JP2005101487A5 - - Google Patents

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JP2005101487A5
JP2005101487A5 JP2003410472A JP2003410472A JP2005101487A5 JP 2005101487 A5 JP2005101487 A5 JP 2005101487A5 JP 2003410472 A JP2003410472 A JP 2003410472A JP 2003410472 A JP2003410472 A JP 2003410472A JP 2005101487 A5 JP2005101487 A5 JP 2005101487A5
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substrate
liquid
exposure apparatus
exposure
image
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Claims (33)

パターンの像を液体を介して基板上に転写して基板を露光する露光装置であって、
パターンの像を基板に投影する投影光学系と、
露光された基板を処理する処理装置との接続部と、
前記接続部を介して基板が処理装置へ搬出される前に、基板に付着した液体を除去する液体除去装置とを備える露光装置。
An exposure apparatus that exposes a substrate by transferring an image of a pattern onto the substrate via a liquid,
A projection optical system that projects an image of the pattern onto the substrate;
A connection with a processing apparatus for processing the exposed substrate;
An exposure apparatus comprising: a liquid removal apparatus that removes liquid attached to the substrate before the substrate is carried out to the processing apparatus via the connection portion.
パターンの像を液体を介して基板上に転写して基板を露光する露光装置であって、
パターンの像を基板に投影する投影光学系と、
露光された基板に付着した液体を除去する液体除去装置と、
露光された基板を液体除去装置に搬送する第1搬送部材と、
液体除去装置により液体が除去された基板を液体除去装置から搬送する第2搬送部材とを備える露光装置。
An exposure apparatus that exposes a substrate by transferring an image of a pattern onto the substrate via a liquid,
A projection optical system that projects an image of the pattern onto the substrate;
A liquid removing device for removing the liquid adhering to the exposed substrate;
A first transport member that transports the exposed substrate to a liquid removal apparatus;
An exposure apparatus comprising: a second transport member that transports the substrate from which the liquid has been removed by the liquid removal apparatus, from the liquid removal apparatus.
前記第1搬送部材は、その表面の少なくとも一部が撥液性であることを特徴とする請求項2に記載の露光装置。   The exposure apparatus according to claim 2, wherein at least a part of the surface of the first transport member is liquid repellent. パターンの像を液体を介して基板上に転写して基板を露光する露光装置であって、
パターンの像を基板に投影する投影光学系と、
露光された基板を搬送する搬送システムと、
基板の搬送経路に設けられ、基板に付着した液体を除去する液体除去装置とを備え、
液体除去装置は、液体の除去を行うときに液体が飛散することを防止するように基板周囲の少なくとも一部を覆うカバーを有する露光装置。
An exposure apparatus that exposes a substrate by transferring an image of a pattern onto the substrate via a liquid,
A projection optical system that projects an image of the pattern onto the substrate;
A transport system for transporting the exposed substrate;
A liquid removal device that is provided in the substrate conveyance path and removes the liquid adhering to the substrate;
The liquid removing apparatus is an exposure apparatus having a cover that covers at least a part of the periphery of the substrate so as to prevent the liquid from scattering when the liquid is removed.
前記カバー機構はチャンバを含むことを特徴とする請求項4に記載の露光装置。   The exposure apparatus according to claim 4, wherein the cover mechanism includes a chamber. 前記液体除去装置は、前記露光後の基板を洗浄する洗浄装置を備え、
前記洗浄装置による前記基板の洗浄後に、前記基板に付着した洗浄液を除去することを特徴とする請求項1〜5のいずれか一項記載の露光装置。
The liquid removing device includes a cleaning device for cleaning the substrate after the exposure,
6. The exposure apparatus according to claim 1, wherein the cleaning liquid attached to the substrate is removed after the cleaning of the substrate by the cleaning apparatus.
