JP2005150527A - 保持装置、それを用いた露光装置およびデバイス製造方法 - Google Patents

保持装置、それを用いた露光装置およびデバイス製造方法 Download PDF

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Publication number
JP2005150527A
JP2005150527A JP2003388129A JP2003388129A JP2005150527A JP 2005150527 A JP2005150527 A JP 2005150527A JP 2003388129 A JP2003388129 A JP 2003388129A JP 2003388129 A JP2003388129 A JP 2003388129A JP 2005150527 A JP2005150527 A JP 2005150527A
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JP
Japan
Prior art keywords
exposure
reticle
electrostatic chuck
holding
electrostatic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003388129A
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English (en)
Japanese (ja)
Other versions
JP2005150527A5 (enExample
Inventor
Shin Matsui
紳 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2003388129A priority Critical patent/JP2005150527A/ja
Priority to US10/987,148 priority patent/US7187432B2/en
Publication of JP2005150527A publication Critical patent/JP2005150527A/ja
Priority to US11/555,711 priority patent/US7218383B2/en
Publication of JP2005150527A5 publication Critical patent/JP2005150527A5/ja
Withdrawn legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B27/00—Photographic printing apparatus
    • G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
    • G03B27/52—Details
    • G03B27/58—Baseboards, masking frames, or other holders for the sensitive material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lenses (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
JP2003388129A 2003-11-18 2003-11-18 保持装置、それを用いた露光装置およびデバイス製造方法 Withdrawn JP2005150527A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003388129A JP2005150527A (ja) 2003-11-18 2003-11-18 保持装置、それを用いた露光装置およびデバイス製造方法
US10/987,148 US7187432B2 (en) 2003-11-18 2004-11-15 Holding system, exposure apparatus, and device manufacturing method
US11/555,711 US7218383B2 (en) 2003-11-18 2006-11-02 Holding system, exposure apparatus, and device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003388129A JP2005150527A (ja) 2003-11-18 2003-11-18 保持装置、それを用いた露光装置およびデバイス製造方法

Publications (2)

Publication Number Publication Date
JP2005150527A true JP2005150527A (ja) 2005-06-09
JP2005150527A5 JP2005150527A5 (enExample) 2007-01-25

Family

ID=34649756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003388129A Withdrawn JP2005150527A (ja) 2003-11-18 2003-11-18 保持装置、それを用いた露光装置およびデバイス製造方法

Country Status (2)

