JP3822763B2 - Cleaning sheet - Google Patents
Cleaning sheet Download PDFInfo
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- JP3822763B2 JP3822763B2 JP12124299A JP12124299A JP3822763B2 JP 3822763 B2 JP3822763 B2 JP 3822763B2 JP 12124299 A JP12124299 A JP 12124299A JP 12124299 A JP12124299 A JP 12124299A JP 3822763 B2 JP3822763 B2 JP 3822763B2
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- substrate processing
- processing apparatus
- cleaning sheet
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims description 55
- 239000000758 substrate Substances 0.000 claims description 38
- 239000010410 layer Substances 0.000 claims description 26
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 19
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 239000010703 silicon Substances 0.000 claims description 7
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 description 15
- -1 benzyl dimethyl ketal Chemical compound 0.000 description 5
- 229920000058 polyacrylate Polymers 0.000 description 5
- 150000001875 compounds Chemical class 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- BWZAUXRKSMJLMH-UHFFFAOYSA-N 1,1-diethoxyethylbenzene Chemical compound CCOC(C)(OCC)C1=CC=CC=C1 BWZAUXRKSMJLMH-UHFFFAOYSA-N 0.000 description 1
- UYEDESPZQLZMCL-UHFFFAOYSA-N 1,2-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=C(C)C(C)=CC=C3SC2=C1 UYEDESPZQLZMCL-UHFFFAOYSA-N 0.000 description 1
- YNSNJGRCQCDRDM-UHFFFAOYSA-N 1-chlorothioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl YNSNJGRCQCDRDM-UHFFFAOYSA-N 0.000 description 1
- CTOHEPRICOKHIV-UHFFFAOYSA-N 1-dodecylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CCCCCCCCCCCC CTOHEPRICOKHIV-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- BGRKGHSKCFAPCL-UHFFFAOYSA-N 2-(2-methylbutan-2-yl)phenol Chemical compound CCC(C)(C)C1=CC=CC=C1O BGRKGHSKCFAPCL-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- NACPTFCBIGBTSJ-UHFFFAOYSA-N 2-hydroxy-2-phenyl-1-(2-propan-2-ylphenyl)ethanone Chemical compound CC(C)C1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 NACPTFCBIGBTSJ-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- UXMQORVHJMUQFD-UHFFFAOYSA-N Heptanophenone Chemical compound CCCCCCC(=O)C1=CC=CC=C1 UXMQORVHJMUQFD-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 1
- 229940081735 acetylcellulose Drugs 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
Landscapes
