JP2007307521A - Cleaning sheet, conveying member with cleaning function, and cleaning method of substrate treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning sheet excellent in foreign matter removal function and transportability, usable at a high temperature, and capable of preventing the operation availability of an apparatus and a conveying member having cleaning function. <P>SOLUTION: The cleaning sheet has a cleaning layer containing a polyester and Vickers hardness of the cleaning layer is 20 or higher. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a cleaning sheet and a conveying member with a cleaning function. More specifically, the present invention relates to a cleaning sheet and a transport member with a cleaning function that can be used at high temperatures, can prevent a reduction in the operating rate of the apparatus, and have excellent foreign matter removal performance and transport performance. The present invention also relates to a cleaning method for a substrate processing apparatus using such a cleaning sheet and a conveying member with a cleaning function.

  In various substrate processing apparatuses that dislike foreign matters, such as manufacturing apparatuses and inspection apparatuses such as semiconductors, flat panel displays, and printed circuit boards, the respective transport systems and the substrate are transported while being physically contacted. At that time, if foreign matter adheres to the substrate or the transport system, subsequent substrates are contaminated one after another, and it is necessary to periodically stop the apparatus and perform a cleaning process. As a result, there has been a problem that the operating rate of the processing apparatus is lowered and a great amount of labor is required for the cleaning process of the apparatus.

  In order to overcome such a problem, a method (see Patent Document 1) for removing foreign substances adhering to the back surface of the substrate by conveying a plate-like member has been proposed. According to such a method, since it is not necessary to stop the substrate processing apparatus and perform the cleaning process, the problem that the operating rate of the processing apparatus is reduced is solved. However, this method cannot sufficiently remove foreign matter.

  On the other hand, there has been proposed a method (see Patent Document 2) for cleaning and removing foreign substances adhering to the processing apparatus by transporting the substrate to which the adhesive substance is fixed as a cleaning member into the substrate processing apparatus. In addition to the advantages of the method described in Patent Document 1, this method is also excellent in removing foreign matters. Therefore, a problem that the operating rate of the processing apparatus is reduced and a great amount of labor is required for the cleaning process of the apparatus. Both of these problems are solved. However, according to the method described in Patent Document 2, the contact portion between the adhesive substance and the apparatus may be strongly bonded and not separated. As a result, there may be a problem that the substrate cannot be reliably transported or a problem that the transport device is damaged.

  Furthermore, the temperature of the wafer stage in the substrate processing apparatus to be cleaned is set widely from room temperature to high temperature depending on the type of substrate processing. Therefore, a cleaning member that can be used in a wide temperature range is ideal. In particular, when cleaning a wafer stage at 50 ° C. or higher, the stage temperature must be lowered to room temperature during the cleaning process. For this reason, there is a problem that a great deal of time is required for temperature control (temperature reduction / temperature increase) of the stage, and the apparatus operating rate is lowered. Therefore, the cleaning member is required to have heat resistance so that the cleaning process can be performed without lowering the wafer stage to room temperature even in such an apparatus.

In addition, when the substrate processing apparatus to be cleaned is a vacuum system apparatus, it is preferable from the viewpoint of operating rate that the degree of vacuum in the vacuum chamber quickly reaches the apparatus specified value. Therefore, the cleaning member is required to have a property of quickly reaching a desired degree of vacuum. However, according to the conventional cleaning member, there is a problem that it takes a very long time for the apparatus to reach a high vacuum atmosphere at the time of removing the foreign substance and after removing the foreign substance, and the operating rate of the apparatus is lowered.
JP-A-11-87458 JP-A-10-154686

  The present invention has been made to solve the above-described conventional problems. The object of the present invention is to enable use at a high temperature, to prevent a reduction in the operating rate of the apparatus, and to remove foreign substances and transport An object of the present invention is to provide a cleaning sheet having excellent performance and a conveying member with a cleaning function (hereinafter, these may be collectively referred to as a cleaning member). Another object of the present invention is to provide a cleaning method for a substrate processing apparatus using such a cleaning member.

  As a result of intensive studies, the present inventors have found that the above object can be achieved by including polyester in the cleaning layer, and have completed the present invention.

  The cleaning sheet of the present invention has a cleaning layer containing polyester, and the cleaning layer has a Vickers hardness of 20 or more.