パターンの像を液体を介して基板上に転写して基板を露光する露光装置であって、
パターンの像を基板に投影する投影光学系と、
基板を保持する基板ステージと、
基板ステージから露光された基板を搬出する前に、基板に付着した液体を除去する液体除去装置とを備える露光装置。
An exposure apparatus that exposes a substrate by transferring an image of a pattern onto the substrate via a liquid,
A projection optical system that projects an image of the pattern onto the substrate;
A substrate stage for holding the substrate;
An exposure apparatus comprising: a liquid removing device that removes liquid adhered to a substrate before unloading the exposed substrate from the substrate stage.
前記露光後に、前記液体が付着した基板は水平面に対して所定角度で搬送されることを特徴とする請求項1〜7のいずれか一項に記載の露光装置。   The exposure apparatus according to claim 1, wherein after the exposure, the substrate to which the liquid adheres is transported at a predetermined angle with respect to a horizontal plane. 前記液体除去装置は、前記基板上の液体を吸引することを特徴とする請求項1〜8のいずれか一項に記載の露光装置。   The exposure apparatus according to claim 1, wherein the liquid removing apparatus sucks the liquid on the substrate. 前記液体除去装置は、前記基板上の液体を乾燥させることを特徴とする請求項1〜9のいずれか一項に記載の露光装置。   The exposure apparatus according to claim 1, wherein the liquid removing apparatus dries the liquid on the substrate. 前記液体除去装置は、前記基板上の液体を飛ばすことを特徴とする請求項1〜10のいずれか一項に記載の露光装置。   The exposure apparatus according to claim 1, wherein the liquid removing apparatus blows off the liquid on the substrate. 前記液体除去装置は、前記液体が付着した基板を回転させる回転機構を含むことを特徴とする請求項11に記載の露光装置。   The exposure apparatus according to claim 11, wherein the liquid removal apparatus includes a rotation mechanism that rotates the substrate to which the liquid is attached. 前記液体除去装置は、前記液体が付着した基板を傾けることを特徴とする請求項1〜12、2、4及び7のいずれか一項に記載の露光装置。   The exposure apparatus according to claim 1, wherein the liquid removing apparatus tilts the substrate to which the liquid is attached. 前記液体除去装置は、前記基板の両面に付着した液体を除去することを特徴とする請求項1〜13のいずれか一項に記載の露光装置。   The exposure apparatus according to claim 1, wherein the liquid removing apparatus removes the liquid adhering to both surfaces of the substrate. 前記液体除去装置は、前記基板の裏面に付着した液体を除去することを特徴とする請求項1〜13のいずれか一項に記載の露光装置。   The exposure apparatus according to claim 1, wherein the liquid removing apparatus removes liquid adhering to the back surface of the substrate. 前記液体を供給する液体供給装置と、
前記液体供給装置によって供給された液体を回収する液体回収装置とをさらに備え、
前記液体除去装置は、前記基板の露光完了後に、前記液体回収装置によって回収されずに、前記基板表面に残留した液体の除去を行うことを特徴とする請求項1〜15のいずれか一項に記載の露光装置。
A liquid supply device for supplying the liquid;
A liquid recovery device for recovering the liquid supplied by the liquid supply device;
16. The liquid removing apparatus according to claim 1, wherein after the exposure of the substrate is completed, the liquid remaining on the substrate surface is removed without being collected by the liquid collecting apparatus. The exposure apparatus described.
基板を保持する第1保持部材と、基板を保持する第2保持部材とをさらに備え、
前記液体除去装置は、一方の保持部材に保持された基板の露光中に、他方の保持部材に保持された基板に付着した液体の除去を行うことを特徴とする請求項16に記載の露光装置。
A first holding member that holds the substrate; and a second holding member that holds the substrate;
17. The exposure apparatus according to claim 16, wherein the liquid removing apparatus removes the liquid adhering to the substrate held by the other holding member during the exposure of the substrate held by the one holding member. .
