CN1611304A - Slit nozzle - Google Patents

Slit nozzle Download PDF

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Publication number
CN1611304A
CN1611304A CNA2004100951959A CN200410095195A CN1611304A CN 1611304 A CN1611304 A CN 1611304A CN A2004100951959 A CNA2004100951959 A CN A2004100951959A CN 200410095195 A CN200410095195 A CN 200410095195A CN 1611304 A CN1611304 A CN 1611304A
Authority
CN
China
Prior art keywords
side plate
gap nozzle
halfbody
nozzle
slit nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2004100951959A
Other languages
Chinese (zh)
Other versions
CN100500302C (en
Inventor
大渊一人
升芳明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ameco Technology Co ltd
Process Equipment Business Division Preparation Co ltd
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of CN1611304A publication Critical patent/CN1611304A/en
Application granted granted Critical
Publication of CN100500302C publication Critical patent/CN100500302C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05CAPPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0225Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Abstract

The invetion provided a slit nozzle which makes it less liable to easily drop the flow rate of a coating liquid at both ends. The slit nozzle 1 is composed of right and left halves 2 and 3. The mating face of the half 2 is made flat and a manifold 4 extending in the longitudinal direction is formed in the center of the other half 3. The section 5 superior to the manifold 4 is used as the mating face with the half 2. The section 6 inferior to the manifold 4 is recessed by grinding the inferior section 6 more than the superior section 5, so that a gap is formed between the half 3 and the mating face of the half 2. The gap is made to have the same size as the width W of an outlet 7 of the slit nozzle. Furthermore, both the ends of the slit nozzle 1 are sealed liquid-tight with side plates 8 and 9. The side plates 8 and 9 are made of a water-repellent material like a resin, or the reverse faces of the side plates 8 and 9 with which the halves 2 and 3 are mated are coated with the water-repellent material.

