JP2020121273A - Cleaning sheet and carrying member with cleaning function - Google Patents

Abstract

To provide a cleaning sheet excellent in foreign matter removal performance and transparency, which can be suitably used for a carrying member that is carried into a substrate processing device and to provide a carrying member with a cleaning function that has the cleaning sheet and the carrying member, which is excellent in foreign matter removal performance and transparency.SOLUTION: The cleaning sheet according to the present invention comprises a cleaning layer, where transmittance in 400 nm of the cleaning layer is 50% or more and transmittance in 400 nm of the cleaning layer already exposed to an environment at 200°C for three hours is 50% or more.SELECTED DRAWING: Figure 3

Description

The present invention relates to a cleaning sheet and a carrying member with a cleaning function.

In various types of substrate processing equipment such as semiconductors, flat panel displays, and printed circuit board manufacturing equipment and inspection equipment that do not like foreign materials, the transportation equipment (typically a chuck table, etc.) and the substrate are brought into physical contact while transporting. To do. At that time, if foreign matter adheres to the transfer device, the subsequent substrates are contaminated one after another, so it is necessary to periodically stop the device and perform a cleaning process. As a result, there has been a problem that the operating rate of the processing apparatus is lowered and a great amount of labor is required for cleaning the apparatus.

In order to overcome such a problem, a method has been proposed in which a foreign material adhering to the transfer device is removed by transferring the plate-shaped member into the substrate processing apparatus (see Patent Document 1). According to this method, since it is not necessary to stop the substrate processing apparatus to perform the cleaning process, the problem that the operating rate of the processing apparatus decreases can be solved. However, this method cannot sufficiently remove the foreign matter adhering to the transport device.

On the other hand, there has been proposed a method of removing foreign matter adhering to the transfer device by transferring the substrate to which the adhesive substance is fixed as a cleaning member into the substrate processing apparatus (see Patent Document 2). This method is more excellent in foreign matter removability than the method described in Patent Document 1. However, in the method described in Patent Document 2, there may be a problem in that the contact portion between the adhesive substance and the transport device is too strongly adhered and cannot be separated. As a result, there may arise a problem that the substrate to which the adhesive substance is fixed cannot be reliably transported, and a problem that the transport device is damaged.

As a means for solving the above-mentioned various problems, the present applicant has reported a cleaning sheet that employs an acrylic polymer, polyimide, or polyester as a cleaning layer, and that can be suitably used as a carrying member for carrying into a substrate processing apparatus. (Patent Documents 3 and 4).

Since the cleaning sheet is a member intended to remove foreign matter, it is preferable that the cleaning sheet has as high transparency as possible for confirming foreign matter. However, in the conventional cleaning sheet, there is a problem that the presence of foreign matter cannot be sufficiently visually recognized because the transparency of the cleaning layer is low.

In addition, in recent years, with the diversification of semiconductor devices, it is sometimes required to set a process region in the substrate processing apparatus in which transportation or the like must be performed under high temperature conditions. However, the conventional cleaning sheet as described above does not have sufficient heat resistance, and for example, under a high temperature condition of 200° C., the cleaning layer is discolored by heating, and the presence of foreign matter can be visually recognized sufficiently. There is a problem that it becomes more difficult.

JP-A-11-87458 JP, 10-154686, A JP, 2007-307521, A JP, 2010-259970, A

An object of the present invention is to provide a cleaning sheet that can be suitably used as a carrying member that carries into a substrate processing apparatus and that has excellent foreign matter removal performance and transparency. Another object of the present invention is to provide a carrying member with a cleaning function, which has such a cleaning sheet and a carrying member and is excellent in foreign substance removal performance and transparency.

The cleaning sheet of the present invention is a cleaning sheet having a cleaning layer, wherein the cleaning layer has a transmittance at 400 nm of 50% or more,
The transmittance of the cleaning layer at 400 nm after being exposed to the environment of 200° C. for 3 hours is 50% or more.

In one embodiment, the cleaning layer has a thickness of 1 μm to 500 μm.

In one embodiment, the cleaning sheet of the present invention includes an adhesive layer.

In one embodiment, the cleaning sheet of the present invention comprises a support.

A carrying member with a cleaning function of the present invention has the cleaning sheet and the carrying member.

