JP2005064154A - 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法 - Google Patents

回路基板、回路基板を用いた電子機器、及び回路基板の製造方法 Download PDF

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Publication number
JP2005064154A
JP2005064154A JP2003290912A JP2003290912A JP2005064154A JP 2005064154 A JP2005064154 A JP 2005064154A JP 2003290912 A JP2003290912 A JP 2003290912A JP 2003290912 A JP2003290912 A JP 2003290912A JP 2005064154 A JP2005064154 A JP 2005064154A
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JP
Japan
Prior art keywords
circuit board
layer
insulator layer
wiring
main surfaces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003290912A
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English (en)
Japanese (ja)
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JP2005064154A5 (enrdf_load_stackoverflow
Inventor
Tadahiro Omi
忠弘 大見
Shigetoshi Sugawa
成利 須川
Akita Morimoto
明大 森本
Takeyoshi Kato
丈佳 加藤
Yasuhiro Wakizaka
康尋 脇坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zeon Corp
Original Assignee
Nippon Zeon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Zeon Co Ltd filed Critical Nippon Zeon Co Ltd
Priority to JP2003290912A priority Critical patent/JP2005064154A/ja
Priority to US10/525,329 priority patent/US20060158865A1/en
Priority to PCT/JP2003/010687 priority patent/WO2004019664A1/ja
Priority to KR1020057002990A priority patent/KR100712764B1/ko
Priority to CNB038199726A priority patent/CN100563404C/zh
Publication of JP2005064154A publication Critical patent/JP2005064154A/ja
Publication of JP2005064154A5 publication Critical patent/JP2005064154A5/ja
Pending legal-status Critical Current

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2003290912A 2002-08-23 2003-08-08 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法 Pending JP2005064154A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003290912A JP2005064154A (ja) 2003-08-08 2003-08-08 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法
US10/525,329 US20060158865A1 (en) 2002-08-23 2003-08-25 Circuit board, electronic device employing circuit board, and mehtod of producing circuit board
PCT/JP2003/010687 WO2004019664A1 (ja) 2002-08-23 2003-08-25 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法
KR1020057002990A KR100712764B1 (ko) 2002-08-23 2003-08-25 회로 기판, 회로 기판을 이용한 전자기기 및 회로 기판의제조 방법
CNB038199726A CN100563404C (zh) 2002-08-23 2003-08-25 电路衬底、使用电路衬底的电子设备及电路衬底的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003290912A JP2005064154A (ja) 2003-08-08 2003-08-08 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法

Publications (2)

Publication Number Publication Date
JP2005064154A true JP2005064154A (ja) 2005-03-10
JP2005064154A5 JP2005064154A5 (enrdf_load_stackoverflow) 2006-06-01

Family

ID=34368764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003290912A Pending JP2005064154A (ja) 2002-08-23 2003-08-08 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法

Country Status (1)

Country Link
JP (1) JP2005064154A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281089A (ja) * 2006-04-04 2007-10-25 Toyota Motor Corp ビルドアップ多層配線板の製造方法
JP2020150067A (ja) * 2019-03-12 2020-09-17 味の素株式会社 基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134984A (ja) * 2000-10-27 2002-05-10 Kyocera Corp 樹脂複合体及びこれを用いた放射雑音抑制基板
JP2002203719A (ja) * 2000-12-28 2002-07-19 Tdk Corp 積層電子部品

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002134984A (ja) * 2000-10-27 2002-05-10 Kyocera Corp 樹脂複合体及びこれを用いた放射雑音抑制基板
JP2002203719A (ja) * 2000-12-28 2002-07-19 Tdk Corp 積層電子部品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281089A (ja) * 2006-04-04 2007-10-25 Toyota Motor Corp ビルドアップ多層配線板の製造方法
JP2020150067A (ja) * 2019-03-12 2020-09-17 味の素株式会社 基板の製造方法
JP7423896B2 (ja) 2019-03-12 2024-01-30 味の素株式会社 基板の製造方法

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