JP2007035684A - Dust removing member of substrate processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a dust removing member of substrate processing equipment in which a conveyance function and a dust removing function coexist, and the dust removing member can be conveyed certainly in the substrate processing equipment and can remove contamination adhering in the equipment conveniently and certainly. <P>SOLUTION: In the dust removing member of substrate processing equipment provided with a layer having a dust removing function at least on one side of a conveyance member, the layer having a dust removing function has a portion 1 subjected to unevenness processing with surface roughness Ra of ≥0.10 μm, and a smooth portion 2 having a surface roughness Ra of a smaller value wherein the portion 1 subjected to unevenness processing is formed symmetrically to two or more axes of symmetry drawn on the conveyance member. More specifically, 180° peel adhesion of the layer having a dust removing function to a silicon wafer (mirror face) is ≥0.2 N/10 mm width. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to a dust removing member of a substrate processing apparatus used for removing foreign substances adhering to the substrate processing apparatus.

In a substrate processing apparatus that dislikes foreign matter, such as a manufacturing apparatus or an inspection apparatus for semiconductors, flat panel displays, printed boards, and the like, each conveying system and the substrate are conveyed while being physically contacted. At that time, if foreign matter adheres to the substrate or the transport system, subsequent substrates are successively contaminated, so that it is necessary to periodically stop and clean the apparatus. For this reason, there existed a problem that the operation rate fell and a lot of labor was required.

With respect to this problem, a method of removing a foreign substance adhering to the inside of the apparatus by transporting the substrate to which the adhesive substance is fixed in the substrate processing apparatus (see Patent Document 1), and transporting the plate-like member to the back side of the substrate There has been proposed a method (see Patent Document 2) for removing foreign substances adhering to the surface.

Among these methods, a method of transporting a substrate to which an adhesive substance is fixed as a layer having a dust removal function is an effective method for overcoming the above problem. However, the adhesive substance and the apparatus contact portion are too strongly bonded to be peeled off, and there is a possibility that the substrate cannot be reliably conveyed. This is a particularly significant problem when a vacuum suction mechanism is used for the chuck table of the apparatus.

For this reason, 180 degree peeling adhesive strength of the layer having a dust removal function is set to 0.2 N / 10 mm width or less (see Patent Document 3), or the tensile elastic modulus is set to 1 Mpa or more (according to JIS K-7127) (Patent Document). 4), attempts have been made to improve the transport function. However, in this case, the dust removal function is lowered and it is difficult to make both functions easily compatible.
JP-A-10-154686 JP-A-11-87458 JP-A-11-112242 JP 11-317680 A

In light of such circumstances, the present invention aims to achieve both a transfer function and a dust removal function, and can reliably transfer the inside of the substrate processing apparatus, and can easily and reliably remove foreign substances adhering to the apparatus. It aims at providing the dust removal member of an apparatus.

The inventors of the present invention reviewed the above attempt and used a dust removing member having a 180 ° peeling adhesive strength to a silicon wafer (mirror surface) of a layer having a dust removing function and having a width of 0.2 N / 10 mm or less. Although the dust removal rate of foreign matter in the apparatus can be improved to some extent by repeatedly transporting the substrate in the substrate processing apparatus, it has been found that the improvement effect has a limit. This is because the adhesion force of the layer having the dust removal function to the removed foreign matter is lower than the adhesion force to the device to which the removed foreign matter is attached.

In order to remove such foreign matter, the adhesive strength of the layer having the dust removing function itself should be increased, that is, the 180 ° peeling adhesive strength to the silicon wafer (mirror surface) should be 0.2 N / 10 mm width or more. desired. However, in this case, as described above, there is a tendency for the problem that the transportability is deteriorated due to strong adhesion to the device contact portion.

As a result of diligent investigations to overcome this conflicting problem, the present inventors applied a surface processing treatment to the layer having a dust removal function to form a concavo-convex processed portion having a surface roughness Ra of 0.10 μm or more. As a result, the substantial contact area between this layer and the device contact portion is reduced. As a result, the adhesive strength of this layer is increased, that is, the 180 ° peeling adhesive strength to the silicon wafer (mirror surface) is 0.2 N. Even when the width is equal to or greater than / 10 mm, it has been found that it does not adhere strongly to the apparatus contact portion and can avoid a decrease in transportability.

