JP2004531051A5 - - Google Patents

Download PDF

Info

Publication number
JP2004531051A5
JP2004531051A5 JP2002558338A JP2002558338A JP2004531051A5 JP 2004531051 A5 JP2004531051 A5 JP 2004531051A5 JP 2002558338 A JP2002558338 A JP 2002558338A JP 2002558338 A JP2002558338 A JP 2002558338A JP 2004531051 A5 JP2004531051 A5 JP 2004531051A5
Authority
JP
Japan
Prior art keywords
terminal
semiconductor body
assigned
conductor
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002558338A
Other languages
English (en)
Japanese (ja)
Other versions
JP3886905B2 (ja
JP2004531051A (ja
Filing date
Publication date
Priority claimed from DE10102354A external-priority patent/DE10102354C1/de
Application filed filed Critical
Publication of JP2004531051A publication Critical patent/JP2004531051A/ja
Publication of JP2004531051A5 publication Critical patent/JP2004531051A5/ja
Application granted granted Critical
Publication of JP3886905B2 publication Critical patent/JP3886905B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002558338A 2001-01-19 2002-01-21 Ｅｓｄ保護を備える半導体部品 Expired - Fee Related JP3886905B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10102354A DE10102354C1 (de) 2001-01-19 2001-01-19 Halbleiter-Bauelement mit ESD-Schutz
PCT/DE2002/000175 WO2002058154A2 (de) 2001-01-19 2002-01-21 Halbleiter-bauelement mit esd-schutz

Publications (3)

Publication Number Publication Date
JP2004531051A JP2004531051A (ja) 2004-10-07
JP2004531051A5 true JP2004531051A5 (https=) 2005-05-19
JP3886905B2 JP3886905B2 (ja) 2007-02-28

Family

ID=7671118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002558338A Expired - Fee Related JP3886905B2 (ja) 2001-01-19 2002-01-21 Ｅｓｄ保護を備える半導体部品

Country Status (7)

Country Link
US (1) US7250659B2 (https=)
EP (1) EP1360726B1 (https=)
JP (1) JP3886905B2 (https=)
KR (1) KR100530449B1 (https=)
CN (1) CN1244151C (https=)
DE (2) DE10102354C1 (https=)
WO (1) WO2002058154A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004031455B4 (de) * 2004-06-29 2014-10-30 Infineon Technologies Ag Verfahren zur Erstellung eines ESD-Schutzes bei einem mikroelektronischen Baustein und entsprechend ausgebildeter mikroelektronischer Baustein
US9387313B2 (en) 2004-08-03 2016-07-12 Interventional Spine, Inc. Telescopic percutaneous tissue dilation systems and related methods
JP4993092B2 (ja) * 2007-05-31 2012-08-08 富士電機株式会社 レベルシフト回路および半導体装置
US7586179B2 (en) * 2007-10-09 2009-09-08 Fairchild Semiconductor Corporation Wireless semiconductor package for efficient heat dissipation
US10015916B1 (en) * 2013-05-21 2018-07-03 Xilinx, Inc. Removal of electrostatic charges from an interposer via a ground pad thereof for die attach for formation of a stacked die
US9960227B2 (en) 2013-09-11 2018-05-01 Xilinx, Inc. Removal of electrostatic charges from interposer for die attachment
US11088134B2 (en) 2016-11-07 2021-08-10 Dialog Semiconductor (Uk) Limited Electrostatic discharge device and split multi rail network with symmetrical layout design technique

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065705B2 (ja) * 1989-08-11 1994-01-19 株式会社東芝 半導体集積回路装置
JPH03156965A (ja) * 1989-11-15 1991-07-04 Fujitsu Ltd 半導体集積回路装置
JPH05308107A (ja) * 1991-07-01 1993-11-19 Sumitomo Electric Ind Ltd 半導体装置及びその製作方法
JP2888005B2 (ja) * 1992-01-24 1999-05-10 住友電気工業株式会社 マイクロ波デバイス用パッケージ
EP0623958B1 (de) * 1993-05-04 1998-04-01 Siemens Aktiengesellschaft Integrierte Halbleiterschaltung mit einem Schutzmittel
DE19507313C2 (de) * 1995-03-02 1996-12-19 Siemens Ag Halbleiterbauelement mit Schutzstruktur zum Schutz vor elektrostatischer Entladung
DE59510495D1 (de) * 1995-04-06 2003-01-16 Infineon Technologies Ag Integrierte Halbleiterschaltung mit einem Schutzmittel
US5917362A (en) * 1996-01-29 1999-06-29 Sony Corporation Switching circuit
JPH1022448A (ja) 1996-07-03 1998-01-23 Oki Micro Design Miyazaki:Kk 静電破壊／ラッチアップ対策半導体装置
US6476486B1 (en) * 1997-10-30 2002-11-05 Agilent Technologies, Inc. Ball grid array package with supplemental electronic component
US5886862A (en) * 1997-11-26 1999-03-23 Digital Equipment Corporation Cross-referenced electrostatic discharge protection systems and methods for power supplies

Similar Documents

Publication Publication Date Title
EP1424731A3 (en) Electronic parts packaging structure and method of manufacturing the same
WO2002058152A3 (en) Electronic circuit device and method for manufacturing the same
EP1434268A3 (en) Electronic substrate, power module and motor driver
JPH04307943A (ja) 半導体装置
EP1447845A3 (en) Package of electronic components and method for producing the same
JP2005348120A5 (https=)
EP1498948A3 (en) A reconnectable chip interface and chip package
JP2004531051A5 (https=)
JPH11298094A (ja) フレキシブルプリント配線板
CN110473860B (zh) 具有集成分流电阻器的半导体器件及其制造方法
TW200610110A (en) LSI package possessing interface function with exterior, circuit device including the same, and manufacturing method of circuit device
JP2005347369A5 (https=)
EP1391936A3 (en) Semiconductor array device with single interconnection layer
EP1309003A3 (en) Wiring arrangement for surface mounted device
TW200603341A (en) Semiconductor device
WO2006005304A3 (de) Halbleiterbauteil mit einem halbleiterchip und elektrischen verbindungselementen zu einer leiterstruktur
JP3886905B2 (ja) Ｅｓｄ保護を備える半導体部品
TW200501843A (en) Hybrid integrated circuit
TW200729440A (en) Electronic assembly having graded wire bonding
EP1387606A3 (en) Device for controlling a vehicle
JP2002299568A (ja) Ｉｃチップ
CN102027285A (zh) 采用导线束合方法的引线框及使用该引线框的led电源灯
CN100353553C (zh) 半导体集成装置
JP2004031562A5 (https=)
JPH0555719A (ja) 回路基板装置