KR20050040110A - Slit nozzle - Google Patents
Slit nozzle Download PDFInfo
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- KR20050040110A KR20050040110A KR1020040086053A KR20040086053A KR20050040110A KR 20050040110 A KR20050040110 A KR 20050040110A KR 1020040086053 A KR1020040086053 A KR 1020040086053A KR 20040086053 A KR20040086053 A KR 20040086053A KR 20050040110 A KR20050040110 A KR 20050040110A
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- Prior art keywords
- slit nozzle
- slit
- side plates
- half bodies
- nozzle
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
Abstract
양 끝부분에 있어서의 도포액의 유량이 저하되기 어려운 슬릿 노즐을 제공한다. The slit nozzle which the flow volume of the coating liquid in both ends does not fall easily is provided.
슬릿 노즐(1)은 좌우의 반체(半體)(2,3)으로 되고, 한쪽 반체(2)의 접합면은 평평하게 하는 동시에, 다른 쪽 반체(3)의 중간 위치에는 길이방향으로 펴지는 매니폴드(manifold)(4)가 형성되며, 이 매니폴드(4) 보다도 위쪽부분(5)를 반체(2)와의 접합면으로 하여, 매니폴드(4) 보다도 아래쪽부분(6)을 위쪽부분(5) 보다도 연삭량(硏削量)을 많게 하여 후퇴시키고, 반체(2)의 접합면 사이에 간극(間隙)을 형성하여, 이 간극을 슬릿 노즐 토출구(吐出口)(7)의 폭치수(W)가 되도록 하고, 더욱이 슬릿 노즐(1)의 양쪽 끝을 측판(側板)(8,9)로 액밀(液密)하게 닫고 있다. 측판(8,9)는 수지 등의 발수성(撥水性) 재료로 구성되거나, 측판(8,9)의 반체(2,3)과 접합되는 이(裏)측면에 발수 코팅을 행하고 있다. The slit nozzle 1 becomes the left and right half bodies 2 and 3, and the joining surface of one half body 2 is flattened, and it extends longitudinally in the intermediate position of the other half body 3, The manifold 4 is formed, and the upper part 5 is made into the joining surface with the half body 2 from this manifold 4, and the lower part 6 from the manifold 4 is upper part ( 5) the amount of grinding is increased to retreat, and a gap is formed between the joining surfaces of the half bodies 2, and the gap is defined by the width dimension of the slit nozzle outlet 7 W), and both ends of the slit nozzle 1 are closed in a liquid tight manner with side plates 8 and 9. The side plates 8 and 9 are made of a water-repellent material such as resin, or the water-repellent coating is performed on the tooth side surfaces joined to the half bodies 2 and 3 of the side plates 8 and 9.
Description
본 발명은 유리기판이나 반도체 웨이퍼(wafer) 등의 피처리물의 표면에 소정 폭으로, 예를 들면 포토레지스트액이나 컬러 필터가 되는 도포액을 도포하는 슬릿 노즐에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a slit nozzle for applying a coating liquid, for example, a photoresist liquid or a color filter, to a surface of a workpiece such as a glass substrate, a semiconductor wafer, or the like with a predetermined width.
도 4는 종래의 슬릿 노즐의 요부를 나타내는 도면으로, 종래에 있어서는 좌우의 반체(11,12)의 접합면에 쐐기(shim)(13)을 물려서 볼트로 접합하고 있다. 이 경우, 슬릿형상 토출구(14)의 폭치수(W)는 쐐기(13)의 두께에 의존한다. 그러나, 쐐기(13)을 정확하게 가공하는데는 한도가 있어, 토출구(14)의 폭치수를 정확하게 설정하는 것이 곤란했었다.Fig. 4 is a view showing the main portion of a conventional slit nozzle. In the related art, a shim 13 is bitten to a joining surface of the left and right half bodies 11 and 12 to be joined by bolts. In this case, the width dimension W of the slit-shaped discharge port 14 depends on the thickness of the wedge 13. However, there is a limit to the precise processing of the wedge 13, and it was difficult to accurately set the width dimension of the discharge port 14.
