JP2005254031A - Cleaning sheet and cleaning method of substrate treatment apparatus using it - Google Patents
Cleaning sheet and cleaning method of substrate treatment apparatus using it Download PDFInfo
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- JP2005254031A JP2005254031A JP2004065040A JP2004065040A JP2005254031A JP 2005254031 A JP2005254031 A JP 2005254031A JP 2004065040 A JP2004065040 A JP 2004065040A JP 2004065040 A JP2004065040 A JP 2004065040A JP 2005254031 A JP2005254031 A JP 2005254031A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 103
- 239000000758 substrate Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims description 24
- 239000010410 layer Substances 0.000 claims abstract description 43
- 238000010521 absorption reaction Methods 0.000 claims abstract description 29
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 5
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 5
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000004820 Pressure-sensitive adhesive Substances 0.000 abstract description 18
- 238000007740 vapor deposition Methods 0.000 abstract description 18
- 238000004904 shortening Methods 0.000 abstract 1
- -1 polyethylene Polymers 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 9
- 229920000058 polyacrylate Polymers 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000012298 atmosphere Substances 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 239000000178 monomer Substances 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 6
- 229920001155 polypropylene Polymers 0.000 description 6
- 229920006395 saturated elastomer Polymers 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000003505 polymerization initiator Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000003795 desorption Methods 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002998 adhesive polymer Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920006284 nylon film Polymers 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- ZAMZCSIXTWIEDY-UHFFFAOYSA-N (2-propylphenyl)methanol Chemical compound CCCC1=CC=CC=C1CO ZAMZCSIXTWIEDY-UHFFFAOYSA-N 0.000 description 1
- 229920003067 (meth)acrylic acid ester copolymer Polymers 0.000 description 1
- BWZAUXRKSMJLMH-UHFFFAOYSA-N 1,1-diethoxyethylbenzene Chemical compound CCOC(C)(OCC)C1=CC=CC=C1 BWZAUXRKSMJLMH-UHFFFAOYSA-N 0.000 description 1
- YNSNJGRCQCDRDM-UHFFFAOYSA-N 1-chlorothioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2Cl YNSNJGRCQCDRDM-UHFFFAOYSA-N 0.000 description 1
- CTOHEPRICOKHIV-UHFFFAOYSA-N 1-dodecylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2CCCCCCCCCCCC CTOHEPRICOKHIV-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- KMNCBSZOIQAUFX-UHFFFAOYSA-N 2-ethoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OCC)C(=O)C1=CC=CC=C1 KMNCBSZOIQAUFX-UHFFFAOYSA-N 0.000 description 1
- NACPTFCBIGBTSJ-UHFFFAOYSA-N 2-hydroxy-2-phenyl-1-(2-propan-2-ylphenyl)ethanone Chemical compound CC(C)C1=CC=CC=C1C(=O)C(O)C1=CC=CC=C1 NACPTFCBIGBTSJ-UHFFFAOYSA-N 0.000 description 1
- 229920002126 Acrylic acid copolymer Polymers 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000005443 coulometric titration Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- 230000006855 networking Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229940113115 polyethylene glycol 200 Drugs 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 239000006200 vaporizer Substances 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cleaning Implements For Floors, Carpets, Furniture, Walls, And The Like (AREA)
- Cleaning In General (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
本発明は、クリーニングシートおよびこれを用いた基板処理装置のクリーニング方法に関するものである。
The present invention relates to a cleaning sheet and a cleaning method for a substrate processing apparatus using the same.
半導体、プラットパネルディスプレイ、プリント基板などの製造装置や検査装置など、異物を嫌う基板処理装置では、各搬送系と基板とを物理的に接触させながら搬送する。その際、基板や搬送系に異物が付着していると、後続の基板をつぎつぎに汚染することになるため、定期的に装置を停止して洗浄処理する必要があった。このため、稼動率の低下や多大な労力が必要になるという問題があった。
In a substrate processing apparatus that dislikes foreign matters, such as a manufacturing apparatus such as a semiconductor, a platform display, a printed circuit board, or an inspection apparatus, each of the transport systems and the substrate are transported in physical contact. At that time, if foreign matter adheres to the substrate or the transport system, subsequent substrates are successively contaminated, so that it is necessary to periodically stop and clean the apparatus. For this reason, there existed a problem that the fall of an operation rate and a great effort were needed.
これらの問題を解決するため、基板処理装置内にクリーニング部材として粘着性物質を固着した基板を搬送することにより、装置内に付着した異物をクリーニング除去する方法が提案されている（特許文献１参照）。
上記の提案方法は、装置を停止して洗浄処理する必要がなく、稼動率の低下や多大な労力を回避する有力な方法である。しかしながら、クリーニング部材を真空系の基板処理装置内に搬送したときに、規定真空度への到達時間が長くなることがあり、そのぶん稼動率を十分に改善できない場合があった。
The proposed method is an effective method for avoiding a reduction in operating rate and a great amount of labor without having to stop the apparatus and perform a cleaning process. However, when the cleaning member is transported into a vacuum-type substrate processing apparatus, the time to reach the specified vacuum degree may be long, and the operating rate may not be improved sufficiently.
本発明は、このような事情に照らし、真空系の基板処理装置内に搬送したときの規定真空度への到達時間を短縮でき、もって稼動率のさらなる向上に寄与するクリーニング部材を提供することを目的としている。
In light of such circumstances, the present invention provides a cleaning member that can shorten the time required to reach a specified vacuum level when transported into a vacuum-type substrate processing apparatus, thereby contributing to a further improvement in operating rate. It is aimed.
本発明者らは、クリーニング部材として、支持体の片面にクリーニング層を、他面に粘着剤層を設けて、クリーニングシートとし、このシートを上記粘着剤層を介して搬送部材上に貼り付けてクリーニング機能付き搬送部材とし、これを基板処理装置内に搬送して、装置内に付着した異物をクリーニング除去する方法について、種々検討してきたが、この方法において、クリーニングシート中に含まれる水分が基板処理装置内で揮散して、装置の真空度を低下させる原因となっていることがわかった。
また、クリーニングシートに含まれる水分は、クリーニング層と粘着剤層とを支持する支持体にその多くが含まれており、この支持体から揮散する水分量を規制すれば、水分の揮散に起因した真空度の低下を抑制できるものと考えた。
As a cleaning member, the present inventors provide a cleaning layer on one side of the support and an adhesive layer on the other side to form a cleaning sheet, and this sheet is attached to the conveying member via the adhesive layer. Various studies have been made on a method of transporting a cleaning member having a cleaning function and transporting the cleaning member into a substrate processing apparatus to remove foreign substances adhering to the substrate. In this method, moisture contained in the cleaning sheet is removed from the substrate. It was found that it was volatilized in the processing apparatus and caused a decrease in the vacuum degree of the apparatus.