- Cleaning In General (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、各種装置をクリーニングするシートに関し、例えば、半導体、フラットパネルディスプレイなどの製造装置や検査装置など、異物を嫌う基板処理装置のクリーニングシートに関する。
【０００２】
【従来の技術】
各種基板処理装置は、各搬送系と基板とを物理的に接触させながら搬送する。その際、基板や搬送系に異物が付着していると、後続の基板を次々に汚染することになり、定期的に装置を停止させ、洗浄処理をする必要があった。このため、稼働率低下や多大な労力が必要になるという問題があった。これらの問題を解決するため、粘着性の物質を固着した基板を搬送することにより基板処理装置内の付着した異物をクリーニング除去する方法が提案されている（例えば特開平１０−１５４６８６号）。
【０００３】
【発明が解決しようとする課題】
粘着性の物質を固着した基板を搬送することにより基板処理装置内の付着した異物をクリーニング除去する方法は、前述の課題を克服する有効な方法である。しかしこの方法では粘着性物質と装置接触部とが強く接着しすぎて剥れない恐れがあり、基板を確実に搬送できなくなる恐れがあった。
本発明は、このような事情に照らし、基板処理装置内に基板を確実に搬送でき、さらに装置内に付着している異物を簡便、確実に除去できるクリーニングシートを提供することを目的としている。
【０００４】
【課題を解決するための手段】
本発明者らは、上記の目的を達成するために、鋭意検討した結果、粘着性の物質を固着したシートあるいはこのシートを固着した基板を搬送することにより、基板処理装置内の付着した異物をクリーニング除去するにあたり、クリーニング層として活性エネルギー源により粘着力を特定値以下とすることにより、前記問題を生じることなく、さらに異物を簡便かつ確実に除去できることを見出し、本発明を完成するに至つた。
【０００５】
即ち、本発明は、基板処理装置内に搬送することにより上記装置内に付着している異物を除去するための基板処理装置のクリーニングシートであって、支持体に、活性エネルギー源により硬化した粘着剤層からなる、シリコンウエハ（ミラー面）に対する１８０°引き剥がし粘着力が２０ｇ／１０ｍｍ以下であるクリーニング層が設けられてなる基板処理装置のクリーニングシート（請求項１）と、基板処理装置内に搬送することにより上記装置内に付着している異物を除去するための基板処理装置のクリーニングシートであって、支持体の片面に、請求項１と同様のクリーニング層が設けられ、他面に通常の粘着剤層が設けられてなる基板処理装置のクリーニングシート（請求項２）と、活性エネルギー源が紫外線であることを特徴とする請求項１又は２記載の基板処理装置のクリーニングシート（請求項３）とに係るものである。
また、本発明は、搬送部材に、請求項２又は３記載の基板処理装置のクリーニングシートが、通常の粘着剤層により設けられたクリーニング機能付き搬送部材（請求項４）と、請求項４記載のクリーニング機能付き搬送部材を、基板処理装置の被洗浄部位に搬送接触させることを特徴とするクリーニング方法（請求項５）とに係るものである。
【０００６】
【発明の実施の形態】
本発明のクリーニングシートは、支持体の片面にクリーニング層が設けられ、該クリーニング層は、活性エネルギー源により硬化した粘着剤層からなる。 かかる粘着剤層は、活性エネルギー源により硬化して分子構造が三次元網状化する性質を有する限り、その材質等は特に限定されないが、例えば感圧接着性ポリマーに分子内に不飽和二重結合を１個以上有する化合物を含有させてなるものが好ましく、かかる感圧接着性ポリマーとしては、例えばアクリル酸、アクリル酸エステル、メタクリル酸、メタクリル酸エステルから選ばれる（メタ）アクリル酸及び／又は（メタ）アクリル酸エステルを主モノマーとしたアクリル系ポリマーが挙げられる。このアクリル系ポリマーの合成にあたり、共重合モノマーとして分子内に不飽和二重結合を２個以上有する化合物を用いるか、あるいは合成後のアクリル系ポリマーに分子内に不飽和二重結合を有する化合物を官能基間の反応で化学結合させるなどして、アクリル系ポリマーの分子内に不飽和二重結合を導入しておくことにより、このポリマー自体も活性エネルギーにより重合硬化反応に関与させるようにすることもできる。
【０００７】
ここで、分子内に不飽和二重結合を１個以上有する化合物（以下、重合性不飽和化合物という）としては、不揮発性でかつ重量平均分子量が１００００以下の低分子量体であるのがよく、特に硬化時の粘着剤層の三次元網状化が効率よくなされるように、５０００以下の分子量を有しているのが好ましい。
【０００８】
また、粘着剤層に添加される重合開始剤は、特に限定されず公知のものを使用でき、例えば活性エネルギー源に熱を用いる場合は、ベンゾイルパーオキサイド、アゾビスイソブチロニトリルなどの熱重合開始剤、また光を用いる場合は、ベンゾイル、ベンゾインエチルエーテル、シベンジル、イソプロピルベンゾインエーテル、ベンゾフェノン、ミヒラーズケトンクロロチオキサントン、ドデシルチオキサントン、ジメチルチオキサントン、アセトフェノンジエチルケタール、ベンジルジメチルケタール、α−ヒドルキシシクロヒキシルフェニルケトン、２−ヒドロキシジメチルフェニルプロパン、２，２−ジメトキシ−２−フェニルアセトフェノンなどの光重合開始剤が挙げられる。
【０００９】