Further, in forming such a concavo-convex portion, forming a smooth portion having a small surface roughness Ra, for example, a surface roughness Ra of 0.05 μm or less together with this portion, improves the transportability. In addition, it was found that good results can be obtained in improving dust removal. Further, in this case, if the unevenly processed portion is formed so as to be bilaterally symmetric with respect to two or more symmetry axes drawn by the conveying member, the horizontal deviation of the layer having the dust removing function is avoided, and this deviation is prevented. Conveyance can be prevented by preventing deterioration in transportability due to the above, and making the unevenness part to exceed 20% and less than 80% of the entire surface of the layer having the dust removal function, especially 25 to 75%. It has been found that particularly good results can be obtained in order to achieve both compatibility and dust removal.

Furthermore, the dust removing member having the above-described structure having a portion having a rough surface and a smooth portion of the layer having a dust removal function is used as a pair, and the first layer having the dust removal function and the second dust removal function are used. Between the layers having surface roughness Ra of 0.10 μm or more and a smooth portion whose surface roughness Ra is smaller than the above value are formed at opposite positions on the conveying member. By doing so, the dust removal member of each of the two dust removal members has the dust removal function of the two dust removal members by transporting the pair of dust removal members in sequence into the substrate processing apparatus. It has been found that the layer can be effectively removed without leaving a defective part of dust removal.

The present invention has been completed based on the above findings.
That is, the present invention provides a dust removal member of a substrate processing apparatus in which a layer having a dust removal function is provided on at least one surface of a transport member, and the layer having the dust removal function has a surface roughness Ra of 0.10 μm or more. The present invention relates to a dust removing member of a substrate processing apparatus, characterized in that the portion has a portion formed. In particular, the present invention can provide a dust removing member for a substrate processing apparatus having the above-described structure, in which a 180 ° peeling adhesive force to a silicon wafer (mirror surface) of a layer having a dust removing function is 0.2 N / 10 mm width or more. .

In the present invention, the layer having a dust removal function has a portion where the surface roughness Ra is concavo-convex to 0.10 μm or more and a smooth portion where the surface roughness Ra is smaller than the above value. The concavo-convex processed portion of the substrate processing apparatus having the above-described structure is formed so as to be symmetric with respect to two or more symmetry axes drawn by the conveying member, particularly the surface roughness Ra is 0.10 μm. It is possible to provide a dust removal member for a substrate processing apparatus having the above-described configuration, in which the unevenness-treated portion exceeds 20% and less than 80% of the entire surface of the layer having a dust removal function.

Further, according to the present invention, two dust removal members of the substrate processing apparatus having the above-described configuration having a portion having a dust removal function and a smooth portion are provided as one set, and the first and second sheets are combined. In the layer having both dust removing functions, the surface roughness Ra is formed to have a concavo-convex portion of 0.10 μm or more and the smooth portion where the surface roughness Ra is smaller than the above value are formed at opposite positions on the conveying member. It is possible to provide a dust removing member for a substrate processing apparatus. In addition, the present invention can provide a dust removal method for a substrate processing apparatus, wherein the dust removal members of the set of two substrates are sequentially conveyed into the substrate processing apparatus to remove the dust in the apparatus. Is.

Thus, in the present invention, the surface roughness treatment is performed on the layer having the dust removal function to form a concavo-convex processed portion having a surface roughness Ra of 0.10 μm or more, and together with this portion, the surface roughness By forming a smooth portion with Ra smaller than the above value, and forming the concavo-convex portion so as to be symmetric with respect to two or more symmetry axes drawn by the conveying member, Therefore, it is possible to provide a dust removal member for a substrate processing apparatus that is excellent in both of the above characteristics and is compatible with both the properties and the dust removal performance of foreign substances adhering to the inside of the apparatus.

