TW550688B - Cleaning sheet, conveying member using the same, and substrate processing equipment cleaning method using them - Google Patents

Abstract

A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm<2> as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer. having a Vickers hardness of not lower than 10.

Description

550688

V. Description of the Invention (1) Technical Field The present invention relates to a sheet for cleaning various equipment. More specifically, the present invention relates to a clean sheet for a substrate processing apparatus susceptible to damage by foreign substances, such as a device for manufacturing or inspecting a semiconductor, a flat panel display, a printed circuit board, etc. A conveying member, and a method for using the sheet in a clean substrate processing equipment. Background technology When it is adopted, it is necessary to reduce the number of such substrates, or a substrate package patent, which is effective from the substrate, and the invention of the substrate, which is too much of the substrate. Various substrate processing devices can physically contact the board and transport the equipment regularly. The suspension requires a lot of manpower, due to the internal method of conveying the attached processing equipment (see Report 10-154686) including the internal method of conveying the attached processing equipment. However, this side is strongly adhered, and the shortcomings of complete conveyance reveal the insider. In this operation, when foreign matter adheres to, subsequent substrates will be contaminated continuously. For cleaning. This can be detrimental to operating efficiency. In order to solve these problems, substrates with adhesive materials have been proposed to remove foreign materials (such as in uncensored Japan, substrates with adhesive materials to remove foreign materials: law system-a kind of overcoming The aforementioned difficult method has the adhesive material # | ^ #, which cannot be peeled from each other, because it can not be guaranteed. In view of these situations, it is an object of the present invention to transfer the substrate to the substrate and to the inside of the device. Only the inside of the processing equipment and the clean sheet of foreign materials are provided for a reliable and reliable removal of Gu Yi.

550688 V. Description of the invention (2) The person carried out extensive research to complete the aforementioned item #. As a result, it is now possible to remove the material from the inside of the substrate processing equipment by conveying a sheet with a clean layer or by fixing it, so that the material is removed 'without causing the aforementioned problems, Among them, this is not viscous and does not have a low product. The tensile modulus of the tenths value or the surface free energy of a value lower than a specific value, the value of Vickers. hardness. -Low table 1 feature. In other words, the present invention provides a cleansing layer which is substantially non-sticky and has a low level; The second sheet can be provided with an ordinary adhesive layer on the other side. It has better cleanliness and substantially no electrical conductivity than the surface free energy of 22 Joules per square meter on Erbei. … In order to show less than 30 millimeters =! No less than 10 Vickers hardness can be set on the layer = on the base material, or on the other side. You can set the ordinary adhesive layer on the clean sheet from other aspects, Taisu Ri h # service Keshu. The features and advantages of this month will be clear. The following is a detailed description of specific examples. In the cleaning method according to the present invention, such as a single clean sheet, a clean layer (which includes a mouth sheet and a sheet laminated with a base material in the following).

550688 V. Description of the invention (3): The first one of the two needs is not sticky in quality, and has not less than 0.98 Newton / flat 4 9: 0 Λ 1 Γ, 12;: # rr; ^ ^ .f thousand Fang also did not compare, from 9.8 to 3,0 0 Newtons / square millimeter = meaning = the present invention, the tensile modulus of the clean layer is designed to fall within the range of -cheng Foreign material money can be saved without crying. When the number of stretched branches in the clean / square almost ±±, # @ = r layer is lower than 0.998 Newton, it becomes sticky, so its internal area during the transport process :: ΪΓ ΐ causes transport problems. '㈣ Adhesion, from Newton's heart = 2: When the mouth exceeds 0.20 Newton River ◦ mm, the clean layer will adhere to the inner area prepared by the swimmer, resulting in transportation problems. And i ΐ :: ί Π ::! Is preferably made of a layer that is essentially non-sticky and only non-conductive on the shell. In the present invention, Πϊ: It is designed so that the clean layer is substantially non-sticky and substantially not ΐ LU, which can attract foreign substances by electrostatic attraction without causing any transportation problems. The clean layer exhibits a surface resistivity of not less than ix 1G13 ohm / square. It is better not to be less than 1 X 1 〇 4 ohm / single tongue to make the surface resistance of the clean layer. Material design effect. Because "=" when the surface resistivity of the electrostatic Lein layer with foreign matter is lower than i χ] 0.3 ohm / square, the electrostatic effect of capturing and adsorbing foreign matter will be reduced. There are no special restrictions on the material and structure of the cleaning layer, as long as it is not substantially

V. Description of the invention (4) It is viscous and substantially _ including plastics such as polyethylene bridges, and only conductive. Examples of this material include films of polycarbonate, polycarbonate, polypropylene: vinyl terephthalate, ethyl cellulose, and adhesives via fluorene, polyamine, polyimide, and polycarbodiimide. Sexual material. The hardening adhesive is hardened to produce a substantially non-square meter ♦ ::: α The clean layer in the sheet to show less than 30 millijoules / good. Good ,: = to dmillijoules / square meter means to clean through: ； (solid surface free energy) is based on (from the literature) the surface self-elongating Fok (F) 〇wkes,) equation (Y〇Ung s) equation and the value obtained by extending the two linear equations ^: ¥ ° in the following equation (1) + cos rL = 2 / TT-r ^ T +? Where Θ represents the contact angle; s〗 (1) the surface free energy of the body; 4 Tables used for the contact angle measurement of the polar force component in the liquid h force component; V represents the force component; and V sp represents the solid; ： Second solid self-propelled from the surface of the dispersion of free energy, the clean sheet is designed to make the polar component of the clean layer I. The contact angle is better, more than 100 degrees is better. Table 7 shows more than The design of 90 degrees makes its display fall above the above 62 degrees. Through the clean layer by energy and contact angle, it can be surely reached: lose: 1: a pair of water table "m layer will be firmly adhered to ： Effects' position of the cleansing layer which is not in the second clean sheet of the present invention. * # 有 Not less than 10 of 550688 V. Description of the invention (5) "'Kickers hardness' is applied from 205 R Π Π from'" Vickers hardness "J = νντ The term used herein is applied to a diamond indenter according to JIS Z2244. In the present invention, from: 5: f marks, surface area and Kers hardness not less than the predetermined material is designed to make the fruit of the clean layer, without making clean reeds = sending clean sheets 9 Closely connected with the position to be cleaned in the transportation process, the second, speech, and preparation of the present invention + t 2 &gt; The clean layer in the π Yin sheet to show less than 30 millimeters; The surface free energy of t bucket / Qian Fangwei is better than / ,,,. This clean layer is good for you ... 5 to 25 Joules / Qian Weiwei is better than 100 degrees. On the surface The contact angle is designed to be larger than the w-n-n cleansing layer that is currently defined above so that it can reliably transport clean sheets to the water display = Table: Free energy and contact angle 'can be produced: Niu solid sticks to be cleaned The material of the cleansing layer described by Qiao Ze is not less than the above-mentioned value. The limitation is only as long as it has: =: Γ 可 ' However, in fact, materials that can be used to extend the modulus can be used to accelerate the crosslinking reaction or cure to show enhanced tensile strength. This f-layer is composed of at least one polymerized curing reaction by using activation energy. , So that the use contains a selected from = two off ::: sensory adhesive polymer, which can include acrylic, acrylate, methyl acrylic and methyl

