JP7165066B2 - Cleaning sheet and conveying member with cleaning function - Google Patents

Description

The present invention relates to a cleaning sheet and a conveying member with a cleaning function.

In various types of substrate processing equipment, such as semiconductor, flat panel display, and printed circuit board manufacturing equipment and inspection equipment, where foreign matter is not tolerated, the substrate is conveyed while being in physical contact with the conveying device (typically, a chuck table, etc.). do. At that time, if foreign matter adheres to the transfer device, subsequent substrates will be contaminated one after another. As a result, there is a problem that the operation rate of the processing equipment is lowered and a problem that a great deal of labor is required for the cleaning process of the equipment.

In order to overcome such problems, there has been proposed a method (see Japanese Patent Application Laid-Open No. 2002-100001) for removing foreign matter adhering to a conveying apparatus by conveying a plate member into a substrate processing apparatus. According to this method, there is no need to stop the substrate processing apparatus to perform the cleaning process, thereby solving the problem of lower operating rate of the processing apparatus. However, this method cannot sufficiently remove the foreign matter adhering to the conveying device.

On the other hand, there has been proposed a method of removing foreign matter adhering to a conveying apparatus by conveying a substrate to which an adhesive substance is adhered as a cleaning member into a substrate processing apparatus (see Patent Document 2). This method is superior to the method described in Patent Document 1 in the ability to remove foreign matter. However, in the method described in Patent Literature 2, there may arise a problem that the contact portion between the adhesive substance and the conveying device adheres too strongly and cannot be separated. As a result, the problem that the board|substrate which adhere|attached the adhesive substance cannot be reliably conveyed, and the problem that a conveying apparatus is damaged may arise.

As means for solving the various problems as described above, the present applicant has reported a cleaning sheet which employs an acrylic polymer, polyimide, or polyester as a cleaning layer and which can be suitably used as a conveying member for conveying into a substrate processing apparatus. (Patent Documents 3 and 4).

Since the cleaning sheet is a member intended to remove foreign matter, it is preferable that the transparency is as high as possible for checking the foreign matter. However, conventional cleaning sheets have a problem that the presence of foreign matter cannot be sufficiently visually recognized due to the low transparency of the cleaning layer.

Further, in recent years, with the diversification of semiconductor devices, it is sometimes required to set a process area in which transfer or the like must be performed under high temperature conditions in a substrate processing apparatus. However, conventional cleaning sheets such as those described above do not have sufficient heat resistance. For example, under high-temperature conditions of the 200° C. level, the cleaning layer is heated and discolored, making it difficult to visually recognize the presence of foreign matter. There is a problem that makes it even more difficult.

JP-A-11-87458 JP-A-10-154686 Japanese Patent Application Laid-Open No. 2007-307521 JP 2010-259970 A

SUMMARY OF THE INVENTION An object of the present invention is to provide a cleaning sheet excellent in foreign matter removing performance and transparency, which can be suitably used as a conveying member for conveying in a substrate processing apparatus. Another object of the present invention is to provide a transporting member with a cleaning function, which has such a cleaning sheet and transporting member and is excellent in foreign matter removing performance and transparency.

The cleaning sheet of the present invention is a cleaning sheet comprising a cleaning layer, the cleaning layer having a transmittance of 50% or more at 400 nm,
The cleaning layer has a transmittance of 50% or more at 400 nm after being exposed to an environment of 200° C. for 3 hours.

In one embodiment, the cleaning layer has a thickness of 1 μm to 500 μm.

In one embodiment, the cleaning sheet of the present invention contains an adhesive layer.

In one embodiment, the cleaning sheet of the invention includes a support.

A conveying member with a cleaning function of the present invention has the cleaning sheet and the conveying member.

ADVANTAGE OF THE INVENTION According to this invention, the cleaning sheet which can be suitably used for the conveyance member conveyed in a substrate processing apparatus, and is excellent in the foreign material removal performance and transparency can be provided. Further, it is possible to provide a conveying member with a cleaning function, which has such a cleaning sheet and conveying member and which is excellent in foreign matter removing performance and transparency.