  In a preferred embodiment, the tensile elastic modulus of the cleaning layer is 2000 MPa or less.

  In another aspect of the present invention, a conveyance member with a cleaning function is provided. In a preferred embodiment, the transport member with a cleaning function includes a transport member and the cleaning layer on at least one surface of the transport member, and the cleaning layer is provided on the transport member via an adhesive layer. Yes.

  In another preferred embodiment, the transport member with a cleaning function includes a transport member and the cleaning layer on at least one surface of the transport member, and the cleaning layer is directly provided on the transport member.

  In still another aspect of the present invention, a cleaning method for a substrate processing apparatus is provided. This method includes transporting the transport member with a cleaning function into the substrate processing apparatus.

  As described above, according to the present invention, since the cleaning layer contains polyester and the Vickers hardness is 20 or more, it can be used at a high temperature, can prevent a reduction in the operating rate of the apparatus, and remove foreign matter. A cleaning member excellent in performance and conveyance performance can be obtained. As a result, the cleaning process can be performed without lowering the high-temperature wafer stage to room temperature, and the cleaning process can be performed efficiently even when the substrate processing apparatus is a vacuum system apparatus. This is presumed to be due to the thermal properties, mechanical properties and surface properties of the polyester. In addition, according to a preferred embodiment of the present invention, the tensile modulus of the cleaning layer is 2000 MPa or less. By forming a cleaning layer having such characteristics, a more preferable cleaning member can be obtained.

  1A and 1B are schematic sectional views of a cleaning sheet in a preferred embodiment of the present invention. According to FIG. 1A, the cleaning sheet 100 includes a support 10, a cleaning layer 20, and a separator 30. The support 10 and / or the separator 30 may be omitted depending on the purpose. According to FIG. 1B, the pressure-sensitive adhesive layer 40 and the separator 30 are disposed on the surface of the support 10 opposite to the cleaning layer 20. When the support 10 is omitted, the pressure-sensitive adhesive layer 40 may be disposed adjacent to the cleaning layer 20. The pressure-sensitive adhesive layer 40 and / or the separator 30 may be omitted depending on the purpose. Further, any appropriate pressure-sensitive adhesive layer (not shown) may be provided between the support 10 and the cleaning layer 20.

  The cleaning layer 20 in the present invention contains polyester. By using polyester, it is possible to obtain a cleaning member that can be used at a high temperature, can prevent a reduction in the operating rate of the apparatus, and has excellent foreign matter removal performance and transportability.

  The polyester has an ester bond (—COO—) in the main chain, and any appropriate polyester is selected. Specific examples of polyester include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT). Commercially available polyester such as heat resistant polyester varnish (trade name: V599-00) manufactured by Ryoden Kasei Co., Ltd. may be used. These polyesters may be used alone or in combination of two or more.

  The polyester can be obtained by any appropriate method depending on the type. The polyester may be subjected to any appropriate modification treatment depending on the purpose.

  In the present invention, the polyester is preferably a heat-resistant polyester. As heat-resistant polyester, for example, when the polyester has a glass transition temperature (Tg), Tg is preferably 40 ° C. or higher, more preferably 50 ° C. or higher, and further preferably 60 ° C. or higher. The upper limit of Tg is preferably 250 ° C. or less from the viewpoint of ease of handling. When the Tg of polyester has such a range, a cleaning member having excellent heat resistance can be obtained, and the apparatus can be cleaned without lowering the stage temperature.

  The polyester may be used alone or in combination with any suitable resin depending on the purpose. Specific examples of resins used in combination include polyacetal (POM), modified polyphenylene ether (PPE), ultra high molecular weight polyethylene (UHPE), etc., as well as polysulfone (PSU), polyethersulfone (PEB), polyphenylene sulfide ( PPS), polyamideimide (PAI), polyetherimide (PEI), polyetheretherketone (PEEK), polyimide (PI), liquid crystal polymer (LCP), fluororesin (FR), or the like can be used. By appropriately using these resins in combination, the balance between adhesiveness and mechanical strength can be controlled. As a result, it is possible to obtain a cleaning member having excellent foreign matter removal performance and conveyance performance. Further, by using such a resin, a cleaning member having excellent heat resistance can be obtained, and the cleaning process of the apparatus can be performed without lowering the stage temperature. The amount of these resins added is appropriately set according to the purpose. Preferably, it is 0.01-10 weight part with respect to 100 weight part of polyester, More preferably, it is 0.1-8 weight part.