基板を保持する第1保持部材と、基板を保持する第2保持部材とをさらに備え、
前記液体除去装置は、一方の保持部材に保持された基板の露光中に、他方の保持部材に保持された基板に付着した液体の除去を行うことを特徴とする請求項1〜15のいずれか一項に記載の露光装置。
A first holding member that holds the substrate; and a second holding member that holds the substrate;
16. The liquid removing apparatus according to claim 1, wherein the liquid attached to the substrate held by the other holding member is removed during exposure of the substrate held by the one holding member. The exposure apparatus according to one item.
さらに、基板ステージを備え、基板ステージに前記液体除去装置が設けられている請求項1に記載の露光装置。   The exposure apparatus according to claim 1, further comprising a substrate stage, wherein the liquid removal device is provided on the substrate stage. 前記基板ステージに前記液体除去装置が設けられている請求項7に記載の露光装置。   The exposure apparatus according to claim 7, wherein the liquid removal apparatus is provided on the substrate stage. パターンの像を液体を介して基板上に転写して基板を露光する露光装置であって、
パターンの像を基板に投影する投影光学系と、
露光された基板を搬送する搬送システムと、
基板の搬送経路の下の少なくとも一部に、露光後の基板から落下した液体を処理する液体処理機構とを備える露光装置。
An exposure apparatus that exposes a substrate by transferring an image of a pattern onto the substrate via a liquid,
A projection optical system that projects an image of the pattern onto the substrate;
A transport system for transporting the exposed substrate;
An exposure apparatus comprising a liquid processing mechanism for processing a liquid dropped from a substrate after exposure at least at a part under a substrate transport path.
前記液体処理機構は、前記搬送経路の下の少なくとも一部に配置された樋部材と、該樋部材を介して回収された液体を排出する排出機構とを有することを特徴とする請求項21に記載の露光装置。   23. The liquid processing mechanism according to claim 21, further comprising: a gutter member disposed at least at a part below the transport path; and a discharge mechanism that ejects the liquid collected through the gutter member. The exposure apparatus described. パターンの像を液体を介して基板上に転写して基板を露光する露光装置であって、
パターンの像を基板に投影する投影光学系と、
液体が付着した基板を搬送する第1搬送部材と、
液体が付着していない基板を搬送する第2搬送部材とを備える露光装置。
An exposure apparatus that exposes a substrate by transferring an image of a pattern onto the substrate via a liquid,
A projection optical system that projects an image of the pattern onto the substrate;
A first transport member that transports the substrate to which the liquid is attached;
An exposure apparatus comprising: a second transport member that transports a substrate to which no liquid is attached.
基板上に存在する露光用の液体を除去する液体除去装置をさらに備え、
前記第1搬送部材は、液体が付着した基板を、前記液体除去装置へ搬送することを特徴とする請求項23記載の露光装置。
A liquid removing device for removing the exposure liquid present on the substrate;
24. The exposure apparatus according to claim 23, wherein the first transport member transports the substrate to which the liquid is adhered to the liquid removing apparatus.
前記第1搬送部材の少なくとも一部の表面は撥液性であることを特徴とする請求項23または24記載の露光装置。   25. The exposure apparatus according to claim 23, wherein at least a part of the surface of the first transport member is liquid repellent. 前記第1搬送部材による基板の搬送経路の下の少なくとも一部に配置され、基板から落下した液体を処理する液体処理機構をさらに備えることを特徴とする請求項21〜25のいずれか一項記載の露光装置。   26. The liquid processing mechanism according to any one of claims 21 to 25, further comprising a liquid processing mechanism that is disposed in at least a part of the substrate transport path by the first transport member and processes a liquid dropped from the substrate. Exposure equipment. 液体を介して基板上に露光光を照射して基板を露光する露光装置であって、
基板を保持して移動可能な第1保持部材と、
基板を保持して移動可能な第2保持部材と、
前記第1保持部材に保持された基板が露光されているときに、前記第2保持部材に保持された、露光を終えた基板に付着した液体の除去を行う液体除去装置と、
を備える露光装置。
An exposure apparatus that exposes a substrate by irradiating exposure light onto the substrate through a liquid,
A first holding member movable while holding the substrate;
A second holding member movable while holding the substrate;
A liquid removing device for removing the liquid adhering to the exposed substrate held by the second holding member when the substrate held by the first holding member is exposed;
An exposure apparatus comprising:
請求項1〜27のいずれか一項記載の露光装置を用いることを特徴とするデバイス製造方法。   A device manufacturing method using the exposure apparatus according to any one of claims 1 to 27. パターンの像を液体を介して基板上に転写して基板を露光する露光装置と共に用いられる液体除去装置であって、
露光された基板を保持する保持部と、
基板上に存在する露光用の液体を除去する液体除去機構とを備える液体除去装置。
A liquid removal apparatus used together with an exposure apparatus for transferring an image of a pattern onto a substrate through a liquid to expose the substrate,
A holding unit for holding the exposed substrate;
A liquid removal apparatus comprising: a liquid removal mechanism that removes an exposure liquid existing on a substrate.