ADVANTAGE OF THE INVENTION According to this invention, the cleaning sheet which can be used suitably for the conveyance member conveyed in a substrate processing apparatus, and which is excellent in the foreign material removal performance and transparency can be provided. Further, it is possible to provide a carrying member having a cleaning function, which has such a cleaning sheet and a carrying member and is excellent in foreign substance removal performance and transparency.

FIG. 1 is a schematic cross-sectional view showing one embodiment of the cleaning sheet of the present invention. FIG. 2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet of the present invention. FIG. 3 is a schematic cross-sectional view showing still another embodiment of the cleaning sheet of the present invention. FIG. 4 is a schematic sectional view showing one embodiment of the carrying member with a cleaning function of the present invention.

<<<< 1. Cleaning sheet ≫≫
The cleaning sheet of the present invention includes a cleaning layer. The cleaning sheet of the present invention may be composed of only the cleaning layer or may have other layers.

The cleaning sheet of the present invention preferably has excellent heat resistance and can be sufficiently used even in a high temperature environment. Such a high temperature environment is preferably 150° C. or higher, more preferably 200° C. or higher, further preferably 250° C. or higher, further preferably 300° C. or higher, particularly preferably 350° C. or higher. is there.

The cleaning sheet of the present invention has a cleaning layer having a transmittance of 400% at 400 nm of 50% or more, preferably 55% or more, more preferably 60% or more, further preferably 65% or more, It is particularly preferably 70% or more. When the transmittance of the cleaning layer at 400 nm is within the above range, it is possible to provide a cleaning sheet having excellent foreign matter visibility because of high transparency.

In the cleaning sheet of the present invention, the transmittance of the cleaning layer provided in the cleaning sheet at 400 nm after exposure to an environment of 200° C. for 3 hours is 50% or more, preferably 55% or more, more preferably 60%. % Or more, more preferably 65% or more, and particularly preferably 70% or more. If the transmittance of the cleaning layer at 400 nm after being exposed to an environment of 200° C. for 3 hours is within the above range, the transparency is high even after being exposed to a high temperature environment, and therefore, after being exposed to a high temperature environment. Also in this case, it is possible to provide a cleaning sheet having excellent foreign matter visibility.

FIG. 1 is a schematic cross-sectional view showing one embodiment of the cleaning sheet of the present invention. In FIG. 1, the cleaning sheet 100 has a cleaning layer 10 and a protective film 20. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, and may be omitted according to the purpose. That is, the cleaning sheet of the present invention may be composed of only the cleaning layer 10.

FIG. 2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet of the present invention. In FIG. 2, the cleaning sheet 100 has a protective film 20, a cleaning layer 10, and an adhesive layer 30. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, and may be omitted according to the purpose.

FIG. 3 is a schematic cross-sectional view showing still another embodiment of the cleaning sheet of the present invention. In FIG. 3, the cleaning sheet 100 has a protective film 20, a cleaning layer 10, a support 40, and an adhesive layer 30. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, and may be omitted according to the purpose.

The cleaning sheet of the present invention may have any appropriate thickness depending on its configuration.

<<1-1. Cleaning layer ≫
The cleaning layer may be made of any appropriate material as long as the transmittance at 400 nm is within the above range, as long as the effect of the present invention is not impaired.

The cleaning layer preferably comprises polybenzoxazole.

Polybenzoxazole is a resin having heat resistance and insulation, and is used in semiconductor devices as a bump protective film, an interlayer insulating film, and the like. As a result of conducting various experiments and studies on polybenzoxazole having excellent heat resistance, it is unexpected that the layer containing polybenzoxazole has not only excellent heat resistance but also excellent foreign matter removal performance and transparency. It has been found that the effect can be exhibited, and therefore, it has been found that the layer containing polybenzoxazole can be preferably used as a cleaning sheet to be conveyed into a substrate processing apparatus in which a process region where conveyance or the like must be performed under high temperature conditions is set.

The cleaning sheet of the present invention is excellent in foreign matter removing performance, heat resistance, and transparency when the cleaning layer included therein contains polybenzoxazole. Therefore, when the cleaning layer included in the cleaning sheet of the present invention contains polybenzoxazole, the cleaning sheet is conveyed into a substrate processing apparatus in which a process region where conveyance or the like must be performed under high temperature conditions is set, foreign matter removal, etc. It can be suitably used for a conveying member for the purpose.

