JP4406156B2 - Cleaning method for substrate processing apparatus and cleaning sheet used therefor - Google Patents
Cleaning method for substrate processing apparatus and cleaning sheet used therefor Download PDFInfo
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- JP4406156B2 JP4406156B2 JP2000215232A JP2000215232A JP4406156B2 JP 4406156 B2 JP4406156 B2 JP 4406156B2 JP 2000215232 A JP2000215232 A JP 2000215232A JP 2000215232 A JP2000215232 A JP 2000215232A JP 4406156 B2 JP4406156 B2 JP 4406156B2
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Landscapes
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、各種の基板処理装置のクリーニング方法、及びこれに用いるクリーニングシートに関し、例えば、半導体、フラットパネルディスプレイ、プリント基板などの製造装置や検査装置など、異物を嫌う基板処理装置のクリーニング方法及びクリーニングシートに関する。
【０００２】
【従来の技術】
各種基板処理装置は、各搬送系と基板とを物理的に接触させながら搬送する。その際、基板や搬送系に異物が付着していると、後続の基板を次々に汚染することになり、定期的に装置を停止させ、洗浄処理をする必要があった。このため、稼働率低下や多大な労力が必要になるという問題があった。これらの問題を解決するため、粘着性の物質を固着した基板を搬送することにより基板処理装置内の付着した異物をクリーニング除去する方法（特開平１０−１５４６８６号）や板状部材を搬送することにより基板裏面に付着する異物を除去する方法（特開平１１−８７４５８号）が提案されている。
【０００３】
【発明が解決しようとする課題】
粘着性の物質を固着した基板を搬送することにより基板処理装置内の付着した異物をクリーニング除去する方法や、板状部材を搬送することにより異物を除去する方法は、前述の課題を克服する有効な方法である。 しかしこれらの方法では粘着性物質や板状部材の厚さがまちまちでその制御が難しく、その厚さが厚い場合には、基板処理装置内を搬送できない恐れがあった。 特に、半導体関連装置では、搬送系における被処理基板（ウエハ）厚みに対する装置のクリアランスが非常に小さい装置が多く、搬送すべき基板の厚さが制御できていない場合は、基板が装置に接触して基板や搬送経路を損傷するという問題がある。
本発明は、このような事情に照らし、基板処理装置内にクリーニング用基板を確実に搬送できると共に、装置内に付着している異物を簡便かつ確実に除去できるクリーニング方法を提供することを目的としている。
【０００４】
【課題を解決するための手段】
本発明者らは、上記の目的を達成するために、鋭意検討した結果、クリーニング機能物質が設けられた基板を搬送するにあたり、クリーニング機能物質が設けられた基板の厚さ、あるいはこれに用いるクリーニングシートの厚さを特定範囲内に制御することにより、前記問題を生じることなく、さらに異物を簡便かつ確実に剥離除去できることを見出し、本発明を完成するに至つた。
【０００５】
即ち、本発明は、クリーニング機能物質が設けられた基板を搬送することにより、基板処理装置内に付着した異物をクリーニング除去する方法において、上記のクリーニング機能物質が、クリーニング層と通常の粘着剤層とからなる積層シート形状であるか、または支持体の片面にクリーニング層が設けられ、他面に通常の粘着剤層が設けられてなる積層シート形状であり、上記の各クリーニング層は、分子内に不飽和二重結合を１個以上有する化合物と重合開始剤とを含ませた硬化型感圧性接着剤組成物を活性エネルギーにより硬化させてなる、ＪＩＳ Ｋ７１２７に準じて測定される引張り強さが１〜３，０００ＭＰａの範囲内にある、実質的に粘着性を有しないものからなると共に、上記の各粘着剤層を介して基板に貼り付けられてなり、該クリーニング機能物質を設けた基板の厚さが、基板処理装置の本来の被処理基板の厚さの１４０％以下であることを特徴とする基板処理装置のクリーニング方法に係るものである。
【０００６】
【発明の実施の形態】
本発明のクリーニング方法においては、クリーニング機能物質を設けた基板の厚さが、基板処理装置の本来の被処理基板の厚さの１４０％以下であることが必要で、さらに好ましくは１２０％以下であることが望ましい。 かかる厚さが１４０％を超えると、基板が装置に接触して基板や搬送経路を損傷する恐れがある。
一方、かかる厚さの下限は、基板が搬送できる限り特に限定されない。
【０００７】