C: \ 2D-CODE \ 90-07 \ 90]] 1082 Ptd Page 8 550688 V. Description of the invention (6) Acrylic acid (meth) acrylic acid and / or (fluorenyl) acrylic acid as the main monomer acrylic acid Department of polymers. When the acrylic polymer is synthesized, the compound having an unsaturated double bond per molecule can be chemically bonded to the acrylic polymer thus synthesized through the use of a compound having two or more unsaturated double bonds per molecule or through a reaction of a functional group. When the unsaturated double bond is introduced into the molecule of the acrylic polymer and is completed, the polymer itself can participate in the polymerization and curing reaction by the activation energy. A compound having one or more unsaturated double bonds per molecule (hereinafter referred to as "polymerizable unsaturated compound") is a non-volatile, low-molecular-weight compound having a weight-average molecular weight of not more than 10,000. Compounds are preferred. In particular, it is preferable that the polymerizable unsaturated compound has a molecular weight of not higher than 5,000, so that the adhesive layer can be three-dimensionally network-crosslinked more efficiently during the curing process. The polymerizable unsaturated compound is also preferably a nonvolatile low-molecular compound having a weight-average molecular weight of not more than 10, 000. In particular, it is preferable that the polymerizable unsaturated compound has a molecular weight of not higher than 5,000, so that the clean layer can be more efficiently three-dimensionally network-crosslinked during the curing process. Examples of this polymerizable compound include phenoxy polyethylene glycol (fluorenyl) acrylate, ε-caprolactone (fluorenyl) acrylate, polyethylene glycol di (fluorenyl) acrylate, polypropylene glycol di (methyl Base) acrylate, trishydroxymethylpropane tri (meth) acrylate, diisopentaerythritol hexa (fluorenyl) acrylate, (meth) acrylate urethane, (fluorenyl) acrylate epoxy , And (fluorenyl) acrylic oligoester. These polymerizable compounds may be used alone or in combination of two or more kinds thereof. As for the polymerization initiator to be added to the cleansing layer, any known material can be used without any limitation. If heat is used as the activation energy, you can use heat __: 1 country_9 C: \ 2D-CODE \ 90-07 \ 90111082.ptd page 9 550688 V. Description of the invention (7) J compound initiator such as over-gas The main energy of benzamidine and azo: using photopolymerization initiators 222 :: using photo ethyl ether, fluorenyl, isopropyl benzoyl β methyl, benzoic acid (Michler's ketone) chlorine I the same, mianketone diphenyl class. South, dimethyl + oxygen 4 :::::, dodecyl. Oxyethyl, dimethylenol, α_ cyclic di, south, diethanol phenylbenzyl propane, and 2,2 -Dimethylcha 9 poor soil native ® same, 2-hydroxydimethyl P ρ acetophenone. The thickness of the / 糸 / 尹 layer is not particularly limited. Iron ~ is from about 5 to 100 microns. ... and, in general, the present invention also provides a specific cleansing layer provided on a base and the aforementioned material provided on one side of a material frame on the other side. The clean sheet to be placed on the upper layer of the other side of the base material has a limitation of 'as long as it can exhibit the desired ::: material without a special adhesive (for example, an acryl-based adhesive can be used.) Use general &amp; this configuration 'available f-pass layer adhesive agent). Such substrates or other conveying members such as two conveying members that adhere to the sheet to each cleaning function so that they can be placed in contact with each other to make them clean; the inside of the device is to be cleaned after cleaning If the substrate is re-used, such as substrate reuse, it can be described as conveying a Newton κmm millimeter object circle (the second series of mirrors is from about 0. 0 1 to 0.5 Newton /! The peeling layer is peeled off, and after cleaning, it can prevent the substrate from self-adhesion. A:]: The substrate is easily peeled off. There are no special restrictions on the basic material. About this C: \ 2D-WDE \ 90-07 \ 90111082.ptd Page 10 550688 V. Description of the invention (8) m ::; plastic!? — Polyterephthalate ... diyl; = ... like and poly ... film. On the list, you can use: Special: Restrictions. However, the actual (= mention-use of this structure "::; :::;: = check the components of the equipment, net. The components of the conduction inspection equipment damaged by foreign substances 2: used to clean all kinds of conduction inspection equipment Make the inspection settings] = method (two such as, 1C socket contact pins) and production, contact point solder) Cut. The foreign material produced will be attached to the side of the contact pin and the side of the contact pin, such as' Shao, wai. This insulation causes flaws. In the worst case, the guide to be inspected = And because of the low. To remove these foreign materials from the contact pins: Polyethylene terephthalate, which will reduce the aluminum particles, is coated with a rubber-based resin such as Shi Xiyan and coated with oxygen. The following raw particles are added with a pin cleaner.) However, recently, the trend of semiconductor manufacturing to "contact the wafer thickness and increase the length of the wafer has become more and more central: towards the lower table (chuck table)" In addition, there is a central holding error in the inspection. Because of this, some measures need to be taken: C: \ 2D-CODE \ 90-07 \ 90111082.ptd Invention description (9) The master platform is removed. To this end, It must be used to clean the missing platform, so the operation of the external and double-checking equipment has been suspended for efficiency reduction or it needs to be removed from it. As a result, operations in these situations are not beneficial. Biography: check the contact pins in the equipment and drop-a kind of clean Quality of clean components and "= chuck platform and delivery are included for removal of attachments by rotation. As a result, the foreign matter of the contact pins has been checked and the conductive detector is in preparation") and β can be attached to the inspection device when removing the device attached to the free contact ^: abbreviated $ 「contact pin cleaning ^ contact area (chuck platform); ::: You can clean the contact pins, see By removing the coefficient of friction of the clean layer; two = the foreign material is also removed. The clean sheet is surely conveyed by checking a specific value, in other words, this hair = mention: magnetic The present invention has been successful. Pieces, including For foreign materials used in conducting inspection of clean structure contact pins ": wide," conducting inspection connector in inspection equipment ") and for removing foreign materials attached to the structure and contact area The contact layer of the contacting equipment. Beizhi 6 is placed on one side of the cleaning device of the contact pin, which is used for cleaning. It can be checked by conducting the inspection of the contact pin 550688. 5. Description of the invention (10) --- A member provided on one side of the conveying member (hereinafter referred to as a "contact pin cleaner"), and a member provided on the other for removing foreign matter attached to the contact area of the device with which the contact pin is cleanly in contact. The aforementioned clean sheet. F There is no special restriction on the cleansing layer in the cleansing member of the present invention, as long as it can be transported through the inside of the inspection equipment and the amount of foreign substances can be simply reduced. However, in fact, from the standpoint of dust removal properties and transport properties, the friction coefficient of the cleansing layer is preferably not less than i · 0, and more preferably from 1.2 to 1.8. When the coefficient of friction of the cleaning layer is lower than 丨 · 〇, foreign materials on the chuck platform may not be able to be reliably attached to the cleaning layer. In contrast, when the friction coefficient of the cleaning layer exceeds the above-defined range, the clean sheet may not be conveyed. In the present invention, the coefficient of friction (") of the clean layer is measured by using a general-purpose test machine to measure the coefficient of friction generated when a stainless steel plate (a plate of 50 mm x 50 mm) is slid along the surface of the clean layer ( F), and then measure the measured value and the vertical load (W) applied to the steel plate in this procedure by substituting it into the following equation (2) and measuring it. The presented one is the dynamic friction coefficient. // = F / W (2 ) Where // represents the dynamic friction coefficient; F represents the frictional resistance (Newton); and w represents the vertical load (Newton) applied to the steel plate. The clean layer exhibits a tensile modulus not higher than 2,000 Newtons per square millimeter, It is preferably greater than 1 Newton per square millimeter. When the tensile modulus of the cleaning layer exceeds 2,000 Newton per square millimeter, foreign materials on the chuck platform may not be able to adhere to the clean layer with certainty. Relatively , When the tensile modulus of the clean layer

\\ 312 \ 2d-code \ 90-07 \ 90111082.ptd Page 13 550688 V. Description of the invention (11) Less than 1 Newton / square millimeter per day, clean in the present invention, fearing that the heart of the clean layer will not be able to Be transported. When within the range defined above, the cleansing and tensile modulus are intended to be substantially non-sticky during the conveying process. 7 The frozen sheet or the like does not make the cleansing layer firmly adhere to :, It can produce the effect of conveying the clean sheet for cleaning the contact pins of the present invention; === position: There is no special limitation on the element. Can use Fan 2 shape, shape and other reasons Plastic materials such as polyethylene, polyparaphenylene = f1 materials can be used. For example, vitamins, polycarbonates, and polypropylene are thinner than polyethylene glycol and ethyleneimide. The rubber-based resins are: Silicone 3 Same: =: Covered with abrasive particles such as granular oxidation, substrates (linings) such as non-woven fabrics, but the present invention should not be interpreted as an acceptance; the shape of the chromium oxide cleaner can be cleaned. The shape and type of equipment are appropriately determined. 'β said the f of this configuration +, can make the clean sheet adhere with ordinary adhesive layer to: Π contact pins on the non-clean side of the contact pin cleaner or ^ components such as a variety of cleaning functions The substrate is conveyed to the inside of the device to form a conveying member, so that it contacts the chuck platform for cleaning. There are no special restrictions on the conveying member on which the clean layer is provided. However, ', in fact, semiconductor wafers, substrates for flat-panel displays such as LCDs and PDPs, substrates for optical discs and MR heads, or plastics such as polyethylene, polyethylene terephthalate, ethyl cellulose, polymer Films of carbonated vinegar, polypropylene, polyamine, polyimide and polycarbodiimide. The invention further provides a tool for manufacturing various substrate processing equipment.