따라서, 쐐기를 사용하지 않는 슬릿 노즐을 생각할 수 있지만, 쐐기는 측면으로부터 액이 새는 것을 방지하고 있었기 때문에, 이 액이 새는 것을 방지하기 위해 측판을 노즐의 양쪽 끝에 부착할 필요가 있다. 이러한 구조가 특허문헌 1~6에 개시되어 있다.Therefore, a slit nozzle which does not use a wedge can be considered, but since the wedge has prevented leakage of liquid from the side surface, it is necessary to attach side plates at both ends of the nozzle to prevent the leakage of liquid. Such a structure is disclosed by patent documents 1-6.
특허문헌 1~3에 나타내어지는 슬릿 노즐에 있어서는, 노즐 본체의 측면에 직접 측판을 부착하고 있다. 또한, 특허문헌 4, 5에 나타내어지는 슬릿 노즐에 있어서는 측판과 노즐 본체의 측면 사이에 실링판 또는 패킹을 개재(介在)시키고 있다.In the slit nozzle shown in patent documents 1-3, the side plate is affixed directly to the side surface of a nozzle main body. Moreover, in the slit nozzle shown by patent document 4, 5, the sealing plate or packing is interposed between the side plate and the side surface of a nozzle main body.
또한, 특허문헌 6에는 노즐 본체의 매니폴드가 개구(開口)하는 측면에 포켓뚜껑을 끼워 넣고, 그 바깥쪽에 측판을 부착하고, 더욱이 노즐의 개구폭은 플루오르 수지제 스페이서(쐐기)로 조정하는 것이 개시되어 있다.In addition, in Patent Document 6, a pocket lid is inserted into a side surface of the manifold of the nozzle main body, a side plate is attached to the outside thereof, and the opening width of the nozzle is adjusted with a fluororesin spacer (wedge). Is disclosed.
[특허문헌 1] 일본국 특허 제3105161호 공보[Patent Document 1] Japanese Patent No. 3105161
[특허문헌 2] 일본국 특허공개 제2000-33312호 공보[Patent Document 2] Japanese Patent Application Laid-Open No. 2000-33312
[특허문헌 3] 일본국 특허공개 제2000-70817호 공보[Patent Document 3] Japanese Patent Application Laid-Open No. 2000-70817
[특허문헌 4] 일본국 특허공개 제2002-86045호 공보[Patent Document 4] Japanese Patent Application Laid-Open No. 2002-86045
[특허문헌 5] 일본국 특허 제2981873호 공보[Patent Document 5] Japanese Patent No. 2981873
[특허문헌 6] 일본국 특허공개 제2002-361150호 공보[Patent Document 6] Japanese Patent Application Laid-Open No. 2002-361150
선행기술 1~5에 개시된 슬릿 노즐에 있어서는, 측판 또는 측판의 안쪽에 설치된 실링판(패킹)에 접하는 부분에서 도포액의 유속이 저하되기 때문에, 슬릿형상 토출구로부터 토출되는 도포액량이 노즐의 길이방향을 따라 균일해지지 않아 양 끝부분에서 부족하기 쉬워진다. In the slit nozzles disclosed in the prior arts 1 to 5, the flow rate of the coating liquid decreases at the part contacting the side plate or the sealing plate (packing) provided inside the side plate, so that the amount of the coating liquid discharged from the slit-shaped discharge port is in the longitudinal direction of the nozzle. As it is not uniform along, it is easy to lack at both ends.
또한, 선행기술 6에 있어서는 스페이서를 발수성 플루오르 수지제로 하고 있기 때문에, 이 스페이서와 접촉하는 부분에서의 도포액 유속의 저하는 억제되지만, 이것 보다도 상류측 매니폴드의 끝부분과 슬릿의 끝부분을 각각의 부재로 막고 있기 때문에, 노즐의 길이방향을 변경할 때는 각각의 부재를 조절해야만 하기 때문에 시간이 소요되고 있었다.In addition, in the prior art 6, since the spacer is made of a water-repellent fluororesin, a decrease in the flow rate of the coating liquid at the portion in contact with the spacer is suppressed, but rather, the end of the upstream manifold and the end of the slit are respectively Since it is prevented by the member of the member, when changing the length direction of a nozzle, since each member must be adjusted, it took time.
