JP2005303224A - Manufacturing method of conveying component with cleaning function - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cleaning component in which equipment smearing, caused by silicone sticking to a front surface of a cleaning layer is unlikely to be generated, when contamination sticking inside the equipment is removed by being transferred inside substrate processing equipment. <P>SOLUTION: After preparing a cleaning layer in at least one side of a transport component, relative intensity (ratio with respect to C<SB>2</SB>H<SB>3</SB><SP>+</SP>) of Si<SP>+</SP>ion measured by a flight-of-time secondary ion mass spectrometry in a cleaning layer front surface is made to be 0.1 or less by performing brush cleaning. A manufacturing method of the conveying component with the cleaning function is constituted such that a cleaning sheet having the cleaning layer in one side of a support and an adhesive layer in the other side is formed, and that the brush cleaning is performed, after laminating this in at least one side of the conveying component via the adhesive layer. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a method for manufacturing a conveying member with a cleaning function used for cleaning a substrate processing apparatus.

In various substrate processing apparatuses that dislike foreign matters, such as manufacturing apparatuses and inspection apparatuses such as semiconductors, flat panel displays, and printed circuit boards, the respective transport systems and the substrate are transported while being physically contacted. At that time, if foreign matter adheres to the substrate or the transport system, subsequent substrates are successively contaminated, so that it is necessary to periodically stop and clean the apparatus. For this reason, there existed a problem that the operation rate fell and a lot of labor was required.

In order to deal with this problem, a method has been proposed in which a substrate having an adhesive substance fixed in a substrate processing apparatus is transported to remove foreign substances adhering to the apparatus (see Patent Document 1). Since this type of cleaning method does not require the substrate processing apparatus to be stopped and cleaned, there is no problem such as a reduction in operating rate or a great effort, and a particle size of about 0.2 to 1.0 μm. It is a useful method as a method for removing foreign substances having slag.
JP 2000-312862 A

In such a cleaning member, a silicone compound may adhere to the surface of the cleaning layer made of an adhesive substance due to various factors. For example, in order to improve handleability and the like, it is often performed to bond a polyester film or the like that has been subjected to a release treatment with a silicone release treatment agent as a protective film on the surface of the cleaning layer. In this case, the above release treatment agent moves to and adheres to the cleaning layer.

When the cleaning member having the silicone adhered thereto is conveyed into the substrate processing apparatus, the silicone is transferred to a contact site in the apparatus to contaminate the apparatus. As a result, the product wafer is contaminated, resulting in deterioration of device characteristics. Many defects occur.

In light of such circumstances, the present invention provides a cleaning member that is less likely to cause device contamination due to silicone adhering to the surface of the cleaning layer when removing foreign substances that are transferred into the substrate processing apparatus and adhered to the apparatus. The purpose is to do.

As a result of diligent investigations for the above object, the present inventors have provided a cleaning layer on a conveying member made of a substrate such as a silicon wafer as a cleaning member, and in producing a conveying member with a cleaning function as described above. By applying a specific treatment to the cleaning layer to reduce the amount of silicone adhering to the surface of the cleaning layer, it is possible to prevent device contamination due to silicone, and to greatly suppress device characteristics deterioration due to product wafer contamination. And the present invention has been completed.

That is, according to the present invention, a cleaning layer is provided on at least one surface of a transport member, and then brush cleaning is performed, whereby the relative intensity of Si ⁺ ions (C ₂₎ measured by time-of-flight secondary ion mass spectrometry on the surface of the cleaning layer. The present invention relates to a method for manufacturing a conveying member with a cleaning function, characterized in that the ratio to H ₃ ⁺ is 0.1 or less. In particular, in the present invention, a cleaning sheet having a cleaning layer on one side of the support and a cleaning sheet having an adhesive layer on the other side are bonded to at least one side of the conveying member via the above-mentioned adhesive layer, and then washed with a brush. The present invention relates to a method for manufacturing a conveying member with a cleaning function having the above-described configuration.