この粘着剤層の硬化に用いる活性エネルギー源としては、紫外線、熱などが挙げられるが、紫外線が好ましい。 かかる粘着剤層は、上記活性エネルギー源により硬化されてその粘着力が低下したものであり、例えばシリコンウエハ（ミラー面）に対する１８０°引き剥がし粘着力が２０ｇ／１０ｍｍ以下、好ましくは１〜１０ｇ／１０ｍｍ程度である。 この粘着力が、２０ｇ／ｍｍを超えると、搬送時に装置内の被クリーニング部に接着して、搬送トラブルとなる恐れがある。
また粘着剤層の厚さは特に限定されないが、通常５〜３０μｍ程度である。
【００１０】
本発明は、支持体の片面に、上記の特定の粘着剤層がクリーニング層として設けられ、他面に通常の粘着剤層が設けられたクリーニングシートも提供する。 この他面側の粘着剤層は、粘着機能を満たす限りその材質などは特に限定されず、通常の粘着剤（例えばアクリル系、ゴム系など）を用いることができる。 かかる構成とすることにより、クリーニングシートを通常の粘着剤層により各種基板や他のテープ・シートなどの搬送部材に貼り付けて、クリーニング機能付き搬送部材（請求項４）として装置内に搬送して、被洗浄部位に接触させてクリーニングすること（請求項５）もできる。
【００１１】
この支持体としては特に限定されないが、例えばポリエチレン、ポリエチレンテレフタレート、アセチルセルロース、ポリカーボネート、ポリプロピレン、ポリアミドなどのプラスチックフィルムなどが挙げられる。 その厚みは通常１０〜１００μｍ程度である。
【００１２】
クリーニングシートが貼り付けられる搬送部材としては特に限定されないが、例えば半導体ウエハ、ＬＣＤ、ＰＤＰなどのフラットパネルディスプレイ用基板、
その他コンパクトディスク、ＭＲヘッドなどの基板などが挙げられる。
【００１３】
【実施例】
以下、本発明を実施例に基づいて説明するが、本発明はこれらに限定されるものではない。 なお、以下、部とあるのは重量部を意味するものとする。
実施例
アクリル酸−２−エチルヘキシル７５部、アクリル酸メチル２０部、及びアクリル酸５部からなるモノマ―混合液から得たアクリル系ポリマー（重量平均分子量７０万）１００部に対して、ポリエチレングリコ―ルジメタクリレ―ト５０部、ウレタンアクリレ―ト５０部、ベンジルジメチルケタール３部、及びジフエニルメタンジイソシアネ―ト３部を均一に混合し、紫外線硬化型の粘着剤溶液とした。
一方、上記粘着剤からベンジルジメチルケタールを除いた以外は、上記と同様にして得た粘着剤溶液を、２５μｍ厚みのポリエチレン製支持フィルムの片面に、乾燥後の厚みが１０μｍになるように塗布して通常の粘着剤層を設け、その表面に厚さ３８μｍのポリエステル系剥離フィルムを貼った。 支持フィルムのもう一方の側に、前記の紫外線硬化型粘着剤溶液を乾燥後の厚みが１０μｍになるように塗布してクリーニング層としての粘着剤層を設け、その表面に同様の剥離フィルムを貼った。
このシートに中心波長３６５ｎｍの紫外線を積算光量１０００ｍＪ／ｃｍ２照射して、本発明のクリーニングシートを得た。 このクリーニングシートのクリーニング層側の剥離フィルムを剥がし、シリコンウエハのミラー面に幅１０ｍｍで貼り付け、ＪＩＳＺ０２３７に準じてシリコンウエハに対する１８０°引き剥がし粘着力を測定した結果、８ｇ／１０ｍｍであった。
【００１４】
このクリーニングシートの通常の粘着剤層側の剥離フィルムを剥がし、８インチのシリコンウエハの裏面（ミラー面）にハンドローラで貼り付け、ウエハ外周に沿ってシートを切断して、クリーニング機能付き搬送用クリーニングウエハを作製した。
【００１５】
一方、基板処理装置のウエハステージを２つ取り外し、レーザー式異物測定装置で、０．３μｍ以上の異物を測定したところ、８インチウエハサイズのエリア内で１つは２００００個、もう一つは１８０００個であった。
【００１６】
次いで前記で得た搬送用クリーニングウエハのクリーニング層側の剥離フィルムを剥がし、上記の２００００個の異物が付着していたウエハステージを持つ基板処理装置内に搬送したところ、支障なく搬送できた。
その後にウエハステージを取り外し、レーザー式異物測定装置で０．３μｍ以上の異物を測定したところ、８インチウエハサイズ内で３９５０個であり、クリーニング前に付着していた異物数の３／４以上を除去することができた。
【００１７】
比較例
実施例において、中心波長３６５ｎｍの紫外線を積算光量１５０ｍＪ／ｃｍ２にて照射した以外は、実施例と同様にクリーニングシートを作製し、対シリコンウエハ粘着力を測定したところ、３４ｇ／１０ｍｍであった。
このクリーニングシートから実施例と同じ方法で作製した搬送用クリーニングウエハを、１８０００個の異物が付着しているウエハステージを持つ基板処理装置内を搬送したところ、ウエハステージに固着し、搬送できなくなった。
【００１８】
【発明の効果】
以上のように本発明のクリーニングシートによれば、基板処理装置内を確実に搬送できると共に、装置内に付着している異物を簡便かつ確実に除去できる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a sheet for cleaning various apparatuses, for example, a cleaning sheet for a substrate processing apparatus that dislikes foreign matters, such as a manufacturing apparatus such as a semiconductor or a flat panel display, or an inspection apparatus.