本発明における本来の被処理基板は、特に限定されないが、例えば半導体基板（ウエハ）、ＬＣＤ、ＰＤＰなどのフラットパネルディスプレイ用基板、その他コンパクトディスク、ＭＲヘッドなどの基板などが挙げられる。
【０００８】
本発明において上記基板に設けられるクリーニング機能物質は、クリーニング機能を有する限りその形状は限定されないが、取り扱い性、搬送性などの点からシート形状（以下、クリーニングシートということがある）が好ましい。 かかるクリーニングシートは、それが設けられた基板の全体の厚さが上記の特定値の範囲内であれば、その構成、厚さ、材料などは特に限定されない。
クリーニングシートの具体的構成例としては、例えばクリーニング層と通常の粘着剤層とからなる積層シート形状、支持体の片面にクリーニング層が設けられ、他面に通常の粘着剤層が設けられてなる積層シート形状などが挙げられる。 かかる通常の粘着剤層により、クリーニング層を基板に固着することができる。
【０００９】
このクリーニングシート自体の厚さは、それが設けられたクリーニング用基板の全体の厚さが上記の特定値の範囲内であれば、特に限定されないが、基板処理装置の本来の被処理基板の厚さの通常４０％以下、好ましくは２０％以下であることが望ましい。 すなわち、このクリーニングシート自体の厚さは、被処理基板の厚さに応じて任意に制御することができ、例えば被処理基板が半導体ウエハの場合であって、クリーニング用に搬送する基板が本来の被処理ウエハより薄い再生ウエハの場合は、かかる薄膜化再生ウエハに設けるクリーニングシートの厚みを厚くすることにより、クリーニング用ウエハの全体厚さを本来の処理ウエハと同等に調整して、薄膜化再生ウエハによる搬送トラブルを回避することも可能である。
【００１０】
上記クリーニングシートのクリーニング層は、その厚さが上記特定範囲内に制御されている限り、その材料などは特に限定されないが、例えば、ポリプロピレン、ポリエチレンテレフタレート、ポリエチレンナフタレート、ポリ弗化ビニリデン、弗化ビニリデン、三弗化ビニリデン、ポリテトラフルオロエチレンなどのポリマーや、後述の紫外線や熱などの活性エネルギー源により架橋反応や硬化が促進された硬化型感圧性接着剤組成物などが挙げられる。
【００１１】
本発明においては、特に紫外線や熱などの活性エネルギー源により架橋反応や硬化が促進されて、その引張り強さを大きくできるものが好ましい。 さらに、装置内の被クリーニング部とぬれにくいほうが好ましい。 ぬれやすいと搬送時にクリーニングシートが被クリーニング部に密着して、搬送トラブルとなる恐れがある。 またクリーニング層の厚さもクリーニング層を設けた基板全体の厚さが、本発明の特定範囲内にある限り特に限定されないが、通常５〜１００μｍ程度である。
【００１２】
かかるクリーニング層の具体例としては、例えば感圧接着性ポリマーに分子内に不飽和二重結合を１個以上有する化合物と重合開始剤を少なくとも含有させたものを、活性エネルギーにより重合硬化反応させて粘着性が実質的に消失されてなるものが挙げられる。 かかる感圧接着性ポリマーとしては、例えばアクリル酸、アクリル酸エステル、メタクリル酸、メタクリル酸エステルから選ばれる（メタ）アクリル酸及び／又は（メタ）アクリル酸エステルを主モノマーとしたアクリル系ポリマーが挙げられる。このアクリル系ポリマーの合成にあたり、共重合モノマーとして分子内に不飽和二重結合を２個以上有する化合物を用いるか、あるいは合成後のアクリル系ポリマーに分子内に不飽和二重結合を有する化合物を官能基間の反応で化学結合させるなどして、アクリル系ポリマーの分子内に不飽和二重結合を導入しておくことにより、このポリマー自体も活性エネルギーにより重合硬化反応に関与させるようにすることもできる。
【００１３】
ここで、分子内に不飽和二重結合を１個以上有する化合物（以下、重合性不飽和化合物という）としては、不揮発性でかつ重量平均分子量が１００００以下の低分子量体であるのがよく、特に硬化時のクリーニング層の三次元網状化が効率よくなされるように、５０００以下の分子量を有しているのが好ましい。
【００１４】
また、クリーニング層に添加される重合開始剤は、特に限定されず公知のものを使用でき、例えば活性エネルギー源に熱を用いる場合は、ベンゾイルパーオキサイド、アゾビスイソブチロニトリルなどの熱重合開始剤、また光を用いる場合は、ベンゾイル、ベンゾインエチルエーテル、シベンジル、イソプロピルベンゾインエーテル、ベンゾフェノン、ミヒラーズケトンクロロチオキサントン、ドデシルチオキサントン、ジメチルチオキサントン、アセトフェノンジエチルケタール、ベンジルジメチルケタール、α−ヒドルキシシクロヒキシルフェニルケトン、２−ヒドロキシジメチルフェニルプロパン、２，２−ジメトキシ−２−フェニルアセトフェノンなどの光重合開始剤が挙げられる。
【００１５】
また本発明においては、クリーニング層の引張り強さが１〜３０００ＭＰａ、好ましくは１００〜２０００ＭＰａの範囲内に設計することが、搬送トラブルを発生を極力避け、異物を簡便かつ確実に除去することができる点から好ましい。ここで引張り強さは、試験法 ＪＩＳ Ｋ７１２７に準じて測定したものである。
【００１６】