Description

Gap nozzle
Technical field
The present invention relates on object being treated surfaces such as glass substrate, semiconductor wafer with the Rack coating as photoresist liquid with become the gap nozzle of the coating fluid of colour filter.
Background technology
Fig. 4 is the view of pith of the existing gap nozzle of expression, in existing gap nozzle, make pad 13 between about the interface of halfbody 11,12 on and use bolted joints.In this case, the width dimensions W of slit-shaped ejiction opening 14 depends on the thickness of pad 13.But it is limited accurately processing pad 13, so be difficult to the correct width dimensions of setting ejiction opening 14.
Therefore, can consider gap nozzle, but pad is in order to prevent leakage from the side without pad, so, need the side plate that be used to prevent leakage be installed in the two side ends of nozzle.This structure is disclosed on the patent documentation 1~6.
In the gap nozzle shown in the patent documentation 1~3, side plate directly is installed in the nozzle body side.And in the gap nozzle shown in the patent documentation 4,5, between side plate and nozzle body side, be provided with diaphragm seal or liner.
And, such nozzle is disclosed in patent documentation 6, promptly on the concetrated pipe open side of nozzle body, embed small-sized bolt, in its outside side plate is installed, and then the partition (pad) that the A/F of nozzle is made with fluororesin is adjusted.
The open P-3105161 of [patent documentation 1] Japan Patent
[patent documentation 2] Japanese Patent Application Publication JP-2000-33312
[patent documentation 3] Japanese Patent Application Publication JP-2000-70817
[patent documentation 4] Japanese Patent Application Publication JP-2002-86045
The open JP-2981873 of [patent documentation 1] Japan Patent
[patent documentation 1] Japanese Patent Application Publication JP-2002-361150
In prior art 1~5 described gap nozzle, reduced the flow velocity of coating fluid because of the part that is connected with the diaphragm seal (liner) of being located at side plate or side plate inboard, therefore, length direction from the coating liquid measure of slit-shaped ejiction opening ejection along nozzle becomes inhomogeneous, and it is not enough that the spouting liquid at both ends becomes easily.
And, in prior art 6, because pad is by the hydrophobic fluorine resin manufacture, thereby reduce at the coating fluid flow velocity at the part place that contacts with this pad and to be inhibited, but the concetrated pipe end of its upstream side is stopped up with different parts with slit end, therefore when the nozzle length direction changes, must regulate parts separately, this is very bothersome.
And, occurred with side plate thickness different and to the ejection of the coating fluid of the substrate ejection also different phenomenon that distributes.
Summary of the invention
The gap nozzle of the present invention that solves above-mentioned problem is engaged by left and right sides halfbody and forms and have such structure, promptly form the recess of decision slit-shaped ejiction opening width dimensions on the interface of at least one halfbody in the halfbody of the left and right sides, and on the two ends of gap nozzle, side plate is installed, the lateral opening that this side plate sealing is formed by above-mentioned recess, and this side plate is hydrophobic material or the above-mentioned at least lateral opening part that covers close lid side plate with hydrophobic material.
The thickness of the side plate near the side plate ejection side of inaccessible slit-shaped ejiction opening is machined into such degree, and promptly ejection distributes does not have difference.
According to the present invention, it is hydrophobic that the both ends of slit-shaped ejection stream are made into, and the coating fluid flow velocity that can suppress the stream both ends thus reduces, thereby can obtain even be coated with and thickness is filmed uniformly.
Description of drawings
Fig. 1 represents to use the apparatus for coating side view of relevant the 1st explanation gap nozzle;
Fig. 2 represents the stereogram of this gap nozzle;
Fig. 3 represents the exploded perspective view of this gap nozzle;
Fig. 4 represents existing gap nozzle pith enlarged drawing;
Fig. 5 represents the side view of relevant the 2nd invention gap nozzle;
The side plate pith enlarged drawing of gap nozzle shown in Fig. 6 presentation graphs 5;
Fig. 7 represents to spray distribution map with the gap nozzle ejection distribution of side plate of the present invention with the gap nozzle that has side plate now.
The specific embodiment
According to accompanying drawing embodiments of the invention are described below.Fig. 1 is the side view that adopts according to the apparatus for coating of gap nozzle of the present invention, Fig. 2 is the stereogram of this gap nozzle, Fig. 3 is the exploded perspective view of this gap nozzle, gap nozzle 1 is supported by the framework 20 of energy horizontal movement and elevating movement, be provided with liquid-feeding pump 21 on an end of framework 20, coating fluid is sent to this liquid-feeding pump and is fed to gap nozzle 1 from liquid-feeding pump 21 by supply pipe 23 through supply pipe 22 from the coating liquid bath.In addition, slit sensor 24 is installed on the side of gap nozzle 1.
Gap nozzle 1 is made of left and right sides halfbody 2,3, the interface of a halfbody 2 is set at the plane, simultaneously, on the centre position of another halfbody 3, be formed with the concetrated pipe 4 that extends along its length, part 5 above concetrated pipe 4 forms the composition surface that engages with halfbody 2, part 6 below concetrated pipe 4 is ground more and retreats than upper section 5, and and the interface of halfbody 2 between form the gap, this gap becomes the width dimensions W of the ejiction opening 7 of gap nozzle.
In addition, under the state that engages left and right sides halfbody 2,3, on the left and right side, the side end of concetrated pipe 4 and ejiction opening 7 has opening, so, with the described opening of side plate 8,9 liquid-tight ground sealing.
In the present invention, constitute side plate 8,9 by hydrophobic materials such as resins, perhaps with medial surface that the same halfbody 2,3 of side plate 8,9 engages on apply hydrophobic layer.Side plate the 8, the 9th, processing like this, promptly near the thickness the ejiction opening 7 of gap nozzle is that 0.1~1.0mm (is preferably below the 0.5mm more preferably 0.1~0.3mm).
Like this, owing to use the opening of hydrophobicity parts obstruction towards ejiction opening 7 sides of gap nozzle, thus can significantly not reduce the coating fluid flow velocity at both ends, so can evenly be coated with.Specifically, viscosity is that the photoresist of 5cp forms thick the filming of 1.5 μ m according to coating weight 1000 μ l/sec under 23 ℃ of temperature.At this moment the reducing of both sides thickness is improved to the degree of 0.1 μ m at least adopting under the situation of gap nozzle of the present invention, and is 0.3 μ m when adopting existing gap nozzle.
By the thickness of drafting board 8,9 is processed into 0.1~1.0mm (be preferably below the 0.5mm, more preferably 0.1~0.3mm), the ejection in the substrate end distributes and improves.Though being processed to 0.1~1.0mm, whole side plate thickness (is preferably below the 0.5mm, more preferably 0.1~0.3mm) can not proof strength, but only process and make it to become 0.1~1.0mm near the ejiction opening and (be preferably below the 0.5mm, more preferably 0.1~0.3mm), thus one, in as side plate also proof strength, ejection distributes and has also improved as illustrated in fig. 7.
Gap nozzle of the present invention can be used to width in accordance with regulations to surperficial painting photoresist, sog solution or the colour filter of glass substrate and the semiconductor wafer device with coating fluid.