さらに、液体除去機構を包囲するカバーを備える請求項29に記載の液体除去装置。   30. The liquid removal apparatus according to claim 29, further comprising a cover surrounding the liquid removal mechanism. さらに、前記保持部に基板を搬送する搬送装置を備える請求項29または30に記載の液体除去装置。   Furthermore, the liquid removal apparatus of Claim 29 or 30 provided with the conveying apparatus which conveys a board | substrate to the said holding | maintenance part. 請求項1〜27のいずれか一項記載に記載の露光装置と、
露光した基板を処理を行う処理装置とを備える露光システム。
An exposure apparatus according to any one of claims 1 to 27;
An exposure system comprising: a processing apparatus that processes an exposed substrate.
前記処理装置が、基板の基材に感光性材料を塗布する塗布装置及び露光された基板を現像する現像装置の少なくとも一方を含む請求項32に記載の露光システム。   The exposure system according to claim 32, wherein the processing apparatus includes at least one of a coating apparatus that applies a photosensitive material to a base material of a substrate and a developing apparatus that develops the exposed substrate.
JP2003410472A 2002-12-10 2003-12-09 Exposure apparatus, device manufacturing method, and exposure system Expired - Fee Related JP4525062B2 (en)

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Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2161620A1 (en) 2003-04-11 2010-03-10 Nikon Corporation Cleanup method for optics in immersion lithography
TWI616932B (en) 2003-05-23 2018-03-01 Nikon Corp Exposure device and component manufacturing method
KR101239632B1 (en) 2003-08-21 2013-03-11 가부시키가이샤 니콘 Exposure apparatus, exposure method, and device producing method
JP4220423B2 (en) 2004-03-24 2009-02-04 株式会社東芝 Resist pattern forming method
US7616383B2 (en) 2004-05-18 2009-11-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR101747662B1 (en) * 2004-06-09 2017-06-15 가부시키가이샤 니콘 Exposure system and device production method
JP2006024715A (en) 2004-07-07 2006-01-26 Toshiba Corp Lithography apparatus and pattern forming method
JP2006049757A (en) * 2004-08-09 2006-02-16 Tokyo Electron Ltd Substrate processing method
JP4271109B2 (en) * 2004-09-10 2009-06-03 東京エレクトロン株式会社 Coating, developing device, resist pattern forming method, exposure device and cleaning device
KR101236120B1 (en) 2004-10-26 2013-02-28 가부시키가이샤 니콘 Substrate processing method, exposure apparatus and method for manufacturing device
JP4522329B2 (en) * 2005-06-24 2010-08-11 株式会社Sokudo Substrate processing equipment
US20070002296A1 (en) * 2005-06-30 2007-01-04 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography defect reduction
US7927779B2 (en) 2005-06-30 2011-04-19 Taiwan Semiconductor Manufacturing Companym, Ltd. Water mark defect prevention for immersion lithography
JP4753641B2 (en) * 2005-07-01 2011-08-24 株式会社Sokudo Substrate processing system
JP2007036121A (en) * 2005-07-29 2007-02-08 Dainippon Screen Mfg Co Ltd Substrate-treating device
US8383322B2 (en) 2005-08-05 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Immersion lithography watermark reduction
JP4937559B2 (en) * 2005-09-14 2012-05-23 株式会社Sokudo Substrate processing apparatus and substrate processing method
US7993808B2 (en) 2005-09-30 2011-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. TARC material for immersion watermark reduction