[0002]
[Prior art]
Various substrate processing apparatuses transport each transport system and the substrate in physical contact with each other. At this time, if foreign substances adhere to the substrate or the transport system, subsequent substrates are contaminated one after another, and it is necessary to periodically stop the apparatus and perform a cleaning process. For this reason, there existed a problem that an operation rate fall and a lot of labor were needed. In order to solve these problems, there has been proposed a method of cleaning and removing adhered foreign substances in the substrate processing apparatus by transporting a substrate to which an adhesive substance is fixed (for example, Japanese Patent Laid-Open No. 10-154686).
[0003]
[Problems to be solved by the invention]
The method of cleaning and removing the adhered foreign matter in the substrate processing apparatus by transporting the substrate to which the adhesive substance is fixed is an effective method for overcoming the above-described problems. However, in this method, the adhesive substance and the apparatus contact portion are too strongly bonded and may not be peeled off, and there is a possibility that the substrate cannot be reliably conveyed.
In light of such circumstances, an object of the present invention is to provide a cleaning sheet that can reliably transport a substrate into a substrate processing apparatus and that can easily and reliably remove foreign substances adhering to the apparatus.
[0004]
[Means for Solving the Problems]
As a result of intensive studies to achieve the above-mentioned object, the present inventors transported a sheet to which an adhesive substance is fixed or a substrate to which this sheet is fixed to remove adhered foreign matter in the substrate processing apparatus. In removing the cleaning, it was found that the foreign matter can be easily and surely removed without causing the above-mentioned problems by setting the adhesive force to a specific value or less by the active energy source as the cleaning layer, and the present invention has been completed. .
[0005]
That is, the present invention provides a cleaning sheet for a substrate processing apparatus for removing foreign matter adhering to the inside of the apparatus by being conveyed into the substrate processing apparatus, the adhesive being cured on the support by an active energy source. A cleaning sheet (Claim 1) of a substrate processing apparatus, which is provided with a cleaning layer having a cleaning layer with an adhesive strength of 20 g / 10 mm or less that is peeled off 180 ° with respect to a silicon wafer (mirror surface). A cleaning sheet of a substrate processing apparatus for removing foreign substances adhering to the inside of the apparatus by being conveyed, wherein a cleaning layer similar to claim 1 is provided on one side of a support, and the other side is usually a cleaning sheet of the adhesive layer substrate processing apparatus comprising provided (claim 2), wherein the active energy source is ultraviolet Motomeko 1 or 2 cleaning sheet of the substrate processing apparatus according those according to (Claim 3).
Further, the present invention provides a transport member with a cleaning function (claim 4), wherein the transport member is provided with the cleaning sheet of the substrate processing apparatus according to claim 2 or 3 by a normal pressure-sensitive adhesive layer. The cleaning member having the cleaning function is brought into contact with the portion to be cleaned of the substrate processing apparatus in accordance with the cleaning method (claim 5).
[0006]
DETAILED DESCRIPTION OF THE INVENTION
In the cleaning sheet of the present invention, a cleaning layer is provided on one side of a support, and the cleaning layer is composed of an adhesive layer cured by an active energy source. The material of the pressure-sensitive adhesive layer is not particularly limited as long as it has the property of being cured by an active energy source and having a three-dimensional network structure. For example, the pressure-sensitive adhesive polymer has an unsaturated double bond in the molecule. And a pressure-sensitive adhesive polymer such as (meth) acrylic acid selected from acrylic acid, acrylic acid ester, methacrylic acid, and methacrylic acid ester, and / or ( Examples thereof include acrylic polymers having (meth) acrylic acid ester as a main monomer. In synthesizing this acrylic polymer, a compound having two or more unsaturated double bonds in the molecule is used as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule is used in the synthesized acrylic polymer. By introducing an unsaturated double bond into the molecule of the acrylic polymer, for example, by chemically bonding it with a reaction between functional groups, this polymer itself is also involved in the polymerization curing reaction by active energy. You can also.
