JP2009033613A - Lid body aggregate, piezoelectric vibration device using the lid body aggregate concerned, and manufacturing method of the piezoelectric vibration device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lid body aggregate which can be hermetically, stably sealed at a low cost, and a manufacturing method of the piezoelectric vibration device using the lid body aggregate concerned. <P>SOLUTION: In the lid body aggregate 2, a base comprises: a recess 6 in an upper part thereof; and a ring-shaped dam 7 which surrounds the recess 6, and has a first sealant S11 formed on an upper face thereof, and a plurality of lid bodies in which a base aggregate 1 having a plurality of bases integrally formed in a matrix pattern is hermetically sealed in a lump are integrally formed in the matrix pattern. On the joining face side to the base aggregate 1 of the lid body aggregate 2, a plurality of peripheral second sealants S21 are formed at a position on an upper face of the dam of the plurality of bases on a one-for-one basis. An inner fringe of the second sealant S21 is formed at a position on a substantially same plane with an inner wall face of the dam 7, or is formed so as to protrude to a position which is more inner than the inner wall face of the dam 7. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a lid assembly in which a plurality of lids are integrally formed, and a method for manufacturing a piezoelectric oscillation device using the lid assembly, which are used in the manufacture of a piezoelectric oscillation device.

  Conventionally, surface-mounted crystal resonators have been widely used as piezoelectric vibration devices in a form corresponding to low profile and space saving. Main components of the surface-mount type crystal resonator are: a flat plate crystal resonator element; a container body (base) made of an insulator having a recess for housing the crystal resonator element; It is a lid for stopping. The base surrounds the concave portion and includes an annular bank having a metal film formed on the upper surface.

  The surface-mounted crystal resonator includes a sealing member in which the crystal film is accommodated in the recess, and the metal film and the lid are formed on the joint surface side of the lid with the base It is melt bonded in a heated atmosphere through the material. When handling the base in the state of individual pieces, the production efficiency deteriorates and it is difficult to respond to the recent demand for miniaturization. Therefore, an assembly in which a plurality of lids or bases are integrally formed is used. Manufacturing methods are used.

  As an example of the manufacturing method using the assembly, for example, as shown in FIG. 8, a plurality of bases are integrally formed by aligning a plurality of bases in a matrix shape. The lid body 9 is placed on the sealing material S1 of each base, and each lid body and each base are hermetically sealed through the sealing material S2 by a batch heating process, and then a large number of them are divided and cut simultaneously. There is a manufacturing method for obtaining a single crystal resonator. Alternatively, as shown in FIG. 9, a base assembly 1 and a lid assembly 2 in which a plurality of lids are integrally formed in a matrix are arranged over the entire surface of one side of the lid assembly. There is also used a manufacturing method in which a large number of crystal resonators are obtained at the same time by dividing and cutting after hermetically sealing by a batch heat treatment through the formed sealing material S2. A manufacturing method using such an aggregate is disclosed in, for example, Patent Document 1 and Patent Document 2.

JP 11-340350 A JP 2004-18695 A

  Patent Document 1 is a manufacturing method based on a combination of the base assembly and a lid assembly in which a plurality of lids are integrated via a connecting portion. With such a configuration, the lid can be easily positioned with respect to the base assembly, but in reality, the lid assembly is placed on the base assembly due to shrinkage during firing of the base. There is concern about the position shift. Further, a sealing material is formed over the entire surface of each lid body of the lid assembly, and when the base and the lid body are sealed by electron beam welding, the lid body Only the sealing material at the outer peripheral portion of the metal contributes to sealing. Therefore, there is a problem that the cost is increased because the amount of the sealing material used cannot be reduced.

  Further, in Patent Document 2, a brazing material having a shape corresponding to the metal film on the upper surface of each base is formed on the lid, but before the crystal resonator is manufactured, it is divided into pieces in advance. As the crystal resonator is miniaturized, it is difficult to accurately position and place the plurality of lids on the metal films of the plurality of bases.

