JP2005101226A5 - - Google Patents
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- Publication number
- JP2005101226A5 JP2005101226A5 JP2003332238A JP2003332238A JP2005101226A5 JP 2005101226 A5 JP2005101226 A5 JP 2005101226A5 JP 2003332238 A JP2003332238 A JP 2003332238A JP 2003332238 A JP2003332238 A JP 2003332238A JP 2005101226 A5 JP2005101226 A5 JP 2005101226A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- holding
- stage
- gas
- substrate holding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 387
- 238000000034 method Methods 0.000 claims description 37
- 238000007689 inspection Methods 0.000 claims description 35
- 238000012545 processing Methods 0.000 claims description 25
- 238000007664 blowing Methods 0.000 claims description 20
- 238000005259 measurement Methods 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 230000001678 irradiating effect Effects 0.000 claims description 10
- 238000010894 electron beam technology Methods 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 2
- 239000013067 intermediate product Substances 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 44
- 238000005452 bending Methods 0.000 description 14
- 239000000428 dust Substances 0.000 description 8
- 238000007667 floating Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000012937 correction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000032258 transport Effects 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003332238A JP2005101226A (ja) | 2003-09-24 | 2003-09-24 | 基板保持装置，基板処理装置，基板検査装置及び基板保持方法 |
| TW093126538A TW200512795A (en) | 2003-09-24 | 2004-09-02 | Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method |
| KR1020040076185A KR100843413B1 (ko) | 2003-09-24 | 2004-09-23 | 기판 보유 지지 장치, 기판 처리 장치, 기판 검사 장치, 기판 보유 지지 방법 및 포토 마스크의 제조 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003332238A JP2005101226A (ja) | 2003-09-24 | 2003-09-24 | 基板保持装置，基板処理装置，基板検査装置及び基板保持方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005101226A JP2005101226A (ja) | 2005-04-14 |
| JP2005101226A5 true JP2005101226A5 (enrdf_load_stackoverflow) | 2006-09-07 |
Family
ID=34460647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003332238A Pending JP2005101226A (ja) | 2003-09-24 | 2003-09-24 | 基板保持装置，基板処理装置，基板検査装置及び基板保持方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005101226A (enrdf_load_stackoverflow) |
| KR (1) | KR100843413B1 (enrdf_load_stackoverflow) |
| TW (1) | TW200512795A (enrdf_load_stackoverflow) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4917780B2 (ja) * | 2005-09-08 | 2012-04-18 | 住友化学株式会社 | 露光装置 |
| JP5412107B2 (ja) * | 2006-02-28 | 2014-02-12 | Ｈｏｙａ株式会社 | フォトマスクブランクの製造方法、及びフォトマスクの製造方法 |
| JP4516089B2 (ja) * | 2007-03-30 | 2010-08-04 | アプライド マテリアルズ インコーポレイテッド | ウェハ搬送用ブレード |
| TWI417980B (zh) * | 2009-02-04 | 2013-12-01 | Hoya Corp | 載台清潔器、描繪裝置及基板處理裝置 |
| JP5470601B2 (ja) * | 2009-03-02 | 2014-04-16 | 新光電気工業株式会社 | 静電チャック |
| JP5440035B2 (ja) * | 2009-08-31 | 2014-03-12 | 横浜ゴム株式会社 | 板状部材の支持装置 |
| JP5526862B2 (ja) * | 2010-02-25 | 2014-06-18 | カシオ計算機株式会社 | 基板吸着方法および基板吸着装置 |
| NL2006514A (en) * | 2010-05-11 | 2011-11-14 | Asml Netherlands Bv | Apparatus and method for contactless handling of an object. |
| CN102736429B (zh) * | 2011-04-07 | 2015-06-17 | 上海微电子装备有限公司 | 硅片温度稳定装置 |
| JP6037199B2 (ja) * | 2011-06-02 | 2016-12-07 | 株式会社ブイ・テクノロジー | 露光装置及び露光方法 |
| TW201732997A (zh) * | 2016-01-18 | 2017-09-16 | Ｈｏｙａ股份有限公司 | 基板保持裝置、描繪裝置、光罩檢查裝置、及光罩之製造方法 |
| CN110320758B (zh) * | 2018-03-30 | 2021-06-29 | 上海微电子装备（集团）股份有限公司 | 一种基底边缘保护装置、光刻设备及保护方法 |
| JP6935112B2 (ja) * | 2018-07-19 | 2021-09-15 | ボンドテック株式会社 | 基板接合装置 |
| JP7444428B2 (ja) * | 2019-03-15 | 2024-03-06 | 株式会社ナノテム | パッドユニット、真空チャック装置及び工作機械 |
| US12055580B2 (en) | 2020-03-26 | 2024-08-06 | Nidec Read Corporation | Circuit board inspecting apparatus |
| CN113777891B (zh) * | 2021-08-19 | 2022-08-26 | 杭州新诺微电子有限公司 | 可移动压板结构及具有该结构的曝光机及曝光机压板方法 |
| CN115890513A (zh) * | 2022-11-01 | 2023-04-04 | 苏州硕贝德通讯技术有限公司 | 一种用于陶瓷基板贴片的真空吸块及其制备方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6383948B1 (en) * | 1999-12-20 | 2002-05-07 | Tokyo Electron Limited | Coating film forming apparatus and coating film forming method |
| TW594421B (en) * | 2002-01-30 | 2004-06-21 | Toshiba Corp | Film forming method/device, image-forming method and semiconductor device manufacturing method |
-
2003
- 2003-09-24 JP JP2003332238A patent/JP2005101226A/ja active Pending
-
2004
- 2004-09-02 TW TW093126538A patent/TW200512795A/zh unknown
- 2004-09-23 KR KR1020040076185A patent/KR100843413B1/ko not_active Expired - Fee Related
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