JP2006199833A5 - - Google Patents

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Publication number
JP2006199833A5
JP2006199833A5 JP2005013420A JP2005013420A JP2006199833A5 JP 2006199833 A5 JP2006199833 A5 JP 2006199833A5 JP 2005013420 A JP2005013420 A JP 2005013420A JP 2005013420 A JP2005013420 A JP 2005013420A JP 2006199833 A5 JP2006199833 A5 JP 2006199833A5
Authority
JP
Japan
Prior art keywords
fine particles
melting point
point metal
low melting
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2005013420A
Other languages
English (en)
Japanese (ja)
Other versions
JP2006199833A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005013420A priority Critical patent/JP2006199833A/ja
Priority claimed from JP2005013420A external-priority patent/JP2006199833A/ja
Publication of JP2006199833A publication Critical patent/JP2006199833A/ja
Publication of JP2006199833A5 publication Critical patent/JP2006199833A5/ja
Pending legal-status Critical Current

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JP2005013420A 2005-01-20 2005-01-20 異方性導電接着剤 Pending JP2006199833A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005013420A JP2006199833A (ja) 2005-01-20 2005-01-20 異方性導電接着剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005013420A JP2006199833A (ja) 2005-01-20 2005-01-20 異方性導電接着剤

Publications (2)

Publication Number Publication Date
JP2006199833A JP2006199833A (ja) 2006-08-03
JP2006199833A5 true JP2006199833A5 (zh) 2007-11-29

Family

ID=36958123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005013420A Pending JP2006199833A (ja) 2005-01-20 2005-01-20 異方性導電接着剤

Country Status (1)

Country Link
JP (1) JP2006199833A (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101221148B1 (ko) * 2007-03-12 2013-01-10 센주긴조쿠고교 가부시키가이샤 이방성 도전 재료
JP5061668B2 (ja) * 2007-03-14 2012-10-31 富士通株式会社 ２種類の配線板を有するハイブリッド基板、それを有する電子装置、及び、ハイブリッド基板の製造方法
KR100926747B1 (ko) * 2007-11-12 2009-11-16 한국전자통신연구원 도전 접착제 및 이를 이용한 플립칩 본딩 방법
KR101025620B1 (ko) * 2009-07-13 2011-03-30 한국과학기술원 초음파 접합용 이방성 전도성 접착제 및 이를 이용한 전자부품 간 접속방법
CN114752332B (zh) * 2022-04-08 2023-07-14 宁波曦晗科技有限公司 一种基于液态金属宽温区各向异性导电胶及其制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07139832A (ja) * 1993-11-15 1995-06-02 Mitsubishi Heavy Ind Ltd 冷凍装置
JP3347512B2 (ja) * 1995-03-17 2002-11-20 富士通株式会社 低温接合用はんだ合金、これを用いた電子機器およびその製造方法
JP4032532B2 (ja) * 1998-10-23 2008-01-16 日立化成工業株式会社 回路部材の実装方法
JP2000133050A (ja) * 1998-10-27 2000-05-12 Sekisui Chem Co Ltd 異方性導電膜及び導電接続構造体
JP2001130930A (ja) * 1999-11-04 2001-05-15 Mitsubishi Electric Corp 陰極線管の製造方法

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