Country Link
US (2) US7187432B2 (enExample)
JP (1) JP2005150527A (enExample)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008226887A (ja) * 2007-03-08 2008-09-25 Nikon Corp 保持装置、露光装置、及びデバイス製造方法
JP2008277541A (ja) * 2007-04-27 2008-11-13 Toshiba Corp 光反射型マスクと光反射型マスクの作製方法及び半導体装置の製造方法
JP2009016678A (ja) * 2007-07-06 2009-01-22 Yaskawa Electric Corp ステージ装置およびその浮上制御方法と、ステージ装置を用いた露光装置
JP2009016680A (ja) * 2007-07-06 2009-01-22 Yaskawa Electric Corp ステージ装置およびその浮上制御方法と、ステージ装置を用いた露光装置
JP2009016679A (ja) * 2007-07-06 2009-01-22 Yaskawa Electric Corp ステージ装置およびその浮上制御方法と、ステージ装置を用いた露光装置
JP2009164284A (ja) * 2007-12-28 2009-07-23 Nikon Corp パターン形成基板、露光方法およびデバイスの製造方法
JP2009194204A (ja) * 2008-02-15 2009-08-27 Nikon Corp 露光装置、露光システムおよびデバイス製造方法
US7591661B2 (en) 2005-10-06 2009-09-22 Ddk Ltd. Connector
JP2010123950A (ja) * 2008-11-21 2010-06-03 Asml Netherlands Bv リソグラフィ装置、ならびに基板非平坦性を補償する方法、パターニングデバイス非平坦性の影響を求める方法、およびパターニングデバイスへの熱負荷の影響を求める方法
JP2014036023A (ja) * 2012-08-07 2014-02-24 Nikon Corp 露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法
KR20140023927A (ko) * 2011-03-11 2014-02-27 에이에스엠엘 네델란즈 비.브이. 정전기 클램프 장치 및 리소그래피 장치
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
US8837108B2 (en) 2011-06-14 2014-09-16 Asahi Glass Company, Limited Glass substrate-holding tool and method for producing an EUV mask blank by employing the same
WO2015101121A1 (zh) * 2013-12-31 2015-07-09 上海微电子装备有限公司 掩模板面型整形装置及采用其的光刻机
US9134253B2 (en) 2013-08-27 2015-09-15 Kabushiki Kaisha Toshiba Inspecting apparatus and inspecting method
JP2017502321A (ja) * 2013-12-22 2017-01-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ チャックアセンブリを有する極端紫外線リソグラフィーシステム及びその製造方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005353988A (ja) * 2004-06-14 2005-12-22 Canon Inc 板状体搬送方法、搬送装置及び露光装置
US7611322B2 (en) * 2004-11-18 2009-11-03 Intevac, Inc. Processing thin wafers
US7554107B2 (en) * 2005-11-04 2009-06-30 Nuflare Technology, Inc. Writing method and writing apparatus of charged particle beam, positional deviation measuring method, and position measuring apparatus
US7643130B2 (en) 2005-11-04 2010-01-05 Nuflare Technology, Inc. Position measuring apparatus and positional deviation measuring method
US7759024B2 (en) * 2007-02-28 2010-07-20 Intel Corporation Controlling shape of a reticle with low friction film coating at backside
NL1036544A1 (nl) * 2008-02-21 2009-08-24 Asml Netherlands Bv A lithographic apparatus having a chuck with a visco-elastic damping layer.
NL2003678A (en) * 2008-12-17 2010-06-21 Asml Holding Nv Euv mask inspection system.
NL2003658A (en) * 2008-12-31 2010-07-01 Asml Holding Nv Euv mask inspection.
JP5190034B2 (ja) * 2009-07-03 2013-04-24 株式会社日立ハイテクノロジーズ 露光装置
KR101640766B1 (ko) * 2009-12-01 2016-07-20 삼성전자주식회사 반사형 레티클 척, 그것을 포함하는 반사형 조명 시스템, 그것을 이용한 반사형 레티클의 평탄성을 개선하는 방법 및 반도체 소자를 제조하는 방법
JP2012015206A (ja) * 2010-06-29 2012-01-19 Toshiba Corp 露光制御システム及び露光制御方法
DE102011086513A1 (de) 2011-11-16 2013-05-16 Carl Zeiss Smt Gmbh Projektionsbelichtungsverfahren und Projektionsbelichtungsanlage für die Mikrolithographie
US9103704B2 (en) * 2013-07-25 2015-08-11 General Electric Company Holding device to hold a reflector and an electromagnetic guiding device
CN104950413B (zh) * 2015-06-24 2017-12-29 苏州佳世达光电有限公司 固定结构
TWI630071B (zh) 2017-10-20 2018-07-21 財團法人工業技術研究院 薄型工件夾具
EP3514821B1 (en) * 2018-01-18 2020-05-27 Laser Systems & Solutions of Europe Method of laser irradiation of a patterned semiconductor device
KR102787867B1 (ko) * 2020-07-03 2025-04-01 삼성디스플레이 주식회사 표시 장치의 제조 장치 및 표시 장치의 제조 방법

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0463853B1 (en) 1990-06-29 1998-11-04 Canon Kabushiki Kaisha Vacuum chuck
JP3173928B2 (ja) 1992-09-25 2001-06-04 キヤノン株式会社 基板保持装置、基板保持方法および露光装置
US5854819A (en) 1996-02-07 1998-12-29 Canon Kabushiki Kaisha Mask supporting device and correction method therefor, and exposure apparatus and device producing method utilizing the same
JP3524295B2 (ja) 1996-09-24 2004-05-10 キヤノン株式会社 走査型露光装置およびデバイス製造方法
US6172738B1 (en) 1996-09-24 2001-01-09 Canon Kabushiki Kaisha Scanning exposure apparatus and device manufacturing method using the same
JP3450648B2 (ja) 1997-05-09 2003-09-29 キヤノン株式会社 倍率補正装置および倍率補正装置を搭載したｘ線露光装置ならびにデバイス製造方法
JPH11295031A (ja) 1998-04-08 1999-10-29 Canon Inc 位置決めステージ装置とその位置計測方法および位置決めステージ装置を備えた露光装置ならびにデバイス製造方法
JP4700819B2 (ja) 2000-03-10 2011-06-15 キヤノン株式会社 基板保持装置、半導体製造装置および半導体デバイス製造方法
JP2005045164A (ja) * 2003-07-25 2005-02-17 Toshiba Corp 自動焦点合わせ装置