When the cleaning layer contains polybenzoxazole, the content ratio of polybenzoxazole in the cleaning layer is preferably 50% by weight to 100% by weight, more preferably 70% by weight to 100% by weight, and further preferably 90% to 100% by weight, particularly preferably 95% to 100% by weight, most preferably 98% to 100% by weight. When the content ratio of polybenzoxazole in the cleaning layer is within the above range, it is possible to provide a cleaning sheet that is more excellent in foreign matter removal performance, heat resistance, and transparency.

The cleaning layer may contain any appropriate other component as long as the effects of the present invention are not impaired. Examples of such other components include heat-resistant resins other than polybenzoxazole, surfactants, plasticizers, antioxidants, conductivity-imparting agents, ultraviolet absorbers, and light stabilizers.

The thickness of the cleaning layer is preferably 1 μm to 500 μm, more preferably 3 μm to 100 μm, and further preferably 5 μm to 50 μm. When the thickness of the cleaning layer is within the above range, it is possible to provide a cleaning sheet that is excellent in foreign matter removal performance and transparency, and is also excellent in conveyance performance into the substrate processing apparatus.

The cleaning layer is substantially tack free. That is, for example, a cleaning layer formed of an adhesive substance or a cleaning layer formed by fixing an adhesive tape is excluded from the cleaning layer of the present invention. When the cleaning sheet of the present invention is provided with a cleaning layer having a substantially adhesive force, there is a possibility that the contact portion between the cleaning layer and, for example, the transfer device in the substrate processing apparatus is too strongly adhered and cannot be separated. As a result, there may occur a problem that the substrate cannot be reliably transferred and a problem that the transfer device is damaged.

The cleaning layer is substantially tack-free as described above. Specifically, the 180° peeling adhesive force A defined by JIS-Z-0237 with respect to the mirror surface of the silicon wafer is preferably less than 0.20 N/10 mm, more preferably 0.01 to 0. It is 10 N/10 mm. If the 180° peeling adhesive force A defined by JIS-Z-0237 for the mirror surface of the silicon wafer of the cleaning layer is within such a range, the cleaning layer has substantially no adhesive force and the cleaning The adhesion between the layer and, for example, the contact portion of the substrate processing apparatus with the transfer device can be reduced, and as a result, the substrate can be transferred reliably and the transfer device can be less likely to be damaged.

The cleaning layer has a thermal weight loss at 400° C. of preferably 5% or less, more preferably 4% or less, further preferably 3% or less, particularly preferably 2.5% or less, It is preferably 2% or less. When the thermal weight loss of the cleaning layer at 400° C. is within the above range, it is possible to provide a cleaning sheet having more excellent heat resistance.

The thermal weight loss of the cleaning layer at 500° C. is preferably 10% or less, more preferably 8% or less, further preferably 6% or less, particularly preferably 4% or less, and most preferably It is 3% or less. When the thermal weight loss of the cleaning layer at 500° C. is within the above range, it is possible to provide a cleaning sheet having more excellent heat resistance.

The thermogravimetric reduction of the cleaning layer at 400° C. and 500° C. can be measured using, for example, a thermal analyzer (TG-DTA) “Thermo plus TG8120” (manufactured by Rigaku Corporation).

The thermal decomposition temperature of the cleaning layer is preferably 380° C. or higher, more preferably 400° C. or higher, further preferably 430° C. or higher, particularly preferably 470° C. or higher, most preferably 500° C. or higher. Is. When the thermal decomposition temperature of the cleaning layer is within the above range, it is possible to provide a cleaning sheet having more excellent heat resistance.

The thermal decomposition temperature of the cleaning layer can be measured using, for example, a thermal analyzer (TG-DTA) "Thermo plus TG8120" (manufactured by Rigaku Corporation).

The cleaning layer has an outgas generation amount at 200° C. of preferably 300 ppm or less, more preferably 250 ppm or less, further preferably 200 ppm or less, particularly preferably 150 ppm or less, and most preferably 100 ppm or less. .. When the amount of outgas generated at 200° C. in the cleaning layer is within the above range, it is possible to provide a cleaning sheet having more excellent heat resistance. Further, if the amount of outgas generated at 200° C. in the cleaning layer is too large compared to the above range, the generated outgas may cause contamination of the surroundings (for example, contamination in the substrate processing apparatus).