In addition, the present invention can provide a transport member with a cleaning function manufactured by the above method and a cleaning method for a substrate processing apparatus, which transports the transport member with a cleaning function into the substrate processing apparatus. Is.

As described above, in the present invention, after the cleaning layer is provided on the conveying member, brush cleaning is performed to reduce the amount of silicone on the surface of the cleaning layer, thereby preventing contamination of the device with the silicone. In addition, it is possible to provide a cleaning member that can largely suppress deterioration of device characteristics due to contamination of a product wafer.

In the present invention, a cleaning layer is provided on at least one side (that is, both sides or one side) of the conveying member, and then this cleaning layer is brush cleaned. In this brush cleaning, for example, the wafer is rotated by a wafer double-side cleaning apparatus, and the cleaning process is performed by contacting the brush while supplying cleaning water. By adjusting the contact pressure, the degree of cleaning can be easily adjusted.

The present invention is characterized in that at least the silicone adhering to the surface of the cleaning layer is reduced by the above brush cleaning. Here, as the degree of silicone reduction, the relative intensity of Si ⁺ ions (ratio to C ₂ H ₃ ⁺ ) measured by time-of-flight secondary ion mass spectrometry is 0.1 or less, preferably 0.01 or less. To be.

When brush cleaning is performed in this manner, the contamination of the apparatus by silicone when transported into the substrate processing apparatus is reliably prevented, and the occurrence of defects due to the deterioration of device characteristics can be suppressed. On the other hand, when the relative strength exceeds 0.1, such an effect cannot be obtained.

The “time-of-flight secondary ion mass spectrometry” (commonly referred to as TOF-SIMS) is a component of the surface formed by a high-speed ion beam (primary ion) hitting a solid sample surface in a high vacuum to cause sputtering. This is a method in which the positively or negatively charged ions (secondary ions) that are generated are repelled in one direction by an electric field and detected at a certain distance.

In this method, during sputtering, secondary ions having various masses are generated according to the composition of the sample surface, and lighter ions fly faster, while heavier ions fly at a slower speed. By measuring the time (time of flight) from detection to detection, the mass of the generated secondary ions can be calculated.

In conventional mass spectrometry, organic compounds are completely separated during ionization, and information on the chemical structure obtained by a mass spectrum is poor. On the other hand, the irradiation amount of the primary ions may be small in the above-described method, and the organic compound is ionized while maintaining the chemical structure, and the structure of the organic compound can be known from the mass spectrum.

In the above system, only the secondary ions generated on the outermost surface of the solid sample surface jump out into the vacuum, so that information on the outermost surface of the sample (a depth of several tens of meters) can be obtained. Furthermore, the method for detecting ions in this way is more sensitive than the method for detecting electrons and light, and can detect trace components in the order of ppm present on the surface.

The inventors pay attention to this time-of-flight secondary ion mass spectrometry, and according to the cleaning member in which the relative intensity of Si-containing fragment ions on the surface of the cleaning layer measured by this analysis method is 0.1 or less, Knowing that device contamination with silicone can be prevented, this has already been proposed as a prior invention (Japanese Patent Application No. 2003-108584).

Here, the above-mentioned Si-containing fragment ions are CH ₃ Si ⁺ , C ₃ H ₉ Si ⁺ , C ₅ H ₁₅ Si ₂ O ⁺ , C ₅ derived from silicone compounds such as polydimethylsiloxane. H ₁₅ Si ₃ O ₃ ⁺ , C ₇ H ₂₁ Si ₃ O ₂ ⁺ , Si ⁺ , CH ₃ SiO ⁻ , CH ₃ SiO ₂ ⁻ , and the relative intensity of each of these Si-containing fragment ions ( The above effect can be achieved by setting the ratio of positive ions to C ₂ H ₃ ⁺ and negative ions to O ⁻ to 0.1 or less.