  The present invention has been made in view of the above points, and provides a lid assembly capable of performing stable hermetic sealing at low cost, and a method for manufacturing a piezoelectric vibration device using the lid assembly. It is intended to do.

  In order to achieve the above object, the invention of claim 1 is directed to a base assembly in which a plurality of bases each having a concave portion at an upper portion and an annular bank portion surrounding the concave portion are integrally formed in a matrix. A plurality of lid bodies that are hermetically sealed and in which a plurality of lid bodies are integrally formed in a matrix shape, at least on the side of the joint surface of the lid body aggregate with the base aggregate. A plurality of circumferential sealing materials are formed at a position corresponding to the upper surface on a one-to-one basis, and the inner peripheral edge of the sealing material is formed at a position substantially on the same plane as the inner wall surface of the bank portion, or Since it is a lid body assembly that is formed to project to a position inside the inner wall surface of the bank portion, the seal formed on each lid body on a one-to-one basis on the upper surface of the bank portion of each base Since materials can be placed in a collective substrate state, it is reliable and efficient It is possible to carry out a hermetic seal.

  The base assembly is made of a ceramic material, a sealing material is also formed on the upper surface of the bank of the base assembly, and a plurality of the banks of the base are formed on the joint surface side of the lid assembly with the base assembly. A plurality of circumferential sealing materials are formed at positions corresponding one-to-one with the top surface of the section, and the inner peripheral edge of the sealing material is formed to project to a position inside the inner wall surface of the bank portion. When the lid assembly is placed on the base assembly, the sealing formed on the upper surface of the dam portion of each base is provided even if dimensional variation occurs due to shrinkage during firing of the ceramic base assembly. Since the stop material forming region is accommodated (enclosed) in the sealing material forming region of each lid, it is possible to prevent positional deviation between the base and the lid. In addition, even if a slight misalignment occurs, the sealing material of each base and the sealing material of each lid are in a positional relationship facing each other, so that reliable and stable hermetic sealing of the piezoelectric vibrating device can be achieved. It can be carried out.

  The present invention has a configuration in which a plurality of circumferential sealing materials are formed at positions corresponding to the top surfaces of the plurality of bases on a one-to-one basis in at least the lid assembly. The present invention is not limited to the form in which the sealing material is formed only on the body assembly, and the present invention may be applied to a form in which the sealing material is also formed on the base assembly (upper surface of each base). Can be applied.

  According to the above configuration, when assembling the piezoelectric vibration device, it is not necessary to divide the lid body into individual pieces from the lid body assembly in advance, and the lid body can be handled in a sheet (substrate) state. Since it is not necessary to position each lid body with respect to each base and temporarily fix each lid body to each base, an efficient piezoelectric vibration device can be produced.

  In addition, the width dimension of the sealing material formed on the lid body is designed in consideration of the difference in shrinkage rate for each production lot when the base assembly is fired, and thus depends on the production lot of the base assembly. Without using the same lid assembly.

  Further, according to the above configuration, the sealing material formed on each lid is formed only at a position corresponding to the top surface of the bank of each base in a one-to-one correspondence. Compared with the case where it is formed over the entire surface, the amount of sealing material used can be reduced, leading to a reduction in manufacturing cost.

  Further, according to the configuration of claim 2, a base assembly including a plurality of bases each including a recess and an annular bank portion surrounding the recess is integrally formed in a matrix and mounted in the recess. 2. A piezoelectric vibration device obtained from a piezoelectric vibration element and a cover assembly according to claim 1, wherein a plurality of circumferential sealing materials are formed at positions corresponding one-to-one with the top surface of the bank of the base. The sealing material is made of metal or low-melting glass, and the piezoelectric vibration element is mounted on the concave portion on a one-to-one basis, and then the concave portion is formed by heating and melting the sealing material using the lid assembly. Since the piezoelectric vibration device is characterized by being obtained by dividing and cutting after performing collective hermetic sealing, it becomes possible to select different kinds of sealing materials according to required specifications, and the degree of freedom of design will be increased. .