Page 14 550688 Description of the invention (12) Five methods of cleaning a wheel with material damage to one of its components, for example, for the manufacture of susceptible external displays, "two-band exclamation, such as for the manufacture or inspection of semiconductors 2, plane display method. The conveying member with clean function used in the equipment such as the road-throwing board and the like, and the right, 刼 -pieces mentioned above), and the conveying member with the clean function (hereinafter referred to as "clean structure compared with the rotating structure 1" The shape of the cow is shaped by laminating the conveying member such as the substrate and the member on the clean sheet, and the shape is: The cleanness obtained by laminating the clean two materials is referred to as "directly cutting the round temple monk knife cutting (hereinafter will be This method cuts waste material and attaches it to a layer with a self-cooling #layer, which is processed into the shape of a rotating member first ::: piece: disadvantages. After the preforms are laminated, they are used to make clean parts. Materials and conveying structures are suppressed during the labeling process, compared with the direct cutting method, it is necessary to perform the labeling of the sheet for cutting = the generation of cutting waste. However, it must be increased to make the system of clean components 1: Secondly, the numerical efficiency of the required work steps is degraded. I / becomes complicated, and thus makes the operation under these circumstances, and the present invention further transports the substrate through the substrate processing equipment. Exactly inside the substrate processing equipment = : Reliably and simply removes the accommodating cutting method in the sheet cutting process, and does not produce the method by the straight drawing. The clean structure of the cutting waste generated :: The present inventors have conducted extensive research and found that Through the stated purpose of including the conveying member into a set. As a result, in the process of manufacturing the member (where the clean board of the clean member is laminated with the clean sheet, the clean clothes manufacturing system uses the direct cutting method to complete 'm C: \ 2D-CODE \ 90-07 \ 901110S2.ptd Page 15 550688 Five Descriptions of the Invention (13) ^), manufacturing clean layers that undergo polymerization when subjected to activation energy, and cutting clean sheets into conveying members / 状 H Xing Jie = polymerization curing reaction of the layer, can produce clean components that can simply and surely come to Wulu without producing the aforementioned question M; Cheng Ming has succeeded. Therefore, this issue in other words, this The invention further provides a method for preparing a piece with cleansing, which comprises subjecting an input structure provided on one of the basic materials to undergo polymerization and curing when subjected to activation energy: $ 由 当 and ordinary adhesion provided on the other side Layer J: Chengzhi's cold clean layer The common adhesive layer is interposed therebetween, where the shape of the one material and the conveying member layer is more than the shape of the conveying member ^, but in the middle, the clean sheet cuts the clean sheet, which is characterized by the clean layer system two The contour of the component is cut and cut and then subjected to polymerization and curing: the contour of the component is in the preparation method of the clean component according to the present invention. 4. The adhesion τ that undergoes polymerization and curing by activation energy must be borrowed from the sheet. It is performed after cutting. This is due to the fact that when polymerizing and solidifying is undergoing polymerization and curing, cross-linking occurs and 2 sheets are cut before cutting, which results in a large amount of cutting waste adhesion. During the cutting process, the components or equipment are cleaned. According to the test method of JIS κ7127, cutting waste is generated. It is better to use root Newton per square millimeter, not higher than the tensile modulus, not higher than 1. The tensile modulus of the layer is better _ton / mm2. It can prevent self-cleaning during the sheet cutting process. J = the specific range described above. Direct cutting method can be used to prepare no ^ f secondary waste, making _ 庵 枓 clean components. In addition,

C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 16 550688 Five 'invention description (14) It is sent by polymerized solids and polymerized and solidified, and will not be fixed in the present invention, or by activating the energy to stretch the mold The number of foreign materials removed by the layer's tensile modulus is less than 10 Newtons to the ordinary adhesive on one side of the invention to be cleaned according to the invention. The cleansing layer made of the modified adhesive of Example 1 can be non-adhesive on the cut sheet of the sheet, so that it can provide a clean member that can be fixed and adhered to the contact area. The clean layer after the sheet is cut is better than 10 Newton / square millimeter from 10 to 2,0 Newton / square millimeter due to the curing of the cross-linking reaction. When cleaning exceeds 2,000 N / mm2, the capacity of the self-conveying system will deteriorate. In contrast, when the tensile layer per square millimeter of the clean layer is used, the clean layer will increase the internal area of the device during transportation, which will cause transportation problems. The preparation of the clean member includes the use of the aforementioned specific adhesive layer containing a clean layer as a base material and a clean sheet provided on the other side, the clean layer being in an uncured form. One step is illustrated in the following examples, but should not limit the present invention. The term "parts" as used below refers to more than 100 parts of an acrylic polymer made from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of ethyl acrylate and 5 parts of acrylic acid ( Weight-average molecular weight: 700,000) To 50 parts of polyethylene glycol dimethacrylate, 50 parts of acrylic urethane, 3 parts of dimethylformal and 3 parts of diphenylphosphonium di Isocyanate. The mixture was then stirred uniformly to obtain a solution of an ultraviolet curing adhesive. After irradiation at a total dose of 1,000 millijoules per square centimeter

550688 V. Description of the invention (15) Ultraviolet light with a central wavelength of micrometers has a tensile modulus of "square millimeters"

The test method of K 71 2 7 is carried out. ', J is made according to the same method as described in J IS, and ^, except that ^ 一一 MeOH was reduced, and the adhesive described in "Yue" J is not enough to provide on it-ordinary adhesion "0 micron dry-thickening adhesive solution is applied to a thickness of 3δ = UV light solid surface to a dry thickness of 40 micrometers, in order to straighten up 2: Peel off the film and peel off the film to make the toilet clean: Floor. Layers are then laminated to each other. The layer and the adhesive layer are arranged opposite to each other, and then the produced sheet is irradiated with a center wavelength of 365 亳 m at a dose of 1,000,000 milliears per square meter. Clean sheet. The quality of the surface of the clean layer was measured by using the Mcp_up45o surface resistivity meter manufactured by Mitsubishi Chewed Corporation. The surface of the clean layer was measured at 5-degrees and 60% relative humidity. The two fruit 'reading is greater than 9.99 x, ohms / square, and it is impossible to measure: the peelable film is then removed from the clean sheet on the side of its ordinary adhesive layer. Then, the clean sheet is adhered to the back side of the 8-inch silicon wafer (mirror surface; and a clean clean wafer is prepared for cleaning. In addition, the two wafer segments are removed from the substrate processing equipment, and then analyzed by lightning foreign substances Meter measures foreign matter with a size of not less than 0.3 microns

