JP2007103639A - Cleaning sheet, transferring member with cleaning function, and cleaning method of substrate processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning sheet and a transferring member with cleaning function which can be used under high temperature condition, easily enables determination of the time of replacement, and assures excellent foreign matter removing performance and transferring performance. <P>SOLUTION: The cleaning sheet includes a poly(4-methyl-1-pentene) resin having the structure expressed by the following chemical expression. Moreover, the transferring member with cleaning function comprises a transferring member and a cleaning layer provided to at least single surface of the transferring member. The cleaning layer includes the poly(4-methyl-1-pentene) resin explained above. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a cleaning sheet and a conveying member with a cleaning function. More specifically, the present invention relates to a cleaning sheet and a transport member with a cleaning function that can be used at a high temperature, can easily be replaced, and have excellent foreign matter removal performance and transport performance. The present invention also relates to a cleaning method for a substrate processing apparatus using such a cleaning sheet and a conveying member with a cleaning function.

  In various substrate processing apparatuses that dislike foreign matters, such as manufacturing apparatuses and inspection apparatuses such as semiconductors, flat panel displays, and printed circuit boards, the respective transport systems and the substrate are transported while being physically contacted. At that time, if foreign matter adheres to the substrate or the transport system, subsequent substrates are contaminated one after another, and it is necessary to periodically stop the apparatus and perform a cleaning process. As a result, there has been a problem that the operating rate of the processing apparatus is lowered and a great amount of labor is required for the cleaning process of the apparatus.

  In order to overcome such a problem, a method (see Patent Document 1) for removing foreign substances adhering to the back surface of the substrate by conveying a plate-like member has been proposed. According to such a method, since it is not necessary to stop the substrate processing apparatus and perform the cleaning process, the problem that the operating rate of the processing apparatus is reduced is solved. However, this method cannot sufficiently remove foreign matter.

  On the other hand, there has been proposed a method (see Patent Document 2) for cleaning and removing foreign substances adhering to the processing apparatus by transporting the substrate to which the adhesive substance is fixed as a cleaning member into the substrate processing apparatus. In addition to the advantages of the method described in Patent Document 1, this method is also excellent in removing foreign matters. Therefore, a problem that the operating rate of the processing apparatus is reduced and a great amount of labor is required for the cleaning process of the apparatus. Both of these problems are solved. However, according to the method described in Patent Document 2, the contact portion between the adhesive substance and the apparatus may be strongly bonded and not separated. As a result, there may be a problem that the substrate cannot be reliably transported or a problem that the transport device is damaged.

  Furthermore, the temperature of the wafer stage in the substrate processing apparatus to be cleaned is set widely from room temperature to high temperature depending on the type of substrate processing. Therefore, a cleaning member that can be used in a wide temperature range is ideal. In particular, when cleaning a wafer stage at 50 ° C. or higher, the stage temperature must be lowered to room temperature during the cleaning process. For this reason, there is a problem that a great deal of time is required for temperature control (temperature reduction / temperature increase) of the stage, and the apparatus operating rate is lowered. Therefore, the cleaning member is required to have heat resistance so that the cleaning process can be performed without lowering the wafer stage to room temperature even in such an apparatus.

In order to satisfy such a requirement for heat resistance, a cleaning method using a specific heat resistant material has been proposed (see Patent Documents 3 and 4). However, the heat resistant material used in such a method has a large haze and a low transparency. Therefore, it is difficult to determine the collected state of foreign matter after cleaning. When such a cleaning member is used a plurality of times, it is difficult to determine the replacement time. As a result, there is a problem that the cleaning member is used excessively and the cleaning performance is deteriorated.
JP-A-11-87458 (pages 2 to 3) JP-A-10-154686 (pages 2 to 4) JP 2001-300436 A JP 2001-300449 A

  The present invention has been made in order to solve the above-described conventional problems. The object of the present invention is to enable use at high temperatures, to easily determine the replacement time, and to improve foreign matter removal performance and transport performance. An object of the present invention is to provide an excellent cleaning sheet and a conveying member with a cleaning function (hereinafter, these may be collectively referred to as a cleaning member). Another object of the present invention is to provide a cleaning method for a substrate processing apparatus using such a cleaning member.

  As a result of intensive studies, the present inventors have found that the above object can be achieved by using poly (4-methyl-1-pentene) resin as a cleaning member, and have completed the present invention.