[0007]
Here, the compound having one or more unsaturated double bonds in the molecule (hereinafter referred to as a polymerizable unsaturated compound) is preferably a low molecular weight substance that is nonvolatile and has a weight average molecular weight of 10,000 or less. In particular, it preferably has a molecular weight of 5000 or less so that the three-dimensional network of the pressure-sensitive adhesive layer at the time of curing can be made efficiently.
[0008]
The polymerization initiator added to the pressure-sensitive adhesive layer is not particularly limited, and known ones can be used. For example, when heat is used as an active energy source, thermal polymerization of benzoyl peroxide, azobisisobutyronitrile, etc. Initiators, and when using light, benzoyl, benzoin ethyl ether, cibenzyl, isopropyl benzoin ether, benzophenone, Michler's ketone chlorothioxanthone, dodecyl thioxanthone, dimethylthioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, α-hydroxycyclo Examples thereof include photopolymerization initiators such as hexyl phenyl ketone, 2-hydroxydimethylphenylpropane, and 2,2-dimethoxy-2-phenylacetophenone.
[0009]
Examples of the active energy source used for curing the pressure-sensitive adhesive layer include ultraviolet rays and heat, but ultraviolet rays are preferred. The pressure-sensitive adhesive layer is cured by the active energy source and has a reduced adhesive strength. For example, the 180 ° peel-off adhesive strength to a silicon wafer (mirror surface) is 20 g / 10 mm or less, preferably 1 to 10 g / It is about 10 mm. If this adhesive strength exceeds 20 g / mm, it may adhere to a portion to be cleaned in the apparatus at the time of conveyance, which may cause a conveyance trouble.
The thickness of the pressure-sensitive adhesive layer is not particularly limited, but is usually about 5 to 30 μm.
[0010]
The present invention also provides a cleaning sheet in which the above-mentioned specific pressure-sensitive adhesive layer is provided as a cleaning layer on one side of a support and a normal pressure-sensitive adhesive layer is provided on the other side. The material of the pressure-sensitive adhesive layer on the other side is not particularly limited as long as it satisfies the pressure-sensitive adhesive function, and a normal pressure-sensitive adhesive (for example, acrylic or rubber-based) can be used. With this configuration, the cleaning sheet is attached to a transport member such as various substrates or other tapes / sheets with a normal adhesive layer, and transported into the apparatus as a transport member with a cleaning function (Claim 4). Further, cleaning can be performed by contacting the part to be cleaned (Claim 5).
[0011]
The support is not particularly limited, and examples thereof include plastic films such as polyethylene, polyethylene terephthalate, acetyl cellulose, polycarbonate, polypropylene, and polyamide. The thickness is usually about 10 to 100 μm.
[0012]
Although it does not specifically limit as a conveyance member to which a cleaning sheet is affixed, For example, a substrate for flat panel displays, such as a semiconductor wafer, LCD, and PDP,
Other examples include substrates such as compact disks and MR heads.
[0013]
【Example】
Hereinafter, although the present invention is explained based on an example, the present invention is not limited to these. Hereinafter, “parts” means parts by weight.
EXAMPLE Polyethylene glycol-based on 100 parts of an acrylic polymer (weight average molecular weight 700,000) obtained from a monomer mixture consisting of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate and 5 parts of acrylic acid. 50 parts of rudimethacrylate, 50 parts of urethane acrylate, 3 parts of benzyldimethyl ketal, and 3 parts of diphenylmethane diisocyanate were uniformly mixed to obtain an ultraviolet curable adhesive solution.
On the other hand, except that benzyldimethyl ketal was removed from the adhesive, the adhesive solution obtained in the same manner as described above was applied to one side of a 25 μm-thick polyethylene support film so that the thickness after drying was 10 μm. A normal pressure-sensitive adhesive layer was provided, and a polyester release film having a thickness of 38 μm was stuck on the surface. On the other side of the support film, the UV curable pressure-sensitive adhesive solution is applied so that the thickness after drying is 10 μm to provide a pressure-sensitive adhesive layer as a cleaning layer, and a similar release film is applied to the surface. It was.