In the present invention, based on the above prior invention, further result of continued research, among the relative intensities of each fragment ion, usually, since the Si ⁺ relative intensity is maximized, the Si ⁺ relative If the strength (ratio to C ₂ H ₃ ⁺ ) is 0.1 or less by brush cleaning after the cleaning layer is provided on the transport member, the device is contaminated with silicone when transported into the substrate processing apparatus. Has been found to be prevented, and the occurrence of defects due to degradation of device characteristics can be suppressed, and the present invention has been completed.

In the present invention, the relative intensity is measured as follows.
That is, as time-of-flight secondary ion mass spectrometry (TOF-SIMS), ULVAC-PHI “TRIFT-II”) was used, and measurement conditions were as follows: sample size: 10 mm × 5 mm, primary ion: ⁶⁹ Ga ⁺ , The acceleration voltage is 15 kV, the measurement range is 100 μm, the charge correction electron gun is used for the cleaning layer, the ion intensity of Si ⁺ is measured, and the relative intensity is obtained as a ratio to C ₂ H ₃ ⁺ .

In the present invention, the cleaning layer provided for the above brush cleaning has a tensile strength (test method: conforming to JIS K7127) of 2,000 MPa or less, and a 180 ° peel-off adhesive force to a silicon wafer (mirror surface) ( Test method: according to JIS Z0237) is 0.2 N / 10 mm width or less, preferably 0.01-0.1 N / 10 mm width. By having such a tensile strength and substantially no adhesiveness, foreign matters can be removed without causing a trouble in conveyance to the substrate processing apparatus. The cleaning layer has a thickness of usually 0.1 to 200 μm, preferably 1 to 100 μm.

Such a cleaning layer is not particularly limited in its material. A typical example is one using a heat-resistant resin such as polyimide.

Further, those composed of a resin layer polymerized and cured by an active energy source such as ultraviolet rays or heat are also preferably used. This is because the molecular structure becomes a three-dimensional network due to the above-mentioned polymerization and curing, so that the adhesive force is substantially lost, and the cleaning member can be reliably transported in the substrate processing apparatus without being strongly adhered to the apparatus contact portion during transportation. It is.

As such a polymerized and cured resin layer, for example, a pressure-sensitive adhesive polymer, a compound having at least one unsaturated double bond in the molecule (hereinafter referred to as a polymerizable unsaturated compound) and a polymerization initiator, Examples thereof include those obtained by curing a curable resin composition containing a crosslinking agent, if necessary, with an active energy source, particularly ultraviolet rays.

As the pressure-sensitive adhesive polymer, an acrylic polymer having (meth) acrylic acid and / or (meth) acrylic acid ester as a main monomer is preferable. In the synthesis of such an acrylic polymer, a compound having two or more unsaturated double bonds in the molecule as a copolymerization monomer, or a compound having an unsaturated double bond in the molecule in the synthesized acrylic polymer An unsaturated double bond may be introduced into the molecule of the acrylic polymer, for example, by a chemical bond between the functional groups. With this introduction, the acrylic polymer itself can be involved in the polymerization curing reaction by the active energy source.

The polymerizable unsaturated compound is preferably a non-volatile and low molecular weight material having a weight average molecular weight of 10,000 or less, particularly 5,000 or less so that three-dimensional networking can be efficiently performed during curing. It is preferable to have a molecular weight of

This polymerizable unsaturated compound includes phenoxy polyethylene glycol (meth) acrylate, ε-caprolactone (meth) acrylate, polyethylene glycol di (meth) acrylate, polypropylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, There are dipentaerythritol hexa (meth) acrylate, urethane (meth) acrylate, epoxy (meth) acrylate, oligoester (meth) acrylate, and the like. Among these, one or more of them are used.

It does not specifically limit as a polymerization initiator, A well-known thing can be used widely.
When heat is used as the active energy source, a thermal polymerization initiator such as benzoyl peroxide or azobisisobutyronitrile is used. In the case of using light, benzoyl, benzoin ethyl ether, cybendil, isopropyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, cymethylthioxanthone, acetophenone diethyl ketal, benzyl dimethyl ketal, Photopolymerization initiators such as α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenylpropane, and 2,2-dimethoxy-2-phenylacetophenone are used.