In addition, the moisture contained in the cleaning sheet is mostly contained in the support that supports the cleaning layer and the pressure-sensitive adhesive layer, and if the amount of moisture that evaporates from this support is regulated, the moisture is caused by evaporation. It was thought that the decrease in the degree of vacuum could be suppressed.
そこで、本出願人は、上記の考えにもとづいて、支持体の材料構成を含めた広範囲の実験検討を繰り返した結果、ベースフィルムの片面に特定の蒸着膜を形成して支持体を構成し、この支持体の上記蒸着膜側にクリーニング層を、その反対側に粘着剤層を設けたクリーニングシートを使用することにより、またこのシートにおける上記支持体の常態吸湿率を特定値以下に規制することにより、真空系の基板処理装置内に搬送したときの真空度の顕著な低下がみられなくなり、規定真空度への到達時間が短縮されて、稼動率のさらなる向上に貢献できることを見出し、本発明を完成するに至った。
Therefore, as a result of repeating a wide range of experimental studies including the material structure of the support based on the above idea, the present applicant formed a specific vapor deposition film on one side of the base film to configure the support, By using a cleaning sheet provided with a cleaning layer on the vapor deposition film side of the support and an adhesive layer on the opposite side, and the normal moisture absorption rate of the support in the sheet is restricted to a specific value or less. As a result, it has been found that a significant decrease in the degree of vacuum when transported into a vacuum-type substrate processing apparatus is not observed, the time to reach the specified degree of vacuum is shortened, and it is possible to contribute to further improvement in the operating rate. It came to complete.
すなわち、本発明は、ベースフィルムの片面に金属膜または金属酸化物膜からなる蒸着膜を形成して支持体を構成し、この支持体の蒸着膜側にクリーニング層が設けられ、その反対側に粘着剤層が設けられていることを特徴とするクリーニングシート、とくに、上記支持体の常態吸湿率が２．０重量％未満である上記構成のクリーニングシート、また常態吸湿量が５０μｇ／cm2 以下である上記構成のクリーニングシートに係るものである。
また、本発明は、上記構成のクリーニングシートが、その粘着剤層を介して搬送部材に貼り付けられていることを特徴とするクリーニング機能付き搬送部材と、このクリーニング機能付き搬送部材を、基板処理装置内に搬送することを特徴とする基板処理装置のクリーニング方法とに係るものである。さらに、本発明は、上記構成のクリーニング方法によりクリーニングされた基板処理装置を提供できるものである。
That is, in the present invention, a support is configured by forming a vapor deposition film made of a metal film or a metal oxide film on one side of a base film, and a cleaning layer is provided on the vapor deposition film side of the support, and on the opposite side thereof. A cleaning sheet provided with a pressure-sensitive adhesive layer, particularly a cleaning sheet having the above-mentioned constitution wherein the normal moisture absorption rate of the support is less than 2.0% by weight, and a normal moisture absorption amount of 50 μg / cm 2 or less. This relates to the cleaning sheet having the above-described configuration.
In addition, the present invention provides a transport member with a cleaning function, wherein the cleaning sheet having the above-described configuration is attached to the transport member via the adhesive layer, and the transport member with the cleaning function is processed into a substrate. The present invention relates to a cleaning method for a substrate processing apparatus, which is transported into the apparatus. Furthermore, the present invention can provide a substrate processing apparatus cleaned by the cleaning method having the above configuration.
このように、本発明では、ベースフィルムの片面に金属膜または金属酸化物膜からなる蒸着膜を形成して支持体を構成し、この支持体の上記蒸着膜側にクリーニング層を設けるようにしたことにより、また上記支持体の常態吸湿率を２．０重量％未満に規制したことにより、クリーニング部材として高い異物除去性を発揮するとともに、真空系の基板処理装置内に搬送したときの規定真空度への到達時間を短縮でき、もって稼動率のさらなる向上に寄与するクリーニング部材を提供できる。
As described above, in the present invention, a support is configured by forming a vapor deposition film made of a metal film or a metal oxide film on one side of the base film, and a cleaning layer is provided on the vapor deposition film side of the support. In addition, by regulating the normal moisture absorption rate of the support to less than 2.0% by weight, it exhibits high foreign matter removability as a cleaning member and has a specified vacuum when transported into a vacuum-type substrate processing apparatus. Therefore, it is possible to provide a cleaning member that can shorten the time to reach the temperature and contribute to further improvement of the operation rate.
本発明のクリーニングシートにおいて、支持体としては、ベースフィルムの片面に金属膜または金属酸化物膜からなる蒸着膜を形成したものが用いられる。中でも、常態吸湿率が２．０重量％未満であるものが好ましく、とくに好ましくは１．０重量％以下、より好ましくは０．５重量％以下、さらに好ましくは０．３重量％以下、最も好ましくは０．０１重量％以下の（とくに０重量％に近い）ものが用いられる。
上記の常態吸湿率とは、支持体固有の値であって、支持体を上記した材料構成として、その常態吸湿率を上記範囲に規制することにより、真空系への基板処理装置内に搬送したときの真空度の顕著な低下を大きく抑制でき、その結果、規定真空度への到達時間をより短縮でき、稼動率の一層の向上をはかることができる。
In the cleaning sheet of the present invention, the support is formed by forming a vapor deposition film made of a metal film or a metal oxide film on one side of the base film. Among them, those having a normal moisture absorption of less than 2.0% by weight are preferable, particularly preferably 1.0% by weight or less, more preferably 0.5% by weight or less, still more preferably 0.3% by weight or less, most preferably. Is 0.01% by weight or less (particularly close to 0% by weight).
The above-mentioned normal moisture absorption is a value specific to the support, and the substrate is transported into the substrate processing apparatus to the vacuum system by regulating the normal moisture absorption within the above range as the material configuration described above. At the same time, a significant decrease in the degree of vacuum can be greatly suppressed, and as a result, the time to reach the specified degree of vacuum can be further shortened, and the operating rate can be further improved.
