JP2005152885A - Slit nozzle - Google Patents

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JP2005152885A
JP2005152885A JP2004299661A JP2004299661A JP2005152885A JP 2005152885 A JP2005152885 A JP 2005152885A JP 2004299661 A JP2004299661 A JP 2004299661A JP 2004299661 A JP2004299661 A JP 2004299661A JP 2005152885 A JP2005152885 A JP 2005152885A
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Prior art keywords
slit nozzle
slit
side plate
nozzle
manifold
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Kazuto Obuchi
一人 大淵
Yoshiaki Sho
芳明 升
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Tokyo Ohka Kogyo Co Ltd
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Tokyo Ohka Kogyo Co Ltd
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Priority to JP2004299661A priority Critical patent/JP2005152885A/en
Priority to TW093132630A priority patent/TW200529929A/en
Priority to CNB2004100951959A priority patent/CN100500302C/en
Priority to KR1020040086053A priority patent/KR101146029B1/en
Publication of JP2005152885A publication Critical patent/JP2005152885A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Abstract

<P>PROBLEM TO BE SOLVED: To provide a slit nozzle which makes it less liable to easily drop the flow rate of a coating liquid at both ends. <P>SOLUTION: The slit nozzle 1 is composed of right and left halves 2 and 3. The mating face of the half 2 is made flat and a manifold 4 extending in the longitudinal direction is formed in the center of the other half 3. The section 5 superior to the manifold 4 is used as the mating face with the half 2. The section 6 inferior to the manifold 4 is recessed by grinding the inferior section 6 more than the superior section 5, so that a gap is formed between the half 3 and the mating face of the half 2. The gap is made to have the same size as the width W of an outlet 7 of the slit nozzle. Furthermore, both the ends of the slit nozzle 1 are sealed liquid-tight with side plates 8 and 9. The side plates 8 and 9 are made of a water-repellent material like a resin, or the reverse faces of the side plates 8 and 9 with which the halves 2 and 3 are mated are coated with the water-repellent material. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、ガラス基板や半導体ウェーハなどの被処理物の表面に所定幅で、例えばホトレジスト液やカラーフィルタとなる塗布液を塗布するスリットノズルに関する。   The present invention relates to a slit nozzle that coats a surface of an object to be processed such as a glass substrate or a semiconductor wafer with a predetermined width, for example, a photoresist solution or a coating solution that becomes a color filter.

図４は従来のスリットノズルの要部を示す図であり、従来にあっては左右の半体１１，１２の合わせ面にシム１３を噛ませてボルトで接合している。この場合、スリット状吐出口１４の幅寸法Ｗはシム１３の厚みに依存する。しかしながら、シム１３を正確に加工するには限度があり、吐出口１４の幅寸法を正確に設定することが困難であった。   FIG. 4 is a diagram showing the main part of a conventional slit nozzle. In the prior art, shims 13 are engaged with the mating surfaces of the left and right halves 11 and 12 and joined with bolts. In this case, the width dimension W of the slit-like discharge port 14 depends on the thickness of the shim 13. However, there is a limit to processing the shim 13 accurately, and it is difficult to set the width dimension of the discharge port 14 accurately.

そこで、シムを用いないスリットノズルが考えられるが、シムは側面からの液漏れを防止していたため、この液漏れを防止するため側板をノズルの両側端に取り付ける必要がある。このような構造が特許文献１〜６に開示されている。   Therefore, a slit nozzle that does not use a shim is conceivable. However, since the shim prevents liquid leakage from the side surface, it is necessary to attach side plates to both ends of the nozzle in order to prevent this liquid leakage. Such a structure is disclosed in Patent Documents 1-6.

特許文献１〜３に示されるスリットノズルにあっては、ノズル本体の側面に直接側板を取り付けている。また、特許文献４，５に示されるスリットノズルにあっては、側板とノズル本体の側面との間にシール板またはパッキンを介在せしめている。   In the slit nozzles disclosed in Patent Documents 1 to 3, a side plate is directly attached to the side surface of the nozzle body. Moreover, in the slit nozzle shown by patent document 4, 5, the sealing plate or packing is interposed between the side plate and the side surface of the nozzle body.

また、特許文献６にはノズル本体のマニホールドが開口する側面にポケット栓を嵌め込み、その外側に側板を取り付け、更にノズルの開口幅はフッ素樹脂製のスペーサ（シム）で調整することが開示されている。
特許第３１０５１６１号公報 特開２０００−３３３１２号公報 特開２０００−７０８１７号公報 特開２００２−８６０４５号公報 特許第２９８１８７３号公報 特開２００２−３６１１５０号公報 Patent Document 6 discloses that a pocket stopper is fitted on the side surface of the nozzle body where the manifold is opened, a side plate is attached to the outside, and the nozzle opening width is adjusted with a fluororesin spacer (shim). Yes.
Japanese Patent No. 3105161 JP 2000-33312 A JP 2000-70817 A JP 2002-86045 A Japanese Patent No. 2981873 JP 2002-361150 A

先行技術１〜５に開示されたスリットノズルにあっては、側板または側板の内側に設けたシール板（パッキン）に接する部分で塗布液の流速が低下するため、スリット状吐出口から吐出される塗布液量がノズルの長さ方向に沿って均一にならず両端部で不足しやすくなる。   In the slit nozzles disclosed in the prior arts 1 to 5, since the flow rate of the coating liquid is reduced at a portion in contact with the side plate or a seal plate (packing) provided inside the side plate, the liquid is discharged from the slit-like discharge port. The amount of the coating liquid is not uniform along the length direction of the nozzle, and it tends to be insufficient at both ends.

また先行技術６にあっては、スペーサを撥水性のフッ素樹脂製としているので、このスペーサと接触する部分での塗布液の流速の低下は抑えられるが、これよりも上流側のマニホールドの端部とスリットの端部を別々の部材で塞じているので、ノズルの長さ方向を変更するときには、それぞれの部材を調節しなければならず
手間がかかっていた。 In the prior art 6, since the spacer is made of a water-repellent fluororesin, a decrease in the flow rate of the coating liquid at the portion in contact with the spacer can be suppressed, but the end of the manifold on the upstream side from this Since the ends of the slit and the end of the slit are closed by separate members, it is necessary to adjust each member when changing the length direction of the nozzle.

また、側板の厚みによって基板に吐出された塗布液の吐出分布が異なるという現象が生じていた。   Moreover, the phenomenon that the discharge distribution of the coating liquid discharged onto the substrate differs depending on the thickness of the side plate has occurred.

上記課題を解決すべく本発明に係るスリットノズルは、左右の半体を接合してなり、左右の半体のうちの少なくとも一方の半体の合わせ面にはスリット状吐出口の幅寸法を決定する凹部が形成され、またスリットノズルの両端には前記凹部によって形成される側面開口を閉じる側板が取り付けられ、且つこの側板を撥水性の材料とするか側板の少なくとも前記側面開口に臨む部分を撥水性の材料にて被覆した構成とした。   In order to solve the above problems, the slit nozzle according to the present invention is formed by joining the left and right halves, and the width dimension of the slit-like discharge port is determined on the mating surface of at least one of the left and right halves. A side plate that closes the side opening formed by the recess is attached to both ends of the slit nozzle, and the side plate is made of a water-repellent material, or at least a portion of the side plate that faces the side opening is repelled. It was set as the structure coat | covered with the aqueous material.

スリット状吐出口を閉塞する側板の吐出側近傍における側板の厚みを吐出分布に差がでない程度まで加工する。   The thickness of the side plate in the vicinity of the discharge side of the side plate closing the slit-shaped discharge port is processed to such an extent that there is no difference in the discharge distribution.

本発明によれば、スリット状吐出流路の両端部を撥水性とすることで、流路の両端部での塗布液の流速低下を抑えることができるので、均一な塗布及び均一な厚さの塗膜が得られる。   According to the present invention, by making the both ends of the slit-like discharge channel water-repellent, a decrease in the flow rate of the coating liquid at both ends of the channel can be suppressed. A coating film is obtained.

以下に本発明の実施の形態を添付図面に基づいて説明する。図１は本発明に係るスリットノズルを適用した塗布装置の側面図、図２は同スリットノズルの斜視図、図３は同スリットノズルの分解斜視図であり、スリットノズル１は水平動と昇降動が可能なフレーム２０に支持され、このフレーム２０の一端側上面には送液ポンプ２１を設け、この送液ポンプ２１に塗布液タンクから供給管２２を介して塗布液を供給し、スリットノズル１に送液ポンプ２１から供給管２３を介して塗布液を供給するようにしている。また、スリットノズル１の側面にはギャップセンサ２４が取り付けられている。   Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is a side view of a coating apparatus to which a slit nozzle according to the present invention is applied, FIG. 2 is a perspective view of the slit nozzle, FIG. 3 is an exploded perspective view of the slit nozzle, and the slit nozzle 1 is moved horizontally and vertically. A liquid feed pump 21 is provided on the upper surface of one end of the frame 20, and a coating liquid is supplied to the liquid feeding pump 21 from a coating liquid tank through a supply pipe 22. The coating liquid is supplied from the liquid feed pump 21 through the supply pipe 23. A gap sensor 24 is attached to the side surface of the slit nozzle 1.

