TWI223345B - Method and apparatus for cleaning semiconductor wafers and other flat media - Google Patents
Method and apparatus for cleaning semiconductor wafers and other flat media Download PDFInfo
- Publication number
- TWI223345B TWI223345B TW91115539A TW91115539A TWI223345B TW I223345 B TWI223345 B TW I223345B TW 91115539 A TW91115539 A TW 91115539A TW 91115539 A TW91115539 A TW 91115539A TW I223345 B TWI223345 B TW I223345B
- Authority
- TW
- Taiwan
- Prior art keywords
- surfactant
- rotor
- water
- spray
- box
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
Description
五、 發明説明( t塑領域 本發明係與用以清洗和乾燥用來承載並對晶圓、墓板、 举面顯丁詻及其他平坦介質進行製程之载具與容器的清潔 裝置有關。 背景 夕或八他半導體晶圓、基板、光罩、平面顯示器、資 枓碟片與類似物體之平坦介質需要超低污染水準,即使是 ‘ J的/亏染亦會造成缺陷。目此,在這些類型之平坦介質 所有或是幾乎所有的製程階段中,需要維持高水準的潔淨 、,隹二已知.圓泛指任何形式的平坦介質,但所敘述之 平坦介質以下可稱為‘‘晶圓,,。 某 似傳統以批次式對晶圓進行製程,例如,在製造用於電 t “、電視及其他的電器產品中之半導體晶片,石夕晶 β將經歷多個批次式的製程步驟,如氧化、微影、擴散、 化學^相沉積、金屬化與⑽i。在整個生產製程中,會發 生批/人式的夾持(handle),此類批次式的製程幾乎只使用 些載具或容器以承載需進行製程之晶圓。 晶 所 。印圓載具、盒子、箱(cassette)、晶舟或容器承載一群W =一在製&中的某些步驟中,必須清潔晶圓載具,由於通 :這些東西具有缝(_)、溝(groove)或開口(aperture)及會卡 ’:染物的内角,因此清潔它們非常困難,若在製造晶圓 需足超低污染水準中,會更增加其困難性。 貴 因此,清潔晶圓的載具仍為很困難、耗時且為相對昂貝 的方法,背黏膠的標籤 '指·纹、灰塵、金屬顆粒、光阻與 I__ _ 5 - 本紙張尺度適财g國*標準(CNS) Μ規格(加〉〈297公爱) 1223345 A7 _____B7 五、發明説明(\~~ --:- 有機化學物亦會污染晶圓載具。 已製造及使用多種清潔晶圓載具的機器,在這些機器 中,當把清潔溶液灑在載具上時,載具固定在一轉子上, 並在一個室中旋轉,旋轉移動降低了製程時間,並幫助乾 燥載具。在某些應用中,導入清潔劑或表面活性劑,並與 去離子水混合,在此方法中所使用之表面活性劑當作可幫 助移除鬆動附著的顆粒之潤濕劑,而清潔劑與污染物起化 學反應以去除污染物。通常表面活性劑只使用一次,並接 著當作廢水排放掉,若清潔劑為濃縮的,則可循環回收。 表面活性劑或清潔劑通常裝在容器或槽中,由於以小流 量提供表面活性劑或清潔劑之流動,以產生所需之濃度水 準,故很難控制進入載具之表面活性劑或清潔劑流動的 里°在過去’自大量儲存容器抽出表面活性劑,並括至將 其稀釋至所需濃度之暫存槽,接著利用文氏管(venturi)將稀 釋的表面活性溶液排出暫存槽,並至與水混合或抽吸 (aspirate)的水流之中,水與表面活性劑混合物接著導至準 備注入到水載具中之清潔歧管(manifold)。 因此,本發明之目的係提供一改善之清潔平坦介質的载 具與容器之機器。 裝載與卸載載具與盒子及它們之門的容易度、進入與退 出轉子,及在各種狀況下將轉子維持平衡仍然是工程上的 挑戰,因此,本發明之目的亦提供一改善的轉子。 本發明與清潔包含固定於室内且可轉動之轉子的平坦介 -6 -V. Description of the Invention The present invention relates to a cleaning device for cleaning and drying a carrier and a container used to carry and process wafers, tomb boards, lifts, and other flat media. Background Xi or Batah semiconductor wafers, substrates, photomasks, flat displays, flat discs and similar flat media require ultra-low pollution levels, and even 'J's / defectives can cause defects. For this reason, in these All or almost all types of flat media need to maintain a high level of cleanliness, which is known. The circle refers to any form of flat media, but the flat media described below can be referred to as `` wafers '' Some, like a traditional batch process for wafers, for example, in the manufacture of semiconductor wafers used in electrical appliances, televisions and other electrical products, Shi Xijing β will go through multiple batch processes Steps such as oxidation, lithography, diffusion, chemical phase deposition, metallization, and metallization. Throughout the production process, batch / human-type handles will occur. Such batch-type processes are almost only used Carrier or container to carry the wafers that need to be processed. Crystal Institute. The round carrier, box, cassette, wafer boat or container carries a group of W = one. In some steps in the manufacturing process, the wafer must be cleaned. Round carriers, because these things have slits (_), grooves (apertures) and meeting cards': internal corners of dyes, so it is very difficult to clean them. If the wafer needs to meet the ultra-low pollution level It will increase its difficulty even more. Therefore, cleaning the wafer carrier is still a difficult, time-consuming, and relatively amply method. The adhesive-backed label 'fingerprint, dust, metal particles, photoresist and I__ _ 5-This paper is suitable for the country * standard (CNS) M specification (plus> <297 public love) 1223345 A7 _____B7 V. Description of the invention (\ ~~-:-Organic chemicals will also contaminate the wafer carrier A variety of machines have been manufactured and used for cleaning wafer carriers. In these machines, when a cleaning solution is sprayed on the carrier, the carrier is fixed on a rotor and rotated in a chamber. Rotational movement reduces the process time. And help dry the vehicle. In some applications, Cleaners or surfactants are mixed in with deionized water. The surfactants used in this method act as wetting agents that help remove loose particles, and the detergents react chemically with contaminants to Removal of pollutants. Surfactants are usually used only once and then discharged as waste water. If the cleaning agent is concentrated, it can be recycled. Surfactants or cleaning agents are usually packed in containers or tanks. Provide the flow of surfactant or detergent to produce the required concentration level, so it is difficult to control the flow of surfactant or detergent into the vehicle. In the past, the surfactant was extracted from a large number of storage containers, and included To a temporary storage tank where it is diluted to a desired concentration, and then a venturi is used to drain the diluted surfactant solution out of the temporary storage tank, and into a water stream mixed with or aspirated with water, the water and The surfactant mixture is then directed to a cleaning manifold ready to be injected into a water carrier. It is therefore an object of the present invention to provide an improved machine and carrier for cleaning flat media. Ease of loading and unloading vehicles and boxes and their doors, entering and exiting the rotor, and maintaining the balance of the rotor under various conditions remain engineering challenges. Therefore, the object of the present invention also provides an improved rotor. The invention relates to cleaning a flat medium including a rotatable rotor fixed in a room -6-
12233451223345
質載具的裝置有關,室中的噴嘴配置成在轉子所承載之載 具上噴灑水與清潔劑或表面活性劑之清洗混合液,清洗混 二液係使用計量幫浦自表面活性劑塊材儲存桶直接抽出而 製備,水的流率利用與計量幫浦結合之流量計量測之,並 將適量的表面活性劑注入至水管中,以產生具有所需表面 活性劑濃度以移除污染物之混合物。 在本發明之第二態樣中,將表面活性劑或清潔劑溶液注 入至水管中,或是注入至線中(inline)混合控制閥,以確保 水與表面活性劑在注入至水載具中之前可全部地混合。 在本發明之第二態樣中,提供具有多道清洗歧管之水載 具以噴灑載具,在每個歧管之水入口中提供流量計,並提 供個別的计量幫浦以將表面活性劑注入至每個水管之中, 以確保將適當量的表面活性劑注入至水管之中,以產生具 有所需表面活性劑濃度之混合物。 在第四態樣中,清潔用來夾持晶圓之載具的系統包含在 圍壁中具有一轉子之盒清潔器,在轉子上之盒夾持組件包 含上鉤與下鉤以將盒子固定在轉子上。盒門夾持組件最好 具有複數個盒門夾持位置,每個盒門夾持位置最好具有門 導件與門鉤以夾持門,盒門挾持組件使得可用離心清潔器 清潔盒子與盒門,並避免盒門個別清潔的需要。 在第五態樣中’提供具有偶數個對轉子對稱間距的盒夾 持組件與偶數個對轉子對稱間距的門夾持組件之轉子,如 此可使轉子免於遭受不平衡的狀態。 在第六態樣中’噴灑歧管具有直線噴灑噴嘴與有角度的 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 1223345 A7 ____B7 ^五、發明説明(5~~ ' 圖11為圖10之幫浦與控制閥系統較佳結構之側視圖的左 前方。 圖12為圖11結構之側視圖的右後方。 圖13為顯示噴灑歧管與噴嘴方向之示範上視圖。 圖14為如圖1中所示,另一具有清潔系統之轉子的透視 圖。 圖15為如圖14中所示之轉子的上視圖。 圖16為圖14與圖15之轉子的門夾持組件之透視圖的右上 方。 圖17為其上視圖的右側。 圖18為圖17之門夾持組件的上隔間之爆炸透視圖。 圖19為圖18之隔間的底盤之透視圖。 圖20為如圖1中所示之系統的圍壁、轉子與噴灑歧管之透 視圖。 圖21-26為如圖20中所示,在系統中之噴灑圖案、噴嘴方 向及容器/轉子移動之示意圖。 圖27為圖20所示之系統中所使用的角度噴灑噴嘴的透視 圖。 圖28為如圖27所示之噴嘴的放大截面圖。 圖29為左或右噴灑歧管的一段之透視圖。 圖30為上或下噴灑歧管的一段之透視圖。 較佳具體實施例評怵 現在回到圖示中,圖1與圖2示範一具有框架12及形成圍 壁之保護板14的載具清潔機器10,在機器1〇的前表面及後 -9 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐) 1223345 A7 B7 五、發明説明(6 ) 表面上提供前門16A與後門16,機器10—般裝置在用於製造 半導體之潔淨室中。空氣過濾器圍壁18位於前門16A之 上,並包含過濾清潔大氣的過濾器。排放管26由機器10的 上方、右後角向外延伸,並通常與設備或建築的排放管路 連接。 參照圖3、圖6與圖9,在框架12中支撐圓柱室24,室24 具有圓柱側壁25,且圓拄側壁25在頂端與底部利用上板36 與底板38密封。