  The cleaning layer has a Vickers hardness of 20 or more, preferably 20 to 45, more preferably 25 to 40, and particularly preferably 25 to 35. When the Vickers hardness has such a range, it is possible to obtain a cleaning member having excellent foreign matter removal performance and conveyance performance. Vickers hardness is measured according to JIS Z2244.

  The tensile elastic modulus of the cleaning layer is preferably 2000 MPa or less, more preferably 1 to 2000 MPa, particularly preferably 10 to 1500 MPa, and most preferably 100 to 1000 MPa. If the tensile elastic modulus is in such a range, the foreign matter in the cleaning target portion can be surely removed without adhering to the non-cleaning portion in the apparatus. The tensile elastic modulus is measured according to JIS K7127.

  The pencil hardness of the cleaning layer is preferably 3B to 5H, particularly preferably 2B to 5H, and more preferably B to 5H. By having these ranges, the object of the present invention can be effectively expressed. The pencil hardness is measured according to JIS K 5400.

  The thickness of the cleaning layer is preferably 0.1 to 2 mm, more preferably 0.2 to 1 mm, and particularly preferably 0.5 to 1 mm. With such a thickness, a self-supporting property can be obtained such that the cleaning layer alone can be transported and foreign matter can be removed. Further, the thickness of the cleaning layer when the cleaning sheet has a support can be appropriately designed according to the purpose. Preferably it is 0.1-100 micrometers, More preferably, it is 0.5-100 micrometers, Especially preferably, it is 5-100 micrometers, Most preferably, it is 5-50 micrometers.

  The cleaning layer preferably has a melting point of 120 ° C. or higher, more preferably 140 ° C. or higher, and most preferably 160 ° C. or higher. By having such a melting point, it is possible to obtain a cleaning member having heat resistance capable of being washed at a high temperature and having excellent foreign matter removal performance and conveyance performance. In the present invention, the upper limit of the melting point is not particularly limited, but considering the moldability and the like, the upper limit is preferably 300 ° C.

  The cleaning layer may further contain any appropriate additive depending on the purpose. Specific examples of the additive include a surfactant, a plasticizer, an antioxidant, and a conductivity imparting agent. By adjusting the type and / or amount of the additive used, a cleaning member having desired characteristics according to the purpose can be obtained. For example, the addition amount of the additive is preferably 0.01 to 100 parts by weight, more preferably 0.1 to 10 parts by weight with respect to 100 parts by weight of the polyester.

  The cleaning layer can be formed by any appropriate method. For example, a composition containing polyester and an additive depending on the purpose (hereinafter sometimes referred to as “polyester composition”) is formed into a predetermined shape (typically a shape corresponding to a conveying member of a substrate processing apparatus). By forming, a cleaning layer can be produced. Specific examples of the forming method include, for example, an injection molding method, an extrusion molding method, a blow molding method, and a forming method in which a polyester composition is applied and dried.

  The cleaning sheet may have a protective film. The protective film is typically used for the purpose of protecting the cleaning layer when the cleaning layer is formed or when the cleaning layer and the conveying member are bonded (press-bonded). Further, since the protective film is used to assist the formation of the cleaning member and the like, it is peeled off at an appropriate stage. Any appropriate film is adopted as the protective film depending on the purpose. For example, polyolefin such as polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene vinyl acetate copolymer, ionomer resin, ethylene ) Acrylic acid copolymer, ethylene / (meth) acrylic acid ester copolymer, polystyrene, polycarbonate, etc., plastic film, polyimide, and fluororesin film. The protective film may be subjected to a release treatment with a release agent or the like according to the purpose. Examples of the release agent include silicone, long chain alkyl, fluorine, fatty acid amide, and silica. The thickness of this protective film is preferably 1 to 100 μm. The formation method of a protective film is suitably selected according to the objective, For example, it can form by injection molding method, extrusion molding method, and blow molding method.