According to one aspect of the present invention, a cleaning sheet is provided. The cleaning sheet includes a poly (4-methyl-1-pentene) resin having a structure represented by the following chemical formula:

  In a preferred embodiment, the cleaning sheet has a melting point of 200 ° C. or higher and a haze of 10% or lower.

According to another aspect of the present invention, a conveyance member with a cleaning function is provided. The transport member with a cleaning function includes a transport member and a cleaning layer provided on at least one surface of the transport member, and the cleaning layer has a structure represented by the following chemical formula. -Containing pentene) resin:

  In a preferred embodiment, the cleaning layer has a melting point of 200 ° C. or higher and a haze of 10% or lower.

  In a preferred embodiment, the transport member with a cleaning function further includes an adhesive layer between the transport member and the cleaning layer.

  According to still another aspect of the present invention, a cleaning method for a substrate processing apparatus is provided. This method includes conveying the cleaning sheet or the conveying member with a cleaning function into the substrate processing apparatus.

  As described above, according to the present invention, heat resistance, haze, and transparency can be satisfied simultaneously by using poly (4-methyl-1-pentene) resin for the cleaning member. As a result, it is possible to obtain a cleaning member that can perform a cleaning process without lowering the high-temperature wafer stage to room temperature and can easily confirm the state of collecting foreign matters (that is, easy to determine the replacement time). . Furthermore, according to the present invention, due to the mechanical properties and surface characteristics of poly (4-methyl-1-pentene) resin, a cleaning member excellent in foreign matter removal performance and transport performance can be obtained.

ポリメチルペンテンは、代表的には、下記化学式で表される４−メチル−１−ペンテンの重合により得られる。代表的な重合方法としては、チーグラー・ナッタ触媒を用いたアニオン重合、メタロセン触媒を用いた配位重合が挙げられる。また、市販のポリメチルペンテンを用いてもよい。市販のポリメチルペンテンの代表例としては、三井化学社製の商品名ＴＰＸシリーズが挙げられる。

The cleaning sheet according to a preferred embodiment of the present invention includes a poly (4-methyl-1-pentene) resin (hereinafter also simply referred to as polymethylpentene). Polymethylpentene has a structure represented by the following chemical formula:

Polymethylpentene is typically obtained by polymerization of 4-methyl-1-pentene represented by the following chemical formula. Typical polymerization methods include anionic polymerization using a Ziegler-Natta catalyst and coordination polymerization using a metallocene catalyst. Commercially available polymethylpentene may also be used. As a representative example of commercially available polymethylpentene, trade name TPX series manufactured by Mitsui Chemicals, Inc. may be mentioned.

  The cleaning sheet preferably has a melting point of 200 ° C. or higher, more preferably 210 ° C. or higher, and most preferably 220 ° C. or higher. By having such a melting point, it is possible to obtain a cleaning sheet having heat resistance capable of being washed at a high temperature and excellent in the ability to remove foreign substances. In the present invention, the upper limit of the melting point is not particularly limited, but a practical upper limit is, for example, about 300 ° C. in consideration of moldability and the like.

  The cleaning sheet preferably has 0 to 10%, more preferably 0 to 5%, and most preferably 0 to 3% haze. By having such a haze, it becomes easy to determine the collection state of foreign matters after cleaning, and excessive use of the cleaning sheet can be prevented. The smaller the haze, the better. The practical lower limit is, for example, 0.01%. Haze is measured according to ASTM D1746.

  The cleaning sheet preferably has a transparency of 80 to 100%, more preferably 85 to 100%, and most preferably 90 to 100%. By having such transparency, it becomes easy to determine the state of collecting foreign matter after cleaning, and excessive use of the cleaning sheet can be prevented. The greater the transparency, the better. The practical upper limit is 98%, for example. Transparency is measured according to ASTM D1746. One of the major achievements of the present invention is that the heat resistance (melting point) as described above is compatible with haze and transparency in the cleaning sheet.

  The thickness of the cleaning sheet is preferably 0.1 to 2 mm, more preferably 0.5 to 1 mm. With such a thickness, a self-supporting property can be obtained such that the cleaning sheet alone can be conveyed and foreign matter can be removed.