スリットノズル１は左右の半体２，３からなり、一方の半体２の合わせ面はフラットにするとともに他方の半体３の中間位置には長さ方向に伸びるマニホールド４が形成され、このマニホールド４よりも上方部分５を半体２との接合面とし、マニホールド４よりも下方部分６を上方部分５よりも研削量を多くして後退させ、
半体２の合わせ面との間に隙間を形成し、この隙間をスリットノズル吐出口７の幅寸法Ｗとなるようにしている。 The slit nozzle 1 is composed of left and right halves 2 and 3, the mating surface of one half 2 is flat, and a manifold 4 extending in the length direction is formed at an intermediate position of the other half 3. 4 and the upper portion 5 as a joining surface with the half body 2, the lower portion 6 is made to recede with a larger grinding amount than the upper portion 5 than the manifold 4,
A gap is formed between the half body 2 and the mating surface, and the gap is set to the width dimension W of the slit nozzle discharge port 7.

また、左右の半体２，３を接合した状態で左右の側面にはマニホールド４と吐出口７の側端部が開口しているため、この開口を側板８，９にて液密に閉じている。   Further, since the side ends of the manifold 4 and the discharge port 7 are opened on the left and right side surfaces with the left and right halves 2 and 3 joined, the opening is closed liquid-tightly by the side plates 8 and 9. Yes.

本発明では側板８，９を樹脂などの撥水性の材料で構成するか、側板８，９の半体２，３と接合される裏側面に撥水コーティングを施している。この側板８，９はスリットノズル吐出口７近傍の厚みが、０.１〜１．０ｍｍ（好ましくは０．５ｍｍ以下、さらに好ましくは０．１〜０．３ｍｍ）になるように加工されている。   In the present invention, the side plates 8 and 9 are made of a water-repellent material such as a resin, or a water-repellent coating is applied to the back side surfaces of the side plates 8 and 9 joined to the halves 2 and 3. The side plates 8 and 9 are processed so that the thickness in the vicinity of the slit nozzle outlet 7 is 0.1 to 1.0 mm (preferably 0.5 mm or less, more preferably 0.1 to 0.3 mm). .

このように、スリットノズル吐出口７の側方への開口を撥水性の部材で塞ぐことで、両端部における塗布液の流速が大きく低下することがないので、均一な塗布が行える。具体的には、粘度５ｃｐのホトレジストを、温度２３℃、塗布量１０００μｌ／secで１.５μｍ厚の塗膜を形成した。この場合の両サイドの膜厚の落ち込みは、従来のスリットノズルを用いた場合には０．３μｍであったが、本発明に係るスリットノズルを用いた場合には０．１μｍまで改善された。   In this way, by closing the opening to the side of the slit nozzle discharge port 7 with a water-repellent member, the flow rate of the coating liquid at both ends is not greatly reduced, and uniform coating can be performed. Specifically, a 1.5 μm thick coating film was formed from a photoresist having a viscosity of 5 cp at a temperature of 23 ° C. and a coating amount of 1000 μl / sec. In this case, the film thickness drop on both sides was 0.3 μm when the conventional slit nozzle was used, but was improved to 0.1 μm when the slit nozzle according to the present invention was used.

側板８，９の厚みを０.１〜１．０ｍｍ（好ましくは０．５ｍｍ以下、さらに好ましくは０．１〜０．３ｍｍ）に加工したことによって、基板端部における吐出分布が良くなった。側板全体の厚みを０.１〜１．０ｍｍ（好ましくは０．５ｍｍ以下、さらに好ましくは０．１〜０．３ｍｍ）に加工することは強度を保てないが、吐出口近傍のみを０.１〜１．０ｍｍ（好ましくは０．５ｍｍ以下、さらに好ましくは０．１〜０．３ｍｍ）になるように加工することで、側板としても強度を保ちつつ、吐出分布も図７に示すように良好となる。   By processing the thickness of the side plates 8 and 9 to 0.1 to 1.0 mm (preferably 0.5 mm or less, more preferably 0.1 to 0.3 mm), the discharge distribution at the edge of the substrate was improved. Processing the entire side plate to a thickness of 0.1 to 1.0 mm (preferably 0.5 mm or less, more preferably 0.1 to 0.3 mm) cannot maintain the strength, but only the vicinity of the discharge port is set to 0.5. By processing to 1 to 1.0 mm (preferably 0.5 mm or less, more preferably 0.1 to 0.3 mm), as shown in FIG. It becomes good.