  As necessary, a support 10 is provided as shown in FIG. The thickness of the support 10 can be appropriately selected, and is preferably 500 μm or less, more preferably 3 to 300 μm, and most preferably 5 to 250 μm. The surface of the support is chemically treated with conventional surface treatments such as chromic acid treatment, ozone exposure, flame exposure, high-voltage impact exposure, ionizing radiation treatment, etc., in order to improve adhesion and retention with adjacent layers. Alternatively, a physical treatment or a coating treatment with a primer (for example, the above-mentioned adhesive substance) may be performed. The support may be a single layer or a multilayer body.

  Any appropriate support is adopted as the support 10. Examples thereof include plastic films such as polyethylene, polyethylene terephthalate, acetyl cellulose, polycarbonate, polypropylene, and polyamide. Various physical properties such as molecular weight can be appropriately selected according to the purpose. Moreover, the formation method of a support body can be suitably selected according to the objective.

  The separator 30 may be provided on the surface of the cleaning layer 20 and / or the surface of the pressure-sensitive adhesive layer 40 as necessary until the cleaning member is put to practical use. By providing the separator, it is possible to prevent foreign matters from adhering to the cleaning layer, thereby preventing deterioration in the cleaning performance of the cleaning member. Any appropriate separator is adopted as the separator. An example of the separator is a resin film. Specific examples include polyolefins such as polyethylene, polypropylene, polybutene, polybutadiene, polymethylpentene, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene vinyl acetate copolymer, ionomer resin, ethylene / (meth) acrylic acid copolymer, Examples thereof include a plastic film made of ethylene / (meth) acrylic acid ester copolymer, polyester, polystyrene, polycarbonate, and a heat resistant resin film such as polyimide. The separator may be treated with a release agent or the like according to the purpose. Preferably, a non-silicone release agent is used, and examples thereof include long-chain alkyl-based, fluorine-based, and fatty acid amide-based release agents. The formation method of a separator is suitably selected according to the objective. The thickness of the separator is preferably 5 to 100 μm.

  The pressure-sensitive adhesive layer 40 may be disposed on the surface of the support 10 opposite to the cleaning layer 20. (See FIG. 1 (b)). It is bonded to a cleaning sheet conveying member (described later) through the adhesive layer. The adhesive layer has, for example, a 180-degree peeling adhesive force with respect to the mirror surface of the silicon wafer, preferably 0.01 to 10 N / 10 mm width, more preferably 0.05 to 5 N / 10 mm width. If the adhesive strength is too high, the cleaning layer or the like may be torn during peeling and removal. The thickness of the pressure-sensitive adhesive layer is appropriately set according to the purpose. Preferably it is 1-100 micrometers, More preferably, it is 5-30 micrometers.

  The material configuration of the pressure-sensitive adhesive layer is not particularly limited, and for example, a material composed of a normal pressure-sensitive adhesive such as acrylic or rubber-based is used. An acrylic pressure-sensitive adhesive is preferable. The main component of the acrylic pressure-sensitive adhesive is appropriately selected according to the purpose. For example, it can be obtained by subjecting a (meth) acrylic acid alkyl ester monomer to a mixture obtained by adding another copolymerizable monomer as necessary (mixing ratio is appropriately designed according to the purpose). Furthermore, the pressure-sensitive adhesive layer may contain an additive depending on the purpose. The weight average molecular weight of the main component of the pressure-sensitive adhesive layer is appropriately selected according to the purpose, and is preferably 100,000 to 1.3 million. By having these ranges, it can have desired adhesiveness. Moreover, the content rate of the main component of an adhesive layer is suitably selected according to the objective. Preferably it is 90 weight% or more of the whole adhesive layer.

  In the cleaning sheet of the present invention, the above-mentioned cleaning layer may be used alone as a cleaning sheet, and is used by being disposed on any appropriate base material (for example, a heat-resistant film such as a polyethylene terephthalate film or a polyimide film). Alternatively, it may be used as a cleaning layer provided on the conveying member (that is, as a cleaning layer of the conveying member with a cleaning function of the present invention). Hereinafter, a conveying member with a cleaning function according to a preferred embodiment of the present invention will be described.

  FIG. 2 is a schematic cross-sectional view of a conveying member with a cleaning function in a preferred embodiment of the present invention. According to FIG. 2, the conveying member with a cleaning function 200 has the cleaning layer 20 on at least one surface of the conveying member 50. The thickness of the cleaning layer 20 can be appropriately designed according to the purpose. Preferably it is 0.1-100 micrometers, More preferably, it is 0.5-100 micrometers, Especially preferably, it is 5-100 micrometers, Most preferably, it is 5-50 micrometers. You may arrange | position the said support body and / or the said adhesive layer between the conveyance member 50 and the cleaning layer 20 according to the objective. Furthermore, a separator may be disposed on the surface of the cleaning layer 20 opposite to the conveying member 50 as necessary. By transporting the transport member with a cleaning function in the apparatus and contacting / moving it to the site to be cleaned, it can be easily and reliably cleaned and removed without causing a transport trouble due to foreign matter adhering to the apparatus.

  As the transport member 50, any appropriate substrate is used according to the type of substrate processing apparatus to be collected. Specific examples include semiconductor wafers (for example, silicon wafers, quartz wafers), substrates for flat panel displays such as LCDs and PDPs, substrates such as compact disks and MR heads.

  The conveying member with a cleaning function of the present invention is manufactured by any appropriate method depending on the purpose. For example, a method of thermocompression bonding of the cleaning sheet and the transport member, a method of bonding through a pressure-sensitive adhesive layer, and a method of directly forming the cleaning sheet on the surface of the transport member can be mentioned. More specifically, a method of transferring and laminating a cleaning sheet to any appropriate conveying member such as a silicon wafer, and a method of directly forming a cleaning sheet by applying varnish to the conveying member. Preferably, the cleaning member is directly formed by applying varnish to the surface of the conveying member. This is because the cleaning sheet can be directly formed on the conveying member, so that it is possible to obtain a conveying member with a cleaning function that is lightweight and has excellent foreign matter removal property and conveying property. Hereinafter, although an example of the preparation method of the conveyance member with a cleaning function is described, it is not limited to this method.

  In one embodiment, a polyester composition (for example, heat-resistant polyester varnish) is applied to one side of a conveying member, heated and dried to form a cleaning sheet, and the conveying member with a cleaning function of the present invention is obtained. Can do. The coating amount, heating temperature, heating time, etc. of the polyester composition are appropriately selected according to the purpose. For example, the heating temperature is 100 ° C to 180 ° C. For example, when the heating temperature is 160 ° C., the heating time is preferably 30 minutes or more. The upper limit of the heating time is not particularly limited, but is preferably 60 minutes or less. The form of the conveying member with a cleaning function of the present invention is not particularly limited. In one preferred embodiment, a conveyance member with a cleaning function as shown in FIG. 2 is used. In addition, a separator etc. may be arrange | positioned as needed for the conveyance member with a cleaning function.

  In the cleaning method according to a preferred embodiment of the present invention, the cleaning sheet or the transporting member with the cleaning function is transported into a desired substrate processing apparatus and brought into contact with the cleaned site, thereby being adhered to the cleaned site. Foreign matter can be easily and reliably removed by cleaning. By using a cleaning member excellent in heat resistance as in the present invention, for example, an ozone asher, a resist coater, an oxidation diffusion furnace, an atmospheric pressure CVD apparatus, a low pressure CVD apparatus, a plasma CVD apparatus, and the like used for substrate processing Can be used in the device. Furthermore, by using a cleaning member whose vacuum degree quickly reaches the apparatus specified value as in the present invention, it can be used even when the substrate processing apparatus to be cleaned is a vacuum system apparatus. Therefore, in the cleaning member of the present invention, the vacuum level quickly reaches the specified value of the apparatus without lowering the temperature of the wafer stage to room temperature, and also causes defective conveyance and contamination in the processing apparatus during the conveyance. There is an advantage that it can be used without any problems.

  The substrate processing apparatus cleaned by the cleaning method is not particularly limited. Specific examples of the substrate processing apparatus include various apparatuses such as an exposure irradiation apparatus for circuit formation, a resist coating apparatus, a sputtering apparatus, an ion implantation apparatus, a dry etching apparatus, and a wafer prober in addition to the apparatuses already described in this specification. Manufacturing equipment and inspection equipment.

  EXAMPLES Hereinafter, although an Example demonstrates this invention further more concretely, this invention is not limited by these Examples. In the examples, “parts” are based on weight.