Claims (2)

  1. One kind in accordance with regulations width on the surface of object being treated, be coated with the gap nozzle of coating fluid, it is characterized in that, this gap nozzle is engaged by left and right sides halfbody and forms, form the recess of the width dimensions of decision slit-shaped ejiction opening on the interface of at least one halfbody in the halfbody of the described left and right sides, and on the two ends of lid gap nozzle, side plate is installed, the lateral opening that described side plate sealing is formed by above-mentioned recess, and this side plate is hydrophobic material, and perhaps this side plate covers with hydrophobic material near the part of above-mentioned lateral opening at least.
  2. One kind in accordance with regulations width on the surface of object being treated, be coated with the gap nozzle of coating fluid, it is characterized in that, this gap nozzle is engaged by left and right sides halfbody and forms, form the recess of the width dimensions of decision slit-shaped ejiction opening on the interface of at least one lid halfbody in the halfbody of the described left and right sides, and on the two ends of this gap nozzle, side plate is installed, the lateral opening that described side plate sealing is formed by above-mentioned recess, and this side plate nearby has the width of 0.1~1.0mm in the top ends of this slit-shaped ejiction opening.
CNB2004100951959A 2003-10-27 2004-10-27 Slit nozzle Active CN100500302C (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2003365611 2003-10-27
JP365611/2003 2003-10-27
JP365611/03 2003-10-27
JP2004299661A JP2005152885A (en) 2003-10-27 2004-10-14 Slit nozzle
JP299661/04 2004-10-14
JP299661/2004 2004-10-14

Publications (2)

Publication Number Publication Date
CN1611304A true CN1611304A (en) 2005-05-04
CN100500302C CN100500302C (en) 2009-06-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100951959A Active CN100500302C (en) 2003-10-27 2004-10-27 Slit nozzle

Country Status (4)

Country Link
JP (1) JP2005152885A (en)
KR (1) KR101146029B1 (en)
CN (1) CN100500302C (en)
TW (1) TW200529929A (en)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100464873C (en) * 2005-10-27 2009-03-04 东京应化工业株式会社 Slit nozzle
CN101767302A (en) * 2008-12-26 2010-07-07 诺信公司 Method of grinding slot nozzles
CN101229537B (en) * 2007-01-25 2010-11-17 中外炉工业株式会社 Slot mode and gasket
CN103331232A (en) * 2013-05-30 2013-10-02 深圳市华星光电技术有限公司 Coating nozzle, coating apparatus with coating nozzle, and coating method thereof
CN103736606A (en) * 2013-12-23 2014-04-23 清华大学深圳研究生院 Integrated outgoing flow channel structure process nozzle
CN103801485A (en) * 2014-02-12 2014-05-21 韶关欧亚特电子制品有限公司 Novel nozzle of hot melt glue gun
CN103801466A (en) * 2012-11-15 2014-05-21 沈阳芯源微电子设备有限公司 Wet processing technology nozzle with low impact force and uniformly distributed flow
US9375743B2 (en) 2013-05-30 2016-06-28 Shenzhen China Star Optoelectronics Technology Co., Ltd. Spray nozzle, spraying device having the spray nozzle and method for spraying
CN106460304A (en) * 2015-02-17 2017-02-22 皇家飞利浦有限公司 A spray nozzle
CN108187970A (en) * 2018-01-23 2018-06-22 佛山市雅路斯工业设备有限公司 A kind of valvular coating head of band
CN110252594A (en) * 2019-06-17 2019-09-20 深圳市曼恩斯特科技有限公司 Coating machine and its coating method
CN110561630A (en) * 2018-06-06 2019-12-13 株式会社迪思科 Method for manufacturing slit nozzle and slit nozzle
CN110586412A (en) * 2018-06-13 2019-12-20 株式会社泰珂洛 Coating tool
CN111158222A (en) * 2018-11-08 2020-05-15 三星电子株式会社 Chemical supply structure and developing apparatus having the same
CN111819008A (en) * 2018-12-18 2020-10-23 株式会社饭沼Gauge制作所 Slit coater
CN112237777A (en) * 2019-07-19 2021-01-19 流机工程株式会社 Filter device and method for treating liquid to be treated
CN115667883A (en) * 2020-05-29 2023-01-31 株式会社岛津制作所 Atomic absorption spectrophotometer

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KR101304418B1 (en) * 2006-02-03 2013-09-05 삼성디스플레이 주식회사 Slit coater for manufacturing display device and manufacturing method of display device using the same
JP4785609B2 (en) * 2006-05-08 2011-10-05 日東電工株式会社 Die system coating apparatus and coating method
JP4749224B2 (en) * 2006-05-08 2011-08-17 日東電工株式会社 DIE, DIE TYPE COATING APPARATUS AND COATING METHOD
CN104635437A (en) * 2013-11-07 2015-05-20 沈阳芯源微电子设备有限公司 Curtain-like developing nozzle
JP2016067974A (en) * 2014-09-26 2016-05-09 株式会社Screenホールディングス Coating applicator and coating method