The cleaning layer has an outgas generation amount at 300° C. of preferably 1000 ppm or less, more preferably 500 ppm or less, further preferably 300 ppm or less, particularly preferably 100 ppm or less, and most preferably 50 ppm or less. .. When the amount of outgas generated at 300° C. in the cleaning layer is within the above range, it is possible to provide a cleaning sheet having more excellent heat resistance. If the amount of outgas generated at 300° C. in the cleaning layer is too large compared to the above range, the generated outgas may cause contamination of the surrounding area (for example, contamination in the substrate processing apparatus).

The amount of outgas generated in the cleaning layer is, for example, 10 minutes at 200° C. or 10 minutes at 300° C. with a heating furnace type pyrolyzer (for example, “PY2020iD” manufactured by Frontier Laboratories) after placing a predetermined amount of sample in a sample cup. After heating for a minute, the volatilized components are partially trapped in a column immersed in liquid nitrogen, and the heating is completed. After that, the column is taken out from the liquid nitrogen, and GC/MS (for example, "GCMS-QP2020" manufactured by SHIMADZU) is measured by an electron ionization method (EI method).

The cleaning layer has an elastic modulus at 25° C. of preferably 0.5 GPa or more, more preferably 0.7 GPa or more, still more preferably 1.0 GPa or more, and particularly preferably 1.3 GPa or more, Most preferably, it is 1.5 GPa or more. If the elastic modulus of the cleaning layer at 25° C. is within the above range, it is possible to provide a cleaning sheet that is more excellent in foreign matter removal performance.

The cleaning layer has an elastic modulus at 200° C. of preferably 0.1 GPa or more, more preferably 0.3 GPa or more, further preferably 0.5 GPa or more, particularly preferably 0.8 GPa or more, Most preferably, it is 1.0 GPa or more. When the elastic modulus of the cleaning layer at 200° C. is within the above range, it is possible to provide a cleaning sheet having excellent foreign matter removing performance even in a high temperature environment.

The elastic modulus at 25° C. and 200° C. of the cleaning layer can be measured using, for example, “RSA G2” (manufactured by TA Instruments).

The cleaning layer has a 180-degree peeling adhesive force B defined by JIS-Z-0237 on the mirror surface of the dummy wafer, which is preferably 10 N/10 mm or more, more preferably 15 N/10 mm or more, and further preferably 20 N. /10 mm or more, particularly preferably 25 N/10 mm or more, and most preferably 30 N/10 mm or more. If the 180-degree peeling adhesive force B defined by JIS-Z-0237 to the mirror surface of the dummy wafer of the cleaning layer is within the above range, for example, the adhesion between the cleaning layer and the transfer member such as the dummy wafer becomes high, During cleaning, it becomes difficult for the cleaning layer to peel off from the transfer member such as the dummy wafer.

The 180-degree peeling adhesive force B defined by JIS-Z-0237 on the mirror surface of the dummy wafer of the cleaning layer is, for example, that a cleaning layer is formed on the mirror surface of a silicon wafer as a dummy wafer, and the adhesive strength B conforms to JIS-Z-0237. Can be measured.

In the cleaning layer, the number of remaining cleaning layers on the mirror surface of the dummy wafer by the cross-cut method is preferably 15/25 or more, more preferably 18/25 or more, further preferably 20/25 or more, and particularly It is preferably 23/25 or more, and most preferably 25/25 or more. If the number of remaining cleaning layers with respect to the mirror surface of the dummy wafer by the cross-cut method of the cleaning layer is within the above range, for example, the adhesion between the cleaning layer and the transfer member such as the dummy wafer will be higher, and the cleaning layer will not be removed during cleaning. It becomes more difficult to peel from a transfer member such as a dummy wafer.

The number of remaining cleaning layers on the mirror surface of the dummy wafer by the cross-cutting method of the cleaning layer is determined, for example, by making 6 parallel cuts on the test surface with a cutter knife at 2 mm intervals and further orthogonal to the cuts. Similarly, 6 parallel cuts are made at 2 mm intervals to make 25 cross-cuts, and a tape having an adhesive force of 16 N/20 mm is formed on the cross-cut part (for example, "BT-manufactured by Nitto Denko Corporation" 315ST") is strongly pressure-bonded, the end of the tape is peeled off at an angle of 45°, and the state of the cross-cut is evaluated by comparing with a standard drawing.

