JP2005005670A - Carrying member with cleaning function and cleaning method for substrate processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a carrying member with cleaning function with which vacuum down in a device caused by the carrying member is hard to be caused, and removal operation for an foreign object is easily and surely performed, when the carrying member is carried into a substrate processing device for cleaning removal for the foreign object in the device. <P>SOLUTION: In the carrying member with cleaning function in which a cleaning layer is provided at least on a single surface of the carrying member, when the member is thrown in a chamber whose degree of vacuum is 3×10<SP>-10</SP>torr and temperature is 50°C, a time for recovering the degree of vacuum, temporarily came down, to 1×10<SP>-9</SP>torr is within 100 minutes after throwing in. Especially, the carrying member with cleaning function having the constitution in which the cleaning layer has no adhesive force substantially, or the carrying member with cleaning function having a constitution in which the cleaning layer comprises heat-resisting polymer resin is provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

The present invention relates to a conveying member with a cleaning function for cleaning various substrate processing apparatuses that dislike foreign matters, such as manufacturing apparatuses and inspection apparatuses for semiconductors, flat panel displays, printed boards, and the like, and a method for cleaning a substrate processing apparatus using the same. And a substrate processing apparatus cleaned by this method.

In various types of substrate processing apparatuses, each transport system and the substrate are transported while being in physical contact. At that time, if foreign matter adheres to the substrate or the transport system, subsequent substrates are successively contaminated. For this reason, it is necessary to periodically stop the apparatus and perform a cleaning process, which causes a problem that a reduction in operating rate and a great deal of labor are required.

In order to solve these problems, a method of transporting a substrate to which an adhesive substance is adhered and cleaning and removing foreign substances adhering to the inside of the substrate processing apparatus (see Patent Document 1), transporting a plate-like member to the back surface of the substrate A method (see Patent Document 2) for removing adhering foreign matter has been proposed. According to these methods, since there is no need to stop the substrate processing apparatus and perform the cleaning process, there is no problem that the operating rate is reduced and a great deal of labor is required. In particular, the former method is based on the removal of foreign matters. It is excellent.
Gyokaihei 10-154686 (pages 2-4) Japanese Patent Laid-Open No. 11-87458 (pages 2 to 3)

However, in the former method, a large amount of volatile gas is generated from the sticky substance when the inside of the transfer device is heated at 100 ° C. or under a high vacuum (10 ⁻⁹ torr). As a result, the inside of the apparatus is contaminated, the degree of vacuum is lowered, and the foreign matter removal operation cannot be easily performed.

In particular, the substrate processing apparatus is often processed under high vacuum conditions such as a plasma etching apparatus, a sputtering apparatus, a dry etching apparatus, a reactive ion etching apparatus, and a CVD apparatus, and these apparatuses perform cleaning. There was a problem of lowering the degree of vacuum.

In light of such circumstances, the present invention is less likely to cause a decrease in the degree of vacuum in the apparatus due to the transport member when cleaning and removing foreign substances in the substrate processing apparatus and removing foreign substances. It is an object to provide a conveying member with a cleaning function that can easily and reliably perform

The applicant of the present invention previously stated that a decrease in the degree of vacuum in the high-vacuum substrate processing apparatus as described above is caused by an aliphatic component, an aromatic component, a solvent component that is a contaminating component, Knowing that the cause is a plasticizer component such as an acid ester, and the like, a cleaning member in which the amount of these volatile gases is regulated to a specific value or lower is disclosed in Japanese Patent Application No. 2000-349972 (= Japanese Patent Application Laid-Open No. 2002-113435). As suggested.

However, according to the subsequent studies by the present inventors, even when the above-described proposed cleaning member is used, if the foreign material is removed by transporting it into the high vacuum substrate processing apparatus, the degree of vacuum caused by the cleaning member is reduced. It has been found that the reduction may occur and the substrate processing apparatus may become unusable.

Therefore, as a result of further investigation on this cause, the decrease in the degree of vacuum is not limited to the above-mentioned proposed aliphatic component, aromatic component, solvent component and plasticizer component, but also due to moisture volatilized under high vacuum. The knowledge that it is.

Based on this finding, the inventors have reduced the normal moisture absorption rate of the cleaning layer, etc. by heat treatment, etc., or reduced the absolute amount of moisture by reducing the thickness of the cleaning layer, etc. When the amount of water volatilized under high vacuum was reduced as much as possible, the decrease in the degree of vacuum when it was transported under high vacuum was suppressed. By restricting the time until the vacuum degree that temporarily decreases when it is put into the chamber is restored to the original vacuum degree, it is surely played, and thereby the degree of vacuum in an actual high vacuum substrate processing apparatus. As a result, the present invention has been completed.

That is, according to the present invention, in the transport member with a cleaning function in which the cleaning layer is provided on at least one surface of the transport member, when this member is put into a chamber having a vacuum degree of 3 × 10 ⁻¹⁰ torr and a temperature of 50 ° C., The present invention relates to a conveying member with a cleaning function, characterized in that the time during which the degree of vacuum temporarily lowering is restored to 1 × 10 ⁻⁹ torr is within 100 minutes after being charged.

In particular, the transport member with the cleaning function having the above-described configuration in which the cleaning layer has substantially no adhesive force, the transport member with the cleaning function having the above-described configuration made of a heat-resistant polymer resin, and the cleaning layer on the support. The cleaning layer is provided on the transport member with the support inside, the transport member with the cleaning function having the above structure, the cleaning layer on one side of the support, and the adhesive layer on the other side, The transport member with a cleaning function having the above-described configuration in which the cleaning layer is provided on the transport member via the pressure-sensitive adhesive layer can be provided.

The present invention also relates to a cleaning method for a substrate processing apparatus, wherein the transport member with a cleaning function having the above-described configuration is transported into the substrate processing apparatus. Furthermore, the present invention can provide a substrate processing apparatus cleaned by the above-described cleaning method.

As described above, in the present invention, when transporting into the substrate processing apparatus and cleaning and removing foreign matter in the apparatus, the transport member with the cleaning function is restricted to a specific value or less, so that the transport member is Therefore, it is possible to provide a highly practical transfer member with a cleaning function that can suppress a decrease in the degree of vacuum during transfer into the apparatus and can easily and reliably remove foreign matters in the processing apparatus.

The conveying member with a cleaning function according to the present invention has a cleaning layer provided on at least one side of the conveying member, and the vacuum temporarily lowers when placed in a chamber having a degree of vacuum of 3 × 10 ⁻¹⁰ torr and a temperature of 50 ° C. The time until the degree returns to 1 × 10 ^-9 torr, that is, the time until the degree of vacuum that temporarily decreases when it is put into the vacuum chamber at the predetermined temperature returns to the original degree of vacuum. , Within 100 minutes, preferably within 50 minutes.

By using such a conveying member with a cleaning function, when this is conveyed into a high-vacuum substrate processing apparatus, an extreme decrease in the degree of vacuum of the apparatus can be suppressed, and the apparatus can be disabled. Therefore, foreign matters in the processing apparatus can be easily and reliably removed by cleaning.

On the other hand, when a transport member with a cleaning function is used that takes more than 100 minutes after the time until it returns to the above-mentioned original vacuum degree, when the transport member with a cleaning function is transported into the high vacuum substrate processing apparatus, the cleaning layer Moisture contained in the inside volatilizes and the degree of vacuum of the apparatus decreases. As a result, it takes time for the apparatus to return to the initial degree of vacuum, and in the worst case, problems such as the apparatus being stopped tend to occur.

In this specification, the measurement of the time until the vacuum level is restored to the original level is measured using a temperature-desorption mass spectrometer (“EMD-WA1000S” manufactured by Denshi Kagaku Co., Ltd.) using a conveyance member with a cleaning function as a sample. )).