FIG. 1 is a schematic cross-sectional view showing one embodiment of the cleaning sheet of the present invention. FIG. 2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet of the present invention. FIG. 3 is a schematic cross-sectional view showing still another embodiment of the cleaning sheet of the present invention. FIG. 4 is a schematic cross-sectional view showing one embodiment of the conveying member with cleaning function of the present invention.

<<<1. Cleaning sheet≫≫
The cleaning sheet of the present invention has a cleaning layer. The cleaning sheet of the present invention may be composed of only the cleaning layer, or may have other layers.

The cleaning sheet of the present invention preferably has excellent heat resistance and can be sufficiently used even in a high temperature environment. Such a high-temperature environment is preferably 150° C. or higher, more preferably 200° C. or higher, still more preferably 250° C. or higher, still more preferably 300° C. or higher, and particularly preferably 350° C. or higher. be.

The cleaning sheet of the present invention has a cleaning layer having a transmittance of 50% or more at 400 nm, preferably 55% or more, more preferably 60% or more, and still more preferably 65% or more. Especially preferably, it is 70% or more. If the transmittance at 400 nm of the cleaning layer is within the above range, the transparency is high, so that it is possible to provide a cleaning sheet with excellent foreign matter visibility.

The cleaning sheet of the present invention has a cleaning layer having a transmittance of 50% or more, preferably 55% or more, and more preferably 60% at 400 nm after being exposed to an environment of 200°C for 3 hours. % or more, more preferably 65% or more, and particularly preferably 70% or more. If the transmittance at 400 nm of the cleaning layer after being exposed to an environment of 200° C. for 3 hours is within the above range, the transparency is high even after exposure to a high temperature environment. Also, it is possible to provide a cleaning sheet having excellent foreign matter visibility.

FIG. 1 is a schematic cross-sectional view showing one embodiment of the cleaning sheet of the present invention. In FIG. 1, cleaning sheet 100 has cleaning layer 10 and protective film 20 . The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, etc., and may be omitted depending on the purpose. That is, the cleaning sheet of the present invention may be composed only of the cleaning layer 10 .

FIG. 2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet of the present invention. In FIG. 2, the cleaning sheet 100 has a protective film 20, a cleaning layer 10, and an adhesive layer 30. As shown in FIG. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, etc., and may be omitted depending on the purpose.

FIG. 3 is a schematic cross-sectional view showing still another embodiment of the cleaning sheet of the present invention. In FIG. 3 , cleaning sheet 100 has protective film 20 , cleaning layer 10 , support 40 , and adhesive layer 30 . The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, etc., and may be omitted depending on the purpose.

Any appropriate thickness can be adopted as the thickness of the cleaning sheet of the present invention depending on its configuration.

<<1-1. Cleaning layer≫
The cleaning layer may be made of any appropriate material as long as the transmittance at 400 nm is within the above range, as long as the effects of the present invention are not impaired.

The cleaning layer preferably comprises polybenzoxazole.

Polybenzoxazole is a resin having heat resistance and insulating properties, and is used in semiconductor devices as a bump protective film, an interlayer insulating film, and the like. As a result of conducting various experiments and studies on polybenzoxazole, which has excellent heat resistance, it was found that a layer containing polybenzoxazole is not only excellent in heat resistance, but also excellent in foreign matter removal performance and transparency. The present inventors have found that the layer containing polybenzoxazole can be preferably used as a cleaning sheet to be transported in a substrate processing apparatus in which a process area in which transport must be performed under high temperature conditions is set.

When the cleaning layer of the cleaning sheet of the present invention contains polybenzoxazole, the cleaning sheet of the present invention is superior in foreign matter removing performance, heat resistance and transparency. For this reason, when the cleaning layer of the cleaning sheet of the present invention contains polybenzoxazole, the cleaning sheet of the present invention is transported into a substrate processing apparatus having a process area in which transport, etc. must be performed under high-temperature conditions, removal of foreign matter, etc. can be suitably used as a conveying member for the purpose of

When the cleaning layer contains polybenzoxazole, the content of polybenzoxazole in the cleaning layer is preferably 50% by weight to 100% by weight, more preferably 70% by weight to 100% by weight, and still more preferably 90% to 100% by weight, particularly preferably 95% to 100% by weight, most preferably 98% to 100% by weight. If the content of polybenzoxazole in the cleaning layer is within the above range, it is possible to provide a cleaning sheet with even better foreign matter removing performance, heat resistance, and transparency.