本発明は、上記の特定のクリーニング層の片面に、粘着剤層が設けられたクリーニングシート、また支持体の片面に、上記の特定のクリーニング層が設けられ、他面に粘着剤層が設けられたクリーニングシートも提供する。この粘着剤層は、粘着機能を満たす限りその材質などは特に限定されず、通常の粘着剤（例えばアクリル系、ゴム系など）を用いることができる。
かかる構成とすることにより、クリーニングシートをこの粘着剤層により各種基板や他のテープ・シートなどの搬送部材に貼り付けて、クリーニング機能付き基板として装置内に搬送して、被洗浄部位に接触させてクリーニングすることができる。
【００１７】
本発明において上記の基板などを再利用するために、クリーニング後に基板をかかる粘着剤層から剥がす場合は、かかる粘着剤層の粘着力は、シリコンウエハ（ミラー面）に対する１８０°引き剥がし粘着力が０．９８Ｎ／１０ｍｍ以下、特に０．２０〜０．９８Ｎ／１０ｍｍ程度であれば、搬送中に剥離することなく、かつクリーニング後に容易に再剥離できるので好ましい。
【００１８】
またクリーニング層が支持体の片面に設けられたクリーニングシートの支持体としては、特に限定されないが、例えばポリエチレン、ポリエチレンテレフタレート、アセチルセルロース、ポリカーボネート、ポリプロピレン、ポリアミド、ポリイミド、ポリカルボジイミドなどのプラスチックフィルムなどが挙げられる。その厚みも、クリーニング層の厚みと同様に、クリーニングシートを設けた基板全体の厚さが、本発明の特定範囲内にある限り特に限定されないが、通常１０〜１００μｍ程度である。
【００１９】
【実施例】
以下、本発明を実施例に基づいて説明するが、本発明はこれらに限定されるものではない。 なお、以下、部とあるのは重量部を意味するものとする。
実施例
アクリル酸−２−エチルヘキシル７５部、アクリル酸メチル２０部、及びアクリル酸５部からなるモノマ―混合液から得たアクリル系ポリマー（重量平均分子量７０万）１００部に対して、ジペンタエリストロールヘキサアクリレート（日本合成化学社製：商品名ＵＶ１７００Ｂ）を１５０部、ベンジルジメチルケタノール５部、及びジフエニルメタンジイソシアネ―ト３部を均一に混合し、紫外線硬化型の粘着剤溶液とした。
【００２０】
一方、上記粘着剤からベンジルジメチルケタノールを除いた以外は、上記と同様にして得た粘着剤溶液を、幅２５０ｍｍ、厚さ２５μｍのポリエチレンテレフタレートフィルムの片面に、乾燥後の厚みが１０μｍになるように塗布して通常の粘着剤層を設け、その表面に厚さ３８μｍのポリエステル系剥離フィルムを貼った。 フィルムのもう一方の側に、前記の紫外線硬化型の粘着剤溶液を乾燥後の厚みが４０μｍとなるように塗布してクリーニング層としての粘着剤層を設け、その表面に同様の剥離フィルムを貼った。
このシートに中心波長３６５ｎｍの紫外線を積算光量２０００ｍＪ／ｃｍ2照射して本発明のクリーニングシートを得た。 このクリーニングシート（剥離フィルムを除く）の厚さは、７５μｍであった。 また、試験法ＪＩＳ Ｋ７１２７に準じて測定したクリーニング層の紫外線硬化後の引張り強さは、１９８０ＭＰａであった。
また、他面側の通常の粘着剤層をシリコンウエハのミラー面に幅１０ｍｍで貼り付け、ＪＩＳ Ｚ０２３７に準じてシリコンウエハに対する１８０°引き剥がし粘着力を測定した結果、０．２５Ｎ／１０ｍｍであった。
【００２１】
得られたクリーニングシートの通常の粘着剤層側の剥離フィルムを剥がし、厚さが７２５μｍの８ｉｎｃｈのシリコンウエハの裏面（ミラー面）にハンドローラで貼り付け、厚さが８００μｍ（クリーニング層側の剥離フィルムを含まず）のクリーニング機能付きクリーニングウエハ（厚み＝ウエハの１１０％）を作製した。
【００２２】
一方、レーザー式異物測定装置で、新品の８ｉｎｃｈシリコンウエハ２枚のミラー面の０．２μｍ以上の異物を測定したところ、１枚目は１１個、２枚目は１０個であった。 これらのウエハを別々の静電吸着機構を有する基板処理装置にミラー面を下側に向けて搬送した後、レーザー式異物測定装置でミラー面を測定したところ、８ｉｎｃｈウエハサイズのエリア内でそれぞれ３２００４個、２５６３２個であった。
【００２３】
次いで前記で得たクリーニングウエハのクリーニング層側の剥離フィルムを剥がし、上記の３２００４個の異物が付着していたウエハステージを持つ基板処理装置内に搬送したところ、支障なく搬送できた。 その後に０．２μｍ以上の異物が１０個のっていた新品の８ｉｎｃｈシリコンウエハをミラー面を下側に向けて搬送し、レーザー式異物測定装置で０．２μｍ以上の異物を測定した。 この処理を５回実施し、その結果を表１に示した。
【００２４】
比較例
実施例において、クリーニング層の厚さを１００μｍ、ポリエチレンテレフタレートフィルムの厚さを７５μｍ、通常の粘着剤層の厚さを１５５μｍにして、クリーニングシートの総厚さ（剥離フィルム含まず）を３３０μｍとした以外は、実施例と同様にして、クリーニングシートを得た。 このクリーニングシートから実施例と同様の方法でクリーニング機能付きクリーニングウエハ（厚み＝ウエハの１４６％）を作製した。
【００２５】
このクリーニングウエハを、２５６３２個の異物が付着しているウエハステージを持つ基板処理装置内を搬送しようとしたところ、搬送途中で装置内部に接触し、搬送できなかった。
【００２６】
【表１】
【発明の効果】