このような支持体において、ベースフィルムとしては、ポリエチレン、ポリプロピレンなどのポリオレフィン、エチレン−酢酸ビニル共重合体などからなるプラスチックフィルムが用いられ、これらのフィルムを１種または２種以上組み合わせて用いたものであってもよく、また片面または両面にコロナ処理などの表面処理を施したものであってもよい。フィルムの厚さは、通常１〜２００μｍ程度である。
また、このベースフィルムの片面に公知の方法により蒸着形成される蒸着膜としては、アルミニウム、シリコン、鉄、コバルト、ニッケルなどからなる金属膜や、アルミナ、酸化チタン、ＩＴＯ（インジウム・錫複合酸化物）などの金属酸化物膜が用いられる。これらの蒸着膜の厚さは、通常１〜１，０００ｎｍ程度である。
In such a support, a plastic film made of a polyolefin such as polyethylene or polypropylene, an ethylene-vinyl acetate copolymer, or the like is used as the base film, and these films are used alone or in combination of two or more. It may be a surface treatment such as corona treatment on one side or both sides. The thickness of the film is usually about 1 to 200 μm.
In addition, as a vapor deposition film formed by vapor deposition on one side of the base film by a known method, a metal film made of aluminum, silicon, iron, cobalt, nickel, etc., alumina, titanium oxide, ITO (indium / tin composite oxide) Or the like is used. The thickness of these deposited films is usually about 1 to 1,000 nm.
本発明のクリーニングシートは、上記支持体の蒸着膜側にクリーニング層が、その反対側に粘着剤層が設けられた構成からなる。ここで、蒸着膜側にクリーニング層を設ける理由は、支持体を構成するベースフィルム中に含まれる水分がクリーニング層を介して処理装置内へ揮散するのを蒸着膜を介在させることによって抑制するためであり、これにより水分の揮散に起因した真空度の低下が抑制される。
このように構成される本発明のクリーニングシートは、常態吸湿量が５０μｇ／cm2 以下であるのが好ましく、より好ましくは４０μｇ／cm2 以下である。この常態吸湿量は、支持体とその両側のクリーニング層および粘着剤層とに含まれるシート全体の水分含量を表しており、上記範囲に規制することにより、真空系の基板処理装置内に搬送したときの真空度の低下抑制にさらに好結果が得られるものである。
The cleaning sheet of the present invention has a configuration in which a cleaning layer is provided on the vapor deposition film side of the support and an adhesive layer is provided on the opposite side. Here, the reason for providing the cleaning layer on the vapor deposition film side is to suppress the evaporation of moisture contained in the base film constituting the support into the processing apparatus through the cleaning layer by interposing the vapor deposition film. This suppresses a decrease in the degree of vacuum due to the evaporation of moisture.
The cleaning sheet of the present invention constructed as described above preferably has a normal moisture absorption of 50 μg / cm 2 or less, more preferably 40 μg / cm 2 or less. This normal moisture absorption represents the moisture content of the entire sheet contained in the support and the cleaning layer and the pressure-sensitive adhesive layer on both sides of the support, and is transferred to a vacuum-type substrate processing apparatus by limiting to the above range. Even better results can be obtained in suppressing the decrease in the degree of vacuum.
クリーニング層は、とくに限定されないが、引張弾性率（試験法ＪＩＳ Ｋ７１２７）が１０〜２，０００ＭＰａであるのが望ましい。引張弾性率が１０ＭＰａ以上であると、ラベル切断時のクリーニング層のはみ出しや切断不良が抑えられ、プリカット方式で汚染のないクリーニング機能付ラベルシートを製造でき、また搬送時に装置内の接触部位に接着して搬送トラブルを引き起こすおそれがない。また、引張弾性率が２，０００ＭＰａ以下であると、搬送系の付着異物の除去性に好結果が得られる。
The cleaning layer is not particularly limited, but it is desirable that the tensile elastic modulus (test method JIS K7127) is 10 to 2,000 MPa. When the tensile elastic modulus is 10 MPa or more, the protrusion of the cleaning layer and cutting failure at the time of label cutting can be suppressed, and a label sheet with a cleaning function free from contamination can be produced by a pre-cut method, and it adheres to a contact part in the apparatus during transportation. There is no risk of transport problems. In addition, when the tensile elastic modulus is 2,000 MPa or less, good results can be obtained in the removability of the adhered foreign matter in the transport system.
このようなクリーニング層は、材質などにとくに限定はなく、たとえば、耐熱性を考慮して、ポリイミドなどの材料を使用することができる。しかし、とくに望ましくは、紫外線や熱などの活性エネルギー源により重合硬化した樹脂層から構成されているのがよい。これは、上記の重合硬化により分子構造が三次元網状化して実質的に粘着性がなくなり、基板処理装置内への搬送時に装置接触部と強く接着せず、基板処理装置内を確実に搬送できるクリーニング部材が得られるからである。
Such a cleaning layer is not particularly limited in material, and for example, a material such as polyimide can be used in consideration of heat resistance. However, it is particularly desirable that the resin layer be polymerized and cured by an active energy source such as ultraviolet rays or heat. This is because the molecular structure becomes a three-dimensional network due to the above-mentioned polymerization and curing, and the adhesiveness is substantially lost, and it does not adhere strongly to the apparatus contact portion when transported into the substrate processing apparatus, and can be transported reliably in the substrate processing apparatus. This is because a cleaning member is obtained.
上記の重合硬化した樹脂層としては、たとえば、感圧接着性ポリマーに分子内に不飽和二重結合を１個以上有する化合物（以下、重合性不飽和化合物という）および重合開始剤と必要により架橋剤などを含ませた硬化型の樹脂組成物を、活性エネルギー源とくに紫外線により硬化したものが挙げられる。
上記した感圧接着性ポリマーには、たとえば、（メタ）アクリル酸および／または（メタ）アクリル酸エステルを主モノマーとしたアクリル系ポリマーが挙げられる。このアクリル系ポリマーの合成にあたり、共重合モノマーとして分子内に不飽和二重結合を２個以上有する化合物を用いたり、合成後のアクリル系ポリマーに分子内に不飽和二重結合を有する化合物を官能基間の反応で化合結合させるなどして、アクリル系ポリマーの分子内に不飽和二重結合を導入してもよい。この導入によりアクリル系ポリマー自体も活性エネルギー源による重合硬化反応に関与させることができる。
As the above-mentioned polymerized and cured resin layer, for example, a pressure-sensitive adhesive polymer having at least one unsaturated double bond in the molecule (hereinafter referred to as a polymerizable unsaturated compound) and a polymerization initiator are optionally crosslinked. And a curable resin composition containing an agent and the like cured by an active energy source, particularly ultraviolet rays.