In particular, a set of two dust removing members having the above-described structure is used to form a concave / convex surface roughness Ra of 0.10 μm or more between the first dust removing layer and the second dust removing layer. The set of two dust removal members are disposed in the substrate processing apparatus so that the formed portion and the smooth portion whose surface roughness Ra is smaller than the above value are formed at positions opposite to each other on the conveying member. By sequentially transporting in order, it is possible to highly improve the transportability and the dust removal performance of foreign matter.

For the layer having a dust removal function in the present invention (hereinafter simply referred to as a dust removal layer), for example, a curable pressure-sensitive adhesive that is polymerized and cured by an active energy source is preferably used because of easy control of the adhesive force. The active energy source is not particularly limited, and includes various sources such as ultraviolet rays, electron beams, and heat. However, ultraviolet rays are preferably used because of easy handling.

Such a curable pressure-sensitive adhesive is described in detail, for example, in Patent Document 3, and usually a compound having at least one unsaturated double bond in the molecule of the pressure-sensitive polymer and a polymerization initiator, and if necessary. Those containing a crosslinking agent or the like are used.

As the adhesive polymer, an acrylic polymer having (meth) acrylic acid and / or (meth) acrylic acid ester as a main monomer is preferably used. The compound having one or more unsaturated double bonds in the molecule is preferably a non-volatile low molecular weight material having a weight average molecular weight of 10,000 or less, preferably 5,000 or less. Examples include polyethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, and dipentaerythritol hexa (meth) acrylate. Furthermore, the polymerization initiators include thermal polymerization initiators such as benzoyl peroxide and azobisisobutyronitrile, and photopolymerization initiators such as benzophenone, benzyldimethyl ketal, and 2,2-dimethoxy-2-phenylacetophenone. Is used.

As the material for the dust removal layer, in addition to the above curable adhesive, polyolefin resins such as polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyimide, polyvinyl chloride, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene -Resins such as vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, polystyrene, and polycarbonate can also be used. These resins adjust the molecular weight of the resin itself and the amount of additives such as a plasticizer so that appropriate adhesiveness can be expressed.

In the present invention, in providing the dust removing layer composed of the above-mentioned curable pressure-sensitive adhesive or the like on at least one surface (that is, one surface or both surfaces) of the transport member, it may be applied directly on the transport member or once on the support. It may be applied to prepare a dust removing sheet, and this may be bonded onto the conveying member. In any case, the thickness of the dust removal layer is not particularly limited, but it is usually preferable to set the thickness to about 5 to 100 μm in consideration of transportability into the substrate processing apparatus.

The support used in the dust removal sheet is not particularly limited. For example, polyolefin such as polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, poly Examples include plastic films made of butylene terephthalate, polyurethane, ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, polystyrene, polycarbonate, and the like. . These supports may be used singly or in combination of two or more, and may be one that has been subjected to surface treatment such as corona treatment on one or both sides. The thickness of the support is usually about 10 to 100 μm.

In the above dust removal sheet, it is desirable to provide an adhesive (adhesive) layer in advance on the back side of the support having a dust removal layer formed on one side in order to facilitate bonding to the conveying member. The thickness of the pressure-sensitive adhesive (adhesive) layer is not particularly limited, but is usually 5 to 100 μm, preferably about 10 to 50 μm. Such a pressure-sensitive adhesive (adhesive) layer is not particularly limited with respect to the material configuration, and a material made of a normal pressure-sensitive adhesive (adhesive) such as acrylic, rubber-based, or silicon-based can be used as appropriate. .

In the present invention, the transport member provided with the dust removal layer is not particularly limited, and for example, a substrate for a flat panel display such as a semiconductor wafer, LCD, or PDP, or a substrate such as a compact disk or an MR head is used.

In the dust removal member of the substrate processing apparatus of the present invention, the surface of the dust removal layer and the surface of the pressure-sensitive adhesive (adhesive) layer provided on the back side of the dust removal sheet are used until dust removal for the substrate processing apparatus. It is desirable to attach a protective film for protection.

Such a protective film is not particularly limited, and a plastic film made of polyethylene terephthalate or the like that has been subjected to a release treatment with a silicone-based, long-chain alkyl-based, fluorine-based, fatty acid amide-based, silica-based release agent, or the like is used. The thickness of the protective film is usually 10 to 100 μm from the viewpoint of workability.