  Furthermore, in the above configuration, when the inner peripheral edge of the sealing material formed on the lid is formed to extend to a position inside the inner wall surface of the bank portion, Since the melting point glass forms a fillet on the inner side of the base, the bonding strength between the lid and the base is improved.

  According to a third aspect of the present invention, at least a piezoelectric member is provided in each recess of a base assembly in which a plurality of bases each including a recess and an annular bank portion surrounding the recess are integrally formed in a matrix. A lid assembly in which a mounting step for mounting a vibration element and a lid that hermetically seals the recesses are integrally formed in a matrix, and at least a joint surface side of the lid assembly with the base assembly A plurality of circumferential sealing materials are formed at positions corresponding one-to-one with the top surfaces of the plurality of bases, and the inner peripheral edge of the sealing material is substantially the same as the inner wall surface of the bank. Sealing in which the recesses are collectively hermetically sealed in a heated atmosphere using a lid assembly formed at a position on the same plane or extending to a position inside the inner wall surface of the bank portion. Process and collective hermetically sealed lid assembly A method of manufacturing a piezoelectric vibration device having a cutting step of dividing and cutting the base aggregate to obtain a plurality of piezoelectric vibration devices. It becomes possible to reliably hermetically seal a plurality of the sealing members of the lid body one-on-one on the top surface of the bank portion. Thereby, an efficient piezoelectric vibration device can be manufactured.

  As described above, it is possible to provide a lid assembly capable of performing stable hermetic sealing at low cost, and a method for manufacturing a piezoelectric vibration device using the lid assembly.

Hereinafter, an embodiment according to the present invention will be described using a surface-mounted crystal resonator as an example.
-First embodiment-
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of a base assembly and a lid assembly showing a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the base assembly and the lid assembly showing a first embodiment of the present invention. FIG. In FIG. 1 and FIG. 2, the description of the wiring conductor formed inside the base assembly is omitted.

  FIG. 1 is a perspective view of a base assembly and a lid assembly showing a first embodiment of the present invention, in which a base assembly 1 is arranged on the upper side and a lid assembly 2 is arranged on the lower side. Yes. The reason for this arrangement is to make the formation region of the sealing material (S21) on the lid assembly easier to understand.

  The base assembly 1 has a rectangular base in plan view including a concave portion 6 for housing the piezoelectric vibration element and an annular bank portion 7 surrounding the concave portion 6, and the base is formed in a matrix. A plurality of them are arranged and formed integrally. The base assembly 1 is integrally formed by laminating two layers of ceramic green sheets mainly composed of alumina. In addition, four external connection terminals 8 made of metal are formed on the bottom surface side (lower surface side) of each base. The one unit base region corresponds to a minimum region defined by dicing lines (described later) D formed vertically and horizontally on the surface where the external connection terminal 8 is exposed and the top surface of the bank portion. . In the base assembly 1, the number of laminated ceramic green sheets is not limited to two, but may be a three-layer structure.

  And as shown in FIG. 2, the upper surface of the bank part 7 of each said base is in the flat state, and the 1st sealing material S11 which consists of a metal multilayer film is formed in the periphery. Here, the first sealing material S11 is composed of three layers, and is laminated in the order of tungsten, nickel, and gold from the bottom. Tungsten is integrally formed during ceramic firing by metallization technology, and the nickel and gold layers are formed by plating technology. Note that molybdenum may be used instead of tungsten.

  The first sealing material S11 is formed over the entire upper surface of the bank portion 7 between adjacent bases. A wiring pattern (not shown) for electrically connecting adjacent bases is formed between the stacked base assemblies 1.