The cleaning layer may contain any appropriate other component within a range that does not impair the effects of the present invention. Examples of such other components include heat-resistant resins other than polybenzoxazole, surfactants, plasticizers, antioxidants, conductivity-imparting agents, ultraviolet absorbers, light stabilizers, and the like.

The thickness of the cleaning layer is preferably 1 μm to 500 μm, more preferably 3 μm to 100 μm, still more preferably 5 μm to 50 μm. When the thickness of the cleaning layer is within the above range, it is possible to provide a cleaning sheet that is excellent in foreign matter removing performance and transparency, and is also excellent in transport performance into a substrate processing apparatus.

The cleaning layer has substantially no tack. That is, for example, a cleaning layer formed from an adhesive substance and a cleaning layer formed by adhering an adhesive tape are excluded from the cleaning layer in the present invention. If the cleaning sheet of the present invention is provided with a cleaning layer having substantially adhesive strength, there is a risk that the contact portion between the cleaning layer and, for example, a conveying device in a substrate processing apparatus will adhere too strongly and will not separate. As a result, there may arise a problem that the substrate cannot be reliably transferred, or a problem that the transfer device may be damaged.

The cleaning layer, as described above, has substantially no adhesion. Specifically, the 180° peeling adhesive force A defined by JIS-Z-0237 against the mirror surface of the silicon wafer is preferably less than 0.20 N/10 mm, more preferably 0.01 to 0.01 mm. It is 10N/10mm. If the 180° peeling adhesive strength A defined by JIS-Z-0237 of the cleaning layer to the mirror surface of the silicon wafer is within such a range, the cleaning layer has substantially no adhesive strength, and the cleaning is performed. Adhesion between the layer and, for example, a contact portion with a transport device in the substrate processing apparatus can be reduced, and as a result, the substrate can be reliably transported and the transport device can be less likely to be damaged.

The cleaning layer preferably has a thermal weight loss at 400° C. of 5% or less, more preferably 4% or less, even more preferably 3% or less, particularly preferably 2.5% or less, and most preferably 2.5% or less. Preferably, it is 2% or less. If the thermal weight loss at 400° C. of the cleaning layer is within the above range, a cleaning sheet with more excellent heat resistance can be provided.

The cleaning layer preferably has a thermal weight loss at 500° C. of 10% or less, more preferably 8% or less, still more preferably 6% or less, particularly preferably 4% or less, and most preferably 3% or less. If the thermal weight loss at 500° C. of the cleaning layer is within the above range, a cleaning sheet with even better heat resistance can be provided.

The thermal weight loss of the cleaning layer at 400° C. and 500° C. can be measured using, for example, a thermal analyzer (TG-DTA) “Thermo plus TG8120” (manufactured by Rigaku Corporation).

The thermal decomposition temperature of the cleaning layer is preferably 380° C. or higher, more preferably 400° C. or higher, still more preferably 430° C. or higher, particularly preferably 470° C. or higher, and most preferably 500° C. or higher. is. If the thermal decomposition temperature of the cleaning layer is within the above range, it is possible to provide a cleaning sheet with superior heat resistance.

The thermal decomposition temperature of the cleaning layer can be measured using, for example, a thermal analyzer (TG-DTA) "Thermo plus TG8120" (manufactured by Rigaku Corporation).

The outgassing amount of the cleaning layer at 200° C. is preferably 300 ppm or less, more preferably 250 ppm or less, still more preferably 200 ppm or less, particularly preferably 150 ppm or less, and most preferably 100 ppm or less. . If the outgassing amount of the cleaning layer at 200° C. is within the above range, it is possible to provide a cleaning sheet with superior heat resistance. Further, if the amount of outgas generated from the cleaning layer at 200° C. is too large compared to the above range, the generated outgas may contaminate the surroundings (eg, contaminate the inside of the substrate processing apparatus).