In the present invention, the method for providing the cleaning layer on at least one surface of the conveying member is not particularly limited. For example, after directly applying a heat-resistant resin such as polyimide or a curable resin composition as described above onto a conveying member, the latter resin composition is polymerized and cured by supplying an active energy source thereto. A method is mentioned. More preferably, a cleaning sheet having a cleaning layer formed by the same method as described above on one side of the support and having an adhesive layer on the other side is prepared, and this is conveyed through the adhesive layer. A method of pasting on at least one side of the member can be employed.

In the above cleaning sheet, the material of the support is not particularly limited. For example, polyolefin such as polyethylene, polypropylene, polybutene, polymethylpentene, polyvinyl chloride, vinyl chloride copolymer, polyethylene terephthalate, polybutylene. One or more of terephthalate, polyurethane, ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester copolymer, polystyrene, polycarbonate, etc. Examples thereof include a plastic film made of a resin.

These plastic films may be a single layer film made of the above resin or a laminated film. Further, one or both surfaces may be subjected to a surface treatment such as corona treatment. The thickness of the support made of such a plastic film is not particularly limited, but is usually 10 to 100 μm.

The pressure-sensitive adhesive layer provided on the other surface side of the cleaning layer has a 180-degree peeling adhesive strength to the silicon wafer (mirror surface) of 0.01 to 10 N / 10 mm width, preferably 0.05 to 5 N / 10 mm width. There should be. If the adhesive force is too low, it will be applied to the adhesive force to the conveying member, and if the adhesive force is too high, the support film may tear when the cleaning sheet is peeled off from the conveying member. Although it does not specifically limit as thickness of this adhesive layer, Usually, 1-100 micrometers, Preferably it is 5-30 micrometers.

Such a pressure-sensitive adhesive layer is not particularly limited in terms of its material structure, and any of those made of a normal pressure-sensitive adhesive such as acrylic or rubber can be used. Among them, as the acrylic pressure-sensitive adhesive, those mainly composed of an acrylic polymer having a component having a weight average molecular weight of 100,000 or less and 10% by weight or less are preferably used. The above acrylic polymer can be obtained by polymerizing a monomer mixture in which (meth) acrylic acid alkyl ester is used as a main monomer and another monomer copolymerizable thereto is added thereto as necessary.

In the cleaning sheet produced in this way and the conveying member with a cleaning function manufactured by pasting the cleaning sheet on the conveying member, a protective film having peelability is provided on the surface of the cleaning layer for protection. It is pasted together.

Protective films with good releasability include polyolefins such as polyethylene, polypropylene, polybutene, polybutadiene, and polymethylpentene, polyethylene terephthalate, polybutylene terephthalate, polyurethane, and ethylene-vinyl acetate that have been peeled with a silicone-based release treatment agent. Examples thereof include plastic films such as a copolymer, an ionomer resin, an ethylene- (meth) acrylic acid copolymer, an ethylene- (meth) acrylic acid ester copolymer, polystyrene, polycarbonate, and polyimide.

In addition, the same plastic film as described above, which has been subjected to a release treatment with a release treatment agent other than silicone, such as a long-chain alkyl, fluorine, or fatty acid amide, can also be used. Furthermore, a plastic film made of polyolefin such as polypropylene, polybutene, polybutadiene, polymethylpentene, etc. can be used alone, that is, without being treated with a release treatment agent. Also good. The thickness of these plastic films is usually 10 to 100 μm.

In the cleaning sheet, it is desirable that a separator is bonded to the surface of the pressure-sensitive adhesive layer provided on the other surface of the support until the sheet is used. In this separator, the same film as the above-described protective film to be bonded to the surface of the cleaning layer, that is, various films peel-treated with a release treatment agent such as silicone-based, long-chain alkyl-based, fluorine-based, fatty acid amide, A plastic film having a thickness of usually 10 to 100 μm made of a polyolefin film alone is used.