  A pair of mounting pads 4 are formed on one end side of the inner bottom portion of the recess 6. The mounting pads 4 are subjected to nickel baking after printing and baking tungsten, and further subjected to gold plating treatment thereon. . The mounting pad 4 is electrically connected to the external connection terminal 8 via a wiring conductor (not shown) formed inside the base. In addition, you may perform the electrical connection of the said mounting pad 4 and the said external connection terminal 8 by forming a castellation in the four corners of the outer periphery upper and lower parts of a base.

  In the following description of the embodiments of the present invention, the surface on which the concave portion 6 shown in FIG. 2 is formed is the “surface” of the base assembly 1 and the side on which the concave portion 6 is not formed. The surface (the surface from which the external connection terminal is exposed) is defined as “back surface” for convenience. That is, in FIG. 1, the “back surface” of the base assembly 1 is facing upward.

  In FIG. 2, dicing planned lines D are formed vertically and horizontally on the front and back surfaces of the base assembly 1 on the boundary line between adjacent bases, and the dicing planned lines D are divided into areas of one base. Yes. The dicing scheduled line D plays a role as a positioning line when dividing into a plurality of crystal resonators by dicing in a later process. The dicing planned line D may be formed by providing shallow kerfs, for example, by means of dicing or the like. However, even if the kerfs are not formed, the base assembly 1 can be devised (marks). Etc.).

  The lid assembly 2 used in the present embodiment has a flat plate shape having a base of Kovar in which a plurality of rectangular lids in plan view as shown in FIG. 1 are integrally formed in a matrix. ing. A nickel plating layer is formed on the upper layer of the kovar, and a gold flash plating layer is formed on the entire upper layer. Here, the thickness of each layer is 1.0 to 4.0 μm for the nickel layer and about 0.01 μm for the gold flash layer. The gold flash plating layer is preferably formed with a thickness of 0.03 μm or less.

  Further, the gold flash plating layer (on the sealing joint surface side of each lid body of the lid body assembly 2 shown in FIG. 1, that is, on the joint surface side of the lid body assembly 2 with the base assembly 1 ( A second sealing material S21 made of a metal brazing material is formed in a circumferential shape on an upper layer (not shown). In the present embodiment, a gold-tin alloy (Au—Sn alloy) is used as the second sealing material. Here, the Au—Sn alloy is formed on the entire quartz resonator, that is, on the gold flash plating layer formed on one lid body and on the upper surface of one base bank portion 7 in the melted state. Including the gold constituting the first sealing material S11, the sealing joint surface of the lid body has a ratio of Au: Sn = 80: 20 or a ratio slightly lower than that of Au. The composition of the Au—Sn alloy to be formed is adjusted in advance.

  The second sealing material S21 is formed on the joint surface side of the lid assembly 2 with the base assembly 1 at a position corresponding to the first sealing material S11 on a one-to-one basis. The second sealing material S21 is also formed between adjacent lids. That is, only the part corresponding to the plurality of recesses 6 is in a state where the sealing material S21 is not formed. Note that, in one base region, the inner peripheral edge of the second sealing material S21 is at a position that substantially coincides with the virtual line L that extends in the vertical direction from the ridge portion of the inner wall of the bank portion 7 to the lid body assembly 2. Is formed.

  As described above, in the case of a lid body assembly in which a sealing material is formed between adjacent lid bodies, the sealing material is connected and integrally formed, so that an improvement in sealing strength can be expected. .

  In addition, on the front and back surfaces of the lid assembly 2, a dicing planned line D is formed vertically and horizontally on a boundary line with an adjacent lid, and the dicing scheduled line D is divided into one lid region. ing. The dicing schedule line D also serves as a positioning line when cutting and cutting into a plurality of crystal resonators by dicing in a later process.