本発明に係るスリットノズルはガラス基板や半導体ウェーハの表面に所定幅でホトレジスト液、ＳＯＧ液或いはカラーフィルター用の塗布液を塗布する装置に適用できる。   The slit nozzle according to the present invention can be applied to an apparatus for applying a photoresist solution, an SOG solution, or a coating solution for a color filter with a predetermined width on the surface of a glass substrate or a semiconductor wafer.

第１発明に係るスリットノズルを適用した塗布装置の側面図The side view of the coating device which applied the slit nozzle which concerns on 1st invention 同スリットノズルの斜視図Perspective view of the slit nozzle 同スリットノズルの分解斜視図Exploded perspective view of the slit nozzle 従来のスリットノズルの要部拡大図Enlarged view of the main parts of a conventional slit nozzle 第２発明に係るスリットノズルの側面図Side view of slit nozzle according to the second invention 図５に示したスリットノズルの側板の要部拡大図Enlarged view of the main part of the side plate of the slit nozzle shown in FIG. 本発明に係る側板を用いたスリットノズルの吐出分布と、従来の側板を用いたスリットノズルの吐出分布を示す図The figure which shows the discharge distribution of the slit nozzle using the side plate which concerns on this invention, and the discharge distribution of the slit nozzle using the conventional side plate

Claims (2)

被処理物表面に所定幅で塗布液を塗布するスリットノズルにおいて、このスリットノズルは左右の半体を接合してなり、左右の半体のうちの少なくとも一方の半体の合わせ面にはスリット状吐出口の幅寸法を決定する凹部が形成され、またスリットノズルの両端には前記凹部によって形成される側面開口を閉じる側板が取り付けられ、且つこの側板を撥水性の材料とするか側板の少なくとも前記側面開口に臨む部分を撥水性の材料にて被覆したことを特徴とするスリットノズル。 In a slit nozzle for applying a coating liquid with a predetermined width to the surface of the workpiece, the slit nozzle is formed by joining the left and right halves, and a slit is formed on the mating surface of at least one of the left and right halves. A recess for determining the width dimension of the discharge port is formed, and a side plate for closing a side opening formed by the recess is attached to both ends of the slit nozzle, and the side plate is made of a water-repellent material or at least the side plate. A slit nozzle characterized in that the portion facing the side opening is covered with a water-repellent material. 被処理物表面に所定幅で塗布液を塗布するスリットノズルにおいて、このスリットノズルは左右の半体を接合してなり、左右の半体のうちの少なくとも一方の半体の合わせ面にはスリット状吐出口の幅寸法を決定する凹部が形成され、またスリットノズルの両端には前記凹部によって形成される側面開口を閉じる側板が取り付けられ、且つこの側板はスリット状吐出口の先端部分近傍において、その幅を０.１〜１．０ｍｍとしていることを特徴とするスリットノズル。
In a slit nozzle for applying a coating liquid with a predetermined width to the surface of the workpiece, the slit nozzle is formed by joining the left and right halves, and a slit is formed on the mating surface of at least one of the left and right halves. A recess that determines the width dimension of the discharge port is formed, and side plates that close the side openings formed by the recess are attached to both ends of the slit nozzle, and this side plate is located near the tip of the slit-like discharge port. A slit nozzle characterized by having a width of 0.1 to 1.0 mm.
JP2004299661A 2003-10-27 2004-10-14 Slit nozzle Pending JP2005152885A (en)

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JP2004299661A JP2005152885A (en) 2003-10-27 2004-10-14 Slit nozzle
TW093132630A TW200529929A (en) 2003-10-27 2004-10-27 Slit nozzle
CNB2004100951959A CN100500302C (en) 2003-10-27 2004-10-27 Slit nozzle
KR1020040086053A KR101146029B1 (en) 2003-10-27 2004-10-27 Slit nozzle

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CN100500302C (en) 2009-06-17

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