Examples of the pressure-sensitive adhesive polymer include an acrylic polymer having (meth) acrylic acid and / or (meth) acrylic acid ester as a main monomer. In synthesizing this acrylic polymer, a compound having two or more unsaturated double bonds in the molecule is used as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule is functionalized in the synthesized acrylic polymer. An unsaturated double bond may be introduced into the molecule of the acrylic polymer, for example, by a chemical bond between the groups. By this introduction, the acrylic polymer itself can be involved in the polymerization curing reaction by the active energy source.
また、重合性不飽和化合物としては、不揮発性でかつ重量平均分子量が１０，０００以下の低分子量体であるのがよく、とくに硬化時の三次元網状化が効率良くなされるように５，０００以下の分子量を有しているのが好ましい。
このような重合性不飽和化合物には、フェノキシポリエチレングリコール（メタ）アクリレート、ε−カプロラクトン（メタ）アクリレート、ポリエチレングリコールジ（メタ）アクリレート、ポリプロピレングリコールジ（メタ）アクリレート、トリメチロールプロパントリ（メタ）アクリレート、ジペンタエリスリトールへキサ（メタ）アクリレート、ウレタン（メタ）アクリレート、エポキシ（メタ）アクリレート、オリゴエステル（メタ）アクリレートなどがあり、これらの中から、１種または２種以上が用いられる。
Further, the polymerizable unsaturated compound is preferably a non-volatile low molecular weight material having a weight average molecular weight of 10,000 or less, and especially 5,000 so that three-dimensional networking at the time of curing is efficiently performed. It preferably has the following molecular weight:
Such polymerizable unsaturated compounds include phenoxy polyethylene glycol (meth) acrylate, ε-caprolactone (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, trimethylolpropane tri (meth). There are acrylates, dipentaerythritol hexa (meth) acrylates, urethane (meth) acrylates, epoxy (meth) acrylates, oligoester (meth) acrylates, etc., and one or more of these are used.
重合開始剤としては、とくに限定されず、公知のものを使用できる。たとえば、活性エネルギー源に熱を用いる場合は、ベンゾイルパーオキサイド、アゾビスイソブチロニトリルなどの熱重合開始剤が、光を用いる場合は、ベンゾイル、ベンゾインエチルエーテル、シベンジル、イソプロピルベンゾインエーテル、ベンゾフェノン、ミヒラーズケトン、クロロチオキサントン、ドデシルチオキサントン、シメチルチオキサントン、アセトフェノンジエチルケタール、ベンジルジメチルケタール、α−ヒドロキシシクロヒキシルフェニルケトン、２−ヒドロキシメチルフェニルプロパン、２，２−ジメトキシ−２−フェニルアセトフェノンなどの光重合開始剤が、用いられる。
It does not specifically limit as a polymerization initiator, A well-known thing can be used. For example, when using heat as an active energy source, a thermal polymerization initiator such as benzoyl peroxide or azobisisobutyronitrile is used. When using light, benzoyl, benzoin ethyl ether, cibenzyl, isopropyl benzoin ether, benzophenone, Photopolymerization of Michler's ketone, chlorothioxanthone, dodecylthioxanthone, cymethylthioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenylpropane, 2,2-dimethoxy-2-phenylacetophenone, etc. An initiator is used.
上記のクリーニング層は、シリコンウエハ（ミラー面）に対する１８０度引き剥がし粘着力（ＪＩＳ Ｚ０２３７に準じて測定）が０．２Ｎ／１０mm幅以下、好ましくは０．０１〜０．１Ｎ／１０mm幅程度であるのがよい。このような低粘着ないし非粘着とすることにより、搬送時に装置内の被接触部と接着することがなく、搬送トラブルを引き起こすおそれがない。また、このようなクリーニング層の厚さとしては、とくに限定されないが、通常は、１〜１００μｍ程度であるのがよい。
The cleaning layer described above has a 180-degree peeling adhesive force (measured according to JIS Z0237) of 0.2 N / 10 mm width or less, preferably about 0.01 to 0.1 N / 10 mm width to the silicon wafer (mirror surface). There should be. By making such low or non-adhesive, it does not adhere to the contacted part in the apparatus at the time of conveyance, and there is no possibility of causing a conveyance trouble. Further, the thickness of such a cleaning layer is not particularly limited, but it is usually preferably about 1 to 100 μm.
支持体の蒸着膜とは反対側に設けられる粘着剤層は、シリコンウエハ（ミラー面）に対する１８０度引き剥がし粘着力が、０．０１〜１０Ｎ／１０mm幅、好ましくは０．０５〜５Ｎ／１０mm幅であるのがよい。粘着力が低すぎると、シリコンウエハなどの搬送部材に貼り付けたときの接着力が不足し、搬送中にシート剥離などの不都合をきたすおそれがあり、また高すぎると、クリーニングシートを搬送部材から剥離除去する際に、支持体フィルムがさけるおそれがある。このような粘着剤層の厚さは、とくに限定されないが、通常は１〜１００μｍ程度、好ましくは５〜５０μｍ程度であるのがよい。
The pressure-sensitive adhesive layer provided on the opposite side of the support from the vapor-deposited film has a 180-degree peeling adhesive strength to the silicon wafer (mirror surface) of 0.01 to 10 N / 10 mm width, preferably 0.05 to 5 N / 10 mm. It should be width. If the adhesive strength is too low, the adhesive strength when affixed to a conveyance member such as a silicon wafer is insufficient, which may cause inconvenience such as sheet peeling during conveyance.If it is too high, the cleaning sheet may be removed from the conveyance member. When peeling and removing, the support film may be avoided. Although the thickness of such an adhesive layer is not specifically limited, Usually, about 1-100 micrometers, Preferably it is about 5-50 micrometers.
このような粘着剤層は、その材料構成について、とくに限定されず、アクリル系やゴム系などの通常の粘着剤をいずれも使用できる。これらの中でも、アクリル系の粘着剤として、重量平均分子量が１０万以下の成分が１０重量％以下であるアクリル系ポリマーを主剤としたものが、とくに好ましく用いられる。
上記のアクリル系ポリマーは、（メタ）アクリル酸アルキルエステルを主モノマーとしこれに必要により共重合可能な他のモノマーを加えたモノマー混合物を、重合反応させることにより、合成できるものである。
Such a pressure-sensitive adhesive layer is not particularly limited with respect to its material structure, and any ordinary pressure-sensitive adhesive such as acrylic or rubber can be used. Among these, as the acrylic pressure-sensitive adhesive, those mainly composed of an acrylic polymer having a component having a weight average molecular weight of 100,000 or less and 10% by weight or less are preferably used.
The above-mentioned acrylic polymer can be synthesized by polymerizing a monomer mixture in which (meth) acrylic acid alkyl ester is used as a main monomer and another monomer copolymerizable as necessary is added thereto.
本発明のクリーニングシートにおいては、上記のクリーニング層や粘着剤層を保護するために、これらの層上に保護フィルムを貼り合わせてもよい。
保護フィルムの材質などにはとくに限定はない。たとえば、シリコーン系、長鎖アルキル系、フッ素系、脂肪酸アミド系、シリカ系の剥離剤などで剥離処理した、ポリエチレン、ポリプロピレン、ポリブテン、ポリブタジエン、ポリメチルペンテンなどのポリオレフィン、ポリ塩化ビニル、塩化ビニル共重合体、ポリエチレンテレフタレート、ポリブチレンテレフタレート、ポリウレタン、エチレン−酢酸ビニル共重合体、アイオノマー樹脂、エチレン−（メタ）アクリル酸共重合体、エチレン−（メタ）アクリル酸エステル共重合体、ポリスチレン、ポリカーボネートなどからなるプラスチックフィルムが挙げられる。その厚さとしては、通常５〜２００μｍ程度であるのがよい。
In the cleaning sheet of the present invention, a protective film may be bonded on these layers in order to protect the cleaning layer and the pressure-sensitive adhesive layer.
There is no particular limitation on the material of the protective film. For example, polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, and other polyolefins, polyvinyl chloride, and vinyl chloride that have been treated with a release agent such as silicone, long chain alkyl, fluorine, fatty acid amide, or silica. Polymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, polystyrene, polycarbonate, etc. The plastic film which consists of is mentioned. The thickness is usually about 5 to 200 μm.
本発明においては、上記構成のクリーニングシートを、支持体の蒸着膜とは反対側に設けられた粘着剤層を介して、搬送部材に貼り付けることにより、クリーニング機能付き搬送部材とする。ここで、上記の搬送部材は、とくに限定されないが、たとえば、半導体ウエハ，ＬＣＤ，ＰＤＰなどのフラットパネルディスプレイ用基板，その他コンパクトディスク，ＭＲヘッドなどの基板などが挙げられる。
In the present invention, the cleaning sheet having the above-described configuration is attached to the transport member via an adhesive layer provided on the opposite side of the support from the vapor deposition film, thereby forming a transport member with a cleaning function. Here, the transport member is not particularly limited, and examples thereof include semiconductor wafers, substrates for flat panel displays such as LCDs and PDPs, and other substrates such as compact disks and MR heads.
本発明においては、上記のクリーニング機能付き搬送部材を、基板処理装置内に搬送することにより、上記装置内に付着する異物を上記搬送部材のクリーニング層に吸着させ、クリーニング除去する。その際、真空系の基板処理装置でも、真空度が極端に低下することはなく、規定真空度に到達する時間を短縮でき、また装置内の接触部位にクリーニング層が接着することもなく、良好に搬送でき、搬送性とクリーニング性との両立を容易にはかれて装置の稼動率の向上に大きく貢献させることかできる。 In the present invention, by transporting the transport member with the cleaning function into the substrate processing apparatus, the foreign matter adhering in the apparatus is adsorbed to the cleaning layer of the transport member and removed by cleaning. At that time, even in a vacuum-type substrate processing apparatus, the degree of vacuum does not extremely decrease, the time to reach the specified degree of vacuum can be shortened, and the cleaning layer does not adhere to the contact part in the apparatus, which is good Therefore, it is easy to achieve both the transportability and the cleaning performance, and can greatly contribute to the improvement of the operation rate of the apparatus.
本発明において、基板処理装置にはとくに限定はなく、露光装置、レジスト塗布装置、現像装置、アッシング装置、ドライエッチング装置、イオン注入装置、ＰＶＤ装置、ＣＶＤ装置、検知装置などの各種装置が挙げられる。これらの中でも、本発明の効果を奏するうえで、真空系の装置がとくに望ましい。本発明においては、前記の方法によりクリーニングされた基板処理装置を提供できるものである。
In the present invention, the substrate processing apparatus is not particularly limited, and examples include various apparatuses such as an exposure apparatus, a resist coating apparatus, a developing apparatus, an ashing apparatus, a dry etching apparatus, an ion implantation apparatus, a PVD apparatus, a CVD apparatus, and a detection apparatus. . Among these, a vacuum system is particularly desirable in order to achieve the effects of the present invention. In the present invention, a substrate processing apparatus cleaned by the above method can be provided.
つぎに、本発明の実施例を記載してより具体的に説明する。ただし、本発明は、以下の実施例にのみ限定されない。以下、部とあるのは重量部を意味する。
以下の実施例および比較例で示した支持体の「常態吸湿率」と、クリーニングシートの「常態吸湿量」との測定方法には、カールフィッシャー方法（三菱化学社製の電量滴定式水分測定装置「ＣＡ−０６型」＋加熱気化装置「ＶＡ−０６」）を使用した。
その際、ガラス板上に、支持体では既知の粘着テープによりその蒸着膜とは反対側を、クリーニングシートではその粘着剤層側を、それぞれ貼り合わせて、１５０℃に加熱したときのガスを滴定セルに導入して、含有水分量を測定した。
Next, an embodiment of the present invention will be described in detail. However, the present invention is not limited only to the following examples. Hereinafter, “parts” means parts by weight.
In the measurement method of the “normal moisture absorption” of the support and the “normal moisture absorption” of the cleaning sheet shown in the following examples and comparative examples, the Karl Fischer method (coulometric titration moisture measuring device manufactured by Mitsubishi Chemical Corporation) is used. "CA-06 type" + heating vaporizer "VA-06").
At that time, on the glass plate, the opposite side of the vapor-deposited film is pasted with a known adhesive tape on the support, and the pressure-sensitive adhesive layer side on the cleaning sheet, and the gas when heated to 150 ° C. is titrated. It was introduced into the cell and the water content was measured.
また、上記の測定にあたり、支持体およびクリーニングシートを常態下〔２３℃，５０％ＲＨ（相対湿度）の雰囲気中〕に１０日間放置して、支持体およびクリーニングシートの吸湿量を飽和状態として、測定に供した。
支持体の「常態吸湿率」は、上記飽和状態としたときの支持体の全重量Ｗ１を測定し、また上記の方法で測定した水分量Ｗ０とから、「常態吸湿率」＝（Ｗ０／Ｗ１）×１００（重量％）として、求められる。
In the above measurement, the support and the cleaning sheet are left under normal conditions (in an atmosphere of 23 ° C. and 50% RH (relative humidity)) for 10 days, and the moisture absorption amount of the support and the cleaning sheet is saturated. It used for the measurement.
The “normal moisture absorption” of the support is determined by measuring the total weight W1 of the support when it is in the saturated state, and the “normal moisture absorption” = (W0 / W1) from the water content W0 measured by the above method. ) × 100 (% by weight).
アクリル酸２−エチルヘキシル７５部、アクリル酸メチル２０部およびアクリル酸５部からなるモノマー混合液から得たアクリル系ポリマー（重量平均分子量７０万）１００部に、ポリエチレングリコール２００ジメタクリレート（新中村化学社製の商品名「ＮＫエステル４Ｇ」）２００部、ポリイソシアネート化合物（日本ポリウレタン工業社製の商品名「コロネートＬ」）３部および光重合開始剤としてベンジルジメチルケタール（チバ・スペシャリティケミカルズ社製の商品名「イルガキュアー６５１」）３部を、均一に混合して、紫外線硬化型の樹脂組成物Ａを調製した。
Polyethylene glycol 200 dimethacrylate (Shin Nakamura Chemical Co., Ltd.) was added to 100 parts of an acrylic polymer (weight average molecular weight 700,000) obtained from a monomer mixture consisting of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate and 5 parts of acrylic acid. 200 parts of the product name “NK Ester 4G” manufactured by the manufacturer, 3 parts of the polyisocyanate compound (trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.), and benzyl dimethyl ketal (product of Ciba Specialty Chemicals Co., Ltd.) An ultraviolet curable resin composition A was prepared by uniformly mixing 3 parts of the name “Irgacure 651”).
これとは別に、温度計、撹拌機、窒素導入管および還流冷却管を備えた内容量が５００ｍｌの３つ口フラスコ型反応器内に、アクリル酸２−エチルへキシル７３部、アクリル酸ｎ−ブチル１０部、Ｎ，Ｎ−ジメチルアクリルアミド１５部およびアクリル酸５部からなるモノマー混合物、重合開始剤として２，２′−アゾビスイソブチロニトリル０．１５部、酢酸エチル１００部を、全体が２００ｇになるように配合して投入し、窒素ガスを約１時間導入しながら撹拌し、内部の空気を窒素で置換した。
その後、内部の温度を５８℃にし、この状態で約４時間保持して重合を行い、粘着剤ポリマー溶液を得た。つぎに、この粘着剤ポリマー溶液１００部に対して、ポリイソシアネート化合物（日本ポリウレタン工業社製の商品名「コロネートＬ」）３部を、均一に混合して、粘着剤溶液Ａを調製した。
Separately, in a 500 ml three-necked flask reactor equipped with a thermometer, a stirrer, a nitrogen inlet tube and a reflux condenser, 73 parts of 2-ethylhexyl acrylate, n-acrylic acid n- A monomer mixture consisting of 10 parts of butyl, 15 parts of N, N-dimethylacrylamide and 5 parts of acrylic acid, 0.15 part of 2,2'-azobisisobutyronitrile as a polymerization initiator and 100 parts of ethyl acetate, The mixture was blended to 200 g, stirred while introducing nitrogen gas for about 1 hour, and the air inside was replaced with nitrogen.
Thereafter, the internal temperature was set to 58 ° C., and the polymerization was carried out in this state for about 4 hours to obtain an adhesive polymer solution. Next, 3 parts of a polyisocyanate compound (trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.) was uniformly mixed with 100 parts of this adhesive polymer solution to prepare an adhesive solution A.
片面がシリコーン系剥離剤にて処理された長尺ポリエステルフィルム（厚さが３８μｍ、幅２５０mm）からなる保護フィルムの剥離処理面に、上記の粘着剤溶液Ａを、乾燥後の厚さが７μｍとなるように塗布した。その粘着剤層上に、支持体として、片面にアルミを蒸着したポリプロピレンフィルム（蒸着膜の厚さが０．０１μｍ、ベースフィルムの厚さが１０μｍ、幅２５０mm）を、アルミ蒸着膜を外側にして、積層した。
つぎに、この支持体のアルミ蒸着膜上に、上記の紫外線硬化型の樹脂組成物Ａを、乾燥後の厚さが１５μｍとなるように塗布して、樹脂層を設けるとともに、その表面に前記と同様の保護フィルムの剥離処理面を貼り合わせて、積層シートＡとした。
The pressure-sensitive adhesive solution A is applied to the release-treated surface of a long polyester film (thickness: 38 μm, width: 250 mm) on one side with a silicone release agent, and the thickness after drying is 7 μm. It applied so that it might become. On the pressure-sensitive adhesive layer, as a support, a polypropylene film (a deposition film thickness of 0.01 μm, a base film thickness of 10 μm, a width of 250 mm) with aluminum deposited on one side is disposed with the aluminum deposition film facing outside. And laminated.
Next, on the aluminum vapor-deposited film of the support, the ultraviolet curable resin composition A is applied so that the thickness after drying is 15 μm, and a resin layer is provided. A laminate sheet A was prepared by laminating the same peeled surface of the protective film.
この積層シートＡに、中心波長３６５ｎｍの紫外線を積算光量１，０００ｍＪ／cm2 照射して、重合硬化した樹脂層からなるクリーニング層を有するクリーニングシートＡを得た。このシートＡを、２３℃，５０％ＲＨの雰囲気中に１０日間放置して、シートＡ全体の吸湿量を飽和状態とした。クリーニング層上の保護フィルムを剥がし、カールフィッシャー法にて常態吸湿量を測定したところ、２５．０μｇ／cm2 であった。
また、このクリーニングシートＡとは別に、支持体（片面にアルミを蒸着したポリプロピレンフィルム）のみを、２３℃，５０％ＲＨの雰囲気中に１０日間放置して、この支持体の吸湿量を飽和状態としたのち、カールフィッシャー法によりその常態吸湿率を測定、算出したところ、０．３２重量％であった。
The laminated sheet A was irradiated with ultraviolet rays having a central wavelength of 365 nm and an integrated light quantity of 1,000 mJ / cm 2 to obtain a cleaning sheet A having a cleaning layer composed of a polymerized and cured resin layer. The sheet A was left in an atmosphere of 23 ° C. and 50% RH for 10 days to bring the moisture absorption amount of the entire sheet A to a saturated state. When the protective film on the cleaning layer was peeled off and the normal moisture absorption was measured by the Karl Fischer method, it was 25.0 μg / cm 2 .
In addition to this cleaning sheet A, only the support (polypropylene film with aluminum deposited on one side) is allowed to stand in an atmosphere of 23 ° C. and 50% RH for 10 days, so that the moisture absorption amount of this support is saturated. After that, the normal moisture absorption was measured and calculated by the Karl Fischer method and found to be 0.32% by weight.
このクリーニングシートＡの粘着剤層側の保護フィルムを剥がして、８インチのシリコンウエハのミラー面に、ハンドローラで貼り付けることにより、クリーニング機能付き搬送部材Ａを作製した。このクリーニング機能付き搬送部材Ａについて、この搬送部材Ａを１cm×１cmの大きさに裁断し、真空度測定装置として、昇温脱離質量分析装置（電子化学社製の「ＥＭＤ−ＷＡ１０００Ｓ」）に投入して、真空度が１０-9Ｔｏｒｒになるまでの時間を測定した。その結果は、４０分であった。
この結果からも明らかなように、上記のクリーニング機能付き搬送部材Ａは、クリーニングシートＡの支持体としてアルミを蒸着した低吸湿性材料を使用して、アルミ蒸着膜側にクリーニング層を設けるようにしたことにより、水分の揮散量を低減でき、その結果、１０-9Ｔｏｒｒの真空度に到達するまでの時間が短くなり、真空系の基板処理装置内にも支障なく搬送できることがわかった。
The protective film on the pressure-sensitive adhesive layer side of the cleaning sheet A was peeled off and attached to the mirror surface of an 8-inch silicon wafer with a hand roller to produce a transport member A with a cleaning function. About this conveyance member A with a cleaning function, this conveyance member A is cut | judged to the magnitude | size of 1 cm x 1 cm, and a temperature rising desorption mass spectrometer ("EMD-WA1000S" by an electronic chemical company) is used as a vacuum degree measuring apparatus. The time until the degree of vacuum reached 10 −9 Torr was measured. The result was 40 minutes.
As is clear from this result, the conveying member A with a cleaning function uses a low hygroscopic material on which aluminum is vapor-deposited as a support for the cleaning sheet A, and a cleaning layer is provided on the aluminum vapor deposition film side. As a result, the volatilization amount of water can be reduced, and as a result, it has been found that the time required to reach a vacuum degree of 10 −9 Torr is shortened and can be transported into a vacuum type substrate processing apparatus without any trouble.
支持体として、片面にアルミナ（酸化アルニミウム）を蒸着したポリプロピレンフィルム（蒸着膜の厚さ：０．０１μｍ、ベースフィルムの厚さ：１０μｍ、幅２５０mm）を用いた以外は、実施例１と同様にして、クリーニングシートＢを作製した。
このクリーニングシートＢを、２３℃，５０％ＲＨの雰囲気中に１０日間放置し、シートＢの吸湿量を飽和状態とした。クリーニング層上の保護フィルムを剥がし、カールフィッシャー法にて常態吸湿量を測定したところ、３６．０μｇ／cm2 であった。
また、このクリーニングシートＢとは別に、支持体（片面にアルミナを蒸着したポリプロピレンフィルム）のみを、２３℃，５０％ＲＨの雰囲気中に１０日間放置して、この支持体の吸湿量を飽和状態としたのち、カールフィッシャー法によりその常態吸湿率を測定、算出したところ、０．３９重量％であった。
The same procedure as in Example 1 was used except that a polypropylene film (a deposited film thickness: 0.01 μm, a base film thickness: 10 μm, a width 250 mm) on which alumina (aluminum oxide) was deposited on one side was used as a support. Thus, a cleaning sheet B was prepared.
This cleaning sheet B was left in an atmosphere of 23 ° C. and 50% RH for 10 days to make the moisture absorption amount of the sheet B saturated. When the protective film on the cleaning layer was peeled off and the normal moisture absorption was measured by the Karl Fischer method, it was 36.0 μg / cm 2 .
In addition to this cleaning sheet B, only the support (polypropylene film with alumina deposited on one side) is left in an atmosphere of 23 ° C. and 50% RH for 10 days to saturate the moisture absorption of the support. After that, the normal moisture absorption was measured and calculated by the Karl Fischer method and found to be 0.39% by weight.
このクリーニングシートＢの粘着剤層側の保護フィルムを剥がして、８インチのシリコンウエハのミラー面に、ハンドローラで貼り付けることにより、クリーニング機能付き搬送部材Ｂを作製した。このクリーニング機能付き搬送部材Ｂについて、この搬送部材Ｂを１cm×１cmの大きさに裁断し、真空度測定装置として、昇温脱離質量分析装置（電子化学社製の「ＥＭＤ−ＷＡ１０００Ｓ」）に投入して、真空度が１０-9Ｔｏｒｒになるまでの時間を測定した。その結果は、４８分であった。
この結果からも明らかなように、上記のクリーニング機能付き搬送部材Ｂは、クリーニングシートＢの支持体としてアルミナを蒸着した低吸湿性材料を使用して、アルミナ蒸着膜側にクリーニング層を設けるようにしたことにより、水分の揮散量を低減でき、その結果、１０-9Ｔｏｒｒの真空度に到達するまでの時間が短くなり、真空系の基板処理装置内にも支障なく搬送できることがわかった。
The protective film on the pressure-sensitive adhesive layer side of the cleaning sheet B was peeled off and attached to the mirror surface of an 8-inch silicon wafer with a hand roller to prepare a transport member B with a cleaning function. About this conveyance member B with a cleaning function, this conveyance member B is cut | judged to the magnitude | size of 1 cm x 1 cm, and a temperature rising desorption mass spectrometer ("EMD-WA1000S" by an electronic chemical company) is used as a vacuum degree measuring apparatus. The time until the degree of vacuum reached 10 −9 Torr was measured. The result was 48 minutes.
As is clear from this result, the conveying member B with a cleaning function uses a low hygroscopic material on which alumina is vapor-deposited as a support for the cleaning sheet B, and a cleaning layer is provided on the alumina vapor deposition film side. As a result, the volatilization amount of water can be reduced, and as a result, it has been found that the time required to reach a vacuum degree of 10 −9 Torr is shortened and can be transported into a vacuum type substrate processing apparatus without any trouble.
比較例１
支持体として、６−ナイロンフィルム（厚さが２５μｍ、幅が２５０mm）を使用した以外は、実施例１と同様にして、クリーニングシートＣを作製した。
このクリーニングシートＣを、２３℃，５０％ＲＨの雰囲気中に１０日間放置し、シートＣの吸湿量を飽和状態とした。クリーニング層上の保護フィルムを剥がし、カールフィッシャー法にて常態吸湿量を測定したところ、８０．０μｇ／cm2 であった。
また、このクリーニングシートＣとは別に、支持体（６−ナイロンフィルム）のみを、２３℃，５０％ＲＨの雰囲気中に１０日間放置して、この支持体の吸湿量を飽和状態としたのち、カールフィッシャー法によりその常態吸湿率を測定、算出したところ、２．９重量％であった。
Comparative Example 1
A cleaning sheet C was produced in the same manner as in Example 1 except that a 6-nylon film (thickness: 25 μm, width: 250 mm) was used as the support.
The cleaning sheet C was allowed to stand in an atmosphere of 23 ° C. and 50% RH for 10 days, and the moisture absorption amount of the sheet C was saturated. When the protective film on the cleaning layer was peeled off and the normal moisture absorption was measured by the Karl Fischer method, it was 80.0 μg / cm 2 .
In addition to this cleaning sheet C, only the support (6-nylon film) was left in an atmosphere of 23 ° C. and 50% RH for 10 days to saturate the moisture absorption of the support. The normal moisture absorption was measured and calculated by the Karl Fischer method and found to be 2.9% by weight.
このクリーニングシートＣの粘着剤層側の保護フィルムを剥がして、８インチのシリコンウエハのミラー面に、ハンドローラで貼り付けることにより、クリーニング機能付き搬送部材Ｃを作製した。このクリーニング機能付き搬送部材Ｃについて、この搬送部材Ｃを１cm×１cmの大きさに裁断し、真空度測定装置として、昇温脱離質量分析装置（電子化学社製の「ＥＭＤ−ＷＡ１０００Ｓ」）に投入して、真空度が１０-9Ｔｏｒｒになるまでの時間を測定した。その結果は、１２０分であった。
この結果からも、上記のクリーニング機能付き搬送部材Ｃは、クリーニングシートＣの支持体として高吸湿性材料を使用したことにより、水分揮散量を低減できず、その結果、１０-9Ｔｏｒｒの真空度に到達するまでの時間が長くなり、真空系の基板処理装置内に搬送すると、装置を故障させるおそれがあり、使用困難であることがわかった。
The protective film on the pressure-sensitive adhesive layer side of the cleaning sheet C was peeled off and attached to the mirror surface of an 8-inch silicon wafer with a hand roller to prepare a conveying member C with a cleaning function. About this conveyance member C with a cleaning function, this conveyance member C is cut | judged to the magnitude | size of 1 cm x 1 cm, and a temperature rising desorption mass spectrometer ("EMD-WA1000S" by an electronic chemical company) is used as a vacuum degree measuring apparatus. The time until the degree of vacuum reached 10 −9 Torr was measured. The result was 120 minutes.
Also from this result, the transport member C with the cleaning function described above cannot reduce the water volatilization amount by using the highly hygroscopic material as the support of the cleaning sheet C. As a result, the vacuum degree of 10 −9 Torr It has been found that it takes a long time to reach, and if it is transported into a vacuum-type substrate processing apparatus, the apparatus may be damaged, making it difficult to use.
Claims (6)
A support film is formed by forming a vapor-deposited film made of a metal film or metal oxide film on one side of the base film, a cleaning layer is provided on the vapor-deposited film side of the support, and an adhesive layer is provided on the opposite side. A cleaning sheet characterized by the above.
The cleaning sheet according to claim 1, wherein the substrate has a normal moisture absorption of less than 2.0% by weight.
The cleaning sheet according to claim 1 or 2, wherein the normal moisture absorption is 50 µg / cm 2 or less.
A conveying member with a cleaning function, wherein the cleaning sheet according to any one of claims 1 to 3 is attached to the conveying member via an adhesive layer.
5. A method for cleaning a substrate processing apparatus, comprising transporting the transport member with a cleaning function according to claim 4 into the substrate processing apparatus.
A substrate processing apparatus cleaned by the cleaning method according to claim 5.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2019240029A1 (en) * | 2018-06-15 | 2019-12-19 | 株式会社アルバック | Vacuum treatment device and dummy substrate device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019240029A1 (en) * | 2018-06-15 | 2019-12-19 | 株式会社アルバック | Vacuum treatment device and dummy substrate device |
| KR20200083563A (en) * | 2018-06-15 | 2020-07-08 | 가부시키가이샤 알박 | Vacuum processing device, dummy substrate device |
| JPWO2019240029A1 (en) * | 2018-06-15 | 2021-01-07 | 株式会社アルバック | Vacuum processing equipment, dummy substrate equipment |
| TWI740157B (en) * | 2018-06-15 | 2021-09-21 | 日商愛發科股份有限公司 | Vacuum processing apparatus and dummy substrate device |
| JP7012155B2 (en) | 2018-06-15 | 2022-01-27 | 株式会社アルバック | Vacuum processing equipment, dummy board equipment |
| KR102392851B1 (en) * | 2018-06-15 | 2022-04-29 | 가부시키가이샤 알박 | vacuum processing unit, dummy substrate unit |
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