The cleaning sheet of the present invention was obtained by irradiating this sheet with ultraviolet light having a central wavelength of 365 nm and an integrated light quantity of 1000 mJ / cm 2. The release film on the cleaning layer side of this cleaning sheet was peeled off and attached to the mirror surface of the silicon wafer with a width of 10 mm, and the 180 ° peel adhesion to the silicon wafer was measured according to JISZ0237. As a result, it was 8 g / 10 mm.
[0014]
Remove the release film on the normal adhesive layer side of this cleaning sheet, attach it to the back (mirror surface) of an 8- inch silicon wafer with a hand roller, cut the sheet along the outer periphery of the wafer, and carry it with a cleaning function A cleaning wafer was prepared.
[0015]
On the other hand, two wafer stages of the substrate processing apparatus were removed, and a foreign substance measuring 0.3 μm or more was measured with a laser type foreign substance measuring apparatus. One was 20000 pieces and the other was 18000 in an 8- inch wafer size area. It was a piece.
[0016]
Next, the release film on the cleaning layer side of the transport cleaning wafer obtained above was peeled off and transported into the substrate processing apparatus having the wafer stage on which the above 20000 foreign substances had adhered, and transport was possible without any problem.
After that, the wafer stage was removed, and a foreign substance measuring 0.3 μm or more was measured with a laser type foreign substance measuring apparatus. As a result, 3950 pieces were measured within an 8- inch wafer size. Could be removed.
[0017]
Comparative Example In the example, a cleaning sheet was prepared in the same manner as in the example except that ultraviolet light having a central wavelength of 365 nm was irradiated at an integrated light amount of 150 mJ / cm 2, and the adhesive strength against a silicon wafer was measured. It was.
When the cleaning wafer for transport produced by the same method as the embodiment from this cleaning sheet was transported in a substrate processing apparatus having a wafer stage to which 18000 foreign matters were adhered, it adhered to the wafer stage and could not be transported. .
[0018]
【The invention's effect】
As described above, according to the cleaning sheet of the present invention, the inside of the substrate processing apparatus can be reliably conveyed, and foreign substances adhering to the inside of the apparatus can be easily and reliably removed.
Claims (5)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12124299A JP3822763B2 (en) | 1999-04-28 | 1999-04-28 | Cleaning sheet |
| TW90111082A TW550688B (en) | 1999-04-28 | 2001-05-08 | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12124299A JP3822763B2 (en) | 1999-04-28 | 1999-04-28 | Cleaning sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000312862A JP2000312862A (en) | 2000-11-14 |
| JP3822763B2 true JP3822763B2 (en) | 2006-09-20 |
Family
ID=14806430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12124299A Expired - Fee Related JP3822763B2 (en) | 1999-04-28 | 1999-04-28 | Cleaning sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3822763B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4173649B2 (en) * | 2001-04-10 | 2008-10-29 | 日東電工株式会社 | Manufacturing method of label sheet with cleaning function |
| JP4316105B2 (en) * | 2000-05-16 | 2009-08-19 | 日東電工株式会社 | Cleaning sheet |
| EP1286792B1 (en) | 2000-06-06 | 2007-08-01 | Nitto Denko Corporation | Cleaning member |
| US7793668B2 (en) | 2000-06-06 | 2010-09-14 | Nitto Denko Corporation | Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them |
| MY137666A (en) * | 2001-04-09 | 2009-02-27 | Nitto Denko Corp | Label sheet for cleaning and conveying member having cleaning function |
| JP2003142370A (en) * | 2001-10-31 | 2003-05-16 | Nitto Denko Corp | Method for cleaning apparatus with reticle in contact |
| US20050118414A1 (en) | 2002-06-19 | 2005-06-02 | Nitto Denko Corporation | Cleaning sheets, transfer member having cleaning function, and method of cleaning substrate-processing apparatus with these |
| JP2005034834A (en) | 2003-06-26 | 2005-02-10 | Nitto Denko Corp | Cleaning member and cleaning method |
| US7718255B2 (en) | 2003-08-19 | 2010-05-18 | Nitto Denko Corporation | Cleaning sheets and method of cleaning with the same |
-
1999
- 1999-04-28 JP JP12124299A patent/JP3822763B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000312862A (en) | 2000-11-14 |
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