또한, 측판의 두께에 따라 기판으로 토출된 도포액의 토출분포가 상이하다고 하는 현상이 발생하였다. Moreover, the phenomenon that the discharge distribution of the coating liquid discharged | emitted to the board | substrate differs in accordance with the thickness of a side plate.
상기 과제를 해결하기 위해 본 발명의 슬릿 노즐은 좌우의 반체를 접합하여 되고, 좌우의 반체 중 적어도 한쪽 반체의 접합면에는 슬릿형상 토출구의 폭치수를 결정하는 오목부가 형성되며, 또 슬릿 노즐의 양끝에는 상기 오목부에 의해 형성되는 측면 개구를 닫는 측판이 부착되고, 또한 이 측판을 발수성 재료로 하거나 측판의 적어도 상기 측면 개구에 면하는 부분을 발수성 재료로 피복한 구성으로 하였다.In order to solve the above problems, the slit nozzle of the present invention joins the left and right half bodies, and a concave portion for determining the width dimension of the slit-shaped discharge port is formed on the joining surface of at least one half body of the left and right half bodies, and both ends of the slit nozzle The side plate which closes the side opening formed by the said recessed part was attached, and this side plate was made into the water-repellent material, or it was set as the structure which coat | covered the part which faces at least the said side opening of the side plate with the water-repellent material.
슬릿형상 토출구를 폐색(閉塞)하는 측판의 토출측 근방에 있어서의 측판의 두께를 토출분포에 차가 생기지 않을 정도까지 가공한다. The thickness of the side plate in the vicinity of the discharge side of the side plate which blocks the slit-shaped discharge port is processed to such an extent that a difference does not occur in the discharge distribution.
본 발명에 의하면, 슬릿형상 토출유로의 양 끝부분을 발수성으로 함으로써, 유로의 양 끝부분에서의 도포액의 유속 저하를 억제할 수 있기 때문에, 균일한 도포 및 균일한 두께의 도막이 얻어진다.According to the present invention, since the lower end of the flow rate of the coating liquid at both ends of the flow path can be suppressed by making both ends of the slit discharge flow path water repellent, a uniform coating and a coating film of uniform thickness are obtained.
이하에, 본 발명의 실시형태를 첨부하는 도면을 토대로 설명한다. 도 1은 본 발명의 슬릿 노즐을 적용한 도포장치의 측면도이고, 도 2는 동일 슬릿 노즐의 사시도이며, 도 3은 동일 슬릿 노즐의 분해사시도이고, 슬릿 노즐(1)은 수평동(水平動)과 승강동(昇降動)이 가능한 프레임(20)에 지지되며, 이 프레임(20)의 한쪽끝 윗면에는 송액 펌프(21)을 설치하여, 이 송액 펌프(21)에 도포액 탱크로부터 공급관(22)를 매개로 하여 도포액을 공급하고, 슬릿 노즐(1)에 송액 펌프(21)로부터 공급관(23)을 매개로 하여 도포액을 공급하도록 하고 있다. 또한, 슬릿 노즐(1)의 측면에는 갭 센서(24)가 부착되어 있다.EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described based on drawing attached. 1 is a side view of a coating apparatus to which the slit nozzle of the present invention is applied, FIG. 2 is a perspective view of the same slit nozzle, FIG. 3 is an exploded perspective view of the same slit nozzle, and the slit nozzle 1 has a horizontal motion and a rise. It is supported by the frame 20 which can be moved, and the liquid feed pump 21 is provided in the upper surface of one end of this frame 20, and the supply pipe 22 is connected to the liquid feed pump 21 from the coating liquid tank. The coating liquid is supplied through the medium, and the coating liquid is supplied to the slit nozzle 1 from the liquid feed pump 21 via the supply pipe 23. In addition, a gap sensor 24 is attached to the side surface of the slit nozzle 1.
슬릿 노즐(1)은 좌우의 반체(2,3)으로 되고, 한쪽 반체(2)의 접합면은 평평하게 하는 동시에, 다른 쪽 반체(3)의 중간 위치에는 길이 방향으로 펴지는 매니폴드(4)가 형성되며, 이 매니폴드(4) 보다도 위쪽부분(5)를 반체(2)와의 접합면으로 하여, 매니폴드(4) 보다도 아래쪽부분(6)을 위쪽부분(5) 보다도 연삭량을 많게 하여 후퇴시키고, 반체(2)의 접합면 사이에 간극을 형성하여, 이 간극을 슬릿 노즐 토출구(7)의 폭치수(W)가 되도록 하고 있다.The slit nozzle 1 becomes the left and right half bodies 2 and 3, the joint surface of one half body 2 is flat, and the manifold 4 which spreads in the longitudinal direction in the intermediate position of the other half body 3 is carried out. ) Is formed, and the upper portion 5 of the manifold 4 is made into the joining surface with the half body 2, and the lower portion 6 of the manifold 4 is larger than the upper portion 5. By retreating, the gap is formed between the joining surfaces of the half bodies 2 so that the gap is the width dimension W of the slit nozzle discharge port 7.
또한, 좌우의 반체(2,3)을 접합한 상태에서 좌우의 측면에는 매니폴드(4)와 토출구(7)의 측단부(側端部)가 개구하고 있기 때문에, 이 개구를 측판(8,9)로 액밀하게 닫고 있다. In addition, since the side ends of the manifold 4 and the discharge port 7 are opened in the left and right sides in the state in which the left and right half bodies 2 and 3 are joined, the openings are formed in the side plates 8,. 9) Closed tightly.
본 발명에서는 측판(8,9)를 수지 등의 발수성 재료로 구성하거나, 측판(8,9)의 반체(2,3)과 접합되는 이측면에 발수 코팅을 행하고 있다. 이 측판(8,9)는 슬릿 노즐 토출구(7) 근방의 두께가 0.1~1.0 mm(바람직하게는 0.5 mm 이하, 더욱 바람직하게는 0.1~0.3 mm)가 되도록 가공되어 있다.In the present invention, the side plates 8 and 9 are made of a water-repellent material such as resin, or water repellent coating is performed on the back sides joined to the half bodies 2 and 3 of the side plates 8 and 9. The side plates 8 and 9 are processed so that the thickness in the vicinity of the slit nozzle discharge port 7 becomes 0.1 to 1.0 mm (preferably 0.5 mm or less, more preferably 0.1 to 0.3 mm).
이와 같이, 슬릿 노즐 토출구(7)의 측방(側方)으로의 개구를 발수성 부재로 막음으로써, 양 끝부분에 있어서의 도포액의 유속이 크게 저하되는 경우가 없기 때문에, 균일한 도포를 행할 수 있다. 구체적으로는, 점도 5 cp의 포토레지스트를 온도 23℃, 도포량 1000 ㎕/sec로 두께 1.5 ㎛의 도막을 형성하였다. 이 경우의 양측 막두께의 붕괴(collapse)는, 종래의 슬릿 노즐을 사용한 경우에는 0.3 ㎛였지만, 본 발명의 슬릿 노즐을 사용한 경우에는 0.1 ㎛까지 개선되었다.Thus, by closing the opening to the side of the slit nozzle discharge port 7 with a water repellent member, the flow velocity of the coating liquid at both ends does not fall significantly, and uniform application | coating can be performed. have. Specifically, a photoresist having a viscosity of 5 cp was formed at a temperature of 23 ° C. and a coating amount of 1000 μl / sec to form a coating film having a thickness of 1.5 μm. The collapse of both film thicknesses in this case was 0.3 µm when the conventional slit nozzle was used, but improved to 0.1 µm when the slit nozzle of the present invention was used.
