JP2005129873A - 回路装置 - Google Patents
回路装置 Download PDFInfo
- Publication number
- JP2005129873A JP2005129873A JP2003366603A JP2003366603A JP2005129873A JP 2005129873 A JP2005129873 A JP 2005129873A JP 2003366603 A JP2003366603 A JP 2003366603A JP 2003366603 A JP2003366603 A JP 2003366603A JP 2005129873 A JP2005129873 A JP 2005129873A
- Authority
- JP
- Japan
- Prior art keywords
- tongue piece
- shield case
- electronic component
- circuit board
- tongue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0049—Casings being metallic containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】 シールドケースはその天面及び/又は底面に放熱のための複数の舌片を有し、前記舌片と、舌片が設けられたシールドケース面との複数の境界線が、略多角形状、略円形状、略楕円形状をなすように前記舌片が配置され、シールドケースの内側に向けて前記舌片を沈み込ませて、前記舌片の先端部を発熱電子部品に当接させたことを特徴とする。
【選択図】 図1
Description
2、2a、2b、2c、2d、2e 舌片
3、3a、3b、3c、3d、3e 境界線
4、4a、4b、4c、4d、4e 舌片間隙間
5 シールドケース天面
6 熱伝導材料
7 凹部
71 凹部の底面
8 凸部
81 凸部の天面
9 天面の裏面
10 回路基板
11 発熱電子部品
12 チップ型電子部品
13 高背電子部品
Claims (3)
- 回路基板と、前記回路基板を収容するシールドケースと、前記回路基板に実装された半導体集積回路等の発熱電子部品を備えた回路装置において、
前記シールドケースはその天面及び/又は底面に放熱のための複数の舌片を有し、前記舌片と、舌片が設けられたシールドケース面との複数の境界線が、略多角形状、略円形状、略楕円形状をなすように前記舌片が配置され、シールドケースの内側に向けて前記舌片を沈み込ませて、前記舌片の先端部を発熱電子部品に当接させたことを特徴とする回路装置。 - 回路基板と、前記回路基板を収容するシールドケースと、前記回路基板に実装された半導体集積回路等の発熱電子部品を備えた回路装置において、
前記シールドケースはその天面及び/又は底面に、凹部及び/又は凸部が設けられ、前記凹部及び凸部に放熱のための複数の舌片を有し、前記舌片と、舌片が設けられた凹部の面及び凸部の面との複数の境界線が、略多角形状、略円形状、略楕円形状をなすように前記舌片が配置され、シールドケースの内側に向けて前記舌片を沈み込ませて、前記舌片の先端部を発熱電子部品に当接させたことを特徴とする回路装置。 - 前記舌片の先端部と発熱電子部品との当接部に熱伝導材料を付加したことを特徴とする請求項1又は2記載の回路装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003366603A JP4052995B2 (ja) | 2003-10-27 | 2003-10-27 | 回路装置 |
PCT/JP2004/014552 WO2005041628A1 (ja) | 2003-10-27 | 2004-09-27 | 回路装置 |
TW93131947A TWI287953B (en) | 2003-10-27 | 2004-10-21 | Circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003366603A JP4052995B2 (ja) | 2003-10-27 | 2003-10-27 | 回路装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005129873A true JP2005129873A (ja) | 2005-05-19 |
JP4052995B2 JP4052995B2 (ja) | 2008-02-27 |
Family
ID=34510248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003366603A Expired - Fee Related JP4052995B2 (ja) | 2003-10-27 | 2003-10-27 | 回路装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP4052995B2 (ja) |
TW (1) | TWI287953B (ja) |
WO (1) | WO2005041628A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011176096A (ja) * | 2010-02-24 | 2011-09-08 | Mitsumi Electric Co Ltd | 電子機器 |
JPWO2020235647A1 (ja) * | 2019-05-23 | 2020-11-26 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9769966B2 (en) * | 2015-09-25 | 2017-09-19 | Intel Corporation | EMI shielding structure to enable heat spreading and low cost assembly |
CN108966618B (zh) * | 2017-05-26 | 2020-04-24 | 南宁富桂精密工业有限公司 | 屏蔽罩及应用该屏蔽罩的电子装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2679729B1 (fr) * | 1991-07-23 | 1994-04-29 | Alcatel Telspace | Dissipateur thermique. |
JPH1065385A (ja) * | 1996-08-21 | 1998-03-06 | Mitsubishi Electric Corp | 基板ケース構造体 |
JP3330893B2 (ja) * | 1999-02-04 | 2002-09-30 | シャープ株式会社 | 金属筐体に囲まれた電子部品の放熱構造 |
DE10026353A1 (de) * | 2000-05-27 | 2001-11-29 | Mannesmann Vdo Ag | Abgeschirmte, elektronische Schaltung |
-
2003
- 2003-10-27 JP JP2003366603A patent/JP4052995B2/ja not_active Expired - Fee Related
-
2004
- 2004-09-27 WO PCT/JP2004/014552 patent/WO2005041628A1/ja active Application Filing
- 2004-10-21 TW TW93131947A patent/TWI287953B/zh not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011176096A (ja) * | 2010-02-24 | 2011-09-08 | Mitsumi Electric Co Ltd | 電子機器 |
JPWO2020235647A1 (ja) * | 2019-05-23 | 2020-11-26 | ||
JP7253048B2 (ja) | 2019-05-23 | 2023-04-05 | 株式会社ソニー・インタラクティブエンタテインメント | 電子機器 |
Also Published As
Publication number | Publication date |
---|---|
JP4052995B2 (ja) | 2008-02-27 |
TWI287953B (en) | 2007-10-01 |
WO2005041628A1 (ja) | 2005-05-06 |
TW200520643A (en) | 2005-06-16 |
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