以上のように本発明のクリーニング方法によれば、基板処理装置内を確実に搬送できると共に、装置内に付着している異物を簡便かつ確実に除去できる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a cleaning method for various substrate processing apparatuses, and a cleaning sheet used therefor, for example, a cleaning method for a substrate processing apparatus that dislikes foreign matters, such as a manufacturing apparatus and an inspection apparatus for semiconductors, flat panel displays, printed boards, and the like, and It relates to a cleaning sheet.
[0002]
[Prior art]
Various substrate processing apparatuses transport each transport system and the substrate in physical contact with each other. At this time, if foreign substances adhere to the substrate or the transport system, subsequent substrates are contaminated one after another, and it is necessary to periodically stop the apparatus and perform a cleaning process. For this reason, there existed a problem that an operation rate fall and a lot of labor were needed. In order to solve these problems, a method of cleaning and removing adhered foreign substances in the substrate processing apparatus by transporting a substrate to which an adhesive substance is fixed (Japanese Patent Laid-Open No. 10-154686) or transporting a plate-like member A method (Japanese Patent Laid-Open No. 11-87458) for removing foreign substances adhering to the back surface of the substrate has been proposed.
[0003]
[Problems to be solved by the invention]
A method for cleaning and removing adhered foreign matter in the substrate processing apparatus by transporting a substrate to which an adhesive substance is fixed, and a method for removing foreign matter by transporting a plate-like member are effective in overcoming the aforementioned problems. It is a simple method. However, in these methods, the thickness of the adhesive material or the plate-like member varies, and it is difficult to control the thickness. If the thickness is large, the substrate processing apparatus may not be transported. In particular, in semiconductor-related devices, there are many devices in which the clearance of the device with respect to the thickness of the substrate (wafer) to be processed in the transport system is very small. There is a problem that the substrate and the transport path are damaged.