上板36具有一中心開口 37,使得通過室24 的空氣可流進過濾盒1 8並向下經過室24。在室24之後下方 與右側的排放增壓50與排放管26連接,移將空氣移出室 24,在室24下方且在排放增壓50中的排放開口 39則將液體 排放至室外。 參照圖5、圖9與圖13,外清洗歧管28(R1-R4)在室圓柱側 壁25之上,各具有12個位於室24外圍的噴灑歧管。外清洗 歧管28可位於圓柱側壁25的外側上,如圖4-6與圖10所示, 或是只要適當地配置在外清洗歧管28上之清洗噴灑噴嘴 30,以對工件也就是晶圓載具噴灑,亦可位於圓柱側壁25 内表面之上。 内清洗歧管29位於室24中心的附近,各内清洗歧管 (R5-R8)具有複數個向外噴灑至工件(也就是晶圓載具、容 器或蓋子)上的清洗噴灑噴嘴30。 同樣地,外乾燥歧管64(D5-D8)各具有複數個乾燥噴灑喷 嘴66,乾燥噴灑噴嘴66在圓柱側壁25上之室24的外圍間隔 地分布,内乾燥歧管65(D1-D4)亦各具有複數個位於室24中 -10 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)Related to the device of the mass carrier, the nozzle in the chamber is configured to spray the cleaning mixed liquid of water and detergent or surfactant on the carrier carried by the rotor, and the cleaning and mixing liquid system uses a metering pump from the surfactant block. The storage bucket is directly drawn out and prepared. The flow rate of water is measured using a flow meter combined with a metering pump, and an appropriate amount of surfactant is injected into the water pipe to produce the required surfactant concentration to remove contaminants. Of a mixture. In a second aspect of the present invention, a surfactant or a detergent solution is injected into a water pipe or an inline mixing control valve to ensure that water and surfactant are injected into a water carrier. All can be mixed before. In a second aspect of the present invention, a water carrier with multiple cleaning manifolds is provided to spray the carrier, a flow meter is provided in the water inlet of each manifold, and individual metering pumps are provided to adjust the surface activity An agent is injected into each water pipe to ensure that an appropriate amount of surfactant is injected into the water pipe to produce a mixture having the desired surfactant concentration. In a fourth aspect, a system for cleaning a carrier for holding a wafer includes a box cleaner having a rotor in a surrounding wall, and a box holding assembly on the rotor includes an upper hook and a lower hook to fix the box to On the rotor. The box door holding assembly preferably has a plurality of box door holding positions. Each box door holding position preferably has a door guide and a door hook to hold the door. The box door holding assembly allows the box and the box to be cleaned with a centrifugal cleaner. Door and avoid the need for individual cleaning of the box door. In a fifth aspect, a rotor provided with an even number of pairs of rotors symmetrically spaced from the rotor and a pair of doors with symmetrically spaced rotors is provided with the rotors to prevent the rotor from being subjected to an imbalance. In the sixth aspect, 'the spray manifold has a straight spray nozzle and an angled paper size applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 1223345 A7 ____B7 ^ V. Description of the invention (5 ~~' Fig. 11 is a front left side view of a preferred structure of the pump and control valve system of Fig. 10. Fig. 12 is a right rear side view of the structure of Fig. 11. Fig. 13 is an exemplary top view showing the direction of the spray manifold and nozzles. Fig. 14 is a perspective view of another rotor having a cleaning system as shown in Fig. 1. Fig. 15 is a top view of the rotor shown in Fig. 14. Fig. 16 is a door clamp of the rotor of Figs. 14 and 15 The upper right of the perspective view of the module. Figure 17 is the right side of the top view. Figure 18 is an exploded perspective view of the upper compartment of the door clamping assembly of Figure 17. Figure 19 is a perspective view of the chassis of the compartment of Figure 18. Figure 20 is a perspective view of the enclosure, rotor, and spray manifold of the system shown in Figure 1. Figures 21-26 are the spray patterns, nozzle directions, and container / rotor movement in the system as shown in Figure 20 Figure 27 is a perspective view of the angle spray nozzle used in the system shown in Figure 20. Fig. 28 is an enlarged sectional view of the nozzle shown in Fig. 27. Fig. 29 is a perspective view of a section of a left or right spraying manifold. Fig. 30 is a perspective view of a section of an upper or lower spraying manifold. A preferred embodiment Evaluation is now back in the diagram. Figures 1 and 2 demonstrate a carrier cleaning machine 10 with a frame 12 and a protective plate 14 forming a surrounding wall, on the front surface and rear of the machine 10-9-This paper size applies Chinese National Standard (CNS) A4 specification (210X 297 mm) 1223345 A7 B7 V. Description of invention (6) The front door 16A and rear door 16 are provided on the surface, and the machine 10 is generally installed in a clean room for semiconductor manufacturing. Air filtration The enclosure wall 18 is located above the front door 16A and contains a filter to filter the clean atmosphere. The discharge pipe 26 extends outward from the top and rear right corners of the machine 10 and is usually connected to the equipment or building's discharge pipeline. Refer to Figure 3 6 and 9, a cylindrical chamber 24 is supported in the frame 12, and the chamber 24 has a cylindrical side wall 25, and the rounded side wall 25 is sealed at the top and bottom with an upper plate 36 and a bottom plate 38. The upper plate 36 has a central opening 37, Allows the air passing through the chamber 24 to flow into the filter box 1 8 Pass down the chamber 24. After the chamber 24, the right side of the discharge booster 50 and the discharge pipe 26 are connected, and the air is removed from the chamber 24. The discharge opening 39 below the chamber 24 and in the discharge booster 50 discharges the liquid 5, 9 and 13, the outer cleaning manifolds 28 (R1-R4) are above the cylindrical side wall 25 of the chamber, each having 12 spray manifolds located outside the chamber 24. The outer cleaning manifold 28 may Located on the outside of the cylindrical side wall 25, as shown in Figures 4-6 and 10, or as long as the cleaning spray nozzle 30 is appropriately arranged on the outer cleaning manifold 28 to spray the workpiece, that is, the wafer carrier, or Above the inner surface of the cylindrical side wall 25. The inner cleaning manifold 29 is located near the center of the chamber 24, and each of the inner cleaning manifolds (R5-R8) has a plurality of cleaning spray nozzles 30 spraying outwardly onto the workpiece (that is, the wafer carrier, container or cover). Similarly, the outer drying manifolds 64 (D5-D8) each have a plurality of drying spray nozzles 66, and the drying spray nozzles 66 are distributed at intervals on the periphery of the chamber 24 on the cylindrical side wall 25, and the inner drying manifolds 65 (D1-D4) Each also has a plurality of -10 in the room 24-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
裝 訂Binding
線 1223345 A7 B7 五、發明説明 心附近之乾燥嘴灑喷嘴66,乾燥歧管(D1-D8)與清洗歧管 (R1-R8)的較佳方向則如圖π中所示。Line 1223345 A7 B7 V. Description of the invention The preferred directions of the drying nozzle sprinkler nozzle 66 near the heart, the drying manifold (D1-D8) and the cleaning manifold (R1-R8) are shown in Figure π.
裝 暫時先參照圖10,外乾燥歧管64經由配管(distributi〇n)歧 管61,並接著利用液體管路63,而與如空氣或氮氣之壓縮 氣體供應源120,經由控制閥63a而連接。同樣地,内乾燥 歧管65經由配管歧管68,並接著利用液體管路67,而與壓 縮氣體供應源13 0 ’經由控制閥6 7 a而連接。外清洗歧管2 8 經由配管歧管141,並接著利用液體管路14〇 ,而與控制閥 170及去離子(DI)水供應源11〇連接。内清洗歧管29經由配管 歧管151,並接著利用液體管路150,而與控制閥ι8〇及去離 子(DI)水供應源11〇連接。壓縮氣體管路亦與噴丨麗歧管連 接,以經由控制閥170、180清洗(purge),昇壓幫·浦46則增 加了來自清洗歧管28及29之外部來源11〇的DI水之水壓。 控制閥170、180最好混合確保表面活性劑與DI水完全地 混合的控制閥。Referring to FIG. 10 for the time being, the outer drying manifold 64 is connected to a compressed gas supply source 120, such as air or nitrogen, through a control pipe 63a through a distribution manifold 61 and then a liquid pipe 63. . Similarly, the inner drying manifold 65 is connected to the compressed gas supply source 13 0 'via a control valve 6 7 a via a piping manifold 68 and then a liquid line 67. The outer cleaning manifold 2 8 is connected to the control valve 170 and the deionized (DI) water supply source 110 through a piping manifold 141 and then a liquid pipe 14. The inner cleaning manifold 29 is connected to the control valve ι80 and the deionized (DI) water supply source 110 through a piping manifold 151 and then a liquid line 150. The compressed gas line is also connected to the spray manifold to purge through the control valves 170 and 180. The booster pump 46 adds DI water from an external source 11 of the cleaning manifold 28 and 29. Water pressure. The control valves 170, 180 are preferably mixed to ensure that the surfactant is completely mixed with the DI water.
參照圖3-6及圖10-12,表面活性劑槽或瓶35經由液體管路 190與表面活性劑計量幫浦48及49連接,表面活性劑計量繁 浦48則經由液體管路192而與混合控制閥no連接,幫浦48 將表面活性劑自槽或瓶35抽出’並抽至與DI水混合的控制 閥170之中,以經由液體管路14〇注入至外清洗歧管28之 中。表面活性劑計量幫浦49經由液體管路194與控制閥180 連接,幫浦49將表面活性劑自槽或瓶35抽出,並抽至與DI 水混合的控制閥180之中,以經由液體管路丨5〇注入至外清 洗歧管29之中。 -11 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公爱) 1223345 A7 B7 五、發明説明(8 ) 在室24底部的排放開口 39通向分流器90,分流器90連接 排放開口 39與回收槽42或設備廢水排放92。 在表面活性劑之側,來自於接近混合控制閥170之液體管 路192的迴路(return)管路142提供了回到槽35之表面活性劑 的注入(priming)(在控制閥145的控制之下);來自於接近混 合控制閥180之液體管路194的迴路管路152提供了回到槽 35之表面活性劑的注入(在控制閥155的控制之下)。在DI水 之側,來自於接近混合控制閥170之液體管路115的回收 (recirculation)管路147提供了 DI水的回收;而來自於接近混 合控制閥180之液體管路117的回收管路157亦提供了 DI水 的回收。即使當工具為閒置時,回收管路147與157仍提供 了流經工具的水流,以避免在管路或閥中滋生細菌。 再參照圖9,在空氣過濾盒18後的空氣進口增壓56之處及 與室24頂部連接之進口開孔中心上之處安裝空氣加熱器 58,並在室24頂部的周圍提供包圍(blanket)加熱器55,電腦 /控制器112與各幫浦、閥、加熱器及流量感測器連接並控 制它們。 參照圖6-9,在基座104上的室24中支稱可旋轉的轉子 70,轉子具有與框架75連接之上環72及底環74,自上環72 與底環74徑向向外地延伸,且在上、下支撐82之上的支點 地支撐梯子76,各梯76如圖9中所示具有複數個圍壁78,以 夾持容器或載具85、或容器蓋87,梯子76的結構與梯子76 上的圍壁78之設計適用於欲清潔之特殊尺寸與形式的載 具、容器及蓋子。在中心柱100及中心柱100中的轉子輪軸 -12 - 本纸張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)Referring to FIGS. 3-6 and 10-12, the surfactant tank or bottle 35 is connected to the surfactant metering pumps 48 and 49 via the liquid pipe 190, and the surfactant metering pump 48 is connected to the surfactant metering pump 48 via the liquid pipe 192. The mixing control valve is connected, pump 48 draws the surfactant from the tank or bottle 35 and pumps it into the control valve 170 mixed with DI water to inject into the external cleaning manifold 28 through the liquid pipe 14 . The surfactant metering pump 49 is connected to the control valve 180 via a liquid line 194. Pump 49 extracts the surfactant from the tank or bottle 35 and pumps it into the control valve 180 mixed with DI water to pass through the liquid pipe. Path 50 is injected into the outer cleaning manifold 29. -11-This paper size is in accordance with Chinese National Standard (CNS) A4 specification (210 X 297 public love) 1223345 A7 B7 V. Description of the invention (8) The discharge opening 39 at the bottom of the chamber 24 leads to the diverter 90, and the diverter 90 is connected Drain opening 39 and recovery tank 42 or equipment wastewater discharge 92. On the surfactant side, the return line 142 from the liquid line 192 near the mixing control valve 170 provides the priming of the surfactant back to the tank 35 (under the control of the control valve 145). Bottom); circuit line 152 from liquid line 194 close to mixing control valve 180 provides injection of surfactant back to tank 35 (under control of control valve 155). On the DI water side, a recirculation line 147 from the liquid line 115 near the mixing control valve 170 provides for the recovery of DI water; and a recovery line from the liquid line 117 near the mixing control valve 180 157 also provides recovery of DI water. Even when the tool is idle, the recovery lines 147 and 157 provide a flow of water through the tool to avoid breeding bacteria in the line or valve. Referring again to FIG. 9, an air heater 58 is installed at the air inlet booster 56 behind the air filter box 18 and at the center of the inlet opening connected to the top of the chamber 24, and a blanket is provided around the top of the chamber 24 (blanket ) The heater 55, the computer / controller 112 is connected to and controls each of the pumps, valves, heaters, and flow sensors. 6-9, a rotatable rotor 70 is supported in the chamber 24 on the base 104. The rotor has an upper ring 72 and a bottom ring 74 connected to the frame 75, and extends radially outward from the upper ring 72 and the bottom ring 74. And the ladder 76 is supported on the fulcrum above the upper and lower supports 82. Each ladder 76 has a plurality of surrounding walls 78 as shown in FIG. 9 to hold the container or carrier 85, or the container cover 87, and the structure of the ladder 76. The design with the surrounding wall 78 on the ladder 76 is suitable for special sizes and forms of vehicles, containers and covers to be cleaned. Rotor shafts in the center column 100 and center column 100 -12-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
裝 訂Binding
線 1223345 A7 B7 五、發明説明(9 ) 106之上可旋轉地支撐整個轉子70,轉子驅動馬達1〇2以旋 轉轉子70’轉子70、中心柱1〇〇及轉子輪軸1Q6的詳細設計 特徵為眾人所熟知的,如第5,224,503號美國專利中所敘 述;另一方法為建構一具有不旋轉梯子的工具。 在使用中,通常將機器10安裝在矽晶圓或其他平坦介質 的製造設備中,當晶圓移至各個製程步驟中時,便會污染 載具85,且必須在將晶圓放置至載具中之前清潔。打開機 器10的門16或16A ,轉動轉子70直到梯子76對準門,接著梯 子76會轉動180度,而可經由門16而接收空的圍壁78。將載 具85裝載至圍壁78中,並將梯子旋轉至其原始位置上,使 得圍壁78面對室24的内側《最好提供具有門閂或制動器 (detent)的梯子76,以將梯子鎖進關閉或操作中的位置,且 圍壁78面對室24的内側,接著讓下一個梯子76對準門,並 利用轉動轉子70(利用手或經由轉子驅動馬達1〇2的控制)以 裝載梯子,裝載將持續到填滿所有的梯子76為止。 如圖6中所示,機器10上的設備板4〇具有與去離子水及氣 體入口的連接,也就是進入機器1〇的氮氣或空氣,及與淚 水排放92的連接,並具有表與閥以量測與控制液體/氣體流 量。 表面活性劑槽35供應清潔劑或表面活性劑,如Vahr〇nDp 94001(高pH值錄清㈣),為_較佳之去除綠的表面活 ^且本申清案中所使用之字眼“表面活性劑,,係指表面 活性劑或清潔劑。控制器112經由閥與幫浦適當的控制,而 將DI水與表面活性劑送至混合控制閥170、180之中,以製Line 1223345 A7 B7 V. Description of the invention (9) 106 The entire rotor 70 is rotatably supported above the rotor drive motor 102 to rotate the rotor 70 ', the rotor 70, the center pillar 100, and the rotor shaft 1Q6. The detailed design features are It is well known as described in US Patent No. 5,224,503; another method is to construct a tool with a non-rotating ladder. In use, the machine 10 is usually installed in a silicon wafer or other flat medium manufacturing equipment. When the wafer is moved to various process steps, it will contaminate the carrier 85, and the wafer must be placed on the carrier. Clean before medium. Open the door 16 or 16A of the machine 10, rotate the rotor 70 until the ladder 76 is aligned with the door, and then the ladder 76 will rotate 180 degrees, and the empty surrounding wall 78 can be received through the door 16. Load the carrier 85 into the surrounding wall 78 and rotate the ladder to its original position so that the surrounding wall 78 faces the inside of the room 24. It is preferable to provide a ladder 76 with a latch or detent to lock the ladder Into the closed or operating position with the surrounding wall 78 facing the inside of the chamber 24, then the next ladder 76 is aligned with the door, and the rotor 70 is controlled (by hand or via the rotor drive motor 102 control) to load Ladder, loading will continue until all ladders 76 are filled. As shown in FIG. 6, the equipment board 40 on the machine 10 has connections to the deionized water and gas inlets, that is, nitrogen or air entering the machine 10, and connections to the tear discharge 92, and has meters and valves To measure and control liquid / gas flow. The surfactant tank 35 is provided with a cleaning agent or a surfactant, such as VahrOnDp 94001 (high pH value), which is _ a better surface activity to remove green ^ and the word "surface activity" used in this application Agent refers to surfactant or detergent. The controller 112 sends DI water and surfactant to the mixing control valves 170 and 180 through the appropriate control of the valve and pump to produce
裝 訂Binding
線 -13 -Line -13-
1223345 A7 B7 10 ) 五、發明説明 造所需之DI水/表面活性劑混合物,並將此混合物注入至各 清洗歧管28、29之中。DI水昇壓幫浦46提昇供應管114中的 水壓’以將DI水送至混合控制閥17〇與混合控制閥18〇。在 外清洗混合控制閥170的上游之液體管路中配置流量計 116’以量測供應至這些閥之以水之流量;同樣地,在内清 洗混合控制閥180的上游之液體管路中配置流量計丨丨8,以 量測供應至這些閥之DI水之流量。 藉由使用來自流量計116與計量幫浦48上的控制來初始 地校正系統,以為注入至外清洗歧管28中之DI水/表面活性 劑混合物設定合理精確的表面活性劑濃度;同樣地,使用 來自流量計118與計量幫浦49上的控制來校正系統,以為注 入至内清洗歧管29中之DI水/表面活性劑混合物設定合理 精確的表面活性劑濃度。每個歧管之溶液最好是1 : 1 〇〇〇〇 且具有與DI水平衡的表面活性劑,但具有獨自的流量控制 /计量’並可個別地設定表面活性劑濃度的水準。 計量幫浦48、49最好為如薄膜幫浦之正型位移的繁浦, 可碉整此薄膜幫浦之流率以調整幫浦衝程(可設定每個衝 程抽出的量)及/或幫浦速度(每分鐘的衝程),幫浦最好設定 在相對的高速,使得表面活性劑可以較少的脈衝/間斷的形 式傳送至系統中。 系統操作者可利用調整幫浦衝程(可設定每衝程的量)及 /或幫浦速度(每分鐘的衝程)而調整表面活性劑/DI水的濃 度。 雖然可藉由預先設定之幫浦速率操作此計量幫浦Μ、49 -14 - 1223345 A7 -------- -B7^ 五、發明説明(11 ) ”表面活/DI 7jc ;辰度之系統,亦可使用電m而此 電控系統使用來自流量計116、118與計量幫浦之抽取速率 的電子控制之輸入。 在表面活性劑桶35之尚可提供低液面偵測器35a ,以在桶 中液體液面過低而需要置換時發出警告,偵測器W可為桶 中的液體偵測器,或為位於桶外之電容制器,或是其他 的適當裝置’當液面到達特定(低)水準時,偵測器可決定 置換表面活性劑的時間,或是某些類型的偵測器可提供對 應表面活性劑液面的訊號。舉例來說,在桶35中插入的托 盤35b(參照圖H)可包含_支撐表面活性劑桶35之負載單元 (load⑶⑴,並由提供液體液面之負載單元決定桶重量變化 時提供桶35的重量。 控制咨112控制轉子驅動馬達1〇2,使得轉子7〇以卜5〇 的低速度在第一方向上旋轉,並經由幫浦46、48、49與閥 170、180的控制,將di水/表面活性劑噴灑到旋轉轉子上的 載具85上。 在一段足夠的時間如3-10分鐘之後,當繼續噴灑表面活 性劑/谷液時,轉子70倒轉其旋轉方向,以改善噴灑的覆蓋 性。位於轉子70内側之内清洗歧管29自室24中心徑向向外 地噴灑;位於室圓柱側壁25周圍之外清洗歧管28朝向室24 中心徑向向内地噴灑;與轉子7〇雙向的旋轉結合之兩個噴 灑動作可提供容器85所有表面實際上的完全覆蓋。 在完成施加表面活性劑溶液之後,如圖1〇中所示,利用 流過檢查閥門143、153與控制閥no、180之氣體或氮氣來 -15 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 1223345 A7 B7 五、發明説明(12 ) 清洗歧管。 在表面活性劑的清洗循環中,g己置分流閥90以將液體導 至設備廢液排放92, 一般來說,當機器10開始清洗循環時, 分流閥90維持其位置,以連接廢液開口 39和設備廢液排放 92。DI水自所有的清洗歧管(R1-R8)噴灑至載具85之上,而 轉子70以第一方向旋轉,並接著以1-50 rpm,最好是6 rpm, 在相反方向上倒轉與旋轉。接著開啟加熱器58,而轉子加 速至約300 rpm,使得在容器85上的水滴離心地飛離容器, 並乾燥容器。位於室24頂部外側之包覆加熱器55持續開 著,以對室24的頂部保溫,DI清洗水則自廢液排放92流出。 若有需要,例如在DI水(沒有表面活性劑)循環經過室的 水循環模式,分流閥90可轉至一位置。 當機器10用來清潔各種容器時,對於不同的容器與污染 物,可多少改變如表面活性劑、清洗水與空氣/氣體噴灑的 時間及旋轉速度與順序、加熱器的操作、表面活性劑的濃 度等特定的清潔參數,以達成最佳的結果,對於熟知此項 技藝之人士為顯而易見的。 表面活性劑通常為不可燃或不會爆炸的,且與溶劑結合 不會具有某些環境上的危害;另一方面,表面活性劑非常 昂貴,使用計量幫浦可對DI水/表面活性劑混合物提供精確 且一致的表面活性劑之濃度,故此系統可節省表面活性劑。 現在再回到圖14與15中所示之設計,轉子組件236具有對 稱配置在轉子框架244上的偶數個盒夾持組件250a、250b、 250c與250d ;同樣地,亦在轉子框架244上對稱地配置偶數 -16 - 本纸張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 1223345 A7 B7 五、發明説明(13 ) 個門夾持組件26〇a與260b。 各盒夾持組件250a-250d具有相同的設計,並位於徑向相 反另一盒夾持組件之位置;較特別的是,盒夾持組件250a 位在徑向相反於盒夾捧組件250c上,而盒夾持組件250b位 在徑向相反於盒爽持組件250d上。同樣地,互相徑向相反 地配置門夾持組件260a與260b,因此轉子組件236具有配置 於對稱且旋轉平衡結構的盒夾持器與門夾持器組件。 盒夾持器組件250a-250d與門夾持器組件260a與260b貼附 至轉子框架244之上,並形成轉子組件236,轉子框架244包 含貼附於核心結構245上之上環板246與底環板248,盒夾持 器組件250a-250d最好經由螺釘275剛性地貼附在環板246與 248的頂部與底部。 參照圖16 ’各門夾持組件260a與2 60b具有一上板272、底 板276、中間板274、側板278、280與貼附於側板之臂292, 各門夾持組件260最好經由延伸經過門夾持組件之上板272 與底板276的螺釘275,且剛性地貼附於轉子框架244之上環 板246與底環板248。 各門夾持組件260a與260b具有通常由中間板274分隔之 上圍壁306與下圍壁308,仍參照圖16,各圍壁306與3〇8具有 兩個門夾持位置,示範之上圍壁306夾持門325a與325b,而 示範之下圍壁夾持門325c與325d,門夾持位置最好為互相 鏡射。 亦參照圖18與19,各圍壁306與308具有底表面或托盤 335、一對左側鉤322、一對右側鉤324及上板34〇,圖18顯示 -17 - 本紙張尺度適用中國國家榡準(CNS) A4規格(210X 297公釐) 12233451223345 A7 B7 10) V. Description of the invention Create the required DI water / surfactant mixture and inject this mixture into each of the cleaning manifolds 28, 29. The DI water boosting pump 46 raises the water pressure 'in the supply pipe 114 to send the DI water to the mixing control valve 17o and the mixing control valve 18o. A flow meter 116 'is provided in the liquid line upstream of the external cleaning mixing control valve 170 to measure the water flow rate supplied to these valves; similarly, a flow rate is provided in the liquid line upstream of the internal cleaning mixing control valve 180 Calculate the flow of DI water supplied to these valves. The system is initially calibrated by using controls from the flow meter 116 and metering pump 48 to set a reasonably accurate surfactant concentration for the DI water / surfactant mixture injected into the external cleaning manifold 28; as such, Controls from the flow meter 118 and metering pump 49 are used to calibrate the system to set a reasonably accurate surfactant concentration for the DI water / surfactant mixture injected into the inner cleaning manifold 29. The solution of each manifold is preferably 1: 1, 000 and has a surfactant balanced with DI water, but has its own flow control / metering ', and the level of the surfactant concentration can be set individually. Metering pumps 48 and 49 are preferably pumps with positive displacements such as film pumps. The flow rate of this film pump can be adjusted to adjust the pump stroke (the amount of each stroke can be set) and / or pump. Pump speed (stroke per minute), the pump is preferably set at a relatively high speed, so that the surfactant can be transmitted to the system in the form of less pulses / intermittent. The system operator can adjust the surfactant / DI water concentration by adjusting the pump stroke (the amount per stroke can be set) and / or the pump speed (stroke per minute). Although this metering pump M, 49 -14-1223345 A7 can be operated by a preset pump rate, the description of the invention (11) "surface activity / DI 7jc; Chen degree The system can also use electricity and this electronic control system uses electronically controlled inputs from the flow rate 116, 118 and the pumping rate of the metering pump. A low liquid level detector 35a is also available in the surfactant bucket 35 In order to issue a warning when the liquid level in the bucket is too low and needs to be replaced, the detector W can be a liquid detector in the bucket, or a capacitor controller located outside the bucket, or other appropriate devices. When the surface reaches a specific (low) level, the detector can decide when to replace the surfactant, or some types of detector can provide a signal corresponding to the surfactant level. For example, inserting in the barrel 35 The tray 35b (see FIG. H) may include a load unit (support) that supports the surfactant bucket 35, and the load unit that provides the liquid level determines the weight of the bucket 35 when the weight of the bucket changes. The control unit 112 controls the rotor drive motor 10, making the rotor 70 at a low speed of 50 Rotate in one direction and spray DI water / surfactant onto the carrier 85 on the rotating rotor through the control of pumps 46, 48, 49 and valves 170, 180. After a sufficient time, such as 3-10 minutes When the surfactant / valley solution is continuously sprayed, the rotor 70 reverses its rotation direction to improve the spraying coverage. The cleaning manifold 29 located inside the rotor 70 is sprayed radially outward from the center of the chamber 24; it is located on the side wall 25 of the cylinder The outside cleaning manifold 28 sprays radially inward toward the center of the chamber 24; the two spraying actions combined with the two-way rotation of the rotor 70 can provide virtually complete coverage of all surfaces of the container 85. After the application of the surfactant solution is completed As shown in Figure 10, use the gas or nitrogen flowing through the inspection valves 143, 153 and the control valves no, 180 to -15-This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) 1223345 A7 B7 V. Description of the invention (12) Cleaning the manifold. In the surfactant cleaning cycle, a diverter valve 90 is set to direct the liquid to the equipment waste liquid discharge 92. Generally, when the machine 10 starts the cleaning cycle Time The diverter valve 90 maintains its position to connect the waste liquid opening 39 and the equipment waste liquid discharge 92. DI water is sprayed from all the cleaning manifolds (R1-R8) onto the carrier 85, and the rotor 70 rotates in the first direction And then reverse and rotate in the opposite direction at 1-50 rpm, preferably 6 rpm. Then turn on the heater 58, and the rotor is accelerated to about 300 rpm, so that the water droplets on the container 85 fly off the container centrifugally, And the container is dried. The coating heater 55 located on the outside of the top of the chamber 24 is continuously turned on to keep the top of the chamber 24 warm, and the DI washing water flows out of the waste liquid discharge 92. The diverter valve 90 can be turned to a position if desired, such as in a water circulation mode where DI water (without surfactant) is circulated through the chamber. When the machine 10 is used to clean various containers, for different containers and pollutants, such as surfactants, cleaning water and air / gas spraying time and rotation speed and sequence, operation of heaters, surfactants Specific cleaning parameters such as concentration to achieve the best results will be apparent to those skilled in the art. Surfactants are generally non-combustible or non-explosive and do not pose certain environmental hazards when combined with solvents. On the other hand, surfactants are very expensive and can be used with DI water / surfactant mixtures with metering pump Provide accurate and consistent surfactant concentration, so this system can save surfactant. Now returning to the design shown in FIGS. 14 and 15, the rotor assembly 236 has an even number of cassette holding assemblies 250 a, 250 b, 250 c, and 250 d symmetrically disposed on the rotor frame 244; similarly, it is also symmetrical on the rotor frame 244. Ground configuration even number -16-This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 1223345 A7 B7 V. Description of the invention (13) Door holding assemblies 26〇a and 260b. Each of the box clamping assemblies 250a-250d has the same design and is located at a position opposite to the other box clamping assembly in a radial direction; more specifically, the box clamping assembly 250a is located on a radial direction opposite to the box clamping assembly 250c, And the box holding component 250b is located on the box holding component 250d which is radially opposite to the box holding component 250d. Similarly, since the door holding assemblies 260a and 260b are arranged radially opposite to each other, the rotor assembly 236 has a box holder and a door holder assembly arranged in a symmetrical and rotationally balanced structure. The box holder assemblies 250a-250d and the door holder assemblies 260a and 260b are attached to the rotor frame 244 and form a rotor assembly 236. The rotor frame 244 includes an upper ring plate 246 and a bottom ring attached to the core structure 245 The plates 248, cassette holder assemblies 250a-250d are preferably rigidly attached to the top and bottom of the ring plates 246 and 248 via screws 275. Referring to FIG. 16 ′, each door holding assembly 260 a and 2 60 b has an upper plate 272, a bottom plate 276, a middle plate 274, side plates 278, 280 and arms 292 attached to the side plates. Each door holding assembly 260 is preferably extended through The screws 275 on the upper plate 272 and the bottom plate 276 of the door clamping assembly are rigidly attached to the ring plate 246 and the bottom ring plate 248 on the rotor frame 244. Each door holding assembly 260a and 260b has an upper surrounding wall 306 and a lower surrounding wall 308, which are usually separated by an intermediate plate 274. Still referring to FIG. 16, each surrounding wall 306 and 308 has two door holding positions. The surrounding wall 306 holds the doors 325a and 325b, while the surrounding walls hold the doors 325c and 325d. The door holding positions are preferably mirrored to each other. Referring also to FIGS. 18 and 19, each of the surrounding walls 306 and 308 has a bottom surface or tray 335, a pair of left hooks 322, a pair of right hooks 324, and an upper plate 34. Figure 18 shows -17. Standard (CNS) A4 (210X 297 mm) 1223345
圍壁兀件的詳細部分,$圖19則顯示底托盤335的詳細部 分,在展托盤335中提供門軌336與337,以接收門之底邊 緣,並以相對於轉子之旋轉軸AA的徑向方向配置門軌 说、337,門軌336、337在其徑向向内或後末端處各具有 後斜坡338與339,各鉤322與324具有一腿325與一附著於腿 之腳327。鉤322與324最好為互相鏡射之影像,腿μ〗周圍 地延伸(也就是一般與旋轉之轉子路徑的方向相切),腳327 從向向内地朝向轉子之旋轉軸AA延伸,而在門夾持器中夾 持門,使得門幾乎對準或平行於轉子之半徑R,門之板p的 平邊的平面最好如圖16中所示,在半徑尺的±3〇、加或⑺度 之内。 在使用中,為了將門裝載至門夾持組件26〇之中,打開圍 土門16(如圖1中所示),並將轉子指向或旋轉直到門夾持組 件260a或260b移至對準圍壁門16之處,接著利用手將門 325a-d裝載至門夾持組件26〇a或26〇b之中。 當將門(如門325a)裝載至一隔間内時,門325a之底部可配 合於門軌336内,門軌可幫助橫向支撐門(也就是使門可抵 抗側邊對側邊的移動)。將門(如門325a)垂直地插入至隔間 開口中並通過門軌336及側鉤322,而裝載在門夾持組件 中’接著將門橫向地移至門軌336上的位置,門的底部與將 門向下並徑向向外地導引至門軌336中之斜坡338嚙合,門 之徑向外側的邊緣亦與側鉤322接觸,一旦在門軌336中, 將門徑向向外地移回,直到門與側鉤322嚙合。接著利用鈞 子固定地放置並夾持門325a,以藉由旋轉轉子外加之離心 -18- 本纸張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐)The detailed parts of the surrounding walls. Figure 19 shows the details of the bottom tray 335. Door rails 336 and 337 are provided in the exhibition tray 335 to receive the bottom edge of the door and the diameter relative to the axis of rotation AA of the rotor. The door rails 337 are arranged in the direction, and the door rails 336 and 337 each have rear slopes 338 and 339 at their radial inward or rear ends, and each of the hooks 322 and 324 has a leg 325 and a leg 327 attached to the leg. The hooks 322 and 324 are preferably mirror images of each other, and the legs μ extend around (that is, generally tangent to the direction of the rotor path of rotation), and the feet 327 extend inwardly toward the rotor's axis of rotation AA, and The door is clamped in the door holder so that the door is almost aligned or parallel to the radius R of the rotor. The plane of the flat side of the door plate p is preferably as shown in FIG. Within degrees. In use, in order to load the door into the door holding assembly 26, the surrounding earth door 16 is opened (as shown in FIG. 1), and the rotor is pointed or rotated until the door holding assembly 260a or 260b is moved to the alignment wall. At the door 16, the doors 325a-d are then loaded into the door holding assemblies 26a or 26b by hand. When a door (such as door 325a) is loaded into a compartment, the bottom of the door 325a can fit into the door rail 336, which can help laterally support the door (that is, make the door resistant to side-to-side movement). Insert the door (such as door 325a) vertically into the compartment opening and pass through the door rail 336 and the side hook 322, and load it into the door clamping assembly. Then move the door laterally to the position on the door rail 336, and the bottom of the door and Guide the door downwardly and radially outwards to engage the slope 338 in the door rail 336, and the radially outer edge of the door also contacts the side hook 322. Once in the door rail 336, move the door radially outward until The door is engaged with the side hook 322. Then use Junzi to fixedly place and hold the door 325a to rotate the rotor plus centrifugation. -18- This paper size applies to China National Standard (CNS) A4 (210 X 297 mm)
裝 訂Binding
線line
力抵抗移動,並利項相同的太 1 7万式裝載其他各門。位於底托 盤335上之中心導件344可暂日^收 .,· ¥助將門之内端或後端導引至門 軌中’並使用上述步驟相反的固 久的項序自門夾持組件260卸載門 325 〇 當裝載至Η夾持位置時’門位於垂直位置中,也就是門 邊’彖面向轉子I軸ΑΑ,而門的另—相對邊緣則徑向向 面向轉子’(並利用鉤子唱合)。門的平面或面垂直於 轉子的移動路徑,而在相同的隔間遍或則中,一門面之 平面面向相鄰門面之平面,且在隔間遍或則之側邊爽持 門,隔間之中心區域為空的’以容許有裝載與卸載的空間。 門夾持组件肠、2_比盒夾持組件還窄,並佔據轉子組 件更小的區段。 使用上述之順序,裝載具有門325a-d之門夾持組件 260a、260b,通常在上隔間3〇6中具有兩道門,而另兩道門 在下隔間308。 兩個門夬持組件260a、260b各具有四道門,總共有八道 門。轉子組件236具有四個盒夾持組件25〇a_d,各組件夾持 兩個i子,共有八個盒子。如此一來,在清潔系統之單一 循%中可清潔八個盒子與八道門,且由於裝載對稱於旋錢 軸AA,故轉子組件236為平衡的。 由於上述之轉子具有四個盒夾持組件及兩個門夾持組 件,且門夾持組件各具有兩隔間(上與下),亦可使用其他 構件與結構。 參照圖20,在一改善之離心式盒清潔器4〇〇的具體實施例 -19- 本紙張尺跳财g时料(CNS)域^(21。χ297/疋The force resists the movement, and the same item is too 17 thousand to load other doors. The center guide 344 on the bottom tray 335 can be temporarily closed., ... ¥ Help guide the inner or rear end of the door into the door rail 'and use the long-lasting item sequence opposite to the above steps to hold the assembly from the door 260 Unloading door 325 〇 When loading to the Η clamping position 'the door is in a vertical position, that is, the side of the door' 彖 faces the rotor I axis ΑΑ, and the other opposite edge of the door faces the rotor radially '(using a hook Chorus). The plane or surface of the door is perpendicular to the moving path of the rotor, and in the same compartment, the plane of one facade faces the plane of the adjacent facade, and the door is flush with the side of the compartment or compartment. The center area is empty to allow space for loading and unloading. The door clamping assembly is narrower than the box clamping assembly and occupies a smaller section of the rotor assembly. Using the sequence described above, door holding assemblies 260a, 260b having doors 325a-d are typically loaded with two doors in the upper compartment 306 and two doors in the lower compartment 308. The two door holding assemblies 260a, 260b each have four doors, for a total of eight doors. The rotor assembly 236 has four cassette holding assemblies 25a-d, each of which holds two cartridges, for a total of eight cassettes. In this way, eight boxes and eight doors can be cleaned in a single cycle of the cleaning system, and the rotor assembly 236 is balanced because the loading is symmetrical to the coin axis AA. Since the above-mentioned rotor has four box clamping assemblies and two door clamping assemblies, and each of the door clamping assemblies has two compartments (upper and lower), other components and structures can also be used. Referring to FIG. 20, a specific embodiment of an improved centrifugal box cleaner 400 is used. -19- The paper rule jumps into the time (CNS) field ^ (21.χ297 / 疋
裝 訂Binding
1223345 A7 B7 五、發明説明(16 ) * 中,夕卜清洗歧管402、404、406、408與410徑向向内地將液 體噴灑至盒子與容器85之上或之内,内液體噴灑歧管412 徑向向外地將液體噴灑在盒子的背表面上。如圖20中所 示,内液體噴灑歧管412位於旋轉轉子403的徑向方向上, 外噴灑歧管402、404、406、408與410位於圍壁401中,或位 於圍壁401的外側,在歧管上並具有延伸經過圍壁開口的噴 嘴。 内與外液體噴灑歧管亦可設置在盒清潔器400中,以在乾 燥循環中喷灑如潔淨乾燥空氣之氣體,亦可提供個別的内 及/或外氣體噴灑歧管。 參照圖21與22,第一外液體噴灑歧管402最好具有複數個 偶數間隔之噴灑噴嘴430與432,噴嘴430為直線噴灑噴嘴, 並直接噴向轉子36之旋轉軸與中心C,直線噴灑噴嘴430可 噴灑錐形圖案,並圍繞一 10-60度或15-45度,最好為30度之 立體角的錐形噴嘴,另一選擇則為直線噴灑噴嘴430為可提 供較平之噴灑圖案的扇型喷嘴。為了在清潔盒子時得到較 好的效果,包含在第一歧管402上的噴嘴432亦可為有角度 之噴灑喷嘴,最好是第一歧管402具有兩個或四個有角度之 噴灑噴嘴432,並由至少一個,最好是數個直線噴灑噴嘴430 隔開。 參照圖22,可在第一外液體喷灑歧管402上配置有角度之 噴嘴432,以自接近FOUP盒或容器的角度Θ,或是與轉子旋 轉A夾角之方向上噴灑。在第一歧管402上之直線噴灑歧管 430直接朝向轉子組件的中心C噴灑,在第一歧管402上之直 -20 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X 297公釐)1223345 A7 B7 V. Description of the invention (16) * In the Xibu cleaning manifolds 402, 404, 406, 408, and 410, the liquid is sprayed radially inward on or in the box and container 85, and the internal liquid is sprayed on the manifold 412 Spray the liquid radially outward on the back surface of the box. As shown in FIG. 20, the inner liquid spraying manifold 412 is located in the radial direction of the rotating rotor 403, and the outer spraying manifolds 402, 404, 406, 408, and 410 are located in the surrounding wall 401, or outside the surrounding wall 401, There is a nozzle on the manifold and extending through the surrounding wall opening. The inner and outer liquid spraying manifolds may also be provided in the box cleaner 400 to spray a gas such as clean dry air in a drying cycle, and individual inner and / or outer gas spraying manifolds may also be provided. 21 and 22, the first external liquid spraying manifold 402 preferably has a plurality of evenly spaced spraying nozzles 430 and 432. The nozzles 430 are linear spraying nozzles, and spray directly onto the rotation axis and center C of the rotor 36, and spraying in a straight line. The nozzle 430 can spray a cone pattern and surround a cone nozzle with a solid angle of 10-60 degrees or 15-45 degrees, preferably 30 degrees. Another option is a linear spray nozzle 430 to provide a flater spray. Patterned fan nozzle. In order to obtain better results when cleaning the box, the nozzle 432 included in the first manifold 402 may also be an angled spray nozzle. It is preferable that the first manifold 402 has two or four angled spray nozzles. 432, and separated by at least one, preferably several, linear spray nozzles 430. Referring to Fig. 22, an angled nozzle 432 may be arranged on the first outer liquid spraying manifold 402, and sprayed at an angle Θ approaching the FOUP box or container, or in an angle of rotation A with the rotor. The straight spraying manifold 430 on the first manifold 402 sprays directly toward the center C of the rotor assembly, and the straight spraying on the first manifold 402 is -20-This paper size applies to China National Standard (CNS) A4 (210X 297mm) (Centimeter)
裝 -訂Binding
1223345 A7 B7 五、發明説明(18 ) 為了避免干擾到相鄰的噴灑噴嘴,第二外喷灑歧管404 上之向下角度的噴灑噴嘴432,與第四外噴灑歧管408上之 向上角度的噴灑噴嘴,最好與下一個下與上直線噴灑噴嘴 430間隔一段足夠的距離,以避免全面衝突的圖案。如此一 來,第二與第四外噴灑歧管404與408上之直線噴灑喷嘴430 與有角度的噴灑噴嘴432之間的距離最好不是相等的;相反 地,第一外噴灑歧管402上與第三外噴灑歧管406上之有角 度的喷灑噴嘴432之間的距離最好是趨近一致。 在第四外噴灑歧管408與第二外噴灑歧管404上之有角度 的噴灑噴嘴432之上角度與下角度不必相等,或不必等於第 一外噴灑歧管402與第三外噴灑歧管406上之有角度的噴灑 噴嘴432之Θ角相等。隨不同的應用可變化角度,但是最好 所有的角度(歧管402之右、歧管404之下、歧管406之左與 歧管408之上)介於10至80度、20至70度、30至50度,且更好 是介於40-50度,在示範的具體實施例中,所有有角度的噴 灑噴嘴均設計成以45度的Θ角噴灑。 歧管402、404、406與408最好在室的側壁之外圍以90度 之區間等距離地間隔,且最好是在各具有有角度之噴灑噴 嘴的歧管402、404、406與408之間至少有一個直線噴灑歧 管410,最好是如圖22中所示,只具有直線噴灑噴嘴430。 内噴灑噴嘴412最好全部只具有主要用來清潔盒子背表 面之直線喷灑喷嘴430;然而,内喷灑歧管412亦可類似於 外噴灑歧管,具有有角度的噴灑噴嘴432。 在示範之具體實施例中,共有八個外噴灑歧管402、404、 -22 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 1223345 A7 B7 五、發明説明(19 ) 406、408與四個外直線喷灑歧管410,最好亦有八個内液體 噴灑歧管,如圖22中所示,可對準於外噴灑歧管,或可偏 移或垂直地交錯,亦可為角度偏移,使得來自内液體噴灑 歧管412之噴灑對準兩個外噴灑歧管之間的一點。若有需 要,外噴灑歧管上之噴嘴430與432的垂直位置可偏移或交 錯,以提供較廣範圍的噴灑覆蓋。 如圖27與28中所示,有角度之噴灑歧管432包含延伸過噴 嘴出口 436之導件表面434,以產生朝噴嘴體438之軸末端方 向夾Θ角之錐狀的喷灑圖案。當裝置時,軸N大體上與轉子 C的旋轉中心交叉,而導件表面434可使噴灑圖案相對於軸 N夾Θ角延伸。 圖21-26顯示在轉子裝載盒子時以A方向旋轉之盒清潔器 400的操作,對所有的歧管402、404、406、408、410與412 供應清潔液體,使得最好同時地自所有歧管上之所有噴灑 噴嘴430與432噴出液體。在圖21中,來自於歧管410之直線 喷灑喷嘴的喷流到達並清潔盒子的某一側與背内面,當轉 子將盒子移至如圖16中所示之位置,歧管402上之直線噴灑 噴嘴430最好以類似於圖21中之歧管410之直線噴灑的圖案 與結構噴灑在盒子之中與之内。然而,歧管402上之有角度 的噴灑噴嘴432以一 Θ角喷灑,而可更直接地噴灑與清潔尾 部外側表面452與前方内側角454及内側壁456。 回到圖23,當盒子52旋轉至歧管404的範圍中時,歧管404 上之直線噴灑噴嘴430以類似於歧管410與402上之直線噴 嘴430的方式喷灑至盒子之中與之上。然而,歧管404上之 -23 - 本紙張尺度適用中國國家標準(CNS) A4規格(210 X 297公釐) 1223345 A7 B7 五、發明説明(20 ) 有角度的噴灑噴嘴432以一角度噴灑下來,因而可更佳地清 潔盒子的上表面450。 