The outgassing amount of the cleaning layer at 300° C. is preferably 1000 ppm or less, more preferably 500 ppm or less, still more preferably 300 ppm or less, particularly preferably 100 ppm or less, and most preferably 50 ppm or less. . If the outgassing amount of the cleaning layer at 300° C. is within the above range, it is possible to provide a cleaning sheet with superior heat resistance. Further, if the amount of outgas generated from the cleaning layer at 300° C. is too large compared to the above range, the generated outgas may contaminate the surroundings (eg, contaminate the inside of the substrate processing apparatus).

The outgassing amount of the cleaning layer is measured, for example, by placing a predetermined amount of sample in a sample cup and heating it with a heating furnace type pyrolyzer (eg "PY2020iD" manufactured by Frontier Labs) at 200°C for 10 minutes or at 300°C for 10 minutes. After heating for 1 minute, some of the volatilized components are trapped in a column immersed in liquid nitrogen, and the heating is terminated. After that, the column is taken out from the liquid nitrogen and measured by GC/MS (for example, "GCMS-QP2020" manufactured by SHIMADZU) by the electron ionization method (EI method).

The cleaning layer preferably has an elastic modulus at 25° C. of 0.5 GPa or more, more preferably 0.7 GPa or more, still more preferably 1.0 GPa or more, and particularly preferably 1.3 GPa or more, Most preferably, it is 1.5 GPa or more. If the elastic modulus at 25° C. of the cleaning layer is within the above range, it is possible to provide a cleaning sheet with excellent foreign matter removing performance.

The cleaning layer preferably has an elastic modulus at 200° C. of 0.1 GPa or more, more preferably 0.3 GPa or more, still more preferably 0.5 GPa or more, and particularly preferably 0.8 GPa or more, Most preferably, it is 1.0 GPa or more. If the elastic modulus of the cleaning layer at 200° C. is within the above range, it is possible to provide a cleaning sheet that is excellent in removing foreign matter even in a high-temperature environment.

The elastic modulus of the cleaning layer at 25° C. and 200° C. can be measured using, for example, “RSA G2” (manufactured by TA Instruments).

The cleaning layer preferably has a 180 degree peeling adhesive strength B defined by JIS-Z-0237 against the mirror surface of the dummy wafer of 10 N/10 mm or more, more preferably 15 N/10 mm or more, and still more preferably 20 N. /10 mm or more, particularly preferably 25 N/10 mm or more, most preferably 30 N/10 mm or more. If the 180 degree peeling adhesive strength B defined by JIS-Z-0237 of the cleaning layer with respect to the mirror surface of the dummy wafer is within the above range, for example, the adhesion between the cleaning layer and a transfer member such as a dummy wafer increases, It becomes difficult for the cleaning layer to peel off from the conveying member such as a dummy wafer during cleaning.

The 180 degree peeling adhesive force B defined by JIS-Z-0237 for the mirror surface of the dummy wafer of the cleaning layer is, for example, formed by forming the cleaning layer on the mirror surface of a silicon wafer as a dummy wafer, and applying it according to JIS-Z-0237. can be measured

In the cleaning layer, the number of cleaning layers remaining on the mirror surface of the dummy wafer measured by the cross-cut method is preferably 15/25 or more, more preferably 18/25 or more, still more preferably 20/25 or more, particularly Preferably it is 23/25 or more, most preferably 25/25 or more. If the number of remaining cleaning layers on the mirror surface of the dummy wafer by the cross-cut method of the cleaning layer is within the above range, for example, the adhesion between the cleaning layer and the conveying member such as the dummy wafer becomes higher, and the cleaning layer is not removed during cleaning. It becomes more difficult to separate from transfer members such as dummy wafers.

The number of remaining cleaning layers on the mirror surface of the dummy wafer by the cross-cut method of the cleaning layer is determined, for example, by making 6 parallel cuts on the substrate with a cutter knife on the test surface at intervals of 2 mm, and further perpendicular to the cuts. In the same manner, 25 grids are made by making 6 parallel cuts at intervals of 2 mm, and a tape having an adhesive strength of 16 N / 20 mm (for example, Nitto Denko Co., Ltd. "BT- 315ST") is strongly pressed, the edge of the tape is peeled off at once at an angle of 45°, and the checkerboard pattern is evaluated by comparing with a standard drawing.

<<1-2. Support≫
The cleaning sheet of the present invention may have a support. The support may be monolayer or multilayer.