In view of such circumstances, the present invention has an object to provide a cleaning method capable of reliably transporting a cleaning substrate into a substrate processing apparatus and easily and reliably removing foreign substances adhering to the apparatus. Yes.
[0004]
[Means for Solving the Problems]
In order to achieve the above object, the present inventors have intensively studied. As a result, in transporting a substrate provided with a cleaning functional substance, the thickness of the substrate provided with the cleaning functional substance, or a cleaning used for the thickness. By controlling the thickness of the sheet within a specific range, it has been found that foreign matters can be peeled and removed more easily and reliably without causing the above problems, and the present invention has been completed.
[0005]
That is, the present invention relates to a method for cleaning and removing foreign matter adhering to a substrate processing apparatus by transporting a substrate provided with a cleaning function substance, wherein the cleaning function substance includes a cleaning layer and a normal adhesive layer. Or a laminated sheet shape in which a cleaning layer is provided on one side of the support and a normal pressure-sensitive adhesive layer is provided on the other side . The tensile strength measured according to JIS K7127, which is obtained by curing a curable pressure-sensitive adhesive composition containing a compound having at least one unsaturated double bond and a polymerization initiator with active energy. It is in the range of 1 to 3,000 MPa, and is substantially non-sticky, and is attached to the substrate via each of the above adhesive layers. Further, the present invention relates to a cleaning method for a substrate processing apparatus, wherein the thickness of the substrate provided with the cleaning functional substance is 140% or less of the original thickness of the substrate to be processed of the substrate processing apparatus.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
In the cleaning method of the present invention, the thickness of the substrate provided with the cleaning functional substance needs to be 140% or less, more preferably 120% or less, of the original thickness of the substrate to be processed of the substrate processing apparatus. It is desirable to be. If the thickness exceeds 140%, the substrate may come into contact with the apparatus and damage the substrate or the conveyance path.
On the other hand, the lower limit of the thickness is not particularly limited as long as the substrate can be transported.
[0007]
The original substrate to be treated in the present invention is not particularly limited, and examples thereof include semiconductor substrates (wafers), substrates for flat panel displays such as LCDs and PDPs, and other substrates such as compact disks and MR heads.
[0008]
In the present invention, the shape of the cleaning functional substance provided on the substrate is not limited as long as it has a cleaning function, but a sheet shape (hereinafter sometimes referred to as a cleaning sheet) is preferable from the viewpoint of handleability and transportability. Such a cleaning sheet is not particularly limited in its configuration, thickness, material, and the like as long as the entire thickness of the substrate on which the cleaning sheet is provided is within the range of the specific value.
As a specific configuration example of the cleaning sheet, for example, a laminated sheet shape composed of a cleaning layer and a normal pressure-sensitive adhesive layer, a cleaning layer is provided on one side of the support, and a normal pressure-sensitive adhesive layer is provided on the other side. Examples include a laminated sheet shape. With such a normal pressure-sensitive adhesive layer, the cleaning layer can be fixed to the substrate.
[0009]
The thickness of the cleaning sheet itself is not particularly limited as long as the entire thickness of the cleaning substrate on which the cleaning sheet is provided is within the range of the above specific value, but the thickness of the original substrate to be processed of the substrate processing apparatus is not limited. It is usually 40% or less, preferably 20% or less. That is, the thickness of the cleaning sheet itself can be arbitrarily controlled according to the thickness of the substrate to be processed. For example, when the substrate to be processed is a semiconductor wafer, the substrate to be transported for cleaning is the original. In the case of a recycled wafer that is thinner than the wafer to be processed, by increasing the thickness of the cleaning sheet provided on the thinned recycled wafer, the overall thickness of the cleaning wafer is adjusted to be the same as the original processed wafer, and the thinned film is recycled. It is also possible to avoid a conveyance trouble caused by a wafer.
[0010]
The material of the cleaning layer of the cleaning sheet is not particularly limited as long as the thickness is controlled within the specific range. For example, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyvinylidene fluoride, fluoride Examples thereof include polymers such as vinylidene, vinylidene trifluoride, and polytetrafluoroethylene, and a curable pressure-sensitive adhesive composition whose crosslinking reaction and curing are accelerated by an active energy source such as ultraviolet rays and heat described later.
