KR20200094669A - Cleaning sheet and carrying member with a cleaning function - Google Patents

Abstract

The present invention provides a cleaning sheet excellent in foreign matter removal performance and heat resistance which can be suitably used for a carrying member carried in a substrate processing apparatus. Further, the present invention provides the carrying member with a cleaning function, which has such a cleaning sheet and a carrying member, and is excellent in the foreign matter removal performance and heat resistance. As the cleaning sheet having a cleaning layer, in the cleaning sheet of the present invention, the cleaning layer has an elastic modulus at 25°C of equal to or more than 0.5 GPa, and the cleaning layer has an elastic modulus at 200°C of equal to more than 0.1 GPa.

Description

CLEANING SHEET AND CARRYING MEMBER WITH A CLEANING FUNCTION

The present invention relates to a cleaning sheet and a conveying member with a cleaning function.

In various substrate processing apparatuses such as semiconductors, flat panel displays, printed circuit boards and other manufacturing apparatuses and inspection apparatuses that are reluctant to carry foreign matters, they are conveyed while physically contacting the transfer apparatus (typically, a chuck table) and the substrate. At that time, if foreign matter adhered to the conveying device, the subsequent substrates were contaminated one after another, so it was necessary to regularly stop the device and perform cleaning treatment. As a result, there has been a problem that the operation rate of the processing device is lowered, and there is a problem that a great effort is required for the cleaning process of the device.

In order to overcome such a problem, a method (see Patent Literature 1) for removing foreign matter adhering to the conveying apparatus by conveying the plate-like member into the substrate processing apparatus has been proposed. According to this method, there is no need to stop the substrate processing apparatus and perform the cleaning treatment, so that the problem that the operation rate of the processing apparatus decreases is solved. However, the foreign matter adhering to the conveying device cannot be sufficiently removed by this method.

On the other hand, a method (see Patent Document 2) for removing foreign matter adhering to the conveying apparatus has been proposed by conveying the substrate on which the adhesive substance is adhered as a cleaning member in the substrate processing apparatus. This method is superior to the method described in Patent Literature 1 for removing foreign matter. However, in the method described in Patent Document 2, a problem may arise in which the contact portion between the adhesive material and the conveying device is too strongly adhered and does not fall off. As a result, a problem that the substrate on which the adhesive substance is adhered can not be reliably conveyed, or a problem that the conveying device is damaged may occur.

As a means for solving various problems such as the above, the present applicant reports a cleaning sheet that can be suitably used for a conveying member conveyed in a substrate processing apparatus employing an acrylic polymer, polyimide, or polyester as a cleaning layer. There are (Patent Documents 3 and 4).

On the other hand, in recent years, with the diversification of semiconductor devices, there is a case in which it is required to set a process area that must be carried out in a high temperature condition in a substrate processing apparatus. However, the conventional cleaning sheet as described above has a problem that the heat resistance is not sufficient and, for example, it cannot withstand under high temperature conditions of 200°C level.

Japanese Patent Publication No. Hei 11-87458 Japanese Patent Publication No. Hei 10-154686 Japanese Patent Publication 2007-307521 Japanese Patent Publication 2010-259970

An object of the present invention is to provide a cleaning sheet excellent in foreign matter removal performance and heat resistance, which can be suitably used for a conveying member conveyed in a substrate processing apparatus. Moreover, it is to provide the conveyance member with a cleaning function excellent in the foreign material removal performance and heat resistance which has such a cleaning sheet and a conveyance member.

The cleaning sheet of the present invention is a cleaning sheet having a cleaning layer, and the elastic modulus at 25°C of the cleaning layer is 0.5 GPa or more, and the elastic modulus at 200°C of the cleaning layer is 0.1 GPa or more.

In one embodiment, the thickness of the cleaning layer is 1 μm to 500 μm.

In one embodiment, the cleaning sheet of the present invention includes an adhesive layer.

In one embodiment, the cleaning sheet of the present invention includes a support.

The conveying member with a cleaning function of the present invention has the cleaning sheet and the conveying member.

ADVANTAGE OF THE INVENTION According to this invention, the cleaning sheet excellent in the foreign material removal performance and heat resistance which can be used suitably for the conveying member conveyed in a board|substrate processing apparatus can be provided. Further, it is possible to provide a conveying member having a cleaning function and a conveying member having such a cleaning function and a cleaning function excellent in foreign matter removal performance and heat resistance.

1 is a schematic cross-sectional view showing one embodiment of the cleaning sheet of the present invention.
2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet of the present invention.
3 is a schematic cross-sectional view showing still another embodiment of the cleaning sheet of the present invention.
4 is a schematic cross-sectional view showing one embodiment of a conveying member with a cleaning function according to the present invention.

≪≪1. Cleaning sheet≫≫

The cleaning sheet of the present invention includes a cleaning layer. The cleaning sheet of the present invention may be composed of only a cleaning layer or may have other layers.

The cleaning sheet of the present invention is excellent in heat resistance and can be sufficiently used even in a high temperature environment. As such a high-temperature environment, it is preferably 150°C or higher, more preferably 200°C or higher, more preferably 250°C or higher, further preferably 300°C or higher, and particularly preferably 350°C or higher.

The cleaning layer of the cleaning sheet of the present invention has an elastic modulus at 25°C of 0.5 GPa or more, preferably 0.7 GPa or more, more preferably 1.0 GPa or more, still more preferably 1.3 GPa or more, Especially preferably, it is 1.5 GPa or more. When the elastic modulus of the cleaning layer at 25°C is within the above range, a cleaning sheet excellent in foreign matter removal performance can be provided.

The cleaning layer of the cleaning sheet of the present invention has an elastic modulus at 200°C of 0.1 GPa or more, preferably 0.3 GPa or more, more preferably 0.5 GPa or more, and even more preferably 0.8 GPa or more, Especially preferably, it is 1.0 GPa or more. When the elastic modulus of the cleaning layer at 200°C is within the above range, it is possible to provide a cleaning sheet excellent in foreign matter removal performance even under a high temperature environment.

1 is a schematic cross-sectional view showing one embodiment of the cleaning sheet of the present invention. In FIG. 1, the cleaning sheet 100 has a cleaning layer 10 and a protective film 20. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10 or the like, and may be omitted depending on the purpose. That is, the cleaning sheet of the present invention may be composed of only the cleaning layer 10.

2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet of the present invention. In FIG. 2, the cleaning sheet 100 has a protective film 20, a cleaning layer 10, and an adhesive layer 30. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10 or the like, and may be omitted depending on the purpose.

3 is a schematic cross-sectional view showing still another embodiment of the cleaning sheet of the present invention. In FIG. 3, the cleaning sheet 100 includes a protective film 20, a cleaning layer 10, a support 40, and an adhesive layer 30. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10 or the like, and may be omitted depending on the purpose.

As for the thickness of the cleaning sheet of this invention, arbitrary suitable thickness can be employ|adopted depending on the structure.

<<1-1. Cleaning layer≫

The cleaning layer can be formed from any suitable material within a range that does not impair the effects of the present invention, provided that the modulus of elasticity at 25°C and the modulus at 200°C are within the above range.

The cleaning layer preferably contains polybenzoxazole.

Polybenzoxazole is a resin having heat resistance and insulation properties, and is used for semiconductor devices as bump protective films, interlayer insulating films, and the like. As a result of various experiments and reviews of the polybenzoxazole having excellent heat resistance as described above, the layer containing the polybenzoxazole exhibits an unexpected effect of not only having excellent heat resistance but also excellent in foreign matter removal performance. Accordingly, it was found that the layer containing polybenzoxazole can be suitably used for a cleaning sheet conveyed in a substrate processing apparatus in which a process region that must be conveyed or the like under high temperature conditions is set. .

In the cleaning sheet of the present invention, when the cleaning layer provided therein contains polybenzoxazole, the foreign matter removal performance and heat resistance are more excellent. For this reason, in the cleaning sheet of the present invention, when the cleaning layer included therein contains polybenzoxazole, the foreign matter removal, etc., which are transported in a substrate processing apparatus in which a process area that must be transported under high temperature conditions is set, etc. It can be used suitably for the target conveyance member.

When the cleaning layer contains polybenzoxazole, the content ratio of polybenzoxazole in the cleaning layer is preferably 50% by weight to 100% by weight, more preferably 70% by weight to 100% by weight, further It is preferably 90% by weight to 100% by weight, particularly preferably 95% by weight to 100% by weight, and most preferably 98% by weight to 100% by weight. When the content ratio of the polybenzoxazole in the cleaning layer is within the above range, a cleaning sheet having better foreign matter removal performance and heat resistance can be provided.

Any suitable other components may be included in the cleaning layer to the extent that the effects of the present invention are not impaired. Examples of such other components include heat-resistant resins other than polybenzoxazole, surfactants, plasticizers, antioxidants, conductivity imparting agents, ultraviolet absorbers, and light stabilizers.

The thickness of the cleaning layer is preferably 1 μm to 500 μm, more preferably 3 μm to 100 μm, further preferably 5 μm to 50 μm. When the thickness of the cleaning layer is within the above range, it is possible to provide a cleaning sheet excellent in foreign matter removal performance and heat resistance and also excellent in conveyance performance into the substrate processing apparatus.

The cleaning layer has virtually no adhesion. That is, for example, a cleaning layer formed from an adhesive substance or a cleaning layer formed by fixing an adhesive tape is excluded from the cleaning layer in the present invention. If the cleaning sheet of the present invention is provided with a cleaning layer having a substantially adhesive force, there is a fear that the contact portion between the cleaning layer and, for example, the conveying device in the substrate processing apparatus is too strongly adhered and does not fall. As a result, there is a concern that a problem that the substrate cannot be reliably transported or a problem that the transport apparatus is damaged may occur.

As described above, the cleaning layer has substantially no adhesive force. Specifically, the 180° peel adhesive force A specified in JIS-Z-0237 to the mirror surface of the silicon wafer is preferably less than 0.20 N/10 mm, and more preferably 0.01 to 0.10 N/10 mm. If the 180° peel adhesive force A specified in JIS-Z-0237 on the mirror surface of the silicon wafer of the cleaning layer is within this range, the cleaning layer has substantially no adhesive force, and the cleaning layer and, for example, a substrate The tackiness of the contact portion of the conveying device in the processing device can be reduced, and as a result, the substrate can be reliably conveyed, and the conveying device can be difficult to break.

In the cleaning layer, the thermal weight reduction at 400°C is preferably 5% or less, more preferably 4% or less, still more preferably 3% or less, particularly preferably 2.5% or less, and most It is preferably 2% or less. When the reduction in heat weight at 400°C of the cleaning layer is within the above range, a cleaning sheet excellent in heat resistance can be provided.

The cleaning layer has a thermal weight reduction at 500°C of preferably 10% or less, more preferably 8% or less, still more preferably 6% or less, particularly preferably 4% or less, most It is preferably 3% or less. When the reduction in thermal weight at 500°C of the cleaning layer is within the above range, a cleaning sheet having more excellent heat resistance can be provided.

The thermal weight loss of the cleaning layer at 400°C and 500°C can be measured, for example, using a thermal analyzer (TG-DTA) "Thermo plus TG8120" (manufactured by Rigaku Co., Ltd.).

The cleaning layer has a thermal decomposition temperature of preferably 380°C or higher, more preferably 400°C or higher, even more preferably 430°C or higher, particularly preferably 470°C or higher, and most preferably 500°C or higher to be. When the thermal decomposition temperature of the cleaning layer is within the above range, a cleaning sheet having better heat resistance can be provided.

The thermal decomposition temperature of the cleaning layer can be measured, for example, using a thermal analyzer (TG-DTA) "Thermo plus TG8120" (manufactured by Rigaku Co., Ltd.).

The cleaning layer has an outgas generation amount at 200°C, preferably 300 ppm or less, more preferably 250 ppm or less, further preferably 200 ppm or less, particularly preferably 150 ppm or less, and most preferably 100 ppm Is below. When the amount of outgas generated at 200°C of the cleaning layer is within the above range, a cleaning sheet having better heat resistance can be provided. In addition, if the amount of outgas generated at 200°C of the cleaning layer is too large compared to the above range, there is a concern that contamination (eg, contamination in the substrate processing apparatus) to the surroundings by the generated outgas may occur.

In the cleaning layer, the amount of outgas generated at 300°C is preferably 1000 ppm or less, more preferably 500 ppm or less, further preferably 300 ppm or less, particularly preferably 100 ppm or less, and most preferably 50 ppm Is below. When the amount of outgas generated at 300°C of the cleaning layer is within the above range, a cleaning sheet having better heat resistance can be provided. In addition, if the amount of outgas generated at 300°C of the cleaning layer is too large compared to the above range, there is a concern that contamination (eg, contamination in the substrate processing apparatus) to the surroundings by the generated outgas may occur.

The amount of outgas generated in the cleaning layer is, for example, a predetermined amount of a sample is placed in a sample cup and heated at a temperature of 200° C. for 10 minutes with a pyrolyzer (eg, “PY2020iD” manufactured by Frontier Laboratories). Alternatively, the mixture was heated at 300°C for 10 minutes, and the volatile components were trapped in a column dipped in liquid nitrogen, and the heating was terminated. Thereafter, the column is taken out of liquid nitrogen, and GC/MS (for example, "GCMS-QP2020" manufactured by SHIMADZU) is measured by an electron ionization method (EI method).

The transmittance at 400 nm of the cleaning layer is preferably 50% or more, more preferably 55% or more, even more preferably 60% or more, particularly preferably 65% or more, and most preferably More than 70%. When the transmittance at 400 nm of the cleaning layer is within the above range, since the transparency is high, it is possible to provide a cleaning sheet excellent in foreign matter visibility.

The transmittance at 400 nm of the cleaning layer can be measured, for example, using a spectrophotometer "V-670" (Nippon Spectrometer).

The cleaning layer has a transmittance at 400 nm after being exposed to an environment of 200° C. for 3 hours, preferably 50% or more, more preferably 55% or more, even more preferably 60% or more, and particularly preferably It is 65% or more, and most preferably 70% or more. When the transmittance at 400 nm after exposure of the cleaning layer at 200° C. for 3 hours is within the above range, the transparency is high even after exposure under a high temperature environment, and thus a cleaning sheet excellent in foreign matter visibility even after exposure under a high temperature environment. Can provide.

The transmittance at 400 nm after exposing the cleaning layer to 200° C. for 3 hours is, for example, after exposing the cleaning layer to the environment at 200° C. for 3 hours, the spectrophotometer "V-670" (Nippon Spectrometer) Can be measured using.

As for the cleaning layer, 180 degree peel adhesive force B prescribed|regulated by JIS-Z-0237 with respect to the mirror surface of a dummy wafer is preferably 10N/10mm or more, More preferably, it is 15N/10mm or more, More preferably, it is 20N. /10 mm or more, particularly preferably 25 N/10 mm or more, and most preferably 30 N/10 mm or more. When the 180-degree peel adhesive force B specified in JIS-Z-0237 with respect to the mirror surface of the dummy wafer of the cleaning layer is within the above range, for example, the adhesion between the cleaning layer and the transfer member such as the dummy wafer increases, and cleaning during cleaning It is difficult for the layer to peel off from a conveying member such as a dummy wafer.

180 degree peel adhesive force B prescribed|regulated by JIS-Z-0237 with respect to the mirror surface of the dummy wafer of a cleaning layer, for example, forms a cleaning layer on the mirror surface of a silicon wafer as a dummy wafer, and conforms to JIS-Z-0237. It can measure accordingly.

In the cleaning layer, the remaining number of the cleaning layer with respect to the mirror surface of the dummy wafer by the crosscut method is preferably 15/25 or more, more preferably 18/25 or more, still more preferably 20/25 or more, It is particularly preferably 23/25 or more, and most preferably 25/25 or more. When the remaining number of the cleaning layer on the mirror surface of the dummy wafer by the crosscut method of the cleaning layer is within the above range, for example, the adhesion between the cleaning layer and the transfer member such as the dummy wafer becomes higher, and the cleaning layer becomes dummy wafer during cleaning. It becomes difficult to peel more from the conveying member such as.

The remaining number of the cleaning layer on the mirror surface of the dummy wafer by the cross-cut method of the cleaning layer is, for example, by using a cutter knife on the test surface, 6 parallel cuts with respect to the substrate, 2 mm apart. Made by, and by making 6 parallel cuts at 2mm intervals similarly to orthogonal to the cut, make 25 checks, and tape with adhesive force of 16N/20mm on the checks (for example, Nitto Denko) It can be measured by strongly compressing "BT-315ST" manufactured by Co., Ltd., and peeling off the end of the tape at once at an angle of 45° to evaluate the state of the checkerboard by comparing it with a standard degree.

<1-2. Support≫

The cleaning sheet of the present invention may be provided with a support. The support may be a single layer or a multilayer body.

Any suitable thickness can be adopted as the thickness of the support, as long as the effects of the present invention are not impaired. The thickness is preferably 500 μm or less, more preferably 1 μm to 400 μm, further preferably 1 μm to 300 μm, particularly preferably 1 μm to 200 μm, and most preferably 1 μm to 100 μm.

As the support, any suitable support can be employed as long as the effects of the present invention are not impaired. As such a support body, the film of plastic, engineering plastic, or super engineering plastic is mentioned, for example. Specific examples of plastics, engineering plastics, and super engineering plastics include polyimide, polyethylene, polyethylene terephthalate, acetyl cellulose, polycarbonate, polypropylene, polyamide, and the like.

Physical properties such as the molecular weight of the material of the support can be appropriately selected depending on the purpose.

The method of forming the support may be appropriately selected depending on the purpose.

The surface of the support is chemically or physically used, such as a conventional surface treatment, for example, chromic acid treatment, ozone exposure, flame exposure, high pressure electric shock exposure, ionizing radiation treatment, etc., in order to improve adhesion, retention, etc. with adjacent layers. Treatment, coating treatment with a primer, etc. may be performed.

<< 1-3. Adhesive layer≫

The cleaning sheet of the present invention may be provided with an adhesive layer. As a material for such a pressure-sensitive adhesive layer, any suitable material can be employed without detracting from the effects of the present invention. As the material of the pressure-sensitive adhesive layer, for example, an acrylic pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, or the like can be employed.

The pressure-sensitive adhesive layer is provided, for example, to adhere to the mirror surface of the dummy wafer. Thereby, the cleaning sheet of this invention is affixed to the dummy wafer as a conveyance member, and it can become a conveyance member with the cleaning function of this invention.

In the pressure-sensitive adhesive layer, the 180-degree peel adhesive force C specified in JIS-Z-0237 with respect to the mirror surface of the dummy wafer is preferably 10 N/10 mm or more, more preferably 15 N/10 mm or more, still more preferably 20 N /10 mm or more, particularly preferably 25 N/10 mm or more, and most preferably 30 N/10 mm or more. When the 180 degree peel adhesive force C specified in JIS-Z-0237 with respect to the mirror surface of the dummy wafer of the pressure-sensitive adhesive layer is within the above range, for example, the adhesive force between the pressure-sensitive adhesive layer and the dummy wafer is increased, and the cleaning sheet is dummy wafer during cleaning. It becomes difficult to peel from.

The thickness of the pressure-sensitive adhesive layer is preferably 1 μm to 200 μm, more preferably 2 μm to 100 μm, further preferably 3 μm to 80 μm, particularly preferably 4 μm to 60 μm, and most preferably 5 μm to 50 μm.

<1-4. Protective film≫

The cleaning sheet of this invention may have a protective film in order to protect a cleaning layer, a support body, an adhesive layer, etc. The protective film can be peeled off at an appropriate stage.

Any suitable film can be adopted as the protective film within a range that does not impair the effects of the present invention. Examples of the material for such a film include polyolefins such as polyethylene, polypropylene, polybutene, polybutadiene, and polymethylpentene, polyvinyl chloride, vinyl chloride copolymers, polyethylene terephthalate, and polybutylene terephthalate. , Polyurethane, ethylene vinyl acetate copolymer, ionomer resin, ethylene·(meth)acrylic acid copolymer, ethylene·(meth)acrylic acid ester copolymer, polystyrene, polycarbonate, polyimide, fluorine resin and the like. .

The protective film may be subjected to any suitable peeling treatment within a range that does not impair the effects of the present invention. The peeling treatment is typically made of a peeling agent. Examples of the release agent include silicone-based release agents, long-chain alkyl-based release agents, fluorine-based release agents, fatty acid amide-based release agents, and silica-based release agents.

The thickness of the protective film is preferably 1 μm to 100 μm.

The method for forming the protective film is appropriately selected depending on the purpose, and can be formed, for example, by an injection molding method, an extrusion molding method, or a blow molding method.

≪1-5. Manufacturing method of cleaning sheet≫

As a manufacturing method of a cleaning sheet, arbitrary suitable manufacturing methods can be employ|adopted in the range which does not impair the effect of this invention. As such a manufacturing method, for example, (1) a method of casting a varnish solution of a cleaning layer onto a support, uniformly forming a film with a spin coater, etc., and heating to form a cleaning layer directly on the support, ( 2) Lamination consisting of a separator and an adhesive film by a method of sticking an adhesive film (a cleaning layer on one side of a label support and a normal adhesive layer on the other side) as a constituent material of a label and a reinforcing part on a separator, etc. A method of forming a sieve, and then, simultaneously or separately punching only the adhesive film of this laminate in the respective shapes of the label and/or the reinforcing portion, peeling off the unnecessary adhesive film from the separator, and the like.

≪≪2. Transfer member with cleaning function≫≫

The conveying member with a cleaning function of the present invention includes the cleaning sheet and the conveying member of the present invention.

4 is a schematic cross-sectional view showing one embodiment of a conveying member with a cleaning function according to the present invention. In FIG. 4, the conveyance member 300 with a cleaning function has a cleaning sheet 100 and a conveyance member 200. When the cleaning sheet 100 has an adhesive layer, preferably, the outermost layer on the conveying member 200 side of the cleaning sheet 100 becomes an adhesive layer.

As a conveyance member, arbitrary suitable conveyance members can be employ|adopted in the range which does not impair the effect of this invention. As such a conveying member, a substrate for flat panel displays, such as a semiconductor wafer (for example, a silicon wafer), LCD, PDP, compact disk, MR head, etc. are mentioned. Among these conveying members, a semiconductor wafer (for example, a silicon wafer) is typically exemplified for the purpose of cleaning the wafer conveying device in the substrate processing apparatus.

Example

Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples. However, the present invention is not limited to them at all. On the other hand, in the following description, "parts" and "%" are on a weight basis unless otherwise specified.

<Measurement of 180° peel adhesion A specified in JIS-Z-0237 on the mirror surface of the silicon wafer of the cleaning layer>

A cleaning layer was formed on the mirror surface of the silicon wafer, and measured according to JIS-Z-0237.

<Measurement of elastic modulus at 25°C and 200°C of the cleaning layer>

The elastic modulus at 25 degreeC and 200 degreeC of the cleaning layer was measured using "RSA G2" (made by TA Instruments).

<180-degree peel adhesive force C prescribed by JIS-Z-0237 to the mirror surface of the dummy wafer of the adhesive layer>

An adhesive layer was formed on the mirror surface of the silicon wafer as a dummy wafer, and measured according to JIS-Z-0237.

<Evaluation of cleaning performance>

For example, it can evaluate by measuring the number of foreign substances of 0.200 micrometers or more on the mirror surface of a silicon wafer using a foreign material inspection device (SFS6200 by KLA Tencor, hereafter referred to as device A).

More specifically, the conveyance member with a cleaning function is conveyed to the liner film peeling apparatus (HR-300CW manufactured by Nitto Seiki) (hereinafter referred to as Device B) for manufacturing a cleaning sheet, before and after conveyance of the conveyance member with a cleaning function. It can be evaluated by measuring the number of foreign substances.

<Evaluation of Returnability>

For example, in the apparatus B, whether the conveyance member with a cleaning function is conveyed on a chuck table to perform vacuum adsorption, and after the vacuum is released, the conveyance member with a cleaning function can be peeled off the chuck table with a lift pin. Can be evaluated as

[Production Example 1]: Preparation of varnish of polybenzoxazole

In a separable flask equipped with a stirring device, 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol): 36.6 g, pyridine: 27.7 g, N-methyl-2-pyrrolidone: 500 g It was charged and stirred at room temperature until 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) was completely dissolved. Thereafter, 27.2 g of trimethylchlorosilane was added dropwise over 1 minute and stirred at room temperature for 60 minutes. Then, 4,4'-bis(chlorocarbonyl)diphenyl ether: 29.5 g was slowly added over 5 minutes, and stirred at room temperature for 5 hours.

The resulting synthetic solution was added dropwise to 2 L of ion-exchanged water, the obtained precipitate was dried at 100° C. for 24 hours, and 4 times the amount of N-methyl-2-pyrrolidone was added to the precipitate after drying and redissolved, thereby re-dissolving the polybenzoxazole. Got the varnish.

[Example 1]: Production and evaluation of transport member 1c with a cleaning function provided with a cleaning layer 1a containing polybenzoxazole

The varnish of polybenzoxazole obtained in Preparation Example 1 was coated on a mirror surface of an 8-inch silicon wafer by spin coating, and heated at 150°C for 30 minutes to remove N-methyl-2-pyrrolidone, followed by vacuum. Then, heating was performed at 300°C for 2 hours to obtain a transfer member 1c with a cleaning function having a thickness of 10 μm of the cleaning layer 1a containing polybenzoxazole.

Table 1 shows various evaluation results.

[Comparative Example 1]: Production and evaluation of a conveying member (C1c) with a cleaning function having a cleaning layer (C1a) containing polyimide

Polyetherdiamine (Heinzmann, ED-2003): 32.2 g, p-phenylenediamine: 9.4 g, was dissolved in N-methyl-2-pyrrolidone: 286.3 g. Next, 3,3,4,4-biphenyltetracarboxylic dianhydride: 30 g was added and stirred at 70° C. for 6 hours to obtain a varnish of polyimide.

The varnish of the polyimide was coated on a mirror surface of an 8-inch silicon wafer by spin coating, heated at 150°C for 30 minutes to remove N-methyl-2-pyrrolidone, and then under vacuum, at 300°C for 2 hours. By heating, a cleaning function-added conveying member (C1c) having a thickness of 10 μm of the cleaning layer (C1a) containing polyimide was obtained.

Table 1 shows various evaluation results.

[Comparative Example 2]: Production and evaluation of a cleaning sheet (C2b) comprising a cleaning layer (C2a) containing an acrylic resin

2-ethylhexyl acrylate: 75 parts, methyl acrylate: 20 parts, acrylic acid: acrylic polymer obtained from a monomer mixture consisting of 5 parts: 100 parts, polyethylene glycol dimethacrylate: 50 parts, urethane acrylate : 50 parts, benzyl dimethyl ketal: 3 parts, and diphenylmethane diisocyanate: 3 parts were uniformly mixed to obtain an ultraviolet curable pressure-sensitive adhesive solution. This adhesive solution was applied to a separator (polyolefin film) so that the thickness after drying was 40 μm, and irradiated with 365 nm of ultraviolet light at 1000 mJ/cm ² to cure.

By the above, the cleaning sheet (C2b) provided with the cleaning layer (C2a) containing an acrylic resin was obtained.

Table 1 shows various evaluation results.

[Comparative Example 3]: Manufacturing and evaluation of a cleaning sheet C2b and a cleaning member having a conveying member with a conveying member (C2c)

The surface opposite to the separator of the cleaning sheet C2b was affixed to the mirror surface of an 8-inch silicon wafer with a hand roller, and then the separator was peeled off to create a conveyance member C2c with a cleaning function.

Table 1 shows various evaluation results.

The cleaning sheet of this invention and the conveyance member with a cleaning function are used suitably for cleaning of substrate processing apparatuses, such as various manufacturing apparatuses and inspection apparatuses.

Cleaning sheet 100
Cleaning layer 10
Protective film 20
Adhesive layer 30
Support 40
Transfer member 300 with cleaning function
Transfer member 200

Claims (5)

As a cleaning sheet having a cleaning layer,
The elastic modulus at 25°C of the cleaning layer is 0.5 GPa or more,
The elastic modulus at 200°C of the cleaning layer is 0.1 GPa or more,
Cleaning sheet. According to claim 1,
A cleaning sheet having a thickness of the cleaning layer of 1 μm to 500 μm. The method of claim 1 or 2,
A cleaning sheet comprising an adhesive layer. The method according to any one of claims 1 to 3,
A cleaning sheet comprising a support. A conveyance member with a cleaning function having the cleaning sheet according to any one of claims 1 to 4 and a conveyance member.

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