In the present invention, the transport member provided with the cleaning layer is not particularly limited, and various substrates are used according to the type of the substrate processing apparatus to be subjected to foreign matter removal. Specific examples include semiconductor wafers, substrates for flat panel displays such as LCDs and PDPs, and other substrates such as compact disks and MR heads.

In the present invention, after providing a cleaning layer on at least one side of the conveying member in this way, a protective film having peelability is bonded on the cleaning layer. By cleaning, at least silicone adhering to the surface of the cleaning layer is reduced, and the relative intensity of Si ⁺ ions (ratio to C ₂ H ₃ ⁺ ) measured by time-of-flight secondary ion mass spectrometry is set to 0.1 or less. .

By transporting the transport member with the cleaning layer of the present invention thus manufactured into the substrate processing apparatus and bringing the cleaning layer into contact with the contacted part of the apparatus, the foreign matter adhering to the part can be easily and reliably obtained. Can be removed by cleaning. At that time, there is no fear that the silicone is transferred to the contacted part of the apparatus, and there is no fear of causing contamination of the apparatus.

In the present invention, the substrate processing apparatus to be cleaned is not particularly limited. For example, an exposure apparatus, a resist coating apparatus, a developing apparatus, an ashing apparatus, a dry etching apparatus, an ion implantation apparatus, a PVD apparatus, a CVD apparatus, and an appearance inspection. Examples thereof include an apparatus and a wafer prober. Moreover, in this invention, each said substrate processing apparatus cleaned by the said method can be provided.

Examples of the present invention will be described below in more detail. However, the present invention is not limited only to the following examples. In the following, “parts” means parts by weight.

Polyethylene glycol 200 dimethacrylate (manufactured by Shin-Nakamura Chemical Co., Ltd.) was added to 100 parts of an acrylic polymer (weight average molecular weight 700,000) obtained from a monomer mixture consisting of 75 parts of 2-ethylhexyl acrylate, 20 parts of methyl acrylate and 5 parts of acrylic acid. Product name “NK Ester 4G”) 200 parts, polyisocyanate compound (trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.) 3 parts, and benzyldimethyl ketal (product name manufactured by Ciba Specialty Chemicals Co., Ltd.) as a photopolymerization initiator 3 parts of “Irgacure 651”) were uniformly mixed to prepare an ultraviolet curable resin composition A.

Separately, in a three-necked flask type reactor having an internal volume of 500 ml, equipped with a thermometer, a stirrer, a nitrogen inlet tube and a reflux condenser, 73 parts of 2-ethylhexyl acrylate, n-acrylic acid n- Monomer mixture consisting of 10 parts of butyl, 15 parts of N, N-dimethylacrylamide and 5 parts of acrylic acid, 0.15 part of 2,2'-azobisisobutyronitrile as a polymerization initiator, 100 parts of ethyl acetate as a solvent Were mixed and introduced so that the whole became 200 g, and stirred while introducing nitrogen gas for about 1 hour, and the air inside was replaced with nitrogen. Thereafter, the internal temperature was set to 58 ° C., and the polymerization was carried out in this state for about 4 hours to obtain an adhesive polymer solution. To 100 parts of this polymer solution, 3 parts of a polyisocyanate compound (trade name “Coronate L” manufactured by Nippon Polyurethane Industry Co., Ltd.) was uniformly mixed to prepare an adhesive solution B.

The pressure-sensitive adhesive solution B was applied on the release-treated surface of the separator C made of a polypropylene film (thickness 30 μm, width 250 mm) from which one side was peeled, and dried after being dried to a thickness of 7 μm. After that, a long polyester film (thickness 25 μm, width 250 mm) was laminated on the pressure-sensitive adhesive layer as a support. Further, on the film, the ultraviolet curable resin composition A is applied so that the thickness after drying is 15 μm, and dried to provide a resin layer. The release-treated surface of the protective film D made of a polyester film that was release-treated with a release-treating agent was bonded to obtain a laminated sheet.

