TW200504917A - Pickup device and pickup method of electronic component and recording medium recorded with the pickup program of electronic component - Google Patents
Pickup device and pickup method of electronic component and recording medium recorded with the pickup program of electronic componentInfo
- Publication number
- TW200504917A TW200504917A TW093115627A TW93115627A TW200504917A TW 200504917 A TW200504917 A TW 200504917A TW 093115627 A TW093115627 A TW 093115627A TW 93115627 A TW93115627 A TW 93115627A TW 200504917 A TW200504917 A TW 200504917A
- Authority
- TW
- Taiwan
- Prior art keywords
- electronic component
- bonding sheet
- pickup
- bonding
- stage
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003272072A JP2005033065A (ja) | 2003-07-08 | 2003-07-08 | 電子部品ピックアップ装置、電子部品ピックアップ方法及び電子部品ピックアッププログラム |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200504917A true TW200504917A (en) | 2005-02-01 |
TWI321823B TWI321823B (ko) | 2010-03-11 |
Family
ID=34209742
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093115627A TW200504917A (en) | 2003-07-08 | 2004-06-01 | Pickup device and pickup method of electronic component and recording medium recorded with the pickup program of electronic component |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2005033065A (ko) |
KR (1) | KR100592338B1 (ko) |
TW (1) | TW200504917A (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101527184B1 (ko) * | 2013-10-14 | 2015-06-09 | 도레이첨단소재 주식회사 | 전자 부품 공정용 양면 점착 백 테이프 및 이를 이용한 전자 부품의 분리방법 |
JP6324860B2 (ja) * | 2014-09-26 | 2018-05-16 | ファスフォードテクノロジ株式会社 | 半導体若しくは電子部品実装装置及び半導体若しくは電子部品実装方法 |
JP6843725B2 (ja) * | 2017-10-11 | 2021-03-17 | 三菱電機株式会社 | 半導体ピックアップ装置 |
KR102130475B1 (ko) * | 2019-11-21 | 2020-07-06 | 제너셈(주) | 픽커 구조체 및 이를 포함하는 패키지 탈거 장치 |
-
2003
- 2003-07-08 JP JP2003272072A patent/JP2005033065A/ja not_active Withdrawn
-
2004
- 2004-06-01 TW TW093115627A patent/TW200504917A/zh not_active IP Right Cessation
- 2004-07-07 KR KR1020040052558A patent/KR100592338B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20050006064A (ko) | 2005-01-15 |
TWI321823B (ko) | 2010-03-11 |
KR100592338B1 (ko) | 2006-06-22 |
JP2005033065A (ja) | 2005-02-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |