JP2004535071A - フラットメディアキャリアから汚染物質を除去する方法、フラットメディアキャリア洗浄装置、メディアキャリア洗浄装置、およびボックス洗浄システム - Google Patents

フラットメディアキャリアから汚染物質を除去する方法、フラットメディアキャリア洗浄装置、メディアキャリア洗浄装置、およびボックス洗浄システム Download PDF

Info

Publication number
JP2004535071A
JP2004535071A JP2003511982A JP2003511982A JP2004535071A JP 2004535071 A JP2004535071 A JP 2004535071A JP 2003511982 A JP2003511982 A JP 2003511982A JP 2003511982 A JP2003511982 A JP 2003511982A JP 2004535071 A JP2004535071 A JP 2004535071A
Authority
JP
Japan
Prior art keywords
surfactant
rotor
water
box
door
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003511982A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004535071A5 (https=
Inventor
ダニエル・ピー・ベクステン
ジェイムズ・ブライヤー
ジェリー・アール・ノービー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daniel P Bexten
James Bryer
Jerry R Norby
Original Assignee
Daniel P Bexten
James Bryer
Jerry R Norby
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/108,278 external-priority patent/US6691718B2/en
Application filed by Daniel P Bexten, James Bryer, Jerry R Norby filed Critical Daniel P Bexten
Publication of JP2004535071A publication Critical patent/JP2004535071A/ja
Publication of JP2004535071A5 publication Critical patent/JP2004535071A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays

Landscapes

  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
JP2003511982A 2001-07-12 2002-07-09 フラットメディアキャリアから汚染物質を除去する方法、フラットメディアキャリア洗浄装置、メディアキャリア洗浄装置、およびボックス洗浄システム Pending JP2004535071A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US90503001A 2001-07-12 2001-07-12
US10/108,278 US6691718B2 (en) 1999-07-28 2002-03-26 Wafer container cleaning system
PCT/US2002/021997 WO2003006183A2 (en) 2001-07-12 2002-07-09 Method and apparatus for cleaning semiconductor wafers and other flat media

Publications (2)

Publication Number Publication Date
JP2004535071A true JP2004535071A (ja) 2004-11-18
JP2004535071A5 JP2004535071A5 (https=) 2006-01-05

Family

ID=26805734

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003511982A Pending JP2004535071A (ja) 2001-07-12 2002-07-09 フラットメディアキャリアから汚染物質を除去する方法、フラットメディアキャリア洗浄装置、メディアキャリア洗浄装置、およびボックス洗浄システム

Country Status (4)

Country Link
EP (1) EP1404463A4 (https=)
JP (1) JP2004535071A (https=)
TW (1) TWI223345B (https=)
WO (1) WO2003006183A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180033917A (ko) * 2016-09-27 2018-04-04 주식회사 유닉 웨이퍼 용기 클리닝 장치 및 시스템
JP2021529092A (ja) * 2018-07-06 2021-10-28 オーイーエム グループ リミテッド ライアビリティ カンパニー スプレー測定機器のためのシステム及び方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108565235B (zh) * 2018-05-31 2024-03-01 亚智系统科技(苏州)有限公司 用于扇出型晶圆级芯片的表面处理、封装系统及操作方法
CN108940996A (zh) * 2018-07-27 2018-12-07 深圳市凯尔迪光电科技有限公司 高精密集成电路离心清洗设备
CN111081594B (zh) * 2019-09-25 2022-09-30 北京时代民芯科技有限公司 一种jlcc图像传感器电路封装前的清洗工装及方法
CN110808219B (zh) * 2019-11-01 2021-05-14 江苏亚电科技有限公司 一种晶圆存放盒清洗装置及清洗方法
CN112191588B (zh) * 2020-09-18 2021-12-21 程瑶 太阳能发电板生产过程配用清洁机及清洗方法
KR102587371B1 (ko) * 2020-12-21 2023-10-12 주식회사 뉴파워 프라즈마 리프팅 커버 도어를 포함하는 글라스 세정 챔버, 이를 포함하는 글라스 화학 강화 설비, 및 초박형 글라스의 화학 강화 방법
CN115338173B (zh) * 2022-08-31 2023-09-26 浙江中科智谷光电科技有限公司 一种液晶模组加工用清洗设备以及控制方法
CN116037592A (zh) * 2022-12-27 2023-05-02 无锡亚电智能装备有限公司 晶圆盒晶圆篮清洗设备
CN117206242B (zh) * 2023-10-03 2024-08-13 上海芯畀科技有限公司 半自动离心式晶圆传送盒清洗机
CN117644074A (zh) * 2024-01-30 2024-03-05 深圳市龙图光罩股份有限公司 掩模版清洗方法、装置、终端设备以及存储介质

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4437479A (en) * 1981-12-30 1984-03-20 Atcor Decontamination apparatus for semiconductor wafer handling equipment
US4736759A (en) * 1986-02-21 1988-04-12 Robert A. Coberly Apparatus for cleaning rinsing and drying substrates
US5238503A (en) * 1991-04-09 1993-08-24 International Business Machines Corporation Device for decontaminating a semiconductor wafer container
EP0552756A1 (en) * 1992-01-21 1993-07-28 Shinko Electric Co. Ltd. Article storage house in a clean room
US5301700A (en) * 1992-03-05 1994-04-12 Tokyo Electron Limited Washing system
US5224503A (en) * 1992-06-15 1993-07-06 Semitool, Inc. Centrifugal wafer carrier cleaning apparatus
US5520205A (en) * 1994-07-01 1996-05-28 Texas Instruments Incorporated Apparatus for wafer cleaning with rotation
US6096100A (en) * 1997-12-12 2000-08-01 Texas Instruments Incorporated Method for processing wafers and cleaning wafer-handling implements
DE19740352A1 (de) * 1997-09-13 1999-03-18 Zf Frledrichshafen Aktiengesel Verfahren zum Montieren eines Lenkventils mit einer Zentriereinheit
US6248177B1 (en) * 1998-01-09 2001-06-19 Fluoroware, Inc. Method of cleaning a wafer carrier
US6412502B1 (en) * 1999-07-28 2002-07-02 Semitool, Inc. Wafer container cleaning system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180033917A (ko) * 2016-09-27 2018-04-04 주식회사 유닉 웨이퍼 용기 클리닝 장치 및 시스템
KR101886414B1 (ko) * 2016-09-27 2018-08-09 주식회사 유닉 웨이퍼 용기 클리닝 장치 및 시스템
JP2021529092A (ja) * 2018-07-06 2021-10-28 オーイーエム グループ リミテッド ライアビリティ カンパニー スプレー測定機器のためのシステム及び方法
JP7450844B2 (ja) 2018-07-06 2024-03-18 シェルバック セミコンダクター テクノロジー リミテッド ライアビリティ カンパニー スプレー測定機器のためのシステム及び方法

Also Published As

Publication number Publication date
EP1404463A2 (en) 2004-04-07
WO2003006183A2 (en) 2003-01-23
EP1404463A4 (en) 2004-10-06
TWI223345B (en) 2004-11-01
WO2003006183A3 (en) 2003-02-27

Similar Documents

Publication Publication Date Title
TWI839024B (zh) 基板處理裝置
CN102891096B (zh) 基板处理装置以及基板处理方法
US6797076B1 (en) Spray nozzle system for a semiconductor wafer container cleaning aparatus
TWI283020B (en) Single wafer type substrate cleaning method and apparatus
US6589359B2 (en) Cleaning method and cleaning apparatus for substrate
US6904920B2 (en) Method and apparatus for cleaning containers
US6692165B2 (en) Substrate processing apparatus
TWI557792B (zh) 基板處理裝置、基板處理方法及記憶媒體
CN103165496B (zh) 基板处理装置和基板处理方法
KR101187104B1 (ko) 기판 세정 방법 및 기판 세정 장치
CN101409211B (zh) 基材处理设备以及清洁该基材处理设备的方法
CN100366332C (zh) 高压处理装置和高压处理方法
JP2004535071A (ja) フラットメディアキャリアから汚染物質を除去する方法、フラットメディアキャリア洗浄装置、メディアキャリア洗浄装置、およびボックス洗浄システム
WO2003038870A1 (en) Configurable single substrate wet-dry integrated cluster cleaner
CN109216229A (zh) 基板处理装置及基板处理方法
KR20110057679A (ko) 아이피에이 공급 장치
CN108475630A (zh) 基板处理装置及基板处理方法
WO2002017355A2 (en) Semiconductor wafer container cleaning apparatus
JP4559702B2 (ja) 流体送出リングおよびその製造方法ならびに提供方法
KR100839912B1 (ko) 기판 처리 장치 및 방법
JPH11145099A (ja) 基板処理装置
TWI231950B (en) Substrate processing apparatus and cleaning method
US20040025901A1 (en) Stationary wafer spin/spray processor
CN116364574A (zh) 喷嘴以及包括其的基板处理装置、基板处理设备
JP3934745B2 (ja) 基板授受ユニット及びこれを用いたウエット処理装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050708

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20050708

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070509

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070710

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20071010

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20071116

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20071112

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20071220

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20080109

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20071210

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20080128

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20080318