This laminated sheet was irradiated with ultraviolet light having a central wavelength of 365 nm and an integrated light quantity of 1,000 mJ / cm ² to obtain a cleaning sheet having a cleaning layer made of a polymerized and cured resin layer. The separator C on the pressure-sensitive adhesive layer side of this sheet was peeled off and attached to the mirror surface of an 8-inch silicon wafer with a hand roller to obtain a conveying member with a cleaning function.

Next, after the protective film D on the cleaning layer side is peeled off from the conveying member with the cleaning function, the cleaning condition is set to the number of rotations using a wafer double-side cleaning device (“JS-1000M” manufactured by Rix Corporation). : 1,000 rpm, rotation time: 30 seconds, pure water supply pressure: 0.5 MPa, brush contact pressure: 0.2 kg / cm ² , brush cleaning was performed.

For the transport member with the cleaning function manufactured in this way, the relative strength of Si ⁺ (ratio to C ₂ H ₃ ⁺ ) of the cleaning layer was determined using a time-of-flight secondary ion mass spectrometer (manufactured by ULVAC-PHI). As a result, the relative intensity of Si ⁺ was 8.5 × 10 ⁻³ .

When the foreign matter of 0.2 μm or more on the mirror surface of two new 8-inch silicon wafers was measured with a laser surface inspection apparatus, the number was 5 or 3 respectively. Next, after these two silicon wafers were transferred to a resist exposure apparatus having separate vacuum suction mechanisms with the mirror surface facing downward, the mirror surface was again measured by the laser surface inspection apparatus. As a result, in the area of the 8-inch silicon wafer, there were 1,780 and 1,615 foreign matters having a size of 0.2 μm or more, respectively.

When the transport member with the cleaning function manufactured as described above was transported to the resist exposure apparatus having the wafer stage on which the 1,780 foreign substances had adhered, it could be transported without any problem. This operation was repeated 5 times. After that, a new 8-inch silicon wafer was transported with the mirror surface facing downward, and a foreign matter of 0.2 μm or more was measured with a laser surface inspection device. As a result, 90% of the foreign matter was removed from the initial stage. It was.

After that, when the product wafer was processed, it was found that the product wafer was not contaminated with silicone and could be produced without any problems.

Comparative Example 1
In Example 1, brush cleaning of the conveying member with a cleaning function was omitted. When the relative strength of Si ⁺ (ratio to C ₂ H ₃ ⁺ ) of the cleaning layer of the conveying member with the cleaning function was measured in the same manner as in Example 1, it was 2.6.

Next, when the transport member with the cleaning function was transported to the resist exposure apparatus having the wafer stage to which the 1,615 foreign matters had adhered, it could be transported without any trouble. This operation was repeated 5 times. After that, a new 8-inch silicon wafer was transported with the mirror surface facing downward, and a foreign matter of 0.2 μm or more was measured with a laser surface inspection device. As a result, 70% of the foreign matter was removed from the initial stage. It was.

However, after that, when the product wafer was processed, since the apparatus was contaminated with silicone, the product wafer was contaminated, and defects due to deterioration of device characteristics occurred frequently. For this reason, in order to remove the silicone contamination of an apparatus, much effort was required, such as stopping the operation | movement of an apparatus and opening and cleaning an apparatus.

Claims (4)

After providing a cleaning layer on at least one side of the conveying member, brush cleaning is performed, and the relative intensity of Si ⁺ ions (ratio to C ₂ H ₃ ⁺ ) measured by time-of-flight secondary ion mass spectrometry on the surface of the cleaning layer is determined. The manufacturing method of the conveyance member with a cleaning function characterized by setting it as 0.1 or less.
The cleaning sheet having a cleaning layer on one side of the support and a pressure-sensitive adhesive layer on the other side is bonded to at least one side of the transport member via the pressure-sensitive adhesive layer, and then washed with a brush. Manufacturing method of conveyance member with cleaning function.
A conveying member with a cleaning function manufactured by the method according to claim 1.
A method for cleaning a substrate processing apparatus, comprising transporting the transport member with a cleaning function according to claim 3 into the substrate processing apparatus.