回到圖24,藉由囀子的旋轉,盒子移動至歧管406的範圍 中,歧管406之直線噴灑噴嘴430如上述般相對於歧管412、 402與404上之直線喷灑噴嘴喷灑至盒子之中或之上,歧管 406上之有角度的噴灑噴嘴432以-Θ角的角度噴灑,以較佳 地覆蓋與清潔盒子的前部外側壁與尾部内側角。 參照圖25,當盒子52移動至歧管408的範圍中時,歧管408 上之直線噴灑喷嘴430如上述地噴灑至盒子之中與之上,歧 管408上之有角度的噴灑歧管432噴灑上來,因而較佳地清 潔盒子的下表面。轉子通常以200-500 rpm的速度旋轉,一 般來說,在A方向的旋轉之後,將旋轉方向反轉,如此一 來,歧管402與406上之有角度的噴嘴之前部/尾部的關係亦 會反轉。 為了更有效地製造,歧管402-410可為相同的,接著如上 述般將噴嘴420與432裝置在左、右、上或下的方向中,當 然只需要有單一歧管的設計與兩個噴嘴的設計,以製造所 有的歧管402、404、406、408與410。在此例中,歧管404 具有向下噴灑的噴嘴432,而歧管408具有向上噴灑且可用 栓460關閉噴嘴孔的噴嘴432,以避免向上或向下之有角度 的喷灑圖案干擾到相鄰的直線噴灑圖案。 直線噴灑喷嘴430最好以15-45度,最好是30度的立體錐 角噴灑出來,所有的外噴灑歧管最好是具有比有角度的噴 灑噴嘴還多之直線喷灑噴嘴,如此可提供盒子與轉子本身 -24 - 本紙張尺度適用中國國家標準(CNS) A4規格(210X297公釐)1223345 A7 B7 V. Description of the invention (18) In order to avoid interference with adjacent spray nozzles, the downward spray angle 432 on the second outer spray manifold 404 and the upward angle on the fourth outer spray manifold 408 The spray nozzles are preferably spaced a sufficient distance from the next lower and upper straight spray nozzles 430 to avoid comprehensive conflicting patterns. In this way, the distance between the linear spray nozzles 430 and the angled spray nozzles 432 on the second and fourth outer spray manifolds 404 and 408 is preferably not equal; on the contrary, the first outer spray manifold 402 The distance from the angled spray nozzle 432 on the third outer spray manifold 406 preferably approaches. The upper and lower angles of the angled spray nozzles 432 on the fourth outer spray manifold 408 and the second outer spray manifold 404 need not be equal, or need to be equal to the first outer spray manifold 402 and the third outer spray manifold. The angle Θ of the angled spray nozzle 432 on 406 is equal. The angle can vary with different applications, but preferably all angles (right of manifold 402, below manifold 404, left of manifold 406 and above manifold 408) are between 10 to 80 degrees, 20 to 70 degrees 30 to 50 degrees, and more preferably 40 to 50 degrees. In the exemplary embodiment, all angled spray nozzles are designed to spray at an angle of Θ of 45 degrees. Manifolds 402, 404, 406, and 408 are preferably equally spaced at 90-degree intervals on the periphery of the side wall of the chamber, and it is preferred that the manifolds 402, 404, 406, and 408 each have an angled spray nozzle. There is at least one linear spray manifold 410, preferably as shown in FIG. 22, with only linear spray nozzles 430. The inner spray nozzles 412 preferably all have only linear spray nozzles 430 mainly for cleaning the back surface of the box; however, the inner spray manifold 412 may also have an angled spray nozzle 432 similar to the outer spray manifold. In the exemplary embodiment, there are a total of eight external spraying manifolds 402, 404, and -22-This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 1223345 A7 B7 V. Description of the invention (19 ) 406, 408 and four outer straight spraying manifolds 410, preferably eight inner liquid spraying manifolds, as shown in FIG. 22, can be aligned with the outer spraying manifolds, or can be offset or vertically The staggering can also be an angular offset, so that the spray from the inner liquid spray manifold 412 is aligned with a point between the two outer spray manifolds. If necessary, the vertical positions of the nozzles 430 and 432 on the outer spray manifold can be offset or staggered to provide a wider range of spray coverage. As shown in Figs. 27 and 28, the angled spray manifold 432 includes a guide surface 434 extending through the nozzle outlet 436 to create a cone-shaped spray pattern at an angle of Θ toward the end of the axis of the nozzle body 438. When installed, the shaft N substantially intersects the center of rotation of the rotor C, and the guide surface 434 may extend the spray pattern at an angle Θ with respect to the shaft N. Figure 21-26 shows the operation of the box cleaner 400 rotating in the A direction when the rotor is loaded with a box, supplying cleaning fluid to all the manifolds 402, 404, 406, 408, 410, and 412, so that it is best to All spray nozzles 430 and 432 on the tube spray liquid. In FIG. 21, the jet flow from the linear spray nozzle of the manifold 410 reaches and cleans one side of the box and the inner surface of the back. When the rotor moves the box to the position as shown in FIG. The linear spray nozzle 430 is preferably sprayed into and inside the box in a pattern and structure similar to the linear spray pattern of the manifold 410 in FIG. 21. However, the angled spray nozzle 432 on the manifold 402 sprays at an angle of Θ, which can more directly spray and clean the tail outer surface 452 and the front inner corner 454 and the inner side wall 456. Returning to FIG. 23, when the box 52 is rotated into the range of the manifold 404, the linear spray nozzle 430 on the manifold 404 sprays into the box in a manner similar to the linear nozzle 430 on the manifolds 410 and 402. on. However, -23 of the manifold 404-This paper size applies to the Chinese National Standard (CNS) A4 (210 X 297 mm) 1223345 A7 B7 V. Description of the invention (20) Angled spray nozzle 432 sprays at an angle Therefore, the upper surface 450 of the box can be better cleaned. Returning to FIG. 24, by the rotation of the mule, the box moves into the range of the manifold 406, and the linear spray nozzle 430 of the manifold 406 sprays with respect to the linear spray nozzles on the manifolds 412, 402, and 404 as described above. To or in the box, the angled spray nozzle 432 on the manifold 406 sprays at an angle of -Θ to better cover and clean the front outer side wall and the rear inner corner of the box. Referring to FIG. 25, when the box 52 moves into the range of the manifold 408, the linear spray nozzle 430 on the manifold 408 sprays into and above the box as described above, and the angled spray manifold 432 on the manifold 408 Sprayed up, so the lower surface of the box is better cleaned. The rotor usually rotates at a speed of 200-500 rpm. Generally speaking, after the rotation in the direction A, the direction of rotation is reversed. In this way, the relationship between the front / tail of the angled nozzles on the manifolds 402 and 406 is also Will reverse. For more efficient manufacturing, the manifolds 402-410 can be the same, and then the nozzles 420 and 432 are installed in the left, right, up or down direction as described above. Of course, only a single manifold design and two Nozzles are designed to make all the manifolds 402, 404, 406, 408, and 410. In this example, the manifold 404 has a nozzle 432 that sprays downwards, and the manifold 408 has a nozzle 432 that sprays upwards and can close the nozzle hole with the plug 460 to avoid interference with the upward or downward angled spray patterns. Adjacent straight spray pattern. The linear spray nozzle 430 is preferably sprayed at a three-dimensional cone angle of 15-45 degrees, and preferably 30 degrees. All external spray manifolds preferably have more linear spray nozzles than angled spray nozzles. Provide box and rotor itself-24-This paper size applies to China National Standard (CNS) A4 specification (210X297 mm)
裝Hold
12233451223345