[0011]
In the present invention, those capable of increasing the tensile strength by promoting the crosslinking reaction and curing by an active energy source such as ultraviolet rays and heat are particularly preferable. Furthermore, it is preferable that the portion to be cleaned in the apparatus is not easily wetted. If it is easy to get wet, the cleaning sheet may come into close contact with the portion to be cleaned during conveyance, which may cause conveyance trouble. The thickness of the cleaning layer is not particularly limited as long as the thickness of the entire substrate provided with the cleaning layer is within the specific range of the present invention, but is usually about 5 to 100 μm.
[0012]
As a specific example of such a cleaning layer, for example, a pressure-sensitive adhesive polymer containing at least a compound having at least one unsaturated double bond in the molecule and a polymerization initiator is polymerized and cured by active energy. Examples include those in which adhesiveness is substantially lost. Examples of the pressure-sensitive adhesive polymer include acrylic polymers having (meth) acrylic acid and / or (meth) acrylic acid ester selected from acrylic acid, acrylic acid ester, methacrylic acid, and methacrylic acid ester as main monomers. It is done. In synthesizing this acrylic polymer, a compound having two or more unsaturated double bonds in the molecule is used as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule is used in the synthesized acrylic polymer. By introducing an unsaturated double bond into the molecule of the acrylic polymer, for example, by chemically bonding it with a reaction between functional groups, this polymer itself is also involved in the polymerization curing reaction by active energy. You can also.
[0013]
Here, the compound having one or more unsaturated double bonds in the molecule (hereinafter referred to as a polymerizable unsaturated compound) is preferably a low molecular weight substance that is nonvolatile and has a weight average molecular weight of 10,000 or less. In particular, it is preferable that the molecular weight is 5000 or less so that the three-dimensional network of the cleaning layer can be efficiently formed at the time of curing.
[0014]
The polymerization initiator added to the cleaning layer is not particularly limited, and known ones can be used. For example, when heat is used as an active energy source, thermal polymerization initiation of benzoyl peroxide, azobisisobutyronitrile, etc. Benzoyl, benzoin ethyl ether, cibenzyl, isopropyl benzoin ether, benzophenone, Michler's ketone chlorothioxanthone, dodecyl thioxanthone, dimethylthioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, α-hydroxycyclohexyl Examples include photopolymerization initiators such as silphenyl ketone, 2-hydroxydimethylphenylpropane, and 2,2-dimethoxy-2-phenylacetophenone.
[0015]
In the present invention, the tensile strength of the cleaning layer is designed to be within a range of 1 to 3000 MPa, preferably 100 to 2000 MPa, so as to avoid the occurrence of conveyance troubles as much as possible and to easily and reliably remove foreign matters. It is preferable from the point. Here, the tensile strength is measured according to the test method JIS K7127.
[0016]
The present invention, on one side of the specific cleaning layer, the cleaning sheet adhesive layer is provided, also on one side of a support, the specific cleaning layer is provided, the adhesive layer is provided on the other surface A cleaning sheet is also provided. The material of the pressure-sensitive adhesive layer is not particularly limited as long as it satisfies the pressure-sensitive adhesive function, and a normal pressure-sensitive adhesive (for example, acrylic or rubber-based) can be used.
With this configuration, the cleaning sheet is attached to a transport member such as various substrates and other tapes and sheets by this adhesive layer, transported into the apparatus as a substrate with a cleaning function, and brought into contact with the site to be cleaned. Can be cleaned.
[0017]
In the present invention, when the substrate is peeled off from the pressure-sensitive adhesive layer after cleaning in order to reuse the above-described substrate, the pressure-sensitive adhesive force of the pressure-sensitive adhesive layer is 180 ° peel-off adhesion to the silicon wafer (mirror surface). A thickness of 0.98 N / 10 mm or less, particularly about 0.20 to 0.98 N / 10 mm, is preferable because it can be easily peeled off after cleaning without peeling during transportation.
[0018]
In addition, the support of the cleaning sheet provided with the cleaning layer on one side of the support is not particularly limited, and examples thereof include plastic films such as polyethylene, polyethylene terephthalate, acetyl cellulose, polycarbonate, polypropylene, polyamide, polyimide, polycarbodiimide, and the like. Can be mentioned. The thickness is not particularly limited as long as the thickness of the entire substrate provided with the cleaning sheet is within the specific range of the present invention, as is the thickness of the cleaning layer, but is usually about 10 to 100 μm.
[0019]
【Example】
Hereinafter, although the present invention is explained based on an example, the present invention is not limited to these. Hereinafter, “parts” means parts by weight.
Example Dipentaeryth with respect to 100 parts of an acrylic polymer (weight average molecular weight 700,000) obtained from a monomer mixture consisting of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate, and 5 parts of acrylic acid 150 parts of Troll Hexaacrylate (manufactured by Nippon Synthetic Chemical Co., Ltd., trade name: UV1700B), 5 parts of benzyldimethylketanol, and 3 parts of diphenylmethane diisocyanate are uniformly mixed, and an ultraviolet curable adhesive solution and did.
[0020]
On the other hand, the pressure-sensitive adhesive solution obtained in the same manner as described above except that benzyldimethylketanol was removed from the pressure-sensitive adhesive had a thickness of 10 μm after drying on one side of a polyethylene terephthalate film having a width of 250 mm and a thickness of 25 μm. Thus, a normal pressure-sensitive adhesive layer was provided, and a 38 μm thick polyester release film was pasted on the surface. On the other side of the film, the UV curable adhesive solution is applied to a thickness of 40 μm after drying to provide an adhesive layer as a cleaning layer, and a similar release film is applied to the surface. It was.
The cleaning sheet of the present invention was obtained by irradiating this sheet with ultraviolet light having a central wavelength of 365 nm and an integrated light quantity of 2000 mJ / cm 2 . The thickness of this cleaning sheet (excluding the release film) was 75 μm. Moreover, the tensile strength after ultraviolet curing of the cleaning layer measured according to the test method JIS K7127 was 1980 MPa.
In addition, a normal pressure-sensitive adhesive layer on the other surface side was attached to the mirror surface of the silicon wafer with a width of 10 mm, and the 180 ° peel-off adhesive strength to the silicon wafer was measured according to JIS Z0237. As a result, it was 0.25 N / 10 mm. It was.
[0021]
The release film on the normal adhesive layer side of the obtained cleaning sheet is peeled off and attached to the back surface (mirror surface) of an 8-inch silicon wafer having a thickness of 725 μm with a hand roller, and the thickness is 800 μm (peeling on the cleaning layer side) A cleaning wafer with a cleaning function (thickness = 110% of the wafer) was prepared.
[0022]
On the other hand, when the foreign matter of 0.2 μm or more on the mirror surface of two new 8-inch silicon wafers was measured with a laser type foreign matter measuring apparatus, the number of the first piece was 11 and the number of the second piece was 10. After these wafers were transferred to a substrate processing apparatus having separate electrostatic attraction mechanisms with the mirror surface facing downward, the mirror surface was measured with a laser type foreign matter measuring apparatus. And 25632.
[0023]
Next, the release film on the cleaning layer side of the cleaning wafer obtained above was peeled off and transported into the substrate processing apparatus having the wafer stage on which the above-mentioned 32004 foreign substances were adhered. Thereafter, a new 8-inch silicon wafer having 10 foreign matters having a size of 0.2 μm or more was conveyed with the mirror surface facing downward, and the foreign matter having a size of 0.2 μm or more was measured with a laser type foreign material measuring apparatus. This treatment was performed 5 times and the results are shown in Table 1.
[0024]
In the comparative example, the cleaning layer thickness was 100 μm, the polyethylene terephthalate film thickness was 75 μm, the normal pressure-sensitive adhesive layer thickness was 155 μm, and the total cleaning sheet thickness (excluding the release film) was 330 μm. A cleaning sheet was obtained in the same manner as in the example except that. A cleaning wafer with a cleaning function (thickness = 146% of the wafer) was produced from this cleaning sheet in the same manner as in the example.
[0025]
When this cleaning wafer was to be transported through a substrate processing apparatus having a wafer stage to which 25632 foreign substances were adhered, the cleaning wafer was in contact with the interior of the apparatus and could not be transported.
[0026]
[Table 1]
【The invention's effect】
As described above, according to the cleaning method of the present invention, the inside of the substrate processing apparatus can be reliably transported, and foreign substances adhering to the inside of the apparatus can be easily and reliably removed.
Claims (2)
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