In the dust removing member of the substrate processing apparatus configured as described above, the dust removing layer has a portion in which the above-described dust removing layer is processed to be uneven to have a surface roughness Ra of 0.10 μm or more (usually up to about 2.0 μm). It is characterized by having a configuration.

With this configuration, when a material having a 180 ° peel adhesion to a silicon wafer (mirror surface) of 0.2 N / 10 mm width or more (usually up to 0.5 N / 10 mm width) is used as the dust removal layer However, as a result of reducing the contact area with the substrate processing apparatus, the substantial adhesive force is reduced, and good transportability can be maintained.

Further, when forming a portion with the surface roughness Ra of 0.10 μm or more as described above, the surface roughness Ra is smaller than the above value together with this portion. For example, the surface roughness Ra is 0.00. By forming a smooth portion having a thickness of 05 μm or less (usually up to about 0.01 μm), it is possible to improve the dust removal property of foreign matters adhering to the substrate processing apparatus.

In that case, it is desirable to form the above-mentioned uneven processed part so as to be bilaterally symmetric with respect to two or more symmetry axes drawn by the conveying member. If the above-mentioned part is unevenly distributed on the conveying member, that is, if a portion having a different surface roughness Ra is unevenly distributed on the conveying member, a problem of falling off from the automatic conveying arm is expected, and the conveying property is hindered. Wow.

FIGS. 1-10 shows ten different examples as a formation aspect of said uneven | corrugated processed part and a smooth part. That is, in the dust removing member of the substrate processing apparatus of the present invention in which the dust removing layer is provided on at least one surface of the circular conveying member, the above-described unevenly processed portion and the smooth portion are formed as the dust removing layer. It is shown.

In each figure, 1 (blacked portion) is a portion where the surface roughness Ra is processed to be 0.10 μm or more, and 2 (outlined portion) is a smooth portion where the surface roughness Ra is smaller than the above value. The concavo-convex processed portion 1 is formed so as to be symmetric with respect to two symmetry axes. In these embodiments, the concavo-convex portion 1 is more than 20% and preferably less than 80% of the entire surface of the dust removal layer, particularly preferably 25 to 75%, and more preferably 30 to 70%. It is more desirable that it is 40 to 60%. By setting it as such a ratio, a favorable result is obtained in coexistence with a conveyance property and dust removal property.

In the present invention, the dust removing member having the dust removing layer configured as described above is transported into the substrate processing apparatus to remove foreign substances adhering to the apparatus. At that time, a dust removing member in which a surface roughness Ra having a concavo-convex shape of 0.10 μm or more and a smooth portion having a surface roughness Ra smaller than the above value are formed at positions opposite to each other on the conveying member. If one of these two sheets is taken as a set and transported in order, the foreign matter of all areas adhering to the inside of the device can be effectively removed without leaving a defective part by the respective dust removal layers of the two dust removal members. It is desirable because it can.

For example, among FIGS. 1 to 10 described above, FIGS. 1 and 2, FIGS. 3 and 4, FIGS. 5 and 6, FIGS. 7 and 8, and FIGS. 9 and 10 each have a surface roughness Ra. Is formed in the opposite positions on the circular conveying member, the portion 1 processed to be concavo-convex to 0.10 μm or more and the smooth portion 2 having a surface roughness Ra smaller than the above value. . Therefore, these are treated as a set, that is, FIGS. 1 and 2, FIGS. 3 and 4, FIGS. 5 and 6, FIGS. 7 and 8, and FIGS. The above effects are achieved when transported in order in the apparatus.

In addition to the set of two sheets, depending on the formation mode of the portion 1 with the surface roughness Ra of ruggedness processed to 0.10 μm or more and the smooth portion 2 with the surface roughness Ra smaller than the above value, Three or more sheets can be conveyed as a set, and the same effects as described above can be obtained.

In the present invention, the means for forming a portion with a surface roughness Ra of 0.10 μm or more on the dust removal layer is not particularly limited.