Here, the measurement conditions were that the temperature in the chamber was maintained at 50 ° C., the sample size was 1 cm ² , the initial vacuum was 3 × 10 ⁻¹⁰ torr, and the vacuum level returned to 10 ⁻⁹ torr after the sample was charged. The time is obtained as the vacuum recovery time.

The conveying member with a cleaning function of the present invention may be any member as long as the degree of vacuum recovery is regulated so as to be within the specified value, and the material configuration is not particularly limited. Normally, in addition to reducing volatile components such as aliphatic components, aromatic components, solvent components, and plasticizer components contained in the cleaning layer, the normal moisture absorption rate of the cleaning layer is lowered. In particular, the normal moisture absorption rate is 1% by weight. The following are preferably used. In order to obtain the above-mentioned normal moisture absorption rate, the conveying member is used under conditions that do not lower the function thereof, for example, 40 to 200 ° C., preferably 50 to 150 ° C., more preferably 50 to 100 ° C. for 1 to 120 minutes, preferably 1 It is better to heat and dehumidify for ~ 60 minutes. Furthermore, in order to reduce the absolute amount of moisture, the thickness of the cleaning layer should be reduced unless its function is lowered, and it is usually desirable to be 1 to 30 μm.

In the present invention, the cleaning layer has a tensile modulus (test method: JIS K7127) of 10 Mpa or more, preferably 10 to 2,000 Mpa. When the tensile elastic modulus is 10 Mpa or more, protrusion of the cleaning layer at the time of label cutting and cutting failure can be suppressed, and a label sheet with a cleaning function free from contamination can be produced by a pre-cut method, and adhered to a contact portion in the apparatus during conveyance. There is no risk of transport problems. When the tensile modulus is 2,000 Mpa or less, good results can be obtained in the removal of foreign matters in the transport system.

Such a cleaning layer is not particularly limited in its material, but is preferably composed of a resin layer polymerized and cured by an active energy source such as ultraviolet rays or heat. This is because the above-mentioned polymerization and curing causes the molecular structure to become a three-dimensional network, which is substantially non-adhesive, and does not adhere strongly to the apparatus contact portion during conveyance, and a cleaning member that can be reliably conveyed in the substrate processing apparatus is obtained. Because.

Here, “substantially non-adhesive” means that there is no pressure-sensitive tack representing the adhesive function when the essence of the adhesive is friction, which is resistance to slipping. This pressure-sensitive tack develops, for example, in accordance with the Dahlquist standard, in the range where the elastic modulus of the adhesive substance is between 1 MPa.

Examples of the polymer-cured resin layer include, for example, a compound having at least one unsaturated double bond in the molecule (hereinafter referred to as a polymerizable unsaturated compound) and a polymerization initiator in a pressure-sensitive adhesive polymer, and crosslinking if necessary. And a curable resin composition containing an agent and the like cured by an active energy source, particularly ultraviolet rays.

Examples of the pressure-sensitive adhesive polymer include an acrylic polymer having (meth) acrylic acid and / or (meth) acrylic acid ester as a main monomer. In synthesizing this acrylic polymer, a compound having two or more unsaturated double bonds in the molecule is used as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule is functionalized in the synthesized acrylic polymer. An unsaturated double bond may be introduced into the molecule of the acrylic polymer, for example, by a chemical bond between the groups. With this introduction, the acrylic polymer itself can be involved in the polymerization curing reaction.

The polymerizable unsaturated compound is preferably a non-volatile and low molecular weight material having a weight average molecular weight of 10,000 or less, particularly 5,000 or less so that three-dimensional networking can be efficiently performed during curing. It is preferable to have a molecular weight of

Examples of such polymerizable compounds include phenoxy polyethylene glycol (meth) acrylate, ε-caprolactone (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, and trimethylolpropane tri (meth). Examples include acrylate, dipentaerythritol hexa (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, and oligoester (meth) acrylate. Among these compounds, one or more are used.

It does not specifically limit as a polymerization initiator, A well-known thing can be used widely.

For example, when using heat as an active energy source, a thermal polymerization initiator such as benzoyl peroxide or azobisisobutyronitrile, and when using light, benzoyl, benzoin ethyl ether, cibenzyl, isopropyl benzoin ether, benzophenone, Light of Michler's ketone chlorothioxanthone, dodecylthioxanthone, cymethylthioxanthone, acetophenone diethyl ketal, benzyldimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenylpropane, 2,2-dimethoxy-2-phenylacetophenone A polymerization initiator is mentioned.

The cleaning layer may be made of a heat-resistant polymer resin. In this case, even if it is applied to a substrate processing apparatus that performs high-temperature processing, such as an ozone asher, a resist coater, an oxidation diffusion furnace, an atmospheric pressure CVD apparatus, a low pressure CVD apparatus, a plasma CVD apparatus, etc. It can be used without causing defects or contamination.

The polymer resin having heat resistance is not particularly limited, but examples thereof include ladder polymers such as phenyl-T, polyquinoxaline, polybenzoylene benzimidazole, polyphenylene, polyamide, polyimide, polybenzimidazole, polycarbodiimide, and aramid. Aromatic polymers and the like. In particular, polyimide, polyamide, polycarbodiimide, and the like are suitable as a cleaning layer in that they do not generate volatile gas or decomposition monomer even when exposed to a high temperature of 400 ° C. or higher.

The cleaning layer having the above material structure has a 180 ° peel-off adhesive force (measured according to JIS Z0237) of 0.2 N / 10 mm width or less, preferably 0.01-0. The width is preferably about 1N / 10 mm. By using such low adhesion or non-adhesion, it does not adhere to the contacted part in the apparatus at the time of conveyance, and a conveyance trouble does not occur.

In the present invention, such a cleaning layer is formed by itself into a sheet shape or a tape shape, and this is provided on at least one surface of the transport member using an appropriate pressure-sensitive adhesive. To do. Preferably, the cleaning layer is provided on a support, and the support is provided on at least one side of the conveying member with the support facing inward. Even more preferably, the cleaning layer is provided on one side of the support. A transporting member with a cleaning function is provided by providing a pressure-sensitive adhesive layer and providing the cleaning layer on at least one surface of the transporting member via the pressure-sensitive adhesive layer.

In the case where the cleaning layer is made of a heat resistant resin, the resin is directly applied and dried on a transfer member such as a silicon wafer by spin coating or spraying to form a cleaning layer, or the above resin The substrate is coated and dried on the support by a comma coat method, a fountain method, a gravure method, etc. to form a cleaning layer, and this is laminated (laminated) with the support on the above conveying member or cleaned. A transfer member with a cleaning function can be obtained by transferring only the layer.

Note that the heating temperature during coating and drying is preferably 200 ° C. or higher, and it is desirable to perform the treatment under an inert atmosphere such as a nitrogen atmosphere or a vacuum in order to prevent oxidative degradation of the resin. Thereby, the volatile component remaining in the resin can be completely removed.

According to the transport member with a cleaning function manufactured as described above, by restricting the vacuum degree return time of the entire member including the cleaning layer within the above-described specific value, When transported to a vacuum substrate processing apparatus, there is no extreme decrease in the degree of vacuum as in the prior art, and there is no hindrance to the operation of the processing apparatus, and the cleaning layer of this transport member is brought into contact with a non-contact portion. As a result, the foreign matter adhering to the part can be easily and reliably removed by cleaning.

The support for supporting the cleaning layer is not particularly limited. For example, polyolefin film such as polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene-vinyl acetate copolymer, ionomer resin, ethylene Examples thereof include a plastic film made of-(meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, polystyrene, polycarbonate, polyimide and the like.

Among these, polyolefin films and ethylene-vinyl acetate copolymer films are particularly preferable because of their low hygroscopic materials. Moreover, when a polymer resin having heat resistance is used as the cleaning layer, a polyethylene terephthalate film, a polyimide film, or the like is preferable. These supports may be used singly or in combination of two or more, and may be one or both surfaces subjected to surface treatment such as corona treatment.

The pressure-sensitive adhesive layer provided on the other surface of the support is not particularly limited with respect to the material configuration, and any ordinary pressure-sensitive adhesive such as acrylic or rubber can be used. Among these, as the acrylic pressure-sensitive adhesive, those mainly composed of an acrylic polymer having a component having a weight average molecular weight of 100,000 or less and 10% by weight or less are preferably used.

The acrylic polymer can be synthesized by, for example, polymerizing a monomer mixture in which (meth) acrylic acid alkyl ester is used as a main monomer and another monomer that can be copolymerized is added if necessary.

Such a pressure-sensitive adhesive layer usually has a thickness of 5 to 100 μm, and particularly preferably 5 to 20 μm in order to reduce the absolute amount of moisture.

In addition, this adhesive layer has a 180-degree peeling adhesive strength to the silicon wafer (mirror surface) of 0.01 to 10 N / 10 mm width, particularly preferably 0.05 to 5 N / 10 mm width. If the adhesive strength is too high, the support may be torn when the cleaning layer is peeled off from the conveying member via the support.

In this invention, in order to protect a cleaning layer and said adhesive layer, you may bond a protective film on these layers.

For this protective film, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, which has been subjected to release treatment with release agents such as silicone, long chain alkyl, fluorine, fatty acid amide, silica, etc. , Polyurethane, ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, polystyrene, polycarbonate and other plastic films. In addition, since a film made of a polyolefin resin such as polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, etc. has releasability without using a release treatment agent, it can be used alone as a protective film.

The protective film made of such various materials preferably has a thickness of usually about 10 to 100 μm.

In the transport member with a cleaning function of the present invention, the transport member on which the cleaning layer is provided is not particularly limited, and various substrates are used depending on the type of substrate processing apparatus to be subjected to foreign matter removal. Specific examples include substrates for flat panel displays such as semiconductor wafers (silicon wafers), LCDs, and PDPs, and other substrates such as compact disks and MR heads.

Since the conveyance member with a cleaning function of the present invention is designed to suppress a decrease in the degree of vacuum, the substrate processing apparatus to be cleaned using this is preferably a high vacuum type substrate processing apparatus, but is not particularly limited. Examples include an exposure apparatus, a resist coating apparatus, a developing apparatus, an ashing apparatus, a dry etching apparatus, an ion implantation apparatus, a PVD apparatus, a CVD apparatus, an appearance inspection apparatus, and a wafer prober.

The present invention can provide each of the above-described substrate processing apparatuses transported and cleaned by the transport member with a cleaning function of the present invention.

Next, the present invention will be described based on examples, but the present invention is not limited thereto. In the following, “parts” means parts by weight.

Polyethylene glycol 200 dimethacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.) was added to 100 parts of an acrylic polymer (weight average molecular weight 700,000) obtained from a monomer mixture consisting of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate and 5 parts of acrylic acid. (Trade name “NK ester 4G”) 200 parts, polyisocyanate compound (trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.) 3 parts, epoxy compound (trade name “Tetrad C” manufactured by Mitsubishi Gas Chemical Co., Ltd.) 2 UV curable resin composition A was prepared by uniformly mixing 3 parts of benzyl dimethyl ketal (trade name “Irgacure 651” manufactured by Ciba Specialty Chemicals) as a photopolymerization initiator.

Separately, in a three-necked flask type reactor having an internal volume of 500 ml equipped with a thermometer, a stirrer, a nitrogen inlet tube and a reflux condenser, 73 parts of 2-ethylhexyl acrylate and 10 parts of n-butyl acrylate , 15 parts of N, N-dimethylacrylamide and 5 parts of acrylic acid, 0.15 part of 2,2′-azobisisobutyronitrile as a polymerization initiator and 100 parts of ethyl acetate, resulting in a total of 200 g The mixture was added and stirred while introducing nitrogen gas for about 1 hour, and the air inside was replaced with nitrogen. Thereafter, the internal temperature was set to 58 ° C., and the polymerization was carried out in this state for about 4 hours to obtain an adhesive polymer solution. To 100 parts of this polymer solution, 3 parts of a polyisocyanate compound (trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.) was uniformly mixed to prepare an adhesive solution A.