Example 1
Heat-resistant polyester varnish (manufactured by Ryoden Kasei Co., Ltd., trade name: V599-00) was applied on one side of a silicon wafer so that the thickness of the dried polyester layer was 10 μm, and heated at 160 ° C. for 30 minutes. An 8-inch wafer-shaped transfer member A with a cleaning function was produced.

  As a result of measuring the Vickers hardness of the obtained cleaning layer using a thin film physical property evaluation apparatus (manufactured by NEC, MHA-400), the Vickers hardness was 30. Moreover, as a result of measuring the tensile elastic modulus of the cleaning layer in accordance with JIS K7172, the tensile elastic modulus was 580 MPa.

  Using a laser surface inspection apparatus, foreign matters having a size of 0.2 μm or more on the mirror surface of two new 8-inch silicon wafers were measured and found to be 5 and 4 respectively. After the mirror surfaces of these wafers were transferred downward to a dry etching apparatus (manufactured by Tokyo Electron Co., Ltd.) having a separate electrostatic adsorption mechanism, the mirror surfaces were measured with a laser surface inspection apparatus. As a result, the number of foreign matters of 0.2 μm or more on the mirror surface was 19834 and 20059 in the wafer size area.

  Next, the carrying member A with a cleaning function obtained as described above was carried by a dry etching apparatus having a wafer stage (wafer stage temperature of 100 ° C.) on which 19844 foreign substances had adhered. As a result, the transport member A with a cleaning function could be transported without hindrance. This operation was repeated 5 times, and then the mirror surface of a new 8-inch silicon wafer was transported downward, and the mirror surface was measured with a laser surface inspection apparatus. As a result, it was found that 80% of foreign matters having a size of 0.2 μm or more on the mirror surface were removed from the initial stage, and that good cleaning was performed. Further, even if an actual product wafer was subsequently introduced into the apparatus, no problem occurred and normal processing was possible.

(Comparative Example 1)
Except that the drying temperature and drying time of the heat-resistant polyester varnish were set at 160 ° C. for 20 minutes, an 8-inch wafer-shaped transport member B with a cleaning function was produced in the same manner as in Example 1. The resulting cleaning layer had a Vickers hardness of 15. As a result of measuring the tensile modulus of the cleaning layer, the tensile modulus was 540 MPa.

  Next, when the transport member B with the cleaning function obtained above was transported by a dry etching apparatus having a wafer stage (wafer stage temperature 100 ° C.) on which 20059 foreign substances had adhered, the cleaning layer was softened by the stage temperature. Since it was fixed on the stage, it could not be transported. Therefore, the cleaning operation was stopped immediately.

  As described above, in the present invention, a cleaning sheet having excellent transportability and removal of foreign matters can be obtained by using polyester as a cleaning member when transported into a substrate processing apparatus and cleaning and removing foreign matters in the apparatus. It can be seen that a method for cleaning a transport member with a cleaning function and a substrate processing apparatus is provided.

  The cleaning member of the present invention is suitably used for cleaning substrate processing apparatuses such as various manufacturing apparatuses and inspection apparatuses.

FIG. 1A is a schematic sectional view of a cleaning sheet according to a preferred embodiment of the present invention, and FIG. 1B is a schematic sectional view of a cleaning sheet according to another preferred embodiment of the present invention. FIG. 2 is a schematic sectional view of a conveying member with a cleaning function according to a preferred embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Support body 20 Cleaning layer 30 Separator 40 Adhesive layer 50 Conveying member 100 Cleaning sheet 200 Conveying member with a cleaning function

Claims (5)

  A cleaning sheet having a cleaning layer containing polyester, wherein the cleaning layer has a Vickers hardness of 20 or more.   The cleaning sheet according to claim 1, wherein a tensile elastic modulus of the cleaning layer is 2000 MPa or less.   A cleaning function comprising: a conveying member; and the cleaning layer according to claim 1 or 2 provided on at least one surface of the conveying member, wherein the cleaning layer is provided on the conveying member via an adhesive layer. Attached conveying member.   A conveying member with a cleaning function, comprising: a conveying member; and the cleaning layer according to claim 1 or 2 provided on at least one surface of the conveying member, wherein the cleaning layer is directly provided on the conveying member. A cleaning method for a substrate processing apparatus, comprising transporting the cleaning sheet according to claim 1 or 2 or the transport member with a cleaning function according to claim 3 or 4 into the substrate processing apparatus.

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