<<1-2. Support ≫
The cleaning sheet of the present invention may include a support. The support may be a single layer or a multilayer.

As the thickness of the support, any suitable thickness can be adopted as long as the effect of the present invention is not impaired. Such a thickness is preferably 500 μm or less, more preferably 1 μm to 400 μm, further preferably 1 μm to 300 μm, particularly preferably 1 μm to 200 μm, and most preferably 1 μm to 100 μm.

As the support, any suitable support can be adopted as long as the effect of the present invention is not impaired. Examples of such a support include films of plastics, engineering plastics, and super engineering plastics. Specific examples of plastics, engineering plastics and super engineering plastics include polyimide, polyethylene, polyethylene terephthalate, acetyl cellulose, polycarbonate, polypropylene and polyamide.

Various physical properties such as the molecular weight of the material of the support can be appropriately selected according to the purpose.

The method of molding the support can be appropriately selected depending on the purpose.

The surface of the support is subjected to conventional surface treatments such as chromic acid treatment, ozone exposure, flame exposure, high-voltage bombardment exposure, and ionizing radiation treatment in order to enhance the adhesiveness to the adjacent layer, the retention, etc. Alternatively, it may be subjected to physical treatment, coating treatment with an undercoating agent, or the like.

<<1-3. Adhesive layer ≫
The cleaning sheet of the present invention may have an adhesive layer. As a material for such a pressure-sensitive adhesive layer, any appropriate material can be adopted as long as the effect of the present invention is not impaired. As a material for such an adhesive layer, for example, an acrylic adhesive, a silicone adhesive, a rubber adhesive, a urethane adhesive, or the like can be adopted.

The adhesive layer is provided, for example, for sticking to the mirror surface of the dummy wafer. As a result, the cleaning sheet of the present invention is attached to the dummy wafer serving as the transfer member, and the transfer member with the cleaning function of the present invention can be obtained.

The adhesive layer has a 180-degree peeling adhesive force C defined by JIS-Z-0237 on the mirror surface of the dummy wafer, which is preferably 10 N/10 mm or more, more preferably 15 N/10 mm or more, and further preferably It is 20 N/10 mm or more, particularly preferably 25 N/10 mm or more, and most preferably 30 N/10 mm or more. If the 180-degree peeling adhesive force C defined by JIS-Z-0237 of the adhesive layer to the mirror surface of the dummy wafer is within the above range, for example, the adhesive force between the adhesive layer and the dummy wafer becomes high, and during cleaning. Moreover, it becomes difficult for the cleaning sheet to peel from the dummy wafer.

The thickness of the pressure-sensitive adhesive layer is preferably 1 μm to 200 μm, more preferably 2 μm to 100 μm, further preferably 3 μm to 80 μm, particularly preferably 4 μm to 60 μm, and most preferably 5 μm to 50 μm. ..

<<1-4. Protective film ≫
The cleaning sheet of the present invention may have a protective film in order to protect the cleaning layer, the support, the pressure-sensitive adhesive layer and the like. The protective film may be peeled off at a suitable stage.

As the protective film, any appropriate film can be adopted as long as the effect of the present invention is not impaired. Examples of the material for such a film include polyolefins such as polyethylene, polypropylene, polybutene, polybutadiene, and polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene vinyl acetate copolymer. Examples include polymer, ionomer resin, ethylene/(meth)acrylic acid copolymer, ethylene/(meth)acrylic acid ester copolymer, polystyrene, polycarbonate, polyimide, and fluororesin.

The protective film may be subjected to any appropriate peeling treatment as long as the effect of the present invention is not impaired. The peeling treatment is typically performed with a peeling agent. Examples of the release agent include a silicone-based release agent, a long-chain alkyl-based release agent, a fluorine-based release agent, a fatty acid amide-based release agent, and a silica-based release agent.

The thickness of the protective film is preferably 1 μm to 100 μm.

The method of forming the protective film is appropriately selected according to the purpose and can be formed by, for example, an injection molding method, an extrusion molding method, a blow molding method, or the like.

<<1-5. Cleaning sheet manufacturing method ≫
As a method for manufacturing the cleaning sheet, any suitable manufacturing method can be adopted as long as the effects of the present invention are not impaired. As such a manufacturing method, for example, (1) a varnish solution for a cleaning layer is cast on a support, a spin coater or the like is used to uniformly form a film, and then heating is performed to directly form the cleaning layer on the support. By the method of forming, (2) sticking a pressure-sensitive adhesive film (having a cleaning layer on one side of the label support and a normal pressure-sensitive adhesive layer on the other side of the label support) as a constituent material of the label and the reinforcing portion on the separator. A method of forming a laminate comprising a separator and an adhesive film, and then punching out only the adhesive film of this laminate into each shape of the label and/or the reinforcing portion simultaneously or separately, and removing the unnecessary adhesive film from the separator by peeling. , And so on.

<<<<2. Transporting member with cleaning function ≫≫
The carrying member with a cleaning function of the present invention includes the cleaning sheet of the present invention and the carrying member.

FIG. 4 is a schematic sectional view showing one embodiment of the carrying member with a cleaning function of the present invention. In FIG. 4, the carrying member 300 with a cleaning function has a cleaning sheet 100 and a carrying member 200. When the cleaning sheet 100 has an adhesive layer, the outermost layer of the cleaning sheet 100 on the transport member 200 side is preferably the adhesive layer.

As the carrying member, any suitable carrying member can be adopted as long as the effects of the present invention are not impaired. Examples of such a transport member include semiconductor wafers (eg, silicon wafers), flat panel display substrates such as LCDs and PDPs, compact disks, and MR heads. Among these transfer members, a semiconductor wafer (for example, a silicon wafer) is typically used for the purpose of cleaning the wafer transfer device in the substrate processing apparatus.

Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples. However, the present invention is not limited thereto. In the following description, “part” and “%” are based on weight unless otherwise specified.

<Measurement of 180° peeling adhesive force A specified by JIS-Z-0237 on the mirror surface of the silicon wafer of the cleaning layer>
A cleaning layer was formed on the mirror surface of the silicon wafer, and the measurement was performed according to JIS-Z-0237.

<Measurement of transmittance of cleaning layer at 400 nm>
The transmittance of the cleaning layer at 400 nm was measured using a spectrophotometer “V-670” (manufactured by JASCO Corporation).

<Measurement of the transmittance of the cleaning layer at 400 nm after being exposed to the environment of 200° C. for 3 hours>
After exposing the cleaning layer to an environment of 200° C. for 3 hours, the transmittance of the cleaning layer at 400 nm was measured using a spectrophotometer “V-670” (manufactured by JASCO Corporation).

<180 degree peeling adhesive force C specified by JIS-Z-0237 on the mirror surface of the dummy wafer of the adhesive layer>
An adhesive layer was formed on the mirror surface of a silicon wafer as a dummy wafer, and the measurement was performed according to JIS-Z-0237.

<Evaluation of cleaning performance>
For example, it can be evaluated by measuring the number of foreign substances of 0.200 μm or more on the mirror surface of the silicon wafer using a foreign substance inspection device (SFS6200 manufactured by KLA Tencor) (hereinafter referred to as device A).
More specifically, the transporting member with a cleaning function is transported to a liner film peeling device for manufacturing a cleaning sheet (HR-300CW manufactured by Nitto Seiki) (hereinafter referred to as device B), and before and after the transporting member with a cleaning function is transported. It can be evaluated by measuring the number of foreign substances.

<Evaluation of transportability>
For example, in the apparatus B, it is possible to evaluate whether or not the carrying member with the cleaning function can be peeled from the chuck table with the lift pin after the carrying member with the cleaning function is carried onto the chuck table, vacuum suction is performed, the vacuum is released.

[Production Example 1]: Production of polybenzoxazole varnish In a separable flask equipped with a stirrer, 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol): 36.6 g, pyridine: 27. 7 g and N-methyl-2-pyrrolidone: 500 g were charged and stirred at room temperature until 4,4′-(hexafluoroisopropylidene)bis(2-aminophenol) was completely dissolved. Then, 27.2 g of trimethylchlorosilane was added dropwise over 1 minute, and the mixture was stirred at room temperature for 60 minutes. Then, 4,4′-bis(chlorocarbonyl)diphenyl ether: 29.5 g was slowly added over 5 minutes, and the mixture was stirred at room temperature for 5 hours.
The obtained synthetic solution was added dropwise to 2 L of ion-exchanged water, the obtained precipitate was dried at 100° C. for 24 hours, and 4 times amount of N-methyl-2-pyrrolidone was added to the dried precipitate to re-produce. By dissolving, a varnish of polybenzoxazole was obtained.