  The tensile elastic modulus of the cleaning sheet is preferably 2000 MPa or less, more preferably 1 to 2000 MPa, and most preferably 450 to 1500 MPa. If the tensile modulus is in such a range, the foreign matter in the cleaning target portion can be surely removed without adhering to the non-cleaning portion in the apparatus. The tensile modulus is measured according to ASTM D638.

  The cleaning sheet may further contain any appropriate additive depending on the purpose. Specific examples of the additive include a surfactant, a plasticizer, an antioxidant, and a conductivity imparting material. By adjusting the kind and / or amount of the additive to be used, a cleaning sheet having desired characteristics according to the purpose can be obtained. For example, the addition amount of the additive is preferably 0.01 to 100 parts by weight, more preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of polymethylpentene.

  The cleaning sheet can be formed by any appropriate method. For example, the cleaning sheet is produced by melting pellet-shaped polymethylpentene at a temperature of about 300 ° C. and forming it into a predetermined shape (typically, a shape corresponding to a conveying member of a substrate processing apparatus). obtain. Specific examples of the molding method include injection molding, extrusion molding, and blow molding.

  The cleaning sheet of the present invention may be used alone as a cleaning sheet, or may be used by being disposed on any appropriate base material (for example, a heat-resistant film such as a polyethylene terephthalate film or a polyimide film), You may use as a cleaning layer provided on the conveyance member (namely, as a cleaning layer of the conveyance member with a cleaning function of this invention). Hereinafter, a conveying member with a cleaning function according to a preferred embodiment of the present invention will be described.

  FIG. 1A is a schematic sectional view of a conveying member with a cleaning function according to one embodiment of the present invention, and FIG. 1B is a schematic sectional view of a conveying member with a cleaning function according to another embodiment of the present invention. FIG. As shown in FIG. 1A, the transport member with a cleaning function 100 includes a transport member 10 and a cleaning layer 20 provided on at least one surface of the transport member. The configuration and characteristics of the cleaning layer 20 are as described for the cleaning sheet. However, the thickness of the cleaning layer 20 can be set thinner than when used as a cleaning sheet. This is because it is supported by the conveying member 10 and does not need to be unnecessarily thick. Specifically, the thickness of the cleaning layer 20 is preferably 5 to 100 μm, more preferably 10 to 50 μm. In addition, as shown in FIG. 1B, an adhesive layer 30 may be provided between the conveying member 10 and the cleaning layer 20.

  The cleaning layer 20 may be formed directly on the conveying member 10, or the cleaning layer may be bonded to the conveying member via an adhesive. When the cleaning layer is directly formed, a conveyance member with a cleaning function as shown in FIG. When the cleaning layer is bonded together, for example, a conveyance member with a cleaning function as shown in FIG. 1B is obtained.

  In the case of directly forming the cleaning layer, the forming method is not particularly limited. As in the case of producing the cleaning sheet, it can be formed by, for example, injection molding, extrusion molding, or blow molding. More specifically, the cleaning layer is formed by molding a polymethylpentene resin layer on the conveying member using a predetermined molding machine and a predetermined mold.

  In the case of bonding the cleaning layer, typically, the following procedure may be employed: First, a cleaning layer forming sheet or film is formed. The method for forming the sheet or film is not particularly limited, and for example, extrusion molding or cast molding is adopted. Next, this sheet or film is bonded to the conveying member using an adhesive. As the adhesive, any appropriate adhesive can be adopted as long as the effects of the present invention are obtained. Representative examples of the adhesive include chlorine-based adhesives; or non-chlorine-based adhesives such as olefin-based, urethane-based, and polyester-based adhesives. Olefin adhesives are preferred. Since the olefin-based adhesive is excellent in adhesiveness with the cleaning layer (polymethylpentene), the cleaning layer does not float or peel off, and as a result, foreign matters can be reliably removed without causing a conveyance trouble. Furthermore, since the cleaning layer and the adhesive layer are all made of an olefin-based material, it is preferable in that it can be easily discarded and has a small adverse effect on the environment during disposal.

  The thickness of the adhesive layer is typically 3 to 100 μm. The adhesive force of the adhesive layer 30 to the conveying member 10 is 180 ° peel adhesive strength, preferably 0.21 to 0.98 N / 10 mm width, and preferably 0.4 to 0.98 N / 10 mm width. If the adhesive force is in such a range, the cleaning layer can be satisfactorily peeled off from the conveying member after cleaning, so that the conveying member can be effectively reused. When the conveying member 10 is a silicon wafer, the 180 ° peeling adhesion is measured as the adhesion of the silicon wafer to the mirror surface.

