JP2005033065A - 電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム - Google Patents

電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム Download PDF

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Publication number
JP2005033065A
JP2005033065A JP2003272072A JP2003272072A JP2005033065A JP 2005033065 A JP2005033065 A JP 2005033065A JP 2003272072 A JP2003272072 A JP 2003272072A JP 2003272072 A JP2003272072 A JP 2003272072A JP 2005033065 A JP2005033065 A JP 2005033065A
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JP
Japan
Prior art keywords
sheet
electronic component
adhesive sheet
adhesive
peeled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2003272072A
Other languages
English (en)
Japanese (ja)
Inventor
Tsuneharu Arai
常晴 荒井
Michio Yonemoto
道夫 米本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP2003272072A priority Critical patent/JP2005033065A/ja
Priority to TW093115627A priority patent/TW200504917A/zh
Priority to KR1020040052558A priority patent/KR100592338B1/ko
Publication of JP2005033065A publication Critical patent/JP2005033065A/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
JP2003272072A 2003-07-08 2003-07-08 電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム Withdrawn JP2005033065A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003272072A JP2005033065A (ja) 2003-07-08 2003-07-08 電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム
TW093115627A TW200504917A (en) 2003-07-08 2004-06-01 Pickup device and pickup method of electronic component and recording medium recorded with the pickup program of electronic component
KR1020040052558A KR100592338B1 (ko) 2003-07-08 2004-07-07 전자부품 픽업 장치, 전자부품 픽업 방법 및 전자부품픽업 프로그램

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003272072A JP2005033065A (ja) 2003-07-08 2003-07-08 電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム

Publications (1)

Publication Number Publication Date
JP2005033065A true JP2005033065A (ja) 2005-02-03

Family

ID=34209742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003272072A Withdrawn JP2005033065A (ja) 2003-07-08 2003-07-08 電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム

Country Status (3)

Country Link
JP (1) JP2005033065A (ko)
KR (1) KR100592338B1 (ko)
TW (1) TW200504917A (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016072280A (ja) * 2014-09-26 2016-05-09 ファスフォードテクノロジ株式会社 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法
JP2019071371A (ja) * 2017-10-11 2019-05-09 三菱電機株式会社 半導体ピックアップ装置
KR102130475B1 (ko) * 2019-11-21 2020-07-06 제너셈(주) 픽커 구조체 및 이를 포함하는 패키지 탈거 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101527184B1 (ko) * 2013-10-14 2015-06-09 도레이첨단소재 주식회사 전자 부품 공정용 양면 점착 백 테이프 및 이를 이용한 전자 부품의 분리방법

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016072280A (ja) * 2014-09-26 2016-05-09 ファスフォードテクノロジ株式会社 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法
JP2019071371A (ja) * 2017-10-11 2019-05-09 三菱電機株式会社 半導体ピックアップ装置
KR102130475B1 (ko) * 2019-11-21 2020-07-06 제너셈(주) 픽커 구조체 및 이를 포함하는 패키지 탈거 장치

Also Published As

Publication number Publication date
TWI321823B (ko) 2010-03-11
KR20050006064A (ko) 2005-01-15
KR100592338B1 (ko) 2006-06-22
TW200504917A (en) 2005-02-01

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Effective date: 20061003