Any appropriate thickness can be adopted for the thickness of the support as long as the effects of the present invention are not impaired. Such thickness is preferably 500 μm or less, more preferably 1 μm to 400 μm, still more preferably 1 μm to 300 μm, particularly preferably 1 μm to 200 μm, and most preferably 1 μm to 100 μm.

Any appropriate support can be adopted as the support as long as the effects of the present invention are not impaired. Examples of such supports include films of plastics, engineering plastics, and super engineering plastics. Specific examples of plastics, engineering plastics, and super engineering plastics include polyimide, polyethylene, polyethylene terephthalate, acetylcellulose, polycarbonate, polypropylene, and polyamide.

Various physical properties such as the molecular weight of the support material can be appropriately selected depending on the purpose.

A method for forming the support may be appropriately selected depending on the purpose.

The surface of the support is subjected to conventional surface treatments such as chromic acid treatment, ozone exposure, flame exposure, high-voltage shock exposure, ionizing radiation treatment, etc., in order to enhance adhesion and retention with adjacent layers. Alternatively, it may be subjected to physical treatment, coating treatment with a primer, or the like.

<<1-3. Adhesive layer≫
The cleaning sheet of the present invention may have an adhesive layer. Any appropriate material can be adopted as the material for such an adhesive layer as long as the effects of the present invention are not impaired. As a material for such an adhesive layer, for example, an acrylic adhesive, a silicone adhesive, a rubber adhesive, a urethane adhesive, or the like can be used.

The adhesive layer is provided, for example, for sticking to the mirror surface of the dummy wafer. As a result, the cleaning sheet of the present invention is attached to the dummy wafer as the conveying member, and the conveying member with cleaning function of the present invention can be obtained.

The adhesive layer preferably has a 180 degree peeling adhesive force C defined by JIS-Z-0237 against the mirror surface of the dummy wafer of 10 N/10 mm or more, more preferably 15 N/10 mm or more, and still more preferably It is 20 N/10 mm or more, particularly preferably 25 N/10 mm or more, and most preferably 30 N/10 mm or more. If the 180-degree peeling adhesive strength C defined by JIS-Z-0237 of the adhesive layer to the mirror surface of the dummy wafer is within the above range, for example, the adhesive strength between the adhesive layer and the dummy wafer increases, and during cleaning, In addition, it becomes difficult for the cleaning sheet to separate from the dummy wafer.

The thickness of the adhesive layer is preferably 1 μm to 200 μm, more preferably 2 μm to 100 μm, still more preferably 3 μm to 80 μm, particularly preferably 4 μm to 60 μm, most preferably 5 μm to 50 μm. .

<<1-4. Protective film≫
The cleaning sheet of the present invention may have a protective film in order to protect the cleaning layer, support, adhesive layer and the like. The protective film can be peeled off at an appropriate stage.

Any appropriate film can be adopted as the protective film as long as the effects of the present invention are not impaired. Examples of materials for such films include polyolefins such as polyethylene, polypropylene, polybutene, polybutadiene and polymethylpentene, polyvinyl chloride, vinyl chloride copolymers, polyethylene terephthalate, polybutylene terephthalate, polyurethane, and ethylene vinyl acetate copolymer. Coalescing, ionomer resin, ethylene/(meth)acrylic acid copolymer, ethylene/(meth)acrylic acid ester copolymer, polystyrene, polycarbonate, polyimide, fluorine resin, and the like.

Any appropriate release treatment may be applied to the protective film as long as the effects of the present invention are not impaired. The stripping treatment is typically done with a stripping agent. Examples of release agents include silicone-based release agents, long-chain alkyl-based release agents, fluorine-based release agents, fatty acid amide-based release agents, and silica-based release agents.

The thickness of the protective film is preferably 1 μm to 100 μm.

A method for forming the protective film is appropriately selected depending on the purpose, and can be formed by, for example, an injection molding method, an extrusion molding method, a blow molding method, or the like.

<<1-5. Cleaning sheet manufacturing method≫
As a method for manufacturing the cleaning sheet, any appropriate manufacturing method can be adopted as long as the effects of the present invention are not impaired. Examples of such a manufacturing method include (1) casting a varnish solution for a cleaning layer on a support, forming a uniform film using a spin coater or the like, and then heating to form a cleaning layer directly on the support. (2) a method of attaching an adhesive film (with a cleaning layer on one side of the label support and an ordinary adhesive layer on the other side), which is a constituent material of the label and the reinforcing portion, on the separator; A method of forming a laminate consisting of a separator and an adhesive film, then simultaneously or separately punching out only the adhesive film of this laminate into each shape of the label and/or the reinforcing portion, and peeling off the unnecessary adhesive film from the separator. , and so on.

<<<2. Conveyor with cleaning function>>>>
A conveying member with a cleaning function of the present invention has the cleaning sheet of the present invention and a conveying member.

FIG. 4 is a schematic cross-sectional view showing one embodiment of the conveying member with cleaning function of the present invention. In FIG. 4 , the conveying member 300 with cleaning function has a cleaning sheet 100 and a conveying member 200 . When the cleaning sheet 100 has an adhesive layer, preferably, the outermost layer of the cleaning sheet 100 on the conveying member 200 side is the adhesive layer.

Any appropriate conveying member can be adopted as the conveying member as long as the effects of the present invention are not impaired. Examples of such transfer members include semiconductor wafers (eg, silicon wafers), substrates for flat panel displays such as LCDs and PDPs, compact discs, and MR heads. Among these transfer members, semiconductor wafers (for example, silicon wafers) are typically used when the purpose is to clean a wafer transfer device in a substrate processing apparatus.

EXAMPLES The present invention will now be described more specifically with reference to examples and comparative examples. However, the present invention is by no means limited to them. In the following description, "parts" and "%" are by weight unless otherwise specified.

<Measurement of 180° peeling adhesive force A defined by JIS-Z-0237 for the mirror surface of the silicon wafer of the cleaning layer>
A cleaning layer was formed on the mirror surface of the silicon wafer and measured according to JIS-Z-0237.

<Measurement of transmittance of cleaning layer at 400 nm>
Using a spectrophotometer "V-670" (manufactured by JASCO Corporation), the transmittance of the cleaning layer at 400 nm was measured.

<Measurement of transmittance at 400 nm after exposing the cleaning layer to an environment of 200° C. for 3 hours>
After exposing the cleaning layer to an environment of 200° C. for 3 hours, the transmittance of the cleaning layer at 400 nm was measured using a spectrophotometer “V-670” (manufactured by JASCO Corporation).

<180 degree peeling adhesive strength C defined by JIS-Z-0237 for the mirror surface of the dummy wafer of the adhesive layer>
An adhesive layer was formed on the mirror surface of a silicon wafer as a dummy wafer, and measured according to JIS-Z-0237.

<Cleaning performance evaluation>
For example, it can be evaluated by measuring the number of particles of 0.200 μm or more on the mirror surface of the silicon wafer using a foreign matter inspection device (SFS6200 manufactured by KLA Tencor) (hereinafter referred to as device A).
More specifically, the conveying member with cleaning function is conveyed to a liner film peeling device (manufactured by Nitto Seiki, HR-300CW) (hereinafter referred to as device B) for manufacturing a cleaning sheet, and before and after conveying the conveying member with cleaning function. can be evaluated by measuring the number of foreign matter in the

<Conveyance evaluation>
For example, in apparatus B, evaluation can be made based on whether or not the carrier member with cleaning function can be separated from the chuck table by the lift pins after the carrier member with cleaning function is carried onto the chuck table, vacuum suction is performed, and the vacuum is released.

[Production Example 1]: Production of polybenzoxazole varnish In a separable flask equipped with a stirrer, 4,4′-(hexafluoroisopropylidene)bis(2-aminophenol): 36.6 g, pyridine: 27 g. 7 g and N-methyl-2-pyrrolidone: 500 g were charged and stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) was completely dissolved. After that, 27.2 g of trimethylchlorosilane was added dropwise over 1 minute, and the mixture was stirred at room temperature for 60 minutes. After that, 29.5 g of 4,4'-bis(chlorocarbonyl)diphenyl ether was slowly added over 5 minutes and stirred at room temperature for 5 hours.
The resulting synthetic solution was added dropwise to 2 L of ion-exchanged water, and the resulting precipitate was dried at 100° C. for 24 hours. By dissolving, a polybenzoxazole varnish was obtained.

[Example 1]: Production and evaluation of conveying member (1c) with cleaning function provided with cleaning layer (1a) containing polybenzoxazole The polybenzoxazole varnish obtained in Production Example 1 was applied to the mirror surface of an 8-inch silicon wafer. was applied by spin coating on top, heated at 150° C. for 30 minutes to remove N-methyl-2-pyrrolidone, and then heated at 300° C. for 2 hours under vacuum to form a cleaning layer containing polybenzoxazole (1a ) with a thickness of 10 μm was obtained.
Various evaluation results are shown in Table 1.

[Comparative Example 1]: Production and Evaluation of Conveying Member with Cleaning Function (C1c) Equipped with Cleaning Layer (C1a) Containing Polyimide Polyetherdiamine (ED-2003 manufactured by Heinzmann): 32.2 g, p-phenylenediamine: 9.4 g were dissolved in N-methyl-2-pyrrolidone: 286.3 g. Next, 30 g of 3,3,4,4-biphenyltetracarboxylic dianhydride was added and stirred at 70° C. for 6 hours to obtain a polyimide varnish.
A polyimide varnish is applied on the mirror surface of an 8-inch silicon wafer by spin coating, heated at 150° C. for 30 minutes to remove N-methyl-2-pyrrolidone, and then heated at 300° C. for 2 hours under vacuum. As a result, a conveying member (C1c) with a cleaning function having a cleaning layer (C1a) containing polyimide and having a thickness of 10 μm was obtained.
Various evaluation results are shown in Table 1.

[Comparative Example 2]: Production and Evaluation of Cleaning Sheet (C2b) Having Cleaning Layer (C2a) Containing Acrylic Resin Consists of 2-ethylhexyl acrylate: 75 parts, methyl acrylate: 20 parts, and acrylic acid: 5 parts. Acrylic polymer obtained from the monomer mixture: 100 parts, polyethylene glycol dimethacrylate: 50 parts, urethane acrylate: 50 parts, benzyl dimethyl ketal: 3 parts, and diphenylmethane diisocyanate: 3 parts are uniformly mixed, An ultraviolet curable adhesive solution was prepared. This adhesive solution was applied to a separator (polyolefin film) so as to have a thickness of 40 μm after drying, and was cured by irradiation with 1000 mJ/cm ² of ultraviolet light of 365 nm.
As described above, a cleaning sheet (C2b) having a cleaning layer (C2a) containing an acrylic resin was obtained.
Various evaluation results are shown in Table 1.

[Comparative Example 3]: Manufacture and evaluation of cleaning sheet (C2b) and conveying member with cleaning function (C2c) The surface of the cleaning sheet (C2b) opposite to the separator was placed on the mirror surface of an 8-inch silicon wafer. They were pasted with a hand roller, and then the separator was peeled off to prepare a conveying member with a cleaning function (C2c).
Various evaluation results are shown in Table 1.

INDUSTRIAL APPLICABILITY The cleaning sheet and conveying member with cleaning function of the present invention are suitably used for cleaning substrate processing apparatuses such as various manufacturing apparatuses and inspection apparatuses.

cleaning sheet 100
cleaning layer 10
Protective film 20
Adhesive layer 30
support 40
Conveying member with cleaning function 300
Conveying member 200

Claims (5)

A cleaning sheet comprising a cleaning layer,
the cleaning layer comprises polybenzoxazole;
The content of the polybenzoxazole in the cleaning layer is 50% by weight to 100% by weight,
The cleaning layer has a transmittance of 50% or more at 400 nm,
The cleaning layer has a transmittance of 50% or more at 400 nm after being exposed to an environment of 200° C. for 3 hours.
cleaning sheet. 2. The cleaning sheet according to claim 1, wherein the cleaning layer has a thickness of 1 μm to 500 μm. 3. A cleaning sheet according to claim 1 or 2, comprising an adhesive layer. 4. A cleaning sheet according to any preceding claim, comprising a support. A conveying member with a cleaning function, comprising the cleaning sheet according to any one of claims 1 to 4 and a conveying member.

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