[Example 1]: Production and evaluation of conveyance member with cleaning function (1c) including cleaning layer (1a) containing polybenzoxazole The varnish of polybenzoxazole obtained in Production Example 1 was used as a mirror surface of an 8-inch silicon wafer. It is applied by spin coating on the above, heated at 150° C. for 30 minutes to remove N-methyl-2-pyrrolidone, and then heated at 300° C. for 2 hours under vacuum to obtain a cleaning layer containing polybenzoxazole (1a A conveyance member with a cleaning function (1c) having a thickness of 10 μm was obtained.
The results of various evaluations are shown in Table 1.

[Comparative Example 1]: Production and evaluation of conveyance member with cleaning function (C1c) including cleaning layer (C1a) containing polyimide Polyether diamine (manufactured by Heinzmann, ED-2003): 32.2 g, p-phenylenediamine: 9.4 g was dissolved in N-methyl-2-pyrrolidone: 286.3 g. Next, 30 g of 3,3,4,4-biphenyltetracarboxylic dianhydride was added and stirred at 70° C. for 6 hours to obtain a polyimide varnish.
A polyimide varnish is applied on the mirror surface of an 8-inch silicon wafer by spin coating, heated at 150°C for 30 minutes to remove N-methyl-2-pyrrolidone, and then heated at 300°C for 2 hours under vacuum. Thus, a cleaning function-carrying member (C1c) having a polyimide-containing cleaning layer (C1a) having a thickness of 10 μm was obtained.
The results of various evaluations are shown in Table 1.

[Comparative Example 2]: Production and evaluation of cleaning sheet (C2b) including cleaning layer (C2a) containing acrylic resin 2-ethylhexyl acrylate: 75 parts, methyl acrylate: 20 parts, acrylic acid: 5 parts Acrylic polymer obtained from the monomer mixture liquid: 100 parts, polyethylene glycol dimethacrylate: 50 parts, urethane acrylate: 50 parts, benzyl dimethyl ketal: 3 parts, and diphenylmethane diisocyanate: 3 parts are uniformly mixed, An ultraviolet curable adhesive solution was prepared. This pressure-sensitive adhesive solution was applied to a separator (polyolefin film) so that the thickness after drying was 40 μm, and was irradiated with ultraviolet light of 365 nm at 1000 mJ/cm ² to be cured.
As described above, a cleaning sheet (C2b) including a cleaning layer (C2a) containing an acrylic resin was obtained.
The results of various evaluations are shown in Table 1.

[Comparative Example 3]: Production and evaluation of a cleaning member (C2b) and a carrying member (C2c) having a cleaning function having a carrying member. It was pasted with a hand roller, and then the separator was peeled off to prepare a carrying member (C2c) with a cleaning function.
The results of various evaluations are shown in Table 1.

INDUSTRIAL APPLICABILITY The cleaning sheet and the carrying member with a cleaning function of the present invention are suitably used for cleaning substrate processing apparatuses such as various manufacturing apparatuses and inspection apparatuses.

Cleaning sheet 100
Cleaning layer 10
Protective film 20
Adhesive layer 30
Support 40
Conveyor member with cleaning function 300
Transport member 200

Claims (5)

A cleaning sheet having a cleaning layer,
The transmittance of the cleaning layer at 400 nm is 50% or more,
The transmittance of the cleaning layer at 400 nm after exposure to an environment of 200° C. for 3 hours is 50% or more,
Cleaning sheet. The cleaning sheet according to claim 1, wherein the cleaning layer has a thickness of 1 μm to 500 μm. The cleaning sheet according to claim 1, further comprising an adhesive layer. The cleaning sheet according to any one of claims 1 to 3, comprising a support. A conveyance member with a cleaning function, comprising the cleaning sheet according to any one of claims 1 to 4 and a conveyance member.

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