측판(8,9)의 두께를 0.1~1.0 mm(바람직하게는 0.5 mm 이하, 더욱 바람직하게는 0.1~0.3 mm 이하)로 가공함으로써, 기판 끝부분에 있어서의 토출분포가 좋아졌다. 측판 전체의 두께를 0.1~1.0 mm(바람직하게는 0.5 mm 이하, 더욱 바람직하게는 0.1~0.3 mm)로 가공하는 것은 강도를 유지할 수 없지만, 토출구 근방만을 0.1~1.0 mm(바람직하게는 0.5 mm 이하, 더욱 바람직하게는 0.1~0.3 mm)가 되도록 가공함으로써, 측판으로서도 강도를 유지하면서 토출분포도 도 7에 나타내는 바와 같이 양호해진다.By distributing the thickness of the side plates 8 and 9 to 0.1 to 1.0 mm (preferably 0.5 mm or less, more preferably 0.1 to 0.3 mm or less), the discharge distribution at the end of the substrate was improved. Processing the thickness of the whole side plate to 0.1 to 1.0 mm (preferably 0.5 mm or less, more preferably 0.1 to 0.3 mm) cannot maintain the strength, but only the vicinity of the discharge port is 0.1 to 1.0 mm (preferably 0.5 mm or less). More preferably, it is 0.1 to 0.3 mm), and discharge distribution is also favorable, as shown in FIG. 7, maintaining strength also as a side plate.
본 발명의 슬릿 노즐은 유리기판이나 반도체 웨이퍼의 표면에 소정 폭으로 포토레지스트액, SOG액 또는 컬러 필터용 도포액을 도포하는 장치에 적용할 수 있다.The slit nozzle of this invention can be applied to the apparatus which apply | coats a photoresist liquid, SOG liquid, or the coating liquid for color filters with the predetermined width on the surface of a glass substrate or a semiconductor wafer.
도 1은 제1 발명의 슬릿 노즐을 적용한 도포장치의 측면도이다.1 is a side view of a coating apparatus to which the slit nozzle of the first invention is applied.
도 2는 동일 슬릿 노즐의 사시도이다.2 is a perspective view of the same slit nozzle.
도 3은 동일 슬릿 노즐의 분해사시도이다.3 is an exploded perspective view of the same slit nozzle.
도 4는 종래의 슬릿 노즐의 요부(要部) 확대도이다.It is an enlarged view of the principal part of the conventional slit nozzle.
도 5는 제2 발명의 슬릿 노즐의 측면도이다.5 is a side view of the slit nozzle of the second invention.
도 6은 도 5에 나타낸 슬릿 노즐의 측판의 요부 확대도이다.6 is an enlarged view illustrating main parts of the side plate of the slit nozzle shown in FIG. 5.
도 7은 본 발명의 측판을 사용한 슬릿 노즐의 토출분포와, 종래의 측판을 사용한 슬릿 노즐의 토출분포를 나타내는 도면이다.7 is a view showing the discharge distribution of the slit nozzle using the side plate of the present invention and the discharge distribution of the slit nozzle using the conventional side plate.
Claims (2)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003365611 | 2003-10-27 | ||
| JPJP-P-2003-00365611 | 2003-10-27 | ||
| JPJP-P-2004-00299661 | 2004-10-14 | ||
| JP2004299661A JP2005152885A (en) | 2003-10-27 | 2004-10-14 | Slit nozzle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20050040110A true KR20050040110A (en) | 2005-05-03 |
| KR101146029B1 KR101146029B1 (en) | 2012-05-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020040086053A KR101146029B1 (en) | 2003-10-27 | 2004-10-27 | Slit nozzle |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2005152885A (en) |
| KR (1) | KR101146029B1 (en) |
| CN (1) | CN100500302C (en) |
| TW (1) | TW200529929A (en) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4804873B2 (en) * | 2005-10-27 | 2011-11-02 | 東京応化工業株式会社 | Slit nozzle |
| KR101304418B1 (en) * | 2006-02-03 | 2013-09-05 | 삼성디스플레이 주식회사 | Slit coater for manufacturing display device and manufacturing method of display device using the same |
| JP4785609B2 (en) * | 2006-05-08 | 2011-10-05 | 日東電工株式会社 | Die system coating apparatus and coating method |
| JP4749224B2 (en) * | 2006-05-08 | 2011-08-17 | 日東電工株式会社 | DIE, DIE TYPE COATING APPARATUS AND COATING METHOD |
| JP2008178818A (en) * | 2007-01-25 | 2008-08-07 | Chugai Ro Co Ltd | Slit die and shim |