  Next, a method for manufacturing a crystal resonator using the lid assembly 2 will be described with reference to FIG. First, since it is necessary to confirm various characteristics of each crystal resonator element 3 during the manufacturing process of the crystal resonator, before the crystal resonator element 3 is mounted in the concave portion 6, The wiring pattern (not shown) formed in (1) is cut to make each base electrically independent (wiring cutting step). In the present embodiment, the wiring cutting step is performed by irradiating a laser from the back side of the base assembly 1, but may be performed by dicing other than the laser.

  Next, on the pair of mounting pads 4 in each recess of the base assembly 1 using the base assembly 1 in which the adjacent bases are electrically isolated by the wiring cutting step. Then, the flat plate-shaped crystal resonator element 3 having a metal film of a predetermined shape formed on the front and back surfaces is bonded one-to-one via the conductive bonding material 5 (mounting process). In this embodiment, an AT-cut quartz plate is used for the quartz resonator element 3, and a silicone-based conductive resin bonding material is used for the conductive bonding material 5. The crystal resonator element 3 is not limited to an AT cut crystal plate, but can be applied to a crystal plate having a cutting angle other than AT cut. It is also possible to use a conductive resin bonding material such as a system.

  After mounting the crystal resonator elements 3 in the recesses 6 of all the bases, the conductive bonding material 5 is collectively heated and cured in an atmosphere controlled to a predetermined temperature profile, so that the crystal resonator elements 3 and the mounting pads 4 And join. In this embodiment, a conductive bonding material is used as a bonding means between the crystal resonator element and the base, but the present invention is not limited to this. For example, an FCB (Flip Chip Bonding) method using metal bumps is used. Thus, the crystal resonator element and the base may be joined.

  After the crystal resonator elements 3 are bonded to all the concave portions 6 via the conductive bonding material 5, the oscillation frequency of each crystal resonator element 3 is finely adjusted. Then, the lid assembly 2 is placed in a recess formed in a jig called a sealing jig with the surface on which the second sealing material S21 is formed facing upward.

  On the lid assembly 2 placed with the second sealing material S21 facing upward, the base assembly 1 faces the first sealing material S11 downward, that is, the base assembly 1 Place with the back side facing up. At this time, the base assembly 1 is placed on the lid assembly 2 such that the outer edge of the base assembly 1 and the outer edge of the lid assembly 2 substantially coincide. And the said sealing material is fuse | melted by atmosphere heating using a heating furnace, and all the bases of the base aggregate 2 are collectively airtightly sealed (sealing process).

  Even if the base assembly 1 is placed on the lid assembly 2 as described above, the first sealing material S11 formed on each base and the region of each lid of the lid assembly 2 Since the formed second sealing material S21 has a one-to-one opposing positional relationship, the first and second sealing materials can be brought into contact with each other with certainty.

  In this embodiment, since the base assembly 1 is formed by firing a ceramic material, the base size may be slightly different for each production lot due to manufacturing variations. However, the lid assembly of the present invention is designed so that the width dimension of the second sealing material S21 takes into account the difference in shrinkage rate for each production lot when the base assembly is fired. The width dimension of the second sealing material forming region can be made substantially the same.

  Further, the width dimension of the second sealing material S21 is designed in consideration of the shrinkage rate of the base in advance, so that the lid on each base as in the case of the lid in the individual state. There is no need to position the body and temporarily fix the lid, and an efficient piezoelectric vibration device can be produced.

  Furthermore, the lid assembly 2 has a one-to-one correspondence with the first sealing material S11 formed on each base of the base assembly 1 on the joint surface side with the base assembly 1. However, since the second sealing material S21 is formed, the use of the metal sealing material is used as compared with the lid assembly in which the sealing material is formed over the entire surface of one side of the lid assembly 2. The amount can be reduced. Further, it is not necessary to position the lid with respect to the base, and the same lid assembly can be used without depending on the production lot, leading to a reduction in production cost.

  According to the embodiment of the present invention, when the sealing material is formed over the entire surface of one side of the lid assembly 2, the absolute amount of the sealing material formed on the lid assembly 2. Since the amount of volatile gas generated when the sealing material is heated and melted can be suppressed to the minimum, the characteristic of the piezoelectric vibration device can be stabilized.