\\ 312 \ 2d-code \ 90-07 \ 90111082. Page 18 550688 V. Description of the invention (16) The existence of '-' ''-. As a result, on one of the two wafer segments, 18,000 on the area having a wafer size of 8 inches were found to be not less than 0.3 micron in size, quality, and on the other Found 17,000. The peelable film is then peeled from the aforementioned transported clean wafer on its clean layer side. The transported clean wafer is then transported to the inside of a substrate processing apparatus having a wafer segment to which 8,000 foreign substances are attached. As a result, the transfer of the clean wafer can be performed without problems. Thereafter, the wafer segment was removed, and then the presence of foreign matter having a size of not less than 0.3 micrometers and inches was measured using a laser-type foreign matter analyzer. As a result, 4,000 foreign materials having a size of not less than 0.3 micrometers were found on an area having a wafer size of 8 inches, and it was apparent that more than 3/4 of the foreign materials adhered before cleaning were removed. . ~ _Comparative Example 1 ', "It was prepared in the same manner as in Example 1, except that the amount of dimethyl acetal was 0.05 parts. The clean layer in the clean sheet had stickiness. The lack of measurement cleanliness The tensile modulus of the layer. The result was 0. 5 Newtons per square millimeter. &Lt; An attempt was made to convey the clean wafer prepared from the aforementioned clean sheet in the same manner as in Example 1 through the substrate processing equipment. Internal. However, the 'clean wafer' is adhered to the conveying arm, so it cannot be lost ..., Example 2 contains 100 parts of 75 parts of 2-ethylhexyl acrylate, 20 parts of propyl chloroformate and 5 parts. Acrylic polymer (weight-average molecular weight: 70,000) prepared from an acrylic monomer monomer mixture of 50 parts was added with 50 parts of polyethylene ^: methacrylate, 50 parts of acrylic amino group Formate, 3 parts of dimethyl acetophenal and 3 parts of diphenylmethane diisocyanate. Then mix =

550688 V. Description of the invention (17) Mix evenly to obtain the solution of the UV curing adhesive. In addition, it will be prepared in the same way as above.-An adhesive containing dipyridyl acetic acid and cold. 3 The polyester peelable film with an adhesive degree of less than 250 mm is described as 布 cloth to a thickness of 25 micrometers and wide to provide a common adhesive on it :. On the two sides to a dry thickness of 10 microns, the peeling film is adhered to ordinary adhesion; on the other hand, a polyester with a thickness of 38 microns may be coated on the base material; the other is to provide a clean layer on it. sticky. Miao ^ Dry thickness The release film is adhered to the surface of the clean layer. θ, ..., will be awarded later, and then the resulting moon material is irradiated with a dose of ^ ⑽mmol to a clean sheet invented by a prosthetic limb with a center of 3 65nm. After UV // exterior, the adhesive layer in accordance with the present net layer was used to display the cleanliness in the material. The measurement was performed using the test method according to Chuan K7127. ° The tensile mold will adhere the mirror layer on the side of the Jieping layer to a mirror surface with a width of j 〇 millimeter, and then according to JIS 7 0? Ί7, heading 丨 Rikou '0θθ® &quot; 18〇 ° f After that, the peelable film is adhered to the self-cleaning sheet, and then the clean sheet is adhered to 8 inches ... the back side of the circle (mirror surface). Second, a clean wafer with β net function is transported. Then, the two wafer segments were removed from the substrate processing equipment, and then the presence of foreign matter having a size of not less than 0.3 micrometer was measured using a laser-type foreign matter analyzer. ， Results ′ On one of the two wafer segments, 2,5 0 0 were found in an area having an 8-inch crystal circle size with a size of not less than 0.3 microns.

Page 20 550688 V. Description of the invention (18) Foreign matter 'and 2 2,0 0 were found on the other. The peelable film is then transported from the aforementioned transported clean wafer on its clean layer side, and then removed by three, and then the wheeled clean wafer is transported to a substrate having a wafer segment attached with 2,500 tf substrates. The interior of the processing equipment. As a result, the conveyance of cleanliness can be performed without problems. Thereafter, the wafer segment was removed, and then the presence of foreign matter having a size of not less than 0.3 micron was measured using a laser-type foreign matter analyzer. As a result, 6,200 foreign materials having a size of not less than 0.3 micrometers were found on an area having a wafer size of 8 inches, and it was apparent that more than 3/4 of the foreign materials adhered before cleaning were removed. . And, compared with Example 2, a clean sheet was prepared in the same manner as in Example 2, except that it was irradiated with ultraviolet light having a center wavelength of 36.5 nm at an overall dose of 5 millijoules per square centimeter. Then, the tensile modulus of the clean layer of the clean sheet thus prepared was measured in the same manner as in Example 2. The result was 0.67 Newtons per square millimeter. Then measure the adhesion of the adhesive layer of the clean layer to the silicon wafer. The result was 0.33 Newtons / 10 house meters. An attempt was made to transport the transported clean wafer prepared from the aforementioned clean sheet in the same manner as in Example 2 through the inside of a substrate processing apparatus having a wafer segment to which 22,000 foreign substances were attached. As a result, the clean wafer is transported to the a-yen section. So 'transport clean wafers can no longer be transported. Example 3 100 parts of an acrylic polymer prepared from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylic acid, and 5 parts of acrylic acid (weight average molecular weight: 7 0 0，0 0 0) added 50 parts of polyethylene glycol two

C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 21 550688

Acrylic acid vinegar, 50 parts of acrylic amino formic acid brewed with carbaldehyde formaldehyde and 3 parts of diphenylmethane di cyanocyanine saponin = formazan will be prepared in the same way as above, ㊉ contains dimethyl acetal The solution of the adhesive outside the acid is not a prescription; a common adhesive layer is provided thereon. Then the peeling film is adhered to the surface of the ordinary adhesive layer, and the adhesive solution is applied to the other side of the base material film to a dry micrometer of ⑼ micrometer, so as to provide an adhesive layer as a clean layer thereon. Panasonic release film adheres to the surface of the clean layer. ‘,,, and later will be similar

Then, the produced sheet was irradiated with ultraviolet rays having a center wavelength of 365 nm at a dose of 3,000 millijoules per square centimeter to obtain a clean sheet according to the present invention. The surface of the clean layer is substantially non-sticky. The clean layer cured by ultraviolet light exhibited a tensile modulus of 0.5 8 Newtons per square millimeter. The measurement of the tensile modulus is performed by a test method according to jIS K7 127. Adhere the clean layer to the mirror surface of the silicon wafer with a width of 10 mm, and then peel and adhere to Shi Xi wafer 1 § 〇 according to J I S Z 0 2 37. The result was 0 · 49 0 Newtons / 10 mm. Therefore, it was confirmed that the cleansing layer was not substantially sticky. The surface resistivity of the clean layer was measured using a MCP-UP450 type surface resistivity meter 'manufactured by Mitsubishi Chemical Corporation at a temperature of 2 3 C and a relative humidity of 60%. As a result, the reading was greater than 9.99 X 1 013 ohm / square, and the measurement could not be performed. Therefore, it has been confirmed that the clean layer is substantially non-conductive. The peelable film is then peeled from the clean sheet on its normal adhesive layer side

\\ 312 \ 2d-code \ 90-07 \ 90111082.ptd Page 22 550688-I _ 5. Description of invention (20) Division. Then, the clean sheet is adhered to 8-inch silicon crystals to prepare a clean wafer for transportation. β side (mirror surface), complex-Example 4 A dagger with a thickness of 25 micrometers and a width of 25 millimeters will be the same as the one used in Example 3, with a dry thickness of 10 micrometers on one side. Iron = square; polyester: Peelable film is adhered to the surface of the ordinary adhesive layer, and the polyester film as a clean layer exhibits 200 Newtons: number. Polyvinyl alcohol film was also measured on silicon wafers. ： = The stretch is 0 half insertion / 1 η true industry ㈤Although sticky. Muli

