JP2005149764A5 - - Google Patents

Download PDF

Info

Publication number
JP2005149764A5
JP2005149764A5 JP2003381658A JP2003381658A JP2005149764A5 JP 2005149764 A5 JP2005149764 A5 JP 2005149764A5 JP 2003381658 A JP2003381658 A JP 2003381658A JP 2003381658 A JP2003381658 A JP 2003381658A JP 2005149764 A5 JP2005149764 A5 JP 2005149764A5
Authority
JP
Japan
Prior art keywords
particle
particles
core
conductive
shell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003381658A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005149764A (ja
JP4686120B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003381658A priority Critical patent/JP4686120B2/ja
Priority claimed from JP2003381658A external-priority patent/JP4686120B2/ja
Publication of JP2005149764A publication Critical patent/JP2005149764A/ja
Publication of JP2005149764A5 publication Critical patent/JP2005149764A5/ja
Application granted granted Critical
Publication of JP4686120B2 publication Critical patent/JP4686120B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2003381658A 2003-11-11 2003-11-11 被覆導電粒子、異方性導電材料及び導電接続構造体 Expired - Fee Related JP4686120B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003381658A JP4686120B2 (ja) 2003-11-11 2003-11-11 被覆導電粒子、異方性導電材料及び導電接続構造体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003381658A JP4686120B2 (ja) 2003-11-11 2003-11-11 被覆導電粒子、異方性導電材料及び導電接続構造体

Publications (3)

Publication Number Publication Date
JP2005149764A JP2005149764A (ja) 2005-06-09
JP2005149764A5 true JP2005149764A5 (zh) 2006-09-21
JP4686120B2 JP4686120B2 (ja) 2011-05-18

Family

ID=34690964

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003381658A Expired - Fee Related JP4686120B2 (ja) 2003-11-11 2003-11-11 被覆導電粒子、異方性導電材料及び導電接続構造体

Country Status (1)

Country Link
JP (1) JP4686120B2 (zh)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100722493B1 (ko) * 2005-09-02 2007-05-28 제일모직주식회사 절연 전도성 미립자 및 이를 이용한 이방 전도성 접착필름
WO2007145657A2 (en) * 2005-11-01 2007-12-21 Massachusetts Institute Of Technology Initiated chemical vapor deposition of vinyl polymers for the encapsulation of particles
WO2007072912A1 (ja) * 2005-12-22 2007-06-28 Sekisui Chemical Co., Ltd. 導電性微粒子及び異方性導電材料
US20100065311A1 (en) * 2006-07-03 2010-03-18 Hitachi Chemical Company, Ltd. Conductive particle, adhesive composition, circuit-connecting material, circuit-connecting structure, and method for connection of circuit member
KR100752533B1 (ko) * 2006-11-06 2007-08-29 한국과학기술연구원 고분자 미세 캡슐-도전성 입자 복합체 및 이의 제조 방법
KR100871759B1 (ko) 2007-04-13 2008-12-05 엘에스엠트론 주식회사 이방 도전성 접착용 도전볼
JP5368760B2 (ja) * 2008-09-29 2013-12-18 積水化学工業株式会社 絶縁被覆導電性粒子、異方性導電材料及び接続構造体
JP5548053B2 (ja) * 2010-07-02 2014-07-16 積水化学工業株式会社 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
JP5672022B2 (ja) * 2011-01-25 2015-02-18 日立化成株式会社 絶縁被覆導電粒子、異方導電性材料及び接続構造体
JP2011181525A (ja) * 2011-06-09 2011-09-15 Sony Chemical & Information Device Corp 異方性導電材料
JP5803393B2 (ja) * 2011-08-02 2015-11-04 日立化成株式会社 絶縁被覆導電粒子及び異方導電性接着フィルム
JP6044195B2 (ja) * 2011-09-06 2016-12-14 日立化成株式会社 絶縁被覆用粒子、絶縁被覆導電粒子、異方導電材料及び接続構造体
KR101950516B1 (ko) * 2011-09-06 2019-02-20 히타치가세이가부시끼가이샤 절연 피복용 입자, 절연 피복 도전 입자, 이방 도전 재료 및 접속 구조체
JP5750342B2 (ja) * 2011-09-12 2015-07-22 株式会社日本触媒 絶縁性微粒子、絶縁性微粒子被覆導電性微粒子、異方性導電接着剤組成物、および異方性導電成形体
JP5952553B2 (ja) * 2011-12-14 2016-07-13 株式会社日本触媒 導電性微粒子及びこれを含む異方性導電材料
JP5939063B2 (ja) * 2012-07-11 2016-06-22 日立化成株式会社 絶縁被覆導電粒子及びそれを用いた異方導電性接着剤
CN110520938B (zh) * 2017-05-08 2021-10-08 日本化学工业株式会社 包覆颗粒及其制造方法
CN110574126A (zh) * 2017-05-08 2019-12-13 日本化学工业株式会社 包覆颗粒及其制造方法
KR102500093B1 (ko) * 2019-03-26 2023-02-16 후루카와 덴키 고교 가부시키가이샤 이방 도전성 시트의 제조 방법
CN110176588B (zh) * 2019-05-28 2022-01-28 中国科学院重庆绿色智能技术研究院 电极材料的制备方法
WO2022044913A1 (ja) 2020-08-24 2022-03-03 日本化学工業株式会社 被覆粒子及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2895872B2 (ja) * 1989-09-26 1999-05-24 触媒化成工業株式会社 異方導電性材料、異方導電性接着剤およびその異方導電性接着剤を使用した電極間を電気的に接続する方法並びにその方法により形成される電気回路基板
JP5060692B2 (ja) * 2001-07-13 2012-10-31 株式会社日本触媒 異方導電性材料
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
KR100589799B1 (ko) * 2003-05-06 2006-06-14 한화석유화학 주식회사 이방성 도전접속용 절연 도전성 입자, 이의 제조방법 및이를 이용한 제품

Similar Documents

Publication Publication Date Title
JP2005149764A5 (zh)
WO2003025955A1 (fr) Particule conductrice revetue, procede de fabrication d'une particule conductrice revetue, materiau conducteur anisotrope et structure de connexion electrique
CN102510712B (zh) 一种极高屏蔽效能的极薄屏蔽膜及其制作方法
TW434758B (en) Resin film and method for connecting electronic parts by using resin film
JP2003286457A5 (zh)
JP2009513026A5 (zh)
EP1041868A3 (en) Insulating resin composition for multilayer printed-wiring board
JPH0345482B2 (zh)
EP1093160A3 (en) Connecting material for anisotropically electroconductive connection
JP2007035573A5 (zh)
JP2006302716A5 (zh)
JP2001195921A (ja) 異方性導電接続用導電性粒子及び異方性導電接続材料
JP7005851B2 (ja) 多層異方性導電フィルム
CN202354026U (zh) 一种极高屏蔽效能的极薄屏蔽膜
JP2003234020A5 (zh)
JP4770139B2 (ja) 導電性粒子および異方導電性材料用組成物
JP2007035574A5 (zh)
JP2007503698A5 (zh)
WO2019102726A1 (ja) チップインダクタ
TW200901236A (en) Chip resistor and method for fabricating the same
JP2006054066A5 (zh)
JP2006199833A5 (zh)
CN103563499A (zh) 构造物及构造物的制造方法
US7381902B2 (en) Wiring board and method of manufacturing the same
WO2023206939A1 (zh) 一种电子结构及其制作方法