On the silicone release treatment surface of the protective film made of a long polyester film (trade name “MRF50N100” manufactured by Mitsubishi Chemical Polyester Film Co., Ltd., thickness 50 μm, width 250 mm) treated on one side with a silicone release agent, The pressure-sensitive adhesive solution A was applied so that the thickness after drying was 5 μm. A long ethylene-vinyl acetate copolymer film (thickness: 100 μm, width: 250 mm) was laminated on the pressure-sensitive adhesive layer as a support. Further, an ultraviolet curable resin composition A is applied onto the film so that the thickness after drying is 5 μm, and a resin layer is provided, and a protective film (“MRF50N100” as described above is provided on the surface thereof. The laminated sheet A was obtained by pasting the silicone release treatment side of “)”.

The laminated sheet A was irradiated with ultraviolet rays having a central wavelength of 365 nm and an integrated light quantity of 1,000 mJ / cm ² to obtain a cleaning sheet A having a cleaning layer composed of a polymerized and cured resin layer. The protective film on the cleaning layer side of the cleaning sheet A was peeled off, and the 180 ° peel adhesion (measured according to JIS Z0237) to the silicon wafer (mirror surface) was measured. As a result, the width was 0.06 N / 10 mm. . Moreover, the tensile strength (tensile modulus: measured according to test method JIS K7127) of this cleaning layer was 440 Mpa.

The protective film on the pressure-sensitive adhesive layer side of the cleaning sheet A was peeled off and attached to the mirror surface of an 8-inch silicon wafer with a hand roller to prepare a conveying member A with a cleaning function. The adhesive strength of the above adhesive layer to the silicon wafer (mirror surface) was 180 N and the width was 1.5 N / 10 mm.

Further, the protective film on the cleaning layer side of the conveying member A with the cleaning function was peeled off, and the vacuum recovery time was measured using a temperature programmed desorption mass spectrometer (“EMD-WA1000S” manufactured by Electronic Science Co., Ltd.). As a result, it was 50 minutes.

Using a laser surface inspection apparatus, foreign matters of 0.2 μm or more on the mirror surface of three new 8-inch silicon wafers were measured and found to be 10, 3, and 5, respectively. Next, these wafers are transferred to separate sputtering devices having an electrostatic attraction mechanism and a vacuum degree of 10 ⁻⁹ torr in the device with the mirror surface facing downward, and then a laser surface inspection device Then, the mirror surface was measured again. As a result, there were 15,553, 16,643, and 14,961 foreign matters of 0.2 μm or more in an 8-inch wafer size area, respectively.

Next, the transport member A with the cleaning function was transported to the sputtering device having the wafer stage on which the 15,553 foreign substances had been adhered with the protective film on the cleaning layer side peeled off. The inside vacuum was kept at 10 ^-9 torr and could be transported without any trouble. This operation was repeated 5 times. After that, a new 8-inch silicon wafer was transported with the mirror surface facing downward, and a foreign object measuring 0.2 μm or more was measured with a laser particle inspection device. As a result, 90% of the foreign object was removed from the initial stage. It was.

In this way, when the transport member A with a cleaning function is transported to the sputtering apparatus, the degree of vacuum in the apparatus is not reduced, and the apparatus can be cleaned without any problems in using the apparatus.

The pressure-sensitive adhesive solution A prepared in Example 1 was applied to the silicone release treatment surface of the same protective film (“MRF50N100”) as in Example 1 so that the thickness after drying was 15 μm. A long polyester film (thickness 50 μm, width 250 mm) was laminated as a support on the adhesive layer. Further, on the film, the ultraviolet curable resin composition A prepared in Example 1 was applied so that the thickness after drying was 30 μm, a resin layer was provided, and the surface thereof was the same as described above. A laminated sheet B was obtained by pasting together the silicone release treatment side of the protective film.