Raw. … So it has been confirmed that the polyacetate film does not substantially have the DJ for measuring the surface electrical rate of the polyimide film. ^ 1 〇13 ohms, which makes it impossible to make measurements, and so on. /: &Quot; 9 &gt; &lt; It has substantially no conductivity. ,, α ,,,,,,,,, and, a star cleansing layer, then the peelable film self-cleaning sheet is prepared in the same manner with clean, # ..., and then with the same as Example 3 In addition, the use of laser type ::::::: net crystal Circle (2). On the mirror surface, 0 has the existence of not less than 0 t. As a result, twelve foreign materials were found on the first two Λ y, inch foreign materials, and ten mirrors were found on the second wafer with the first 'two f8 foreign materials'. Then divide these sections. Later, the existence of the shell in the temple was used within the mirror to treat foreign matter inside the Lei Erban processing equipment. On the first silicon wafer, 8 inches, page 23, \\ 3l2 \ 2d-code \ 90-07 \ 90111082.ptd 550688 V. Description of the invention (21) It was found that 23,788 had a size of not less than 0. .2 micron size "2,008" was found on the first silicon wafer, and 28,403 on the third silicon wafer. The top film: the release film from the aforementioned Clean wafers are transported in their cleanliness. The transported clean wafer (1) is then transported to the inside of a substrate processing apparatus having a wafer section with 8 foreign substances attached. As a result, transportation was difficult. Thereafter, a brand new 8-inch silicon wafer with 7 foreign objects having a size of not less than ^ 0 ^ 2 U meters was sent to the inside of the substrate processing equipment with its mirror surface :: rtf. Then, using a laser-type exogenous material: the analyzers individually measure the existence of foreign materials of these wafers having a size of not less than 0.2 micrometers. As a result, in the area of the wafer size at 8 inches, the side + j square, u · 2u wood size foreign matter, showed that 74% of the foreign matter attached to the cold 1T was removed. Then, the aforementioned clean wafer (2) is transported to the &amp; interior of the substrate processing equipment of the wafer segment of 2,068 foreign matter. As a result, transportation was difficult. Thereafter, a brand new 8-inch wafer with 13 foreign materials existing thereon and having a size of 2 micrometers or less; was measured in the same manner as described above. As a result, 7,988 foreign materials having a size of not less than 0.2 micrometers were found on an area of 8-inch wafer size, showing that 69% of the foreign materials attached before cleaning were removed. Comparative Example 3 was prepared in the same manner as in Example 3, except that the clean layer in the clean sheet had a sticky layer that was irradiated with ultraviolet light having a center wavelength of 36.5 nm at a total dose of 5 Joules per square centimeter. Sex. Then measure and prepare

550688

The tensile modulus of the clean layer of the clean sheet. The result was 0.07 Newton / square millimeter. Then measure the adhesion of the clear layer to the Shi Xi wafer. The result is Q MW Newton / 10 mm. An attempt was made to transport the clean wafer (3) prepared from the aforementioned clean sheet in the same manner as in Example 3 through the inside of a substrate processing apparatus having a wafer segment to which 28,403 foreign substances were attached. . As a result, the transported clean wafer is fixed to the wafer segment. Therefore, transporting clean wafers can no longer be transported. Example 5 Acrylic polymer prepared from 100 parts of a monomer mixture containing 30 parts of 2-ethylhexyl acrylate, 70 parts of ethyl acrylate and 10 parts of acrylic acid (weight average molecular weight: 2 (80, 00, 00)) was added 150 parts of diisoisotetraol hexaacrylate (trade name: UV 1700B, Nippon Synthetic Chemical Co., Ltd., L t d. )), 3 parts of a polyisocyanate compound (trade name: ◦ 〇〇〇〇〇〇〇 ン 〇 L, Nippon Polyurethane Industry Co., Ltd. (N 丨 pp〇n

Polyurethane Industry Co., Ltd.) and 10 parts of dimethyl acetal (Irgacure 651 'Ciba Specialty Chenncals Co., Ltd.). After lacking, the mixture was uniformly stirred to obtain an ultraviolet curing adhesive solution A. &amp; The ultraviolet-curing adhesive solution was irradiated with ultraviolet light having a center wavelength of 365 nanometers at a body dose of 1,000 millijoules per square meter. The surface of the clean layer is substantially non-sticky. The UV-cured cleansing layer exhibited a tensile modulus of 1,440 N / mm2. The measurement of the technical extension was performed by a test method according to J IS KK7127. 550688, Description of the invention (23) In addition, 1 100 is a fulvic acid system prepared from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl formate, and 5 parts of acrylic acid. To the polymer (weight-average molecular weight: 70,000) was added 50 parts of polyethylene 200-methacrylate (trade name: Ester 4g,

Smnnakamuu Chemical Co., manufactured by Ud.), 50 parts: ϋ'N'01Chemicai Co., Ltd.) and 3 parts of polyisocyanate compound (trade name: C〇〇〇〇nate L, Nippon polymer Carbamate Industry Co., Ltd.

Then the mixture is stirred uniformly, and one of the thin film of the basic material is provided-the ordinary adhesive layer. The thickness is then 38 micrometers in degrees; above it &amp; for a clean layer. Tak Yi-yu adheres to the surface of the clean layer. ',,, and later-a similar peelable film, and then the resulting sheet is engraved with 丨, 000 millijoules per square centimeter = amount of light? Clean sheet of the invention with a UV dagger with a center wavelength of 365 nm. The peelable film is then self-cleaned on the side according to this layer. Then measure the surface free energy of the clean layer. = For Erjing House Joules / square meter. The clean layer exhibited a water contact of 105.1 degrees, ′, · 4 and then the peelable film was cleaned from the sheet at its ordinary adhesion angle. . Then use a manual roller to adhere the clean sheet to 8 inches of silicon and peel off (mirror surface) to prepare a clean crystal with clean function: Lunar surface

550688

In addition, the wafer segment was removed from the substrate processing equipment, and then the presence of foreign matter having a size of not less than 0.3 micron was measured using a laser-type foreign matter analyzer. As a result, 21,000 foreign materials having a size of not less than 0.3 micrometers were found on an area of an 8-inch wafer size. Eight The peelable film is then stripped from the clean wafer on its clean layer side. The clean wafer is then transported inside the substrate processing equipment. As a result, the cleaning layer was not firmly adhered to the position to be cleaned even after the continuous transmission of 100 films. Therefore, conveyance can be performed without problems.

Thereafter, the wafer segment is removed from the substrate processing equipment, and then the presence of foreign matter having a size of not less than 0.3 micrometers is measured using a laser-type foreign matter analyzer. As a result, 10,000 foreign substances having a size of not less than 0.3 micrometers were found on an area of 8 inches wafer size, which showed that half of the foreign substances adhered before cleaning were removed. Comparative Example 5 100 parts of polyethylene was used, including 100 parts of polyethylene glycol 2000 dimethacrylate (trade name: NK Ester 4G, manufactured by Sninnakamura Chemical Co., Ltd.) and 100 parts of polyethylene. Diol 600 acrylate (trade name: NK Ester A-600, manufactured by Sninnakamura Chemical Co., Ltd.)

And 3 parts of a polyisocyanate compound (commercial name: coonate L, manufactured by Nippon Polyurethane S Industrial Co., Ltd.) was added to 〇00parts containing 30 parts of 2-ethyl acrylic acid Acrylic acid polymer (weight average molecular weight: 2,8 0,0 0 0) in an acrylic polymer (weight average molecular weight: 2,8 0,0 0 0), and then The adhesive solution C prepared by the method of uniformly stirring the mixture was used as the adhesive of the clean layer. Then it is the same as that of Example 5.