  If necessary, a separator is provided on the surface of the cleaning layer 20 opposite to the conveying member 10 (that is, the foreign matter collecting surface of the cleaning layer) until the cleaning member is put to practical use. By providing the separator, it is possible to prevent foreign matters from adhering to the cleaning layer before the cleaning process, and as a result, it is possible to prevent the cleaning performance of the cleaning member from being deteriorated. Any appropriate separator is adopted as the separator as long as the effects of the present invention can be obtained. For example, a peeled plastic film is used. Specific examples of the release treatment include surface treatment with a release agent such as a long-chain alkyl type, a fluorine type, or a fatty acid amide type. Specific examples of the material constituting the plastic film include polyolefins such as polyethylene, polypropylene, polybutene, polybutadiene, and polymethylpentene; polyesters such as polyethylene terephthalate and polybutylene terephthalate; polyurethanes; ethylene / vinyl acetate copolymers, ethylene · ( Examples include olefin copolymers such as (meth) acrylic acid copolymers and ethylene / (meth) acrylic acid ester copolymers; ionomer resins; polystyrenes; polycarbonates; and heat-resistant resins such as polyimides. The thickness of the separator is typically 5 to 100 μm.

  As the transport member 10, any appropriate substrate is used depending on the type of substrate processing apparatus to be subjected to foreign matter removal. Specific examples include semiconductor wafers (for example, silicon wafers), flat panel display substrates such as LCDs and PDPs, substrates such as compact disks and MR heads.

  In the cleaning method according to a preferred embodiment of the present invention, the cleaning sheet or the transporting member with the cleaning function is transported into a desired substrate processing apparatus and brought into contact with the cleaned site, thereby being adhered to the cleaned site. Foreign matter can be easily and reliably removed by cleaning. By using a cleaning member excellent in heat resistance as in the present invention, for example, an ozone asher, a resist coater, an oxidation diffusion furnace, an atmospheric pressure CVD apparatus, a low pressure CVD apparatus, a plasma CVD apparatus, and the like used for substrate processing Even if it is used in the apparatus, there is an advantage that it can be used without lowering the temperature of the wafer stage to room temperature and without causing defective transfer or contamination in the processing apparatus during transfer.

  The substrate processing apparatus cleaned by the cleaning method is not particularly limited. Specific examples of the substrate processing apparatus include various apparatuses such as an exposure irradiation apparatus for circuit formation, a resist coating apparatus, a sputtering apparatus, an ion implantation apparatus, a dry etching apparatus, and a wafer prober in addition to the apparatuses already described in this specification. Manufacturing equipment and inspection equipment.

EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited by these Examples. The evaluation methods in the examples are as follows. In the examples, “parts” are based on weight.
(1) Tensile modulus Measured according to ASTM D638.
(2) Haze
Measured according to ASTM D1746.
(3) Transparency Measured according to ASTM D1746.

  Polymethylpentene (Mitsui Chemicals Co., Ltd .: trade name: TPX MX002) pellet resin is melted with an injection molding machine (cylinder temperature: 300 ° C.) and molded using a 200 mmφ circular mold to form an 8-inch wafer. A cleaning sheet A having a corresponding shape was produced. The thickness of the cleaning sheet A was 0.7 mm, the tensile modulus was 750 MPa, the haze was 0.9%, and the transparency was 93%.

Using a laser surface inspection apparatus, foreign matters of 0.2 μm or more on the mirror surface of five new 8-inch silicon wafers were measured and found to be 10, 12, 9, 13, and 8, respectively. After the mirror surfaces of these wafers were transferred downward to a dry etching apparatus (manufactured by Tokyo Electron Co., Ltd.) having a separate electrostatic adsorption mechanism, the mirror surfaces were measured with a laser surface inspection apparatus. As a result, the number of foreign matters of 0.2 μm or more on the mirror surface was 33452, 38563, 31569, 30425, and 35409, respectively.
Next, the cleaning sheet A obtained as described above was transported by a dry etching apparatus having a wafer stage (wafer stage temperature of 100 ° C.) on which 33542 foreign substances had adhered. As a result, the cleaning sheet A could be conveyed without any trouble.

