JP2005150685A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005150685A5 JP2005150685A5 JP2004211354A JP2004211354A JP2005150685A5 JP 2005150685 A5 JP2005150685 A5 JP 2005150685A5 JP 2004211354 A JP2004211354 A JP 2004211354A JP 2004211354 A JP2004211354 A JP 2004211354A JP 2005150685 A5 JP2005150685 A5 JP 2005150685A5
- Authority
- JP
- Japan
- Prior art keywords
- semi
- amorphous semiconductor
- semiconductor layer
- manufacturing
- impurity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004211354A JP4554292B2 (ja) | 2003-07-18 | 2004-07-20 | 薄膜トランジスタの作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003277144 | 2003-07-18 | ||
| JP2003361289 | 2003-10-21 | ||
| JP2004211354A JP4554292B2 (ja) | 2003-07-18 | 2004-07-20 | 薄膜トランジスタの作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005150685A JP2005150685A (ja) | 2005-06-09 |
| JP2005150685A5 true JP2005150685A5 (enExample) | 2007-06-14 |
| JP4554292B2 JP4554292B2 (ja) | 2010-09-29 |
Family
ID=34704840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004211354A Expired - Fee Related JP4554292B2 (ja) | 2003-07-18 | 2004-07-20 | 薄膜トランジスタの作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4554292B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8900970B2 (en) * | 2006-04-28 | 2014-12-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device using a flexible substrate |
| JP5117001B2 (ja) * | 2006-07-07 | 2013-01-09 | 株式会社ジャパンディスプレイイースト | 有機el表示装置 |
| US8330887B2 (en) * | 2007-07-27 | 2012-12-11 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device and electronic device |
| JP2009071289A (ja) * | 2007-08-17 | 2009-04-02 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその作製方法 |
| US8101444B2 (en) * | 2007-08-17 | 2012-01-24 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| KR101484297B1 (ko) * | 2007-08-31 | 2015-01-19 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시장치 및 표시장치의 제작방법 |
| US20090141004A1 (en) * | 2007-12-03 | 2009-06-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| JP5498711B2 (ja) * | 2008-03-01 | 2014-05-21 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタ |
| JP5518366B2 (ja) * | 2008-05-16 | 2014-06-11 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタ |
| JP5602389B2 (ja) * | 2008-05-16 | 2014-10-08 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタ |
| CN102509736B (zh) | 2008-10-24 | 2015-08-19 | 株式会社半导体能源研究所 | 半导体器件和用于制造该半导体器件的方法 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0682839B2 (ja) * | 1984-08-21 | 1994-10-19 | セイコー電子工業株式会社 | 表示用パネルの製造方法 |
| JP3238020B2 (ja) * | 1994-09-16 | 2001-12-10 | 株式会社東芝 | アクティブマトリクス表示装置の製造方法 |
| KR0171984B1 (ko) * | 1995-12-11 | 1999-03-30 | 김주용 | 박막 트랜지스터의 자기 정렬 노광 방법 |
| JP2915397B1 (ja) * | 1998-05-01 | 1999-07-05 | インターナショナル・ビジネス・マシーンズ・コーポレイション | バックチャネル効果を防止する薄膜トランジスタおよびその製造方法 |
| JP2000357797A (ja) * | 1999-06-15 | 2000-12-26 | Toshiba Corp | 薄膜トランジスタの製造方法 |
| JP3965562B2 (ja) * | 2002-04-22 | 2007-08-29 | セイコーエプソン株式会社 | デバイスの製造方法、デバイス、電気光学装置及び電子機器 |
-
2004
- 2004-07-20 JP JP2004211354A patent/JP4554292B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI397961B (zh) | 用以形成包含鰭型結構的電子裝置之製程 | |
| US7714318B2 (en) | Electronic device including a transistor structure having an active region adjacent to a stressor layer | |
| US9530843B2 (en) | FinFET having an epitaxially grown semiconductor on the fin in the channel region | |
| US8927405B2 (en) | Accurate control of distance between suspended semiconductor nanowires and substrate surface | |
| CN100452431C (zh) | 具有局部应力结构的金属氧化物半导体场效应晶体管 | |
| US8673725B2 (en) | Multilayer sidewall spacer for seam protection of a patterned structure | |
| CN103247679B (zh) | 石墨烯器件用的具有低等效氧化物厚度的双层栅极电介质 | |
| CN107665864A (zh) | 具有气隙间隔件的finfet及其形成方法 | |
| US8664102B2 (en) | Dual sidewall spacer for seam protection of a patterned structure | |
| KR101827329B1 (ko) | 박막 트랜지스의 제작 방법 | |
| CN110678986A (zh) | 垂直晶体管自对准触点工艺形成的嵌入式底部金属触点 | |
| US8610181B2 (en) | V-groove source/drain MOSFET and process for fabricating same | |
| JP2005150685A5 (enExample) | ||
| JP2005167212A5 (enExample) | ||
| KR101326134B1 (ko) | 박막 트랜지스터 표시판 및 그 제조 방법 | |
| US12224351B2 (en) | Semiconductor device and method of manufacturing the same | |
| US8486810B2 (en) | Method for fabricating a substrate provided with two active areas with different semiconductor materials | |
| US20240413223A1 (en) | Semiconductor structure with reduced leakage current and method for manufacturing the same | |
| US20250311261A1 (en) | Method for semiconductor processing | |
| CN120980938A (zh) | 具有反铁电间隔层的半导体元件及其制造方法 | |
| KR20120023572A (ko) | 반도체 장치 및 그 제작 방법 | |
| TW201513350A (zh) | 3維構造之mosfet及其製造方法 | |
| TW201513351A (zh) | 3維構造之mosfet及其製造方法 |