\\ 312 \ 2d-code \ 90-07 \ 90111082.ptd page 27 550688 V. Description of the invention (25) The tensile modulus of the clean layer thus obtained was measured in the same manner. The result was 0.1 N / mm2. A clean sheet was prepared from the clean layer in the same manner as in Example 5. Then measure the surface free energy of the clean layer. The result is 57.3 millijoules per square meter. The clean layer exhibits a contact angle to water of 49.4 degrees. An attempt was made to transport the transported clean wafer prepared from the aforementioned clean sheet in the same manner as in Example 5 to the inside of the substrate processing apparatus.纟 士 果 The clean wafer is fixed to the wafer section during the first sheet conveying process. Because of this, clean wafers can no longer be transported. Example 6 A 100-weight acrylic acid-based polymer (weight average molecular weight: 100 parts) prepared from a monomer mixture containing 75 parts of 2-ethylhexyl acrylate, 20 parts of acrylic acid brewing, and 5 parts of acrylic acid. 700,000) was added 100 parts of polyethylene &gt; alcohol 200 difluorenyl acrylate (trade name: NK Ester 4G, Yiyou @ 的 聚 异 cyano

Sn i nnakamura Chemical Co., Ltd.) Acid S purpose compound (trade name: Colonate L, manufactured by Nippam Polyamide Co., Ltd.) and 3 parts of which are introduced as photopolymerization in Caiyi 1 ”Benzene Formaldehyde (Irgacure 651, Cibat Chemical Co., Ltd./manufactured). Then the mixture was stirred to prepare the purple solution of the company's formulation A. 糸 External light curing adhesive will be prepared in the same manner as before Except for front-liquid A, which does not contain diacetal as the photopolymerization initiator, the adhesive solution is coated to a thickness of 38 microns and a width of 25 mm. Polyfluorene = one side of the adhesive to a dry thickness of 10 microns In order to provide on it-a release film and a through adhesive layer.

550688

Ϊ Glue a polyester peelable film with a thickness of 38 microns to the side of the ordinary adhesive layer. Next, the above-mentioned UV-curable adhesive solution α is a film ... side to a dry thickness of 10 micrometers, and is based on the lift-up / base layer: €. A similar peelable film was then adhered to the &lt; surface. -^

Then, the resulting sheet was irradiated with a total length of 2,000 millijoules per square centimeter, and the ultraviolet rays with a center wavelength of 36.5 nanometers were obtained, and the clean sheet according to ‘Ermin's. The peelable film was then peeled from the clean sheet on its rabbit side. Then, the Mickel-400 type Vickers leapers &amp; leaf manufactured by NEC were used to measure the Vickers hardness of the clean layer of the clean sheet. The result is 45. The UV-cured clean layer exhibited a tensile modulus of 147.2 Newtons per square millimeter. The measurement of the tensile modulus was performed using a test method according to [13 KK7127]. The clean layer was adhered to the mirror of the silicon wafer with a width of 10 mm, and then 180 of the silicon wafer was measured according to JIS ZO23. Peel adhesion, the result was 0.04 9 Newtons / 10 mm. Therefore, it was confirmed that the cleansing layer was not substantially sticky. Electrical performance

The surface resistivity of the clean layer was measured using a MCp-up45o type surface resistivity manufactured by Mitsubishi Chemical Corporation at a temperature of 23 ° C and a relative humidity of 60%. As a result, the reading was greater than 9.99 X 10π ohm / square, and it was impossible to measure it. From these results, it was confirmed that the cleansing layer has substantially no conductivity # and then the peelable film was peeled from the clean sheet. Then clean the wafer to the back side (mirror surface) of the 8-inch silicon wafer, and prepare a clean wafer with clean transport. Of

550688 V. Description of the invention (27) In addition, the two μ circles are removed from the substrate processing equipment, and then the existence of foreign matter having a size of not less than 0.3 micrometers is measured using a laser-type foreign matter analyzer. As a result, 25,000 foreign substances having a size of not less than 0.3 micrometers were found on one of the two wafer segments in an area having a wafer size of 8 inches, and 2 were found on the other. 3,000. The peelable film is then peeled from the aforementioned transported clean wafer on its clean layer side. The transported clean wafer is then transported to the inside of a substrate processing apparatus having a wafer segment to which a foreign substance is attached. As a result, the transfer of the geki wafer can be performed without any problem. It is then adapted and then measured with a laser-type foreign material analyzer having a &amp; division 'size: the presence of foreign material. As a result, 4,800 wafers with an area of 8-inch wafers or more are displayed in a size of not less than 0.3 micrometers! : Remove more than 4/5 of the foreign matter adhered before cleaning. Comparative Example 6 Workers and workers are removed. In the same manner as in Example 6 of the yoke, including the 100 parts together? — 舻 finn —Work X is used in J

Ester * A-60 0, Snin— ^ 6 0 0 Diacrylic acid vinegar (trade name: ㈣, 3 parts of polyisocyanic smchemicai c., Ltd.) Amino acid industrial stock / ° (f product name: C〇1〇nate L, Nipon Ju

Also known as Co., Ltd.) and 1 Q parts as an apricot hair extension agent: acetal, / magination &quot; knife as the first polymerization bow I use chemicals limited stock: J (manufacturer: two. Irga, e 651 'Cibamate acid 2-ethylhexyl ester, 7 "eight :::: to 00 parts of propylene made from a mixture containing 30 parts of propylene: human: fluorene ester and 10 parts of acrylic acid monomer 2,80 &quot; 00), the average molecular weight: 4 prepared by a method of uniformly stirring the mixture

C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 30 550688 V. Description of the invention (28) ^: S 5 is used as an adhesive for the cleaning layer. Then, the Vickers of the cleansing layer of the clean sheet thus prepared as described above with I, 2, 1 is equal to 5 \. Measure the surface free energy of the clean layer. The result was 34.6 gross squared = minutes. The clean layer exhibits a contact angle to water of 8 2 · 3 degrees. 々 = In the same way as in Example 6, made from the aforementioned clean sheet, !! The delivery wafer is transported to a substrate with 2 3 0 0 foreign materials attached to it. internal. As a result, the clean wafer is fixed to the wafer segment in the first i π * t second pass seed. As a result, clean wafers can no longer be transported. Example 7 The acid contains 75 parts of acrylic acid 2-ethylhexyl vinegar and 20 parts of acrylic acid: (Subsequent to dimethylacrylic acid prepared by a monomer mixture of ping acid: ,, 0 °) Add 50 parts of polyethylene glycol 200

Chemical Co τ. 〇 Mouth name. NK Estei &quot; 4G, Sninnakamura Product name: U_N_〇1 ', • made), 50 parts of acrylic urethane (commercially produced), 3 parts of poly ^; Co., Ud • Peng Polyurethane Industry ^ = ^ compound (commercial name: Colonate L, the second initiator of methanol, diacetate: yes, manufactured by the company) and 3 parts of it as photopolymerization to obtain UV light E1 chemical agent a °. 'Then the mixture is mixed, and the system is also prepared in the same manner as the above / liquid A without the photopolymerization, except that the aforementioned adhesive solution is applied to a thickness of 3 8 ^ \ ^ bismethyl acetal One of the adhesives on the side of the material has a thickness of 10 μm and a polyester peelable film with a thickness of 250 mm to provide a common adhesive layer thereon.