  As a result of visually confirming the cleaning surface of the cleaning sheet A after being transported once, it was possible to easily confirm the collected state of the foreign matter, and it was determined that the cleaning was possible continuously from the collected amount and the size of the collected foreign matter. Therefore, a second cleaning operation was performed using the same cleaning sheet A. As a result of visually confirming the cleaning surface after the second cleaning, a large foreign matter (maximum diameter of 1 mm) was collected. Therefore, the cleaning surface A was switched to a new cleaning sheet A. This operation was repeated for a total of 5 cleaning operations.

  Next, after the mirror surface of a new 8-inch silicon wafer was transported downward, the mirror surface was measured with a laser surface inspection device. As a result, it was found that 93% of foreign matters of 0.2 μm or more on the mirror surface were removed from the initial stage, and that good cleaning was performed. Furthermore, even if an actual product wafer is subsequently introduced into the apparatus, no problem occurs and normal processing is possible.

  A pellet resin of polymethylpentene (Mitsui Chemicals Co., Ltd .: trade name TPX MX002) is melted by an injection molding machine (cylinder temperature: 300 ° C.), and a resin layer of 198 mmΦ is formed on an 8-inch silicon wafer using a circular mold. Molding was performed to prepare a conveying member B with a cleaning function. The thickness of the resin layer (cleaning layer) was 15 μm.

This carrying member B with a cleaning function was carried by a dry etching apparatus having a wafer stage (wafer stage temperature 100 ° C.) on which 38563 foreign substances had adhered. As a result, the transport member B with the cleaning function could be transported without hindrance.
In the same manner as in Example 1, the cleaning operation was repeated 5 times while confirming the collected state of foreign matter after cleaning. Next, after the mirror surface of a new 8-inch silicon wafer was transported downward, the mirror surface was measured with a laser surface inspection device. As a result, it was found that 90% of foreign matters of 0.2 μm or more on the mirror surface were removed from the initial stage, and that good cleaning was performed. Furthermore, even if an actual product wafer is subsequently introduced into the apparatus, no problem occurs and normal processing is possible.

  On the mirror surface of the 8-inch silicon wafer, an olefin adhesive (manufactured by Tokushi Co., Ltd., Joytac AD-408) was applied with a spin coater and dried at 100 ° C. for 10 minutes. The thickness of the adhesive (adhesive layer) after drying was 5 μm. Next, after a polymethylpentene film (manufactured by Riken Technos, trade name Four Wrap, thickness 20 μm) was bonded to the adhesive layer, the film was cut into a wafer shape to prepare a conveying member C with a cleaning function. The film had a tensile modulus of 680 MPa, a haze of 2.5%, and a transparency of 90%.

This carrying member C with a cleaning function was carried by a dry etching apparatus having a wafer stage (wafer stage temperature of 100 ° C.) on which 3569 foreign substances had adhered. As a result, the conveyance member C with the cleaning function could be conveyed without any trouble.
In the same manner as in Example 1, the cleaning operation was repeated 5 times while confirming the collected state of foreign matter after cleaning. Next, after the mirror surface of a new 8-inch silicon wafer was transported downward, the mirror surface was measured with a laser surface inspection device. As a result, it was found that 88% of foreign matters of 0.2 μm or more on the mirror surface were removed from the initial stage, and good cleaning was performed. Furthermore, even if an actual product wafer is subsequently introduced into the apparatus, no problem occurs and normal processing is possible.

(Comparative Example 1)
For 100 parts of an acrylic polymer (weight average molecular weight 700,000) obtained from a monomer mixture consisting of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate and 5 parts of acrylic acid, polyethylene glycol dimethacrylate (Shin Nakamura Chemical) 200 parts by the company, trade name NK ester 4G), 3 parts by polyisocyanate compound (trade name Coronate L, made by Nippon Polyurethane Industry Co., Ltd.), 2 parts by epoxy compound (trade name Tetrad C, by Mitsubishi Gas Chemical Company) and benzylmethyl 3 parts of ketal (photopolymerization initiator, manufactured by Ciba Specialty Chemicals, trade name Irgacure 651) was uniformly mixed to prepare an ultraviolet curable pressure-sensitive adhesive solution V.
The pressure-sensitive adhesive solution V was coated on an 8-inch silicon wafer by spin coating, and dried at 120 ° C. for 5 minutes. The thickness of the pressure-sensitive adhesive layer after drying was 15 μm. Next, a silicone-treated surface of a polyester film (trade name MRF25N100, trade name: MRF25N100, thickness: 25 μm, width: 250 mm, manufactured by Mitsubishi Chemical Polyester Film Co., Ltd.) treated with a silicone release agent was bonded to the pressure-sensitive adhesive layer to obtain a protective film. With the protective film thus bonded, ultraviolet rays having a central wavelength of 365 nm were irradiated with an integrated light amount of 1000 mJ / cm ² to obtain a cleaning member D having an ultraviolet-cured cleaning layer. This ultraviolet cured cleaning layer had a tensile modulus of 440 MPa.

  Next, the protective film was peeled off from the cleaning member D, and the film was transported by a dry etching apparatus having a wafer stage (wafer stage temperature 100 ° C.) on which 30425 foreign substances had adhered. As a result, the cleaning layer was softened by the heat of the wafer stage and could not be transported by being fixed to the stage. Therefore, the cleaning operation was stopped immediately.

(Comparative Example 2)
4-4′-diaminodiphenyl ether and pyromellitic dianhydride were mixed and reacted at 120 ° C. in N-methyl-2-pyrrolidone (hereinafter abbreviated as NMP) under a nitrogen stream, and then cooled to obtain a cleaning layer resin. A polyamic acid polymer W was prepared.
The polyamic acid polymer W was coated on an 8-inch silicon wafer by a spin coating method and dried at 90 ° C. for 10 minutes. The thickness of the resin layer after drying was 15 μm. This was treated at 300 ° C. for 2 hours in a nitrogen atmosphere to obtain a cleaning member E. The cleaning layer (resin layer) had a tensile modulus of 1800 MPa, a haze of 35%, and a transparency of 64%.

Next, the cleaning member E was transported by a dry etching apparatus having a wafer stage (wafer stage temperature of 100 ° C.) on which 35409 foreign substances had adhered. As a result, the cleaning member E could be transported without hindrance.
As a result of visually confirming the cleaning surface of the cleaning member E after being transported once, the haze of the cleaning layer was large and the reflection of light was difficult to confirm the collection state of foreign matter. A second cleaning operation was performed. As a result, the cleaning member E becomes a suction error on the wafer stage during the cleaning operation, and cannot be transported. When the apparatus was opened and the cleaning member E was taken out and confirmed in detail again by visual inspection, it was found that a large foreign matter was adhered near the edge of the cleaning surface, which caused the adsorption error.

  As is clear when Examples 1 to 3 and Comparative Examples 1 and 2 are compared, the cleaning member of the present invention can be used at a high temperature (for example, a wafer stage temperature of 100 ° C.), and is in a state of collecting foreign matter. It can be seen that the confirmation is easy and the foreign matter removing ability and the conveyance performance are excellent.

  The cleaning sheet and the conveyance member with a cleaning function of the present invention are suitably used for cleaning substrate processing apparatuses such as various manufacturing apparatuses and inspection apparatuses.

(A) is a schematic sectional drawing of the conveyance member with a cleaning function by one Embodiment of this invention, (b) is a schematic sectional drawing of the conveyance member with a cleaning function by another embodiment of this invention.

Explanation of symbols

100 Conveying member with cleaning function 10 Conveying member 20 Cleaning layer 30 Adhesive layer

Claims (6)

A cleaning sheet comprising a poly (4-methyl-1-pentene) resin having a structure represented by the following chemical formula:

  The cleaning sheet according to claim 1, having a melting point of 200 ° C or higher and a haze of 10% or lower. Cleaning having a transport member and a cleaning layer provided on at least one surface of the transport member, the cleaning layer containing a poly (4-methyl-1-pentene) resin having a structure represented by the following chemical formula Function conveying member:

  The conveying member with a cleaning function according to claim 3, wherein the cleaning layer has a melting point of 200 ° C. or more and a haze of 10% or less.   The conveyance member with a cleaning function according to claim 3, further comprising an adhesive layer between the conveyance member and the cleaning layer. A cleaning method for a substrate processing apparatus, comprising transporting the cleaning sheet according to claim 1 or 2 or the transport member with a cleaning function according to any one of claims 3 to 5 into the substrate processing apparatus.

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