronic device) manufactured by applying the manufacturing method of the electronic device of this invention, (a) is sectional drawing, (b) is a disassembled perspective view. (a)乃至(d)は、本発明の電子装置の製造方法の一実施形態を説明するための断面図である。(A) thru | or (d) are sectional drawings for demonstrating one Embodiment of the manufacturing method of the electronic device of this invention. 本発明の電子装置の製造方法の一実施形態を説明するための斜視図である。It is a perspective view for demonstrating one Embodiment of the manufacturing method of the electronic device of this invention. 従来の水晶振動子の断面図である。It is sectional drawing of the conventional crystal oscillator.

符号の説明Explanation of symbols

1・・・・・・・絶縁基体
1a、1b・・・板状絶縁層
1c・・・・・・枠状絶縁層
2・・・・・・・接続パッド
3・・・・・・・外部端子
4・・・・・・・導体層
5・・・・・・・水晶振動素子(電子部品素子)
6・・・・・・・振動電極
7・・・・・・・導電性接着材
8・・・・・・・カバー部材
9・・・・・・・接合材
10・・・・・・基板領域
11・・・・・・カバー領域
12・・・・・・第1ブレード
13・・・・・・貫通溝
14・・・・・・第2ブレード
15・・・・・・母基板
15a、15b・板状絶縁基体
15c・・・・・枠状絶縁基体
16・・・・・・母カバー
1 .... Insulating substrate 1a, 1b ... Plate insulating layer 1c ... Frame insulating layer 2 .... Connecting pad 3 .... External Terminal 4 ···· Conductive layer 5 ··········· Quartz resonator element (electronic component element)
6 .... Vibrating electrode 7 .... Conductive adhesive 8 .... Cover member 9 .... Joint 10 ...... Board Area 11 ··· Cover area 12 · · · First blade 13 · · · Through groove 14 · · · Second blade 15 · · · Mother board 15a, 15b · Plate-like insulating base 15c · · · Frame-like insulating base 16 · · · Mother cover

Claims (2)

マトリクス状に配列された複数個の基板領域を有するセラミック製の母基板を準備し、該母基板の各基板領域に電子部品素子を搭載する工程Aと、
前記基板領域と1対1に対応する複数個のカバー領域を有する金属製の母カバーを前記母基板上に配置し、該母基板と前記母カバーとを各基板領域の外周部において接合する工程Bと、
前記母カバーを各基板領域の外周に沿って第1のブレードにて切断することにより前記母カバー及び母基板から成る接合体に、母カバーを厚み方向に貫通する貫通溝を形成し、しかる後、前記第1のブレードよりも刃幅の狭い第2のブレードを貫通溝内に挿入して母基板を切断・分割することにより複数個の電子装置を得る工程Cと、を含む電子装置の製造方法。
Preparing a ceramic mother substrate having a plurality of substrate regions arranged in a matrix, and mounting electronic component elements on each substrate region of the mother substrate; and
A step of disposing a metal mother cover having a plurality of cover areas corresponding to the board area on a one-to-one basis on the mother board, and joining the mother board and the mother cover at an outer periphery of each board area. B and
By cutting the mother cover with a first blade along the outer periphery of each substrate region, a through groove that penetrates the mother cover in the thickness direction is formed in the joined body composed of the mother cover and the mother substrate, and thereafter And a step C of obtaining a plurality of electronic devices by inserting a second blade having a narrower blade width than the first blade into the through groove and cutting and dividing the mother substrate. Method.
前記電子部品素子が水晶振動素子であることを特徴とする請求項1に記載の電子装置の製造方法。 The method of manufacturing an electronic device according to claim 1, wherein the electronic component element is a crystal resonator element.
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