550688 5 Description of the invention (29) ____ Then the polyester with a thickness of 38 microns can be peeled off the thin surface. Next, the other side of the material film of the UV-curable 1 W through-adhesive layer described above to 10 μm dry household θ 'fen' Ye A was applied to the foundation cleaning: layer deletion. Then put similar ;; away ;;: = for the surface. Connect the adhesive to the adhesive layer and then irradiate the resulting sheet with a center wavelength of 3 65 nm: a clean sheet # of the total invention at a dose of 1,000 mJ. The peelable film is then peeled off from the base layer on the basis of the clean layer. Through the use of ultraviolet light curing two / sheet in its clean friction coefficient and 50 Newtons / square millimeter pull two: the sheet shows a number of 1.7, so that the size of 50 mm x 50 mm is not equal. To measure the friction system at a rate of 300 mm / min and a 9.8 Newton sag, the surface was moved in a predetermined direction. Then use the common tensile test = :: clean layer = ^. The measurement of the tensile modulus is performed by using the rubbing method produced according to "1." The test party then divided the peelable film from the clean sheet at 1 and divided it. Then the manual sheet was used to light the clean sheet = 2 8-inch silicon wafer P-chip chip, manufactured by PASS INC., is connected to the contact pin clean member of the peeling shape on the side of the layer. 柳 = willow cleaner (commodity name: 衣 仏 J's lunar surface (non funeral, | This method has the function of conveying clean components with clean function.…, And then prepare the peelable film from the clean component and then transfer the clean component to the wafer probe through the wafer probe. Then, clean the contact pins and The chuck flat △ /, is used in the clothing semi-conductor. As a result, the cleaning layer is not firmly within the I contact position. Therefore, it can be

\\ 312 \ 2d-code \ 90-07 \ 901ii〇82 &gt; ptd page 32 550688

DESCRIPTION OF THE INVENTION The house is conveyed without problems. Second, observe the contact pins under a microscope. As a result, it was confirmed that foreign matter such as oxides that had adhered to the contact pins during the cleaning of the puppets disappeared, indicating that the contact pins had been cleaned. In addition, it was found that the silicon debris having a size of about 1 mm was completely disappeared on the chuck platform before cleaning, indicating that the chuck platform had been cleaned. After that, the wafers are rotated and inspected on the actual basis. As a result, processing can be performed without problems. Example 8 An acrylic polymer (weight-average molecular weight) prepared from 100 parts of a monomer mixture containing 75 parts of 2-ethylhexyl acrylate as ... ^ / earth, ^ knife, methyl acrylate, and 5 parts of acrylic acid ： 0 0 0) 50 parts of polyethylene glycol 200 dimethacrylic acid (trade name: NK Ester 4G, made by Sninnakamura Ckou hemiCal Co., Ltd.) and 50 parts of acrylate aminoacetate (Commercial name ϋ N 0 1 S n η naka mu ra C hemica 1 C 〇., Manufactured by L t d.), 3 parts of a polyisocyanate compound (trade name ^ 〇i〇nate 1,), pentaamine曱 Acid Brewery Industry Co., Ltd.'s Dimethyl Methanol (Irgacure 651, Ciba. Manufactured by Kou Yue Zhi Co., Ltd. and then mix the ultraviolet light curing adhesive solution A. ㈣) Clothing is also prepared in the same manner as previously described Ordinary A, except for the aforementioned adhesive, does not contain dimethyl acetal.] Blend: Ordinary pressure-sensitive adhesive solution A is coated on one side of the rice-based brewing basic material film to 10 microns dry and See, = =-ordinary adhesive layer. Then the 38 micron thick polymer can be peeled Thin

550688 V. Description of the invention (31) It touches the surface of the ordinary adhesive layer. Apply A to another UV-curable adhesive solution of the base material film for the adhesive layer as a clean layer. A dry thickness of 30 microns was applied to the surface of the layer to prepare a clean sheet A ,. L. Peelable film is adhered to the adhesion, and then the UV-curable adhesion is measured (JIS K7127). As a result, it has a total dose irradiation of 3 6 5 nanometers J ^, ' , ^ MJ / flat UV curing adhesive A exhibits 4 9; :: number of long external rays of light. Ding Ming / ten square * meter stretch mold Λ Λ The clean sheet a made by dagger adheres to the crystal Circle. Attach the back of the 8-inch silicon wafer (mirror surface) with Ji I sheet A, and then use the direct cutting method to cut into the shape of the wafer. Continuously insert lights on 25 sheets to interpolate As a result, no cutting waste was generated during the sheet cutting process. After that, 5 wafers with sheet were irradiated with a total dose of 1,000 millijoules per square centimeter with 3 6 5 nm. The central wavelength of ultraviolet light is used to prepare a clean wafer A with clean function. In addition, a laser-type foreign material analyzer is used to measure 4 new 8-inch Ishiba wafers on the mirror surface. · The presence of foreign matter with a size of 2 microns. As a result, 8 were found on the first sheet with a size of not less than 0.2 microns Addition to substances 'found in the second sheet 11, found on the third sheet 9', and 5 was found on the fourth sheet. This and other wafer so

Page 34 C: \ 2D-CODE \ 90-07 \ 90111082.ptd 550688 V. Description of the invention (32) Is the mirror surface conveyed to the surface with electrostatic attraction?丨 Inside the individual substrate processing equipment of the facility, and then use a laser-type foreign matter analyzer to measure the presence of foreign matter with a size not less than 0.2 micron. As a result, 31,254 foreign materials having a size of not less than 0.2 micron were found on the 8-inch wafer size area on the first sheet, and 2, 9,954 were found on the second sheet. Two, eight, eight, eight, three were found on the three sheets, and two, seven, eight, eight, six were found on the fourth sheet.

The peelable film is then peeled from the aforementioned transported clean wafer A on its clean layer side. The clean wafer A is then conveyed to the inside of a substrate processing apparatus having a wafer segment to which 3,254 foreign substances are attached. As a result, the 'transportation can be performed without problems. Thereafter, a new 8-inch silicon wafer was transported with its mirror surface facing down to the inside of the substrate processing equipment, and then the presence of foreign matter with a size of not less than 0.2 micron was measured with a laser-type foreign matter analyzer. Do this 5 times. The results are described in Table 1. Example 9

A clean sheet b was prepared in the same manner as in Example 8, except that the use of 100 parts of a polyfunctional acrylic amino sulfonate (trade name: UV 1700B) was used. (Manufactured), 3 parts of polyisocyanate compound (brand name: C 〇〇〇〇〇〇〇one L, manufactured by Nipon Polyurethane Industry Co., Ltd.) and 10 parts of dimethyl alcohol as a photopolymerization initiator This formic acid (trade name: Irgacure 6 51, manufactured by Cibato Chemical Co., Ltd.) was added to 1,000 parts by 3 q parts of acrylic acid 2-ethylhexyl vinegar, 70 parts of methyl acrylate and丨 0 parts of an acrylic polymer (weight average molecular weight: 2,800,000) prepared from a monomer mixture of acrylic acid, and then the mixture was uniformly stirred to prepare a UV-cured adhesive.

C: \ 2D-CODE \ 90-07 \ 90111082.ptd page 35 550688 5. Description of the invention (33) The tensile modulus of the solution B as the ultraviolet one. Agency :: Post-measurement I external light curing sticky / mm2 plus ^, before, and before the calendar curing shows a total dose of 0. 〇1 cattle exposure I hair Joules / thousand centimeters. M ^ .. Ultraviolet light with a central wavelength of 3 65 nm. Curing Adhesive B a]] / / Λ 丄 丄 / Heart 糸 Out of the ultraviolet light after the fall makes the front = 0 Newton / square millimeter of tensile modulus. :, '= The clean sheet β described above is connected to the dicing method to prepare 2 j 1 mesh and j for direct calling and verification. &Lt; Yamagata 1 has ^ wafers with sheets. She 杲, Yu y 仏 隹 watt / τ knife. Then make 5 of the 25 wafers &gt;: 1 η η η 丄 Joules / cm² 敕 粬 曰 w 曰 M month to 1, 0 0 0 milli

The positive tincture i irradiates ultraviolet light with 3 6 5 ½, Φ ,, and ± E, and the central wavelength of the saw blade * J hair U wood. Then, a clean wafer B with a cleaning function can be transported. Then, the peelable film is peeled off from the side of the "W" layer. The bran and spleen are then cleaned. Then, the clean wafer B will be transported to the clean wafer B after 10 w. Attached? Q 9 5 The inside of the 4 substrates of foreign materials, Wang Xi, ',,, Gong Ji pay 2 9, 浐-可 古 毹 网 H Rikou &amp; substrate processing equipment. As a result, will be 8 inches, the wafer is used to make a mirror * for material analysis; on the right. The spleen + π &amp; there is no small ο. 2 the existence of foreign matter with the size of rice. This detail is performed 5 times. The results are described in Table i Comparative Example 8 A wafer having a sheet material was prepared by a direct dicing method in the same way as in Example 8 except for a clean sheet. H m The fin t material is prepared by making the clean sheet A irradiated with ultraviolet light having a non-center wavelength at an overall dose of + J Joules / thousand centimeters. Xiao Guo, self-cleaning during the sheet cutting process. Yashidan from + ^ roll 荖 m 1: cutting waste. These chips are attached to the edge of the wafer with the sheet, the back of the wafer and the tape