| JP5558706B2 (en) * | 2008-12-26 | 2014-07-23 | ノードソン コーポレーション | Slot nozzle polishing method |
| CN103801466B (en) * | 2012-11-15 | 2015-11-18 | 沈阳芯源微电子设备有限公司 | The wet processing process nozzle of the uniform flow of a kind of low impulsive force |
| CN103331232B (en) * | 2013-05-30 | 2016-02-03 | 深圳市华星光电技术有限公司 | Coating shower nozzle, the apparatus for coating with this coating shower nozzle and coating process thereof |
| US9375743B2 (en) | 2013-05-30 | 2016-06-28 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Spray nozzle, spraying device having the spray nozzle and method for spraying |
| CN104635437A (en) * | 2013-11-07 | 2015-05-20 | 沈阳芯源微电子设备有限公司 | Curtain-like developing nozzle |
| CN103736606B (en) * | 2013-12-23 | 2016-04-06 | 清华大学深圳研究生院 | Integrated form outgoing runner structural manufacturing process nozzle |
| CN103801485A (en) * | 2014-02-12 | 2014-05-21 | 韶关欧亚特电子制品有限公司 | Novel nozzle of hot melt glue gun |
| JP2016067974A (en) * | 2014-09-26 | 2016-05-09 | 株式会社Ｓｃｒｅｅｎホールディングス | Coating applicator and coating method |
| JP6259163B2 (en) * | 2015-02-17 | 2018-01-10 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | Steamers and clothing steamers |
| CN108187970A (en) * | 2018-01-23 | 2018-06-22 | 佛山市雅路斯工业设备有限公司 | A kind of valvular coating head of band |
| JP7150392B2 (en) * | 2018-06-06 | 2022-10-11 | 株式会社ディスコ | Slit nozzle manufacturing method and slit nozzle |
| JP6492255B1 (en) * | 2018-06-13 | 2019-04-03 | 株式会社タンガロイ | Application tool |
| KR102631793B1 (en) * | 2018-11-08 | 2024-02-01 | 삼성전자주식회사 | Chemical supply structure and a developing apparatus having the same |
| JP6904583B2 (en) * | 2018-12-18 | 2021-07-21 | 株式会社飯沼ゲージ製作所 | Slit coater |
| CN110252594B (en) * | 2019-06-17 | 2021-05-18 | 深圳市曼恩斯特科技股份有限公司 | Coating machine and coating method thereof |
| JP6851090B2 (en) * | 2019-07-19 | 2021-03-31 | 株式会社流機エンジニアリング | Filtration device and treatment method of liquid to be treated |
| CN115667883A (en) * | 2020-05-29 | 2023-01-31 | 株式会社岛津制作所 | Atomic absorption spectrophotometer |
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| JPH0523572A (en) * | 1991-07-19 | 1993-02-02 | Tdk Corp | Two-liquid container, two-liquid mixing method and its device |
| JPH0679213A (en) * | 1992-09-04 | 1994-03-22 | Tosoh Corp | Nozzle for dispenser |
| JPH10277467A (en) | 1997-04-08 | 1998-10-20 | Yasui Seiki:Kk | Coating device |
| JPH11197576A (en) * | 1998-01-08 | 1999-07-27 | Konica Corp | Coater and coating method |
| JP2002248399A (en) * | 2001-02-27 | 2002-09-03 | Toray Ind Inc | Method and apparatus for manufacturing coating member |
| JP2002361150A (en) * | 2001-06-08 | 2002-12-17 | Fuji Photo Film Co Ltd | Spacer of coating apparatus, coating apparatus and production method of spacer |
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2004
- 2004-10-14 JP JP2004299661A patent/JP2005152885A/en active Pending
- 2004-10-27 CN CNB2004100951959A patent/CN100500302C/en active Active
- 2004-10-27 KR KR1020040086053A patent/KR101146029B1/en active IP Right Grant
- 2004-10-27 TW TW093132630A patent/TW200529929A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN1611304A (en) | 2005-05-04 |
| JP2005152885A (en) | 2005-06-16 |
| KR101146029B1 (en) | 2012-05-14 |
| TW200529929A (en) | 2005-09-16 |
| CN100500302C (en) | 2009-06-17 |
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