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JPH0523572A (en) * 1991-07-19 1993-02-02 Tdk Corp Two-liquid container, two-liquid mixing method and its device
JPH0679213A (en) * 1992-09-04 1994-03-22 Tosoh Corp Nozzle for dispenser
JPH10277467A (en) 1997-04-08 1998-10-20 Yasui Seiki:Kk Coating device
JPH11197576A (en) * 1998-01-08 1999-07-27 Konica Corp Coater and coating method
JP2002248399A (en) * 2001-02-27 2002-09-03 Toray Ind Inc Method and apparatus for manufacturing coating member
JP2002361150A (en) * 2001-06-08 2002-12-17 Fuji Photo Film Co Ltd Spacer of coating apparatus, coating apparatus and production method of spacer

Cited By (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100464873C (en) * 2005-10-27 2009-03-04 东京应化工业株式会社 Slit nozzle
CN101229537B (en) * 2007-01-25 2010-11-17 中外炉工业株式会社 Slot mode and gasket
CN101767302A (en) * 2008-12-26 2010-07-07 诺信公司 Method of grinding slot nozzles
CN101767302B (en) * 2008-12-26 2013-11-27 诺信公司 Method of grinding slot nozzles
CN103801466A (en) * 2012-11-15 2014-05-21 沈阳芯源微电子设备有限公司 Wet processing technology nozzle with low impact force and uniformly distributed flow
CN103801466B (en) * 2012-11-15 2015-11-18 沈阳芯源微电子设备有限公司 The wet processing process nozzle of the uniform flow of a kind of low impulsive force
US9375743B2 (en) 2013-05-30 2016-06-28 Shenzhen China Star Optoelectronics Technology Co., Ltd. Spray nozzle, spraying device having the spray nozzle and method for spraying
CN103331232A (en) * 2013-05-30 2013-10-02 深圳市华星光电技术有限公司 Coating nozzle, coating apparatus with coating nozzle, and coating method thereof
WO2014190578A1 (en) * 2013-05-30 2014-12-04 深圳市华星光电技术有限公司 Coating nozzle, coating device having same, and coating method thereof
CN103331232B (en) * 2013-05-30 2016-02-03 深圳市华星光电技术有限公司 Coating shower nozzle, the apparatus for coating with this coating shower nozzle and coating process thereof
CN103736606A (en) * 2013-12-23 2014-04-23 清华大学深圳研究生院 Integrated outgoing flow channel structure process nozzle
CN103736606B (en) * 2013-12-23 2016-04-06 清华大学深圳研究生院 Integrated form outgoing runner structural manufacturing process nozzle
CN103801485A (en) * 2014-02-12 2014-05-21 韶关欧亚特电子制品有限公司 Novel nozzle of hot melt glue gun
CN106460304A (en) * 2015-02-17 2017-02-22 皇家飞利浦有限公司 A spray nozzle
CN108187970A (en) * 2018-01-23 2018-06-22 佛山市雅路斯工业设备有限公司 A kind of valvular coating head of band
CN110561630A (en) * 2018-06-06 2019-12-13 株式会社迪思科 Method for manufacturing slit nozzle and slit nozzle
CN110586412A (en) * 2018-06-13 2019-12-20 株式会社泰珂洛 Coating tool
CN110586412B (en) * 2018-06-13 2021-07-06 株式会社泰珂洛 Coating tool
CN111158222A (en) * 2018-11-08 2020-05-15 三星电子株式会社 Chemical supply structure and developing apparatus having the same
CN111819008A (en) * 2018-12-18 2020-10-23 株式会社饭沼Gauge制作所 Slit coater
CN110252594A (en) * 2019-06-17 2019-09-20 深圳市曼恩斯特科技有限公司 Coating machine and its coating method
CN110252594B (en) * 2019-06-17 2021-05-18 深圳市曼恩斯特科技股份有限公司 Coating machine and coating method thereof
CN112237777A (en) * 2019-07-19 2021-01-19 流机工程株式会社 Filter device and method for treating liquid to be treated
CN115667883A (en) * 2020-05-29 2023-01-31 株式会社岛津制作所 Atomic absorption spectrophotometer

Also Published As

Publication number Publication date
JP2005152885A (en) 2005-06-16
KR101146029B1 (en) 2012-05-14
TW200529929A (en) 2005-09-16
CN100500302C (en) 2009-06-17
KR20050040110A (en) 2005-05-03

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SE01 Entry into force of request for substantive examination
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Effective date of registration: 20230607

Address after: Ibaraki

Patentee after: Ameco Technology Co.,Ltd.

Address before: Kanagawa, Japan

Patentee before: Process Equipment Business Division Preparation Co.,Ltd.

Effective date of registration: 20230607

Address after: Kanagawa, Japan

Patentee after: Process Equipment Business Division Preparation Co.,Ltd.

Address before: Kawasaki, Japan

Patentee before: TOKYO OHKA KOGYO CO.,LTD.

TR01 Transfer of patent right