Page 36 550688 V. Description of the invention (34) --- type label. Therefore, the preparation of the wafer C with the sheet is suspended. Comparative Example 9 A clean sheet D was prepared in the same manner as in Example 8, except that the pressure-sensitive adhesive solution A sharpened in Example 8 was used as the adhesive for the cleansing layer. The clean layer in the clean sheet D exhibited a tensile modulus of 0.1 Newtons per square millimeter ^ / Then the clean moon D was directly cut in the same manner as in Example 8 to prepare a wafer with a sheet . As a result, no cutting waste is generated during the sheet cutting process. Prepare 2 5 wafers with sheet. Then, an attempt is made to transport the clean wafer D to the inside of a substrate processing apparatus having a wafer attached with 2, 7, 8 6 foreign substances. As a result, the transported clean wafer D is adhered to the wafer segment during the transport of the first sheet. Therefore, the clean wafer D is no longer transportable. Percentage of foreign matter removal-1 sheet conveyance 2 sheet conveyance 3 sheet conveyance 4 sheet conveyance 5 sheet conveyance Example S 85% 92% 9 6% 96% 9 6% Example 9 70% 75% 83% 83% 8 3% Comparative Example 8 Production of clean wafers was suspended. Comparative embodiment Example 9 Difficult to convey Conveyance pause Conveyance pause Conveyance pause Conveyance pause --------

Industrial Applicability As described above, the clean sheet according to the present invention can be reliably rotated through the substrate

C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 37 550688 V. Description of the invention (35) The inside of the board processing equipment can easily and surely remove foreign substances attached to the inside of the equipment. Although the present invention has been described in terms of its preferred form with a certain degree of specificity, it should be clear that the details of the structure and the combination and arrangement of parts can be changed without departing from the spirit and scope of the present invention as filed in the patent application below. Disclosure of this preferred form.

C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 38 550688

C: \ 2D-CODE \ 90-07 \ 90111082.ptd Page 39

Claims (1)

550688 ΛΆ ^ 90WQR September, η, I .; 6. Patent application scope 1 · A% net sheet, containing · It is not substantially sticky, and its tensile modulus measured according to Chuan 127 is 0 · = Newton / square millimeter is used to support the first layer, the first layer, and the second layer on the one side; and 2. The base material such as the first piece of the patent application scope. A normal adhesive layer placed on the other side of the base material. The towel also contains a design 3. If the cleanliness of the item in the scope of the patent application is not higher than 0. 20 Newtons / 10 half a second, the clean layer peels and adheres. / ^ 的 18〇 on m mirror surface. 4. As for the clean sheet in the scope of the application for patent], it is non-sticky in nature and does not have electrical conductivity. 5. The clean sheet of the 5th scope of the patent application scope. Among them, it is made of sticky and non-conductive material, and it is made of thin film. The layer system, made of plastic material or clean sheet such as the 1st item in the scope of patent application, is now less than 30 millijoules. / Square meter of surface free energy. &Quot; Flat flattening 7. If the clean sheet of the scope of patent application No. 6 is, the contact angle to water is now greater than 90 degrees. 8 ·-a kind of clean sheet, including : A clean layer with a Vickers hardness of not less than 10; and a base material for supporting the clean layer on one side of it. 9 · Clean sheet as in item 8 of the scope of patent application It also includes an ordinary adhesive layer provided on the other side of the base material. 10 · For example, the clean sheet of the scope of patent application No. 1 or 8, wherein the cleansing correction is replaced by 4 C: \ Total file \ 90 \ 901 丨] 082 \ 901]] 〇82 (replacement) · 2 · ρΐ (page 40 550688-1) Article 6: The patent application scope is $, the adhesive layer, and it is activated by It can be cured. It is a clean sheet according to item 10 of the application range, wherein the clean layer and the double bond 14 make at least one parent molecule have one or more unsaturated solidification / 5 Γ 5 The pressure-sensitive adhesive polymer and the polymerization initiator are polymerized so that their viscosity substantially disappears and is prepared. It is purple ° external application =. The clean sheet of the scope of the patent No. 11 wherein the activation energy will be The clean sheet of the first item of the patent scope is used for the substrate processing equipment clean 14 which is sent to the inside of the substrate processing equipment by a clean method Γ. A kind of cleaning member for conduction inspection equipment, including: A contact pin cleaner for removing the conductive J substance attached to the conduction inspection device; and d contact pin_ is provided on one side of the contact pin cleaner for contacting the device contacted by the contact pin cleaner In the face: to-apply for the clean sheet of the scope of patent application item! Quality 1 5 · —A clean member for conduction inspection equipment, including: disposed on one side of the conveying member, for removing contact with foreign substances other than the conduction inspection contact pins of the conduction inspection equipment Pin cleanliness = one and w are located on one side of the contact pin cleaner and are used to remove foreign matter attached to the contact area of the equipment in contact with the contact pin cleaner. ， 1 6 · If the patent application scope is 4 or 5 clean components, of which 匸: \ Total file \ 90 \ 90]]] 082 \ 901] 1082 (replacement)-2.ptc 'No. 41; &quot; &quot; -------- 550688 j No. 9Q〗 ~ nriR9 Scope of patent application The correction sheet for the month includes the adhesive layer provided on the other side of the beauty # 从 ^ and used to remove the adhesive layer on one side of the attached z, and the foreign material provided outside the contact area of the device = contact pin cleaner The contact setting is not lower than I.::;;:]::1. The clean sheet according to item ′ wherein the clean layer is stretched according to: the tensile modulus of ns K7127 which is higher than 2,000 Newtons per square millimeter. / The clean component of the patent scope No. 14 or 15 uses the method of cleaning the conductive inspection equipment that transports the clean component to the inside of the conductive inspection equipment. 20 ^ If the clean component in item 16 of the scope of patent application is used, it is a method for cleaning the conduction inspection equipment by transporting 4 clean components to the inside of the transfer equipment. π ^ — 2 1 · — A method for preparing a conveying member with a cleaning function, including the following steps: 1 When the effect of activation energy is placed on the side of one of the base materials = polymerization adhesion curing The clean layer made of the agent and the clean sheet of the W through adhesive layer provided on the other side are laminated with the conveying member, so that the ordinary adhesive layer is interposed there. In this configuration, the shape of the clean sheet is larger than that The shape of the conveying member is large; and = the conveyance of the member cuts the clean sheet; the clean layer in the eighth is cut after cutting the clean sheet along the outline of the conveying member, and then undergoes a polymerization curing reaction. C: \ master file \ 90 \ 90111082 \ 90] 11082 (replace) -2.ptc Amendment on page 42 of the month of 550688 6. Application for a patent scope 22. The method for preparing a conveying member with a cleaning function, such as the scope of application for patent item 21, wherein the clean layer exhibits no more than 1 Newton / square when cutting the sheet The millimeter is based on the tensile modulus measured in 113 K7127. 2 3. The method for preparing a conveying member with a cleaning function according to item 21 of the scope of the patent application, wherein the clean layer exhibits no less than j 0 Newton / square meter squared after polymerization and curing according to j ISK 7 1 2 7 The obtained tensile modulus. 24 · —A clean sheet used in the method for preparing a conveying member with a cleaning function as described in the scope of patent application No. 21, including a clean sheet provided on one side of the base material, which can be activated by the activation energy. The clean layer made of an adhesive that has undergone polymerization ^ and a two-day zero-occupant layer provided on the other side, and the deep clean layer is in an uncured state. (:: \ Total \ 90 \ 90] 11082 \ 9011] 082 (Replace) -2.ptc Page 43