Using this laminated sheet B, a cleaning sheet B and a conveying member B with a cleaning function were produced in the same manner as in Example 1 below.

Next, the protective film on the cleaning layer of the conveying member B with the cleaning function was peeled off, and heat-treated at 90 ° C. for 10 minutes. Thereafter, in the same manner as in Example 1, the time for returning the degree of vacuum of the conveying member B with the cleaning function was measured and found to be 30 minutes.

Next, when the transport member B with the cleaning function was transported to the sputtering apparatus having the wafer stage on which the 16,643 foreign substances had adhered, the protective film on the cleaning layer side was peeled off, and the apparatus was transported. The inside vacuum was kept at 10 ^-9 torr and could be transported without any trouble. This operation was repeated 5 times. After that, a new 8-inch silicon wafer was transported with the mirror surface facing downward, and a foreign object measuring 0.2 μm or more was measured with a laser particle inspection device. As a result, 93% of the foreign object was removed from the initial stage. It was.

As described above, when the transport member B with the cleaning function is transported to the sputtering apparatus, the degree of vacuum in the apparatus is not reduced, and the apparatus can be cleaned without any problems in using the apparatus.

Comparative Example 1
The pressure-sensitive adhesive solution A prepared in Example 1 was applied to the silicone release treatment surface of the same protective film (“MRF50N100”) as in Example 1 so that the thickness after drying was 30 μm. A long polyester film (thickness 50 μm, width 250 mm) was laminated as a support on the adhesive layer. Further, on the film, the ultraviolet curable resin composition A prepared in Example 1 was applied so that the thickness after drying was 60 μm, and a resin layer was provided, and the surface thereof was the same as described above. A laminated sheet C was obtained by laminating the silicone release surface side of the protective film.

Using this laminated sheet C, a cleaning sheet C and a conveying member C with a cleaning function were produced in the same manner as in Example 1.

With respect to this conveying member C with a cleaning function, the vacuum degree recovery time was measured in the same manner as in Example 1, and was 120 minutes.

Next, when the transporting member C with the cleaning function was transported to the sputtering apparatus having the wafer stage on which the 14,961 foreign matter had adhered, the protective film on the cleaning layer side was peeled off, and one sheet was transported. As a result, the degree of vacuum in the apparatus dropped from 10 ^-9 torr to 10 ^-1 torr, and the cleaning of the second and subsequent sheets was stopped.

As described above, in the transport member C with the cleaning function, when transported to the sputtering apparatus, the degree of vacuum in the apparatus is extremely lowered, and the apparatus cannot be used and cannot be cleaned.

Claims (7)

In a transport member with a cleaning function in which a cleaning layer is provided on at least one side of the transport member, a vacuum that temporarily decreases when the member is put into a chamber having a degree of vacuum of 3 × 10 ⁻¹⁰ torr and a temperature of 50 ° C. A conveying member with a cleaning function, wherein the time for returning to a degree of 1 × 10 ⁻⁹ torr is within 100 minutes after being charged.
The conveying member with a cleaning function according to claim 1, wherein the cleaning layer has substantially no adhesive force.
The conveying member with a cleaning function according to claim 1, wherein the cleaning layer is made of a polymer resin having heat resistance.
The conveyance member with a cleaning function according to claim 1, further comprising a cleaning layer on the support, the cleaning layer being provided on the conveyance member with the support inside.
The cleaning layer is provided on one side of the support, the pressure-sensitive adhesive layer is provided on the other side, and the cleaning layer is provided on the conveying member via the pressure-sensitive adhesive layer. Conveying member with cleaning function.
6. A method for cleaning a substrate processing apparatus, comprising transporting the transport member with a cleaning function according to claim 1 into the substrate processing apparatus.
A substrate processing apparatus cleaned by the cleaning method according to claim 6.