For example, a method of bringing a metal roll or the like having a surface roughness Ra of 0.10 μm or more into contact with a coated dust removal layer in advance by applying high pressure, a coated curable pressure-sensitive adhesive When a protective film is bonded onto the dust removal layer and an energy source such as ultraviolet rays is applied and cured, the protective film is subjected to an unevenness process with a surface roughness Ra of 0.10 μm or more in advance, such as a film surface. For example, a method of printing an appropriate paint and applying the above-described uneven processing may be used.

The substrate processing apparatus for removing dust using the dust removing member of the present invention is not particularly limited, and an exposure apparatus, a resist coating apparatus, a developing apparatus, an ashing apparatus, a dry etching apparatus, an ion implantation apparatus, a PVD apparatus, a CVD apparatus, a detection apparatus, etc. The various apparatuses are mentioned.

Next, examples of the present invention will be described in more detail. However, the present invention is not limited only to the following examples. In the following description, “parts” means parts by weight.

In Examples 1 and 2 and Comparative Example 1 below, an ultraviolet curable adhesive having the same composition is used as a material for forming the dust removal layer. In Comparative Example 2, an ultraviolet curable adhesive having a composition different from these is used. used. The adhesive strength after ultraviolet curing of both curable adhesives was measured as follows. Furthermore, the measurement of the surface roughness Ra of the dust removal layer after UV curing was performed as follows.

<Measurement of adhesive strength>
A silicon wafer (mirror surface) is used as an adherend, a dust removal sheet before UV curing is bonded to it, and after holding for 30 minutes, UV light with a central wavelength of 365 nm is irradiated so that the integrated light quantity is 2,000 mJ / cm ^2. UV cured. Then, 180 degree peeling adhesive force was measured using "TENSILON: RTM-100 type" manufactured by Orientec. The measurement conditions were a sheet width: 10 mm and a peeling speed: 300 mm / min.

<Measurement of surface roughness Ra>
The surface roughness Ra of the dust-removing layer was measured under the following setting conditions using an “ultra-deep shape measuring microscope: Model VK-8510” manufactured by Keyence Corporation.
Objective lens: 1,000 times Measurement MODE: Color ultra-depth measurement Measurement (scanning) distance: 13-20 μm
Scan pitch: 0.02 μm
Laser gain: Auto Laser sensitivity: Gammal

A 50 wt% ethyl acetate solution consisting of 31 parts 2-ethylhexyl acrylate, 69 parts methyl acrylate, 6 parts acrylic acid and 0.2 part benzoyl peroxide is polymerized to synthesize an acrylic polymer having an average molecular weight of about 700,000. did.

To 100 parts of this acrylic polymer, 50 parts of dipentaerythritol hexaacrylate (trade name “Kayarad DPHA” manufactured by Nippon Kayaku Co., Ltd.), photopolymerization initiator (trade name “Irgacure 184” manufactured by Ciba Specialty Chemicals Co., Ltd.) “] 5 parts and 2.5 parts of a polyisocyanate compound (trade name“ Coronate L ”manufactured by Nippon Polyurethane Co., Ltd.) were added to prepare an acrylic UV curable adhesive solution.

A polyester film having a thickness of 25 μm is used as a support, and the UV curable adhesive solution is applied onto the support so that the thickness after drying is 15 μm and dried. Then, an ultraviolet curable pressure-sensitive adhesive layer was formed. As shown in FIG. 9, the surface of this pressure-sensitive adhesive layer is bonded with a polyester film that has been subjected to surface unevenness processing as shown in FIG. 9 (the unevenness processed portion is 50%, the smooth portion is 50%) and the release treatment. It was.

A 65 wt% toluene solution consisting of 100 parts of butyl acrylate, 5 parts of acrylic acid and 0.2 part of azobisisobutyronitrile was polymerized to synthesize an acrylic polymer having an average molecular weight of about 600,000. An acrylic pressure-sensitive adhesive solution was prepared by adding 5 parts of a polyisocyanate compound (trade name “Coronate L” manufactured by Nippon Polyurethane Co., Ltd.) as a crosslinking agent to 100 parts of the solid content of the acrylic polymer. .

This pressure-sensitive adhesive solution was applied on a protective film (polyester film subjected to a release treatment) so that the thickness after drying was 15 μm, and dried to form a pressure-sensitive pressure-sensitive adhesive layer. This pressure-sensitive adhesive layer was bonded to the back side of the support on which the ultraviolet curable pressure-sensitive adhesive layer was formed to obtain a laminated sheet having a five-layer structure.

The laminated sheet is irradiated with ultraviolet light having a center wavelength of 365 nm from the ultraviolet curable pressure-sensitive adhesive layer side so that the integrated light amount becomes 2,000 mJ / cm ² and is cured by ultraviolet rays, whereby the dust removing sheet B1. Was made. In addition, about the said ultraviolet curable adhesive used for preparation of this dust removal sheet B1, 180 degree peeling adhesive force after the ultraviolet curing measured by the said method was 0.39 N / 10mm width.

Next, the protective film on the pressure-sensitive adhesive layer side of the dust removal sheet B1 is peeled off, and a 6-inch silicon wafer is attached to the mirror surface as a conveying member, and then the peripheral portion is aligned to the wafer shape to process the substrate. A dust removing member C1 of the apparatus was produced.

With respect to the dust removing member C1, the protective film A1 on the ultraviolet curable pressure-sensitive adhesive layer side was peeled off, and the surface state of the dust-removing layer composed of the ultraviolet curable pressure-sensitive adhesive layer was examined. As a result, as shown in FIG. The surface roughness Ra of the portion having 50% of the portion and 50% of the smooth portion and the unevenness processed was 0.10 μm, and the surface roughness Ra of the smooth portion was 0.04 μm.

Further, in the production of the dust removing sheet B1 and the dust removing member C1 described above, the surface asperity is processed as the protective film A2 instead of the protective film A1 bonded to the surface of the ultraviolet curable pressure-sensitive adhesive layer as shown in FIG. The dust-removing sheet B2 and the dust-removing member C2 were produced by the same method as described above except that a polyester film that had been subjected to a release treatment was used.

With respect to this dust removing member C2, the protective film A2 on the ultraviolet curable pressure-sensitive adhesive layer side was peeled off, and the surface state of the dust removing layer made of the ultraviolet curable pressure-sensitive adhesive layer was examined. As a result, as shown in FIG. The surface roughness Ra of the portion having 50% of the portion and 50% of the smooth portion and the unevenness processed was 0.10 μm, and the surface roughness Ra of the smooth portion was 0.04 μm.

The dust removal member C1 and the dust removal member C2 produced as described above were used as a set of two sheets, and the transportability when transporting them sequentially into the substrate processing apparatus was evaluated by the following transportability test. As a result, it was confirmed that both the dust removing member C1 and the dust removing member C2 have good transportability and can be transported into the substrate processing apparatus without any problem.

<Transportability test>
An adhesive tape laminating machine (“DR-8500II” manufactured by Nitto Seiki Co., Ltd.) was used, and the dust removing member was conveyed to the dust removing layer facing downward. After being once adsorbed to the chuck table (table temperature: 25 ° C.), it was confirmed whether there was any abnormal noise when it was desorbed. The case where an abnormal noise such as “bread” was generated at the time of detachment, or the paper was not completely fixed to the chuck table and could not be transported, was regarded as poor transportability.

Next, the dust removal sheet B1 that constitutes each member with respect to dust removal property that removes foreign matter adhering to the apparatus by sequentially transporting the pair of dust removal members C1 and the dust removal member C2 into the substrate processing apparatus Evaluation was carried out by the following dust removal test using B2.

<Dust removal test>
By uniformly dispersing 0.01 g of polystyrene particles having an average particle size of 0.2 μm on a 6-inch silicon wafer having less than 10 foreign substances adhering from the beginning, and removing the excess with an air gun. The number of foreign objects for dust removal was adjusted.

To the silicon wafer with the number of foreign matters adjusted in this way, first, the dust removal layer side of the dust removal sheet B1 was attached, held for 1 minute, and then peeled off to remove dust. Next, the dust removing layer side of the dust removing sheet B2 was attached, held for 1 minute, and then peeled off to remove dust.

By measuring the number of foreign matter before and after dust removal with “surface inspection device: Surfscan 6200 type” manufactured by KLA Tencor, dust removal rate = [(number of foreign matter before dust removal work−number of foreign matter after dust removal work) / dust removal work It was calculated as [the number of previous foreign objects] × 100 (%).

As a result, the dust removal rate = [(7493-4122) / 7493] = 44.9% in the first dust removal sheet B1, and the dust removal rate = [(7493-1076) / 7493] = 85. 6%. As is clear from this test result, the dust removal member C1 and the dust removal member C2 are made into a set of two sheets, and these are transported in order, so that the dust removal rate of the foreign matter is 85% or more. It can be seen that is obtained.

Instead of the protective film A1 to be bonded to the surface of the UV curable pressure-sensitive adhesive layer, the protective film A3 is subjected to surface unevenness processing as shown in FIG. 9 (the uneven processed part is 70%, the smooth part is 30%) and A dust removal sheet B3 and a dust removal member C3 were produced in the same manner as in Example 1 except that the release-treated polyester film was used.

With respect to the dust removing member C3, the protective film A3 on the ultraviolet curable pressure-sensitive adhesive layer side was peeled off, and the surface state of the dust removing layer made of the ultraviolet curable pressure-sensitive adhesive layer was examined. The surface roughness Ra of the portion having 70% of the portion and 30% of the smooth portion, and the processed uneven portion was 0.10 μm, and the surface roughness Ra of the smooth portion was 0.04 μm.

Further, in the same manner as described above, instead of the protective film A1 bonded to the surface of the UV curable pressure-sensitive adhesive layer, the protective film A4 is subjected to surface unevenness processing as shown in FIG. 10 (the uneven processed portion is 30% smooth A dust removing sheet B4 and a dust removing member C4 were produced in the same manner as in Example 1 except that a polyester film that had been subjected to a release treatment was used.

With respect to this dust removing member C4, the protective film A4 on the ultraviolet curable pressure-sensitive adhesive layer side was peeled off and the surface state of the dust removing layer comprising the ultraviolet curable pressure-sensitive adhesive layer was examined. As a result, as shown in FIG. The surface roughness Ra was 0.10 μm, and the surface roughness Ra of the smooth portion was 0.04 μm.

Using the dust removing member C3 and the dust removing member C4 produced in this manner as a set of two sheets, a transportability test similar to that of Example 1 was performed. As a result, both the dust removal member C3 and the dust removal member C4 have good transportability. Thus, it was confirmed that it can be transported into the substrate processing apparatus without any problem.

In addition, as a result of performing the dust removal test in the same manner as in Example 1, with the first dust removal sheet B3, the dust removal rate = [(85545-6534) / 8545] = 23.5%, and with the next dust removal sheet B4, the dust removal Rate = [(8545-937) / 8545] = 89.0%. As is clear from the test results, the dust removal member C3 and the dust removal member C4 are made into a set of two sheets, and these are transported in order, whereby the dust removal rate of the foreign matter is 89%. It can be seen that the remarkably excellent dust removal performance can be obtained.

In Example 2 described above, the protective film A3 was further changed to have a roughened portion 80% and a smooth portion 20% as shown in FIG. A dust removal sheet B5 and a dust removal member C5 having a thickness Ra of 0.10 μm and a smooth portion having a surface roughness Ra of 0.04 μm were produced.

Similarly, in Example 2 described above, the protective film A4 is further changed to have a concavo-convex portion 20% and a smooth portion 80% as shown in FIG. A dust removing sheet B6 and a dust removing member C6 having a surface roughness Ra of 0.10 μm and a smooth portion having a surface roughness Ra of 0.04 μm were produced.

The dust removal member C5 and the dust removal member C6 produced in this way were used as a set of two sheets, and the same transportability test and dust removal test as in Example 1 were performed. In the dust removal test, high dust removal performance was obtained when two sheets were transported. In the transportability test, the dust removal member C5 had good transportability, but the dust removal member C6 had poor transportability. Also from this result, it was found that the area of the processed uneven portion should desirably have a value exceeding 20% and less than 80% of the entire dust removal layer.

Comparative Example 1
A dust removal sheet and dust removal were carried out in the same manner as in Example 1 except that a polyester film that had been subjected to a release treatment that had not been subjected to surface unevenness processing was used instead of the protective film A1 that was bonded to the surface of the ultraviolet curable pressure-sensitive adhesive layer. A member was prepared. The formed dust removal layer had a smooth entire surface and a surface roughness Ra of 0.04 μm.

Only this dust removal member was used, and the same transportability test and dust removal test as in Example 1 were performed. As a result, in the dust removal test, high dust removal performance was obtained by one transport, but in the transportability test, it was fixed to the chuck table and could not be transported.

Comparative Example 2
When preparing the ultraviolet curable pressure-sensitive adhesive, the amount of dipentaerythritol hexaacrylate was changed from 50 parts to 100 parts, and the dust removal sheet and dust removal member were prepared in the same manner as in Comparative Example 1 except that. The UV curable pressure-sensitive adhesive used had a 180 ° peel-off adhesive strength after UV curing of 0.16 N / 10 mm width. The formed dust removal layer had a smooth surface as in Comparative Example 1, and its surface roughness Ra was 0.04 μm.

Only this dust removal member was used, and the same transportability test and dust removal test as in Example 1 were performed. As a result, good results were obtained in the transportability test, but the dust removal test showed the following dust removal rate by transporting it four times.

First time: Dust removal rate = [(8878-3043) / 8878] = 65.7%
Second time: Dust removal rate = [(8878-2045) / 8878] = 77.0%
3rd: Dust removal rate = [(8878-1667) / 8878] = 81.2%
4th: Dust removal rate = [(8878-1556) / 8878] = 82.5%

That is, as is clear from the transportability test and dust removal test described above, it is possible to improve the dust removal rate by reducing the adhesive force of the dust removal layer to improve the transportability and transporting this repeatedly several times. It is. However, even at the fourth conveyance, it is only 82.5%, and the dust removal performance that can be achieved is low compared to Examples 1 and 2 of the present invention.

It is the schematic which shows the aspect which forms the part uneven | corrugated processed into the dust removal layer, and the smooth part in the dust removal member of the substrate processing apparatus of this invention. It is the schematic which shows the said another aspect. It is the schematic which shows the said another aspect. It is the schematic which shows the said another aspect. It is the schematic which shows the said another aspect. It is the schematic which shows the said another aspect. It is the schematic which shows the said another aspect. It is the schematic which shows the said another aspect. It is the schematic which shows the said another aspect. It is the schematic which shows the said another aspect.

1 Uneven processed part 2 Smooth part

Claims (6)

In the dust removing member of the substrate processing apparatus in which a layer having a dust removing function is provided on at least one side of the transport member, the layer having the dust removing function has a portion having a surface roughness Ra of 0.10 μm or more. A dust removal member for a substrate processing apparatus.
2. The dust removal member of the substrate processing apparatus according to claim 1, wherein the layer having a dust removal function has a 180 ° peeling adhesion to a silicon wafer (mirror surface) of 0.2 N / 10 mm or more.
The layer having the dust removal function has a portion having a surface roughness Ra of 0.10 μm or more and a smooth portion having a surface roughness Ra smaller than the above value, and a portion having the surface roughness Ra described above. The dust removal member of the substrate processing apparatus according to claim 1, wherein the dust removal member is formed so as to be symmetric with respect to two or more symmetry axes drawn by the transport member.
4. The dust removing member for a substrate processing apparatus according to claim 3, wherein a portion having a surface roughness Ra of 0.10 [mu] m or more is more than 20% and less than 80% of the entire surface of the layer having a dust removing function.
A layer having both dust removal functions of the first and second sheets, wherein two of the dust removal members of the substrate processing apparatus according to claim 3 or 4 form a set, has a surface roughness Ra of 0.10 μm or more. A dust removing member for a substrate processing apparatus, wherein a processed portion and a smooth portion having a surface roughness Ra smaller than the above value are formed at positions opposite to each other on a conveying member.
6. A dust removal method for a substrate processing apparatus, wherein the dust removal members of the set of two substrate processing apparatuses according to claim 5 are sequentially conveyed into the substrate processing apparatus to remove dust inside the apparatus.

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