  When the collective hermetic sealing is completed, a combined body (sheet substrate) of the lid assembly 2 and the base assembly 1 in which a plurality of crystal resonators are connected is formed in the lid assembly. Along the dicing schedule line D, cutting is performed with a dicing blade in a direction from the upper side of the lid assembly 2 toward the back surface of the base assembly 1 (cutting step). The cutting is performed by running a dicing blade from two orthogonal directions of the sheet substrate. By cutting in this way, a large number of crystal resonators can be obtained simultaneously. The cutting may be performed in a direction from the lower side of the base assembly 1 toward the lid assembly 2.

-Second Embodiment-
A second embodiment of the present invention will be described with reference to FIGS. FIG. 3 is a perspective view of a base assembly and a lid assembly showing a second embodiment of the present invention, and FIG. 4 is a cross section of the base assembly and the lid assembly showing a second embodiment of the present invention. FIG. In FIG. 3 to FIG. 4, description of the wiring conductor formed inside the base is omitted. In addition, about the structure similar to the above-mentioned embodiment, while attaching | subjecting the same number and omitting a part of description, it has an effect similar to the above-mentioned embodiment.

  In FIG. 3, the base assembly 1 is obtained by laminating and firing two layers of ceramic green sheets mainly made of alumina, as in the first embodiment. Further, as shown in FIG. 4, a circumferential first sealing material S12 is formed on the upper surface of the bank portion 7 of each base with the same film configuration as that of the first embodiment. Here, the first sealing material S12 is not formed on the planned dicing line D on the upper surface of the bank portion 7, and is in a state of being spaced apart from the adjacent base at regular intervals with the dicing planned line interposed therebetween. ing. In other words, the adjacent base is not electrically connected to the upper surface of the bank portion. Other base internal conductors such as wiring patterns are the same as those in the first embodiment, and the description thereof is omitted.

  On the other hand, as shown in FIG. 3, the second sealing material 22 has a one-to-one correspondence with the first sealing material S <b> 12 on the joint surface side with the base assembly 1. A plurality of each is formed in an independent state. In one base region, the inner peripheral edge of the second sealing material S22 is located at a position substantially coincident with a virtual line L extending in the vertical direction from the ridge portion of the inner wall of the bank portion 7 to the lid body assembly 2. Is formed. On the other hand, the outer peripheral edge of the second sealing material S22 is located on substantially the same plane as the outer peripheral edge of the first sealing material S12.

  With such a configuration, even if the base assembly 1 is placed on the lid assembly 2, the first sealing material S <b> 12 formed on each base and each lid of the lid assembly 2 Since the second sealing material S22 formed in the body region is in a one-to-one facing positional relationship, the first and second sealing materials are in contact with each other, and a stable atmosphere is obtained. Sealing can be performed.

  Further, in the individual cutting step, the metal film (first and second sealing materials) is not formed on the dicing planned line D between the adjacent lids and between the adjacent bases. Therefore, it is possible to perform the individual cutting by dicing more smoothly.

  Further, according to the above configuration, the sealing material formed on each lid is formed only at a position corresponding to the upper surface of the bank portion of each base on a one-to-one basis, and the first sealing material S12 is adjacent to the base. Since it is not formed on the planned dicing line D, the amount of the sealing material used can be reduced.

-Third embodiment-
A third embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a cross-sectional view of a base assembly and a lid assembly showing a third embodiment of the present invention. FIG. 6 is an enlarged view of a portion A in FIG. In addition, about the structure similar to the above-mentioned embodiment, while attaching | subjecting the same number and omitting a part of description, it has an effect similar to the above-mentioned embodiment.

  In the embodiment of the present invention, as shown in FIG. 5, the base assembly 1 has the same configuration as that of the second embodiment, and the description thereof is omitted.

  In the embodiment of the present invention, as shown in FIG. 6, the lid assembly 2 is configured such that, in one base region, the inner peripheral edge of the second sealing material S <b> 23 starts from the ridge portion of the inner wall of the bank portion 7. It is located on the inner side (recess direction) from the virtual line L extending in the vertical direction to 2. On the other hand, the outer peripheral edge of the second sealing material S23 is located on substantially the same plane as the outer peripheral edge of the first sealing material S12. That is, the width dimension W2 of the second sealing material S23 is formed to be larger than the width dimension W1 of the first sealing material S12.

  With the above configuration, the formation region of the first sealing material S12 of each base is accommodated (included) in the formation region of the second sealing material S23 of each lid. Therefore, even when the variation in the base size for each production lot is expanded due to the shrinkage during firing of the base assembly 1, the above configuration can suppress the positional deviation between the base and the lid. Thereby, it becomes possible to perform the hermetic sealing of the piezoelectric vibration device more reliably and stably.

  Further, since the inner peripheral edge of the second sealing material S23 is formed so as to be located on the inner side of the inner peripheral edge of the first sealing material S12, A fillet of a sealing material (metal brazing material) formed from the upper surface to the lid side is also formed in the recess inner direction. Therefore, since the joining area | region by a sealing material expands, the joining strength of a cover body and a base can be improved.

-Fourth Embodiment-
A fourth embodiment of the present invention will be described with reference to FIG. FIG. 7 is a part of a cross-sectional view of a base assembly and a lid assembly showing a fourth embodiment of the present invention. In addition, about the structure similar to the above-mentioned embodiment, while attaching | subjecting the same number and omitting a part of description, it has an effect similar to the above-mentioned embodiment.

  In the embodiment of the present invention, the base assembly 1 shown in FIG. 7 has the same configuration as the second embodiment, and the first sealing material S12 formed in the base assembly 1 is shown in FIG. In this way, the adjacent bases are formed in a state of being spaced apart at a fixed interval across a dicing scheduled line. On the other hand, a second sealing material S24 is formed in the lid assembly 2 between adjacent lids. That is, the second sealing material S24 formed on one lid is integrally formed with the second sealing material S24 formed on the adjacent lid.

  The inner peripheral edge of the second sealing material S24 is located on the inner side (the recess direction) from the virtual line L extending in the vertical direction from the ridge portion of the inner wall of the bank portion 7 to the lid body assembly 2, The second sealing material S24 is also formed between adjacent lids.

  In the present embodiment, a gold-tin alloy is used as the material of the second sealing material S24, but the gold-tin alloy melted by atmospheric heating is the first sealing material S24. A region that does not come into contact with the sealing material S12 (B portion and C portion in FIG. 7) is drawn to the first sealing material S12 to form a fillet. Thereby, the lid assembly 2 and the base assembly 1 are securely airtightly joined. Therefore, as described above, even if the formation position of the first sealing material S12 is separated from the adjacent base by a predetermined distance across the dicing scheduled line, the presence of the B part and the C part Since the joining region can be secured, the joining strength between the lid and the base can be improved.

  With such a configuration, the amount of the sealing material S12 formed on the base assembly 1 can be reduced, and the manufacturing cost can be reduced.

  In the embodiment of the present invention, a gold-tin alloy (Au—Sn alloy) is used as the sealing material. However, the present invention is not limited to this. For example, a tin-silver alloy (Sn—Ag alloy) is used. ) Or gold-germanium (Au—Ge alloy) may be used. Alternatively, it is also possible to use low melting point glass in addition to the metal brazing material. For example, bismuth oxide glass, vanadium oxide glass, silver phosphate glass, tin phosphate glass, or the like can be used as borosilicate glass or lead-free glass.

  Further, in the embodiment of the present invention, an example is given in which a sealing material is formed on both the lid assembly and the base assembly. However, the present invention is not limited to this embodiment. Only the sealing material may be formed. For example, the form which uses glass as a sealing material may be sufficient as the single side | surface (joint surface side with a base aggregate) of a lid | cover aggregate.

  In the embodiment of the present invention, a surface-mounted crystal resonator is taken as an example, but a lid assembly of a piezoelectric vibration device such as a crystal oscillator on which an electronic component such as an IC is mounted, and a piezoelectric body using the lid assembly. It is applicable also to the manufacturing method of a vibration device.

  The present invention can be implemented in various other forms without departing from the spirit or main features thereof. Therefore, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

  It can be applied to mass production of piezoelectric vibration devices.

The perspective view of the base assembly and lid assembly which show the 1st Embodiment of this invention. FIG. 3 is a cross-sectional view of the base assembly and the lid assembly showing the first embodiment of the present invention. The perspective view of the base aggregate | assembly and lid | cover aggregate | assembly which shows the 2nd Embodiment of this invention. Sectional drawing of the base aggregate | assembly and lid | cover aggregate | assembly which show the 2nd Embodiment of this invention. Sectional drawing of the base aggregate | assembly and lid | cover aggregate | assembly which show the 3rd Embodiment of this invention. The A section enlarged view of FIG. Sectional drawing of the base aggregate and cover aggregate which show the 4th Embodiment of this invention. Sectional drawing which shows an example of the conventional crystal oscillator. Sectional drawing which shows an example of the conventional crystal oscillator.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base assembly 2 Lid assembly 3 Crystal vibrating element 4 Mounting pad 5 Conductive joining material 6 Recessed part 7 Bank part 8 External connection terminal S11, S12 1st sealing material S21, S22, S23, S24 2nd sealing Stop material D Dicing schedule line

Claims (3)

A plurality of lids are integrally formed in a matrix shape, which collectively and hermetically seals a base assembly in which a plurality of bases each including a recess and an annular bank portion surrounding the recess are integrally formed in a matrix shape. A lid assembly,
At least on the joint surface side of the lid assembly with the base assembly, a plurality of circumferential sealing materials are formed at positions corresponding one-to-one with the top surfaces of the plurality of bases, and The lid body is characterized in that the inner peripheral edge of the sealing material is formed at a position substantially on the same plane as the inner wall surface of the bank portion, or is formed so as to protrude to a position inside the inner wall surface of the bank portion. Aggregation. A base assembly in which a plurality of bases each including a recess and an annular bank portion surrounding the recess are integrally formed in a matrix, a piezoelectric vibration element mounted on the recess, and the base bank portion A piezoelectric vibration device obtained from the lid assembly according to claim 1, wherein a plurality of circumferential sealing materials are formed at positions corresponding one-to-one with the upper surface,
The sealing material is made of metal or low-melting glass, and the piezoelectric vibration element is mounted on the concave portion on a one-to-one basis, and then the concave portion is collectively packed by heating and melting the sealing material using the lid assembly. A piezoelectric vibration device obtained by dividing and cutting after hermetically sealing. A mounting step of mounting at least a piezoelectric vibration element in each recess of a base assembly in which a base including a recess and an annular bank portion surrounding the recess is integrally formed in a matrix shape,
A lid assembly in which a lid for hermetically sealing the concave portion is integrally formed in a matrix, wherein at least a plurality of the base ridges are provided on a side of the joint surface of the lid assembly with the base assembly. A plurality of circumferential sealing materials are formed at positions corresponding one-to-one with the top surface of the part, and the inner peripheral edge of the sealing material is formed at a position substantially flush with the inner wall surface of the bank portion, or A sealing step of hermetically sealing the recesses in a heated atmosphere using a lid assembly formed to project to a position inside the inner wall surface of the bank portion,
A method of manufacturing a piezoelectric vibrating device, comprising: a step of dividing and cutting the lid assembly and the base assembly that are collectively hermetically sealed to obtain a plurality of piezoelectric vibrating devices.

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