TW200719095A (en) * 2005-11-09 2007-05-16 Nikon Corp Exposure apparatus, exposure method and device manufacturing method
US8125610B2 (en) 2005-12-02 2012-02-28 ASML Metherlands B.V. Method for preventing or reducing contamination of an immersion type projection apparatus and an immersion type lithographic apparatus
JP4998854B2 (en) * 2006-02-03 2012-08-15 株式会社ニコン Substrate processing method, substrate processing system, program, and recording medium
JP2007317987A (en) * 2006-05-29 2007-12-06 Sokudo:Kk Substrate processing apparatus, and substrate processing method
US8518628B2 (en) 2006-09-22 2013-08-27 Taiwan Semiconductor Manufacturing Company, Ltd. Surface switchable photoresist
US20080156356A1 (en) * 2006-12-05 2008-07-03 Nikon Corporation Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus, and device fabricating method
JP4672763B2 (en) * 2008-09-16 2011-04-20 株式会社東芝 Resist pattern forming method
JP5970921B2 (en) * 2012-04-02 2016-08-17 セイコーエプソン株式会社 robot

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4346164A (en) * 1980-10-06 1982-08-24 Werner Tabarelli Photolithographic method for the manufacture of integrated circuits
JPS6265326A (en) * 1985-09-18 1987-03-24 Hitachi Ltd Exposure device
JP2592475B2 (en) * 1987-12-30 1997-03-19 株式会社日立製作所 Projection exposure apparatus and pattern offset correction method thereof
JPH03215867A (en) * 1990-01-19 1991-09-20 Fujitsu Ltd Developing processing method for positive resist
JPH05304072A (en) * 1992-04-08 1993-11-16 Nec Corp Manufacture of semiconductor device
JPH06124873A (en) * 1992-10-09 1994-05-06 Canon Inc Liquid-soaking type projection exposure apparatus
JP2753930B2 (en) * 1992-11-27 1998-05-20 キヤノン株式会社 Immersion type projection exposure equipment
JPH06332167A (en) * 1993-05-24 1994-12-02 Shin Etsu Chem Co Ltd Positive type photoresist composition and pattern forming method
JPH07220990A (en) * 1994-01-28 1995-08-18 Hitachi Ltd Pattern forming method and exposure apparatus therefor
JP4029183B2 (en) * 1996-11-28 2008-01-09 株式会社ニコン Projection exposure apparatus and projection exposure method
JP2000505958A (en) * 1996-12-24 2000-05-16 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Two-dimensional balance positioning device having two article holders and lithographic device having this positioning device
JPH10255319A (en) * 1997-03-12 1998-09-25 Hitachi Maxell Ltd Master disk exposure device and method therefor
JP3747566B2 (en) * 1997-04-23 2006-02-22 株式会社ニコン Immersion exposure equipment
JP3817836B2 (en) * 1997-06-10 2006-09-06 株式会社ニコン EXPOSURE APPARATUS, ITS MANUFACTURING METHOD, EXPOSURE METHOD, AND DEVICE MANUFACTURING METHOD
WO1999049504A1 (en) * 1998-03-26 1999-09-30 Nikon Corporation Projection exposure method and system
JP2001085295A (en) * 1999-09-09 2001-03-30 Tokyo Electron Ltd Device and method for processing substrate
US20020163629A1 (en) * 2001-05-07 2002-11-07 Michael Switkes Methods and apparatus employing an index matching medium
KR101037057B1 (en) * 2002-12-10 2011-05-26 가부시키가이샤 니콘 Exposure apparatus and method for manufacturing device
US7070915B2 (en) * 2003-08-29 2006-07-04 Tokyo Electron Limited Method and system for drying a substrate

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