^清t在-歧管上使料有有角度之噴 子的清針對如具有兩個盒子位置之梯予5。=:最 好在歧s 402-408上有兩個、三個或四個有角度的噴嘴針 對具有更多盒子位置的梯子,最好有更多的有角度之喷嘴。 因此:利用在朝向或遠離旋轉方向,或上或下而央^負 度4歧T上具有嘴灑喷嘴’可達成改善的清潔。當狹,亦 可同樣:也'直線嘴灑嘴嘴以-角度或偏移貼附在二政管 上或疋歧貧本身即為有角度的,而使喷嘴以一角度嘴灌 出來’以達成上述之優點。在具有轉子上持=是 FOUP門的盒清潔器之中亦可使用有角度的喷灑圖案,歧管 402-408不可具有至少一個在刊方向噴灑之有角度的喷灑 噴嘴,及至少一個在-θ方向噴灑之有角度的喷灑噴嘴(在同 一歧管上)。 -25 - 本紙張尺度適用中國國家標準(CNS) Α4規格(210X297公釐)^ Clear the nozzle on the -manifold to make the material angled, such as a ladder with two box positions. =: It is better to have two, three or four angled nozzles on the s 402-408. For ladders with more box positions, it is better to have more angled nozzles. Therefore: the use of a nozzle having a nozzle in the direction of moving away from the direction of rotation, or upward or downward, and the central axis of the negative 4 ° T can achieve improved cleaning. When it is narrow, it can be the same: it is also 'straight mouth sprinkler mouth nozzle attached to the second political pipe at an angle or offset, or the poor is itself angled, and the nozzle is poured out at an angle' to achieve The advantages mentioned above. An angled spray pattern can also be used in a box cleaner with a rotor holding = FOUP door. The manifolds 402-408 must not have at least one angled spray nozzle spraying in the direction of the magazine, and at least one Angled spray nozzle (on the same manifold) spraying in the -θ direction. -25-This paper size applies to China National Standard (CNS) Α4 size (210X297 mm)
Claims (1)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US90503001A | 2001-07-12 | 2001-07-12 | |
US10/108,278 US6691718B2 (en) | 1999-07-28 | 2002-03-26 | Wafer container cleaning system |
Publications (1)
Publication Number | Publication Date |
---|---|
TWI223345B true TWI223345B (en) | 2004-11-01 |
Family
ID=26805734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW91115539A TWI223345B (en) | 2001-07-12 | 2002-07-12 | Method and apparatus for cleaning semiconductor wafers and other flat media |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1404463A4 (en) |
JP (1) | JP2004535071A (en) |
TW (1) | TWI223345B (en) |
WO (1) | WO2003006183A2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110808219A (en) * | 2019-11-01 | 2020-02-18 | 江苏亚电科技有限公司 | Wafer storage box cleaning device and cleaning method |
CN116037592A (en) * | 2022-12-27 | 2023-05-02 | 无锡亚电智能装备有限公司 | Wafer basket cleaning equipment for wafer box |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101886414B1 (en) * | 2016-09-27 | 2018-08-09 | 주식회사 유닉 | Apparatus and system for cleaning wafer container |
CN108565235B (en) * | 2018-05-31 | 2024-03-01 | 亚智系统科技(苏州)有限公司 | Surface treatment and packaging system for fan-out type wafer-level chip and operation method |
JP7450844B2 (en) * | 2018-07-06 | 2024-03-18 | シェルバック セミコンダクター テクノロジー リミテッド ライアビリティ カンパニー | Systems and methods for spray measuring equipment |
CN108940996A (en) * | 2018-07-27 | 2018-12-07 | 深圳市凯尔迪光电科技有限公司 | High-accuracy integrated circuit eccentric cleaning equipment |
CN111081594B (en) * | 2019-09-25 | 2022-09-30 | 北京时代民芯科技有限公司 | Cleaning tool and method for JLCC image sensor circuit before packaging |
CN112191588B (en) * | 2020-09-18 | 2021-12-21 | 程瑶 | Cleaning machine and cleaning method matched with solar power generation panel in production process |
KR102587371B1 (en) * | 2020-12-21 | 2023-10-12 | 주식회사 뉴파워 프라즈마 | Cleaning chamber including lifting cover door, glass chemical-strengthening apparatus including the same and method for strengthening ultra thin glass |
CN115338173B (en) * | 2022-08-31 | 2023-09-26 | 浙江中科智谷光电科技有限公司 | Cleaning equipment for liquid crystal module processing and control method |
CN117644074A (en) * | 2024-01-30 | 2024-03-05 | 深圳市龙图光罩股份有限公司 | Mask cleaning method, device, terminal equipment and storage medium |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4437479A (en) * | 1981-12-30 | 1984-03-20 | Atcor | Decontamination apparatus for semiconductor wafer handling equipment |
US4736759A (en) * | 1986-02-21 | 1988-04-12 | Robert A. Coberly | Apparatus for cleaning rinsing and drying substrates |
US5238503A (en) * | 1991-04-09 | 1993-08-24 | International Business Machines Corporation | Device for decontaminating a semiconductor wafer container |
US5363867A (en) * | 1992-01-21 | 1994-11-15 | Shinko Electric Co., Ltd. | Article storage house in a clean room |
US5301700A (en) * | 1992-03-05 | 1994-04-12 | Tokyo Electron Limited | Washing system |
US5224503A (en) * | 1992-06-15 | 1993-07-06 | Semitool, Inc. | Centrifugal wafer carrier cleaning apparatus |
US5520205A (en) * | 1994-07-01 | 1996-05-28 | Texas Instruments Incorporated | Apparatus for wafer cleaning with rotation |
US6096100A (en) * | 1997-12-12 | 2000-08-01 | Texas Instruments Incorporated | Method for processing wafers and cleaning wafer-handling implements |
DE19740352A1 (en) * | 1997-09-13 | 1999-03-18 | Zf Frledrichshafen Aktiengesel | Vehicle power steering valve with centering device |
WO1999034939A1 (en) * | 1998-01-09 | 1999-07-15 | Fluoroware, Inc. | Wafer container washing apparatus |
US6412502B1 (en) * | 1999-07-28 | 2002-07-02 | Semitool, Inc. | Wafer container cleaning system |
-
2002
- 2002-07-09 JP JP2003511982A patent/JP2004535071A/en active Pending
- 2002-07-09 WO PCT/US2002/021997 patent/WO2003006183A2/en active Application Filing
- 2002-07-09 EP EP02749953A patent/EP1404463A4/en not_active Withdrawn
- 2002-07-12 TW TW91115539A patent/TWI223345B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110808219A (en) * | 2019-11-01 | 2020-02-18 | 江苏亚电科技有限公司 | Wafer storage box cleaning device and cleaning method |
CN116037592A (en) * | 2022-12-27 | 2023-05-02 | 无锡亚电智能装备有限公司 | Wafer basket cleaning equipment for wafer box |
Also Published As
Publication number | Publication date |
---|---|
JP2004535071A (en) | 2004-11-18 |
WO2003006183A2 (en) | 2003-01-23 |
EP1404463A2 (en) | 2004-04-07 |
WO2003006183A3 (en) | 2003-02-27 |
EP1404463A4 (en) | 2004-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI223345B (en) | Method and apparatus for cleaning semiconductor wafers and other flat media | |
US20050268944A1 (en) | Method and apparatus for cleaning containers | |
KR100654698B1 (en) | Method and Apparatus for Processing Substrate | |
JP3786549B2 (en) | Semiconductor wet etching equipment | |
CN100501921C (en) | Substrate processing method and substrate processing apparatus | |
US20120064727A1 (en) | Substrate treatment equipment and method of treating substrate using the same | |
KR100539294B1 (en) | High-pressure treatment apparatus and high-pressure treatment method | |
KR20080110007A (en) | Apparatus for treating substrate and method for cleaning nozzle thereof | |
JP2003092283A (en) | Apparatus and method for processing substrate | |
US20020036006A1 (en) | Wet cleaning process and wet cleaning equipment | |
US20070032910A1 (en) | Apparatus for dispensing precise volumes of fluid | |
CN115780358A (en) | Cleaning device for semiconductor material preparation | |
KR20080011792A (en) | Apparatus and method for cleaning semiconductor substrates | |
KR100914533B1 (en) | Apparatus for supplying chemicals | |
CN208465784U (en) | The mixing arrangement of medical fluid and supercritical fluid | |
CN100392799C (en) | Basic plate processing plant and cleaning method | |
JP2004267871A (en) | Treatment liquid supply nozzle, treatment liquid supply apparatus, and nozzle washing method | |
JP3359874B2 (en) | Nozzle structure of cleaning device and cleaning method | |
JPH06296943A (en) | Ultrasonic cleaner | |
KR100661391B1 (en) | Apparatus for depositing particles for manufacturing a standard wafer | |
JP2002170805A (en) | Wafer washing apparatus | |
JPH07122485A (en) | Treating method and treating equipment | |
KR100219414B1 (en) | A cleaning apparatus for semiconductor process | |
JP3243875U (en) | quick connector cleaning machine | |
JP2003338480A (en) | Spin treating device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |