JP2005064154A5 - - Google Patents

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Publication number
JP2005064154A5
JP2005064154A5 JP2003290912A JP2003290912A JP2005064154A5 JP 2005064154 A5 JP2005064154 A5 JP 2005064154A5 JP 2003290912 A JP2003290912 A JP 2003290912A JP 2003290912 A JP2003290912 A JP 2003290912A JP 2005064154 A5 JP2005064154 A5 JP 2005064154A5
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JP
Japan
Prior art keywords
layer
insulator layer
main surfaces
insulator
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003290912A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005064154A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003290912A priority Critical patent/JP2005064154A/ja
Priority claimed from JP2003290912A external-priority patent/JP2005064154A/ja
Priority to US10/525,329 priority patent/US20060158865A1/en
Priority to PCT/JP2003/010687 priority patent/WO2004019664A1/ja
Priority to KR1020057002990A priority patent/KR100712764B1/ko
Priority to CNB038199726A priority patent/CN100563404C/zh
Publication of JP2005064154A publication Critical patent/JP2005064154A/ja
Publication of JP2005064154A5 publication Critical patent/JP2005064154A5/ja
Pending legal-status Critical Current

Links

JP2003290912A 2002-08-23 2003-08-08 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法 Pending JP2005064154A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2003290912A JP2005064154A (ja) 2003-08-08 2003-08-08 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法
US10/525,329 US20060158865A1 (en) 2002-08-23 2003-08-25 Circuit board, electronic device employing circuit board, and mehtod of producing circuit board
PCT/JP2003/010687 WO2004019664A1 (ja) 2002-08-23 2003-08-25 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法
KR1020057002990A KR100712764B1 (ko) 2002-08-23 2003-08-25 회로 기판, 회로 기판을 이용한 전자기기 및 회로 기판의제조 방법
CNB038199726A CN100563404C (zh) 2002-08-23 2003-08-25 电路衬底、使用电路衬底的电子设备及电路衬底的制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003290912A JP2005064154A (ja) 2003-08-08 2003-08-08 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法

Publications (2)

Publication Number Publication Date
JP2005064154A JP2005064154A (ja) 2005-03-10
JP2005064154A5 true JP2005064154A5 (enrdf_load_stackoverflow) 2006-06-01

Family

ID=34368764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003290912A Pending JP2005064154A (ja) 2002-08-23 2003-08-08 回路基板、回路基板を用いた電子機器、及び回路基板の製造方法

Country Status (1)

Country Link
JP (1) JP2005064154A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281089A (ja) * 2006-04-04 2007-10-25 Toyota Motor Corp ビルドアップ多層配線板の製造方法
JP7423896B2 (ja) * 2019-03-12 2024-01-30 味の素株式会社 基板の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4446585B2 (ja) * 2000-10-27 2010-04-07 京セラ株式会社 樹脂複合体及びこれを用いた放射雑音抑制基板
JP2002203719A (ja) * 2000-12-28 2002-07-19 Tdk Corp 積層電子部品

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