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7591661B2 (en) 2005-10-06 2009-09-22 Ddk Ltd. Connector
JP2008226887A (ja) * 2007-03-08 2008-09-25 Nikon Corp 保持装置、露光装置、及びデバイス製造方法
JP2008277541A (ja) * 2007-04-27 2008-11-13 Toshiba Corp 光反射型マスクと光反射型マスクの作製方法及び半導体装置の製造方法
JP2009016678A (ja) * 2007-07-06 2009-01-22 Yaskawa Electric Corp ステージ装置およびその浮上制御方法と、ステージ装置を用いた露光装置
JP2009016680A (ja) * 2007-07-06 2009-01-22 Yaskawa Electric Corp ステージ装置およびその浮上制御方法と、ステージ装置を用いた露光装置
JP2009016679A (ja) * 2007-07-06 2009-01-22 Yaskawa Electric Corp ステージ装置およびその浮上制御方法と、ステージ装置を用いた露光装置
JP2009164284A (ja) * 2007-12-28 2009-07-23 Nikon Corp パターン形成基板、露光方法およびデバイスの製造方法
JP2009194204A (ja) * 2008-02-15 2009-08-27 Nikon Corp 露光装置、露光システムおよびデバイス製造方法
JP2010123950A (ja) * 2008-11-21 2010-06-03 Asml Netherlands Bv リソグラフィ装置、ならびに基板非平坦性を補償する方法、パターニングデバイス非平坦性の影響を求める方法、およびパターニングデバイスへの熱負荷の影響を求める方法
US8345265B2 (en) 2008-11-21 2013-01-01 Asml Netherlands B.V. Lithographic apparatus and methods for compensating substrate unflatness, determining the effect of patterning device unflatness, and determining the effect of thermal loads on a patterning device
KR20140023927A (ko) * 2011-03-11 2014-02-27 에이에스엠엘 네델란즈 비.브이. 정전기 클램프 장치 및 리소그래피 장치
JP2014507810A (ja) * 2011-03-11 2014-03-27 エーエスエムエル ネザーランズ ビー．ブイ． 静電クランプ装置およびリソグラフィ装置
US8837108B2 (en) 2011-06-14 2014-09-16 Asahi Glass Company, Limited Glass substrate-holding tool and method for producing an EUV mask blank by employing the same
JP2014036023A (ja) * 2012-08-07 2014-02-24 Nikon Corp 露光方法、フラットパネルディスプレイの製造方法、及びデバイス製造方法
JP2014167963A (ja) * 2013-02-28 2014-09-11 Toshiba Corp 静電チャック、レチクル、および静電チャック方法
US9134253B2 (en) 2013-08-27 2015-09-15 Kabushiki Kaisha Toshiba Inspecting apparatus and inspecting method
JP2017502321A (ja) * 2013-12-22 2017-01-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ チャックアセンブリを有する極端紫外線リソグラフィーシステム及びその製造方法
WO2015101121A1 (zh) * 2013-12-31 2015-07-09 上海微电子装备有限公司 掩模板面型整形装置及采用其的光刻机
US9983488B2 (en) 2013-12-31 2018-05-29 Shanghai Micro Electronics Equipment (Group) Co., Ltd. Reticle shape correction apparatus and photolithography tool using same

Also Published As

Publication number Publication date
US7218383B2 (en) 2007-05-15
US20070061609A1 (en) 2007-03-15
US20050128462A1 (en) 2005-06-16
US7187432B2 (en) 2007-03-06

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