JP2004530870A5 - - Google Patents

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Publication number
JP2004530870A5
JP2004530870A5 JP2002572429A JP2002572429A JP2004530870A5 JP 2004530870 A5 JP2004530870 A5 JP 2004530870A5 JP 2002572429 A JP2002572429 A JP 2002572429A JP 2002572429 A JP2002572429 A JP 2002572429A JP 2004530870 A5 JP2004530870 A5 JP 2004530870A5
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JP
Japan
Prior art keywords
ground
probe
grounding
spring
spring probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002572429A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004530870A (ja
JP4106273B2 (ja
Filing date
Publication date
Priority claimed from US09/804,782 external-priority patent/US6447328B1/en
Application filed filed Critical
Publication of JP2004530870A publication Critical patent/JP2004530870A/ja
Publication of JP2004530870A5 publication Critical patent/JP2004530870A5/ja
Application granted granted Critical
Publication of JP4106273B2 publication Critical patent/JP4106273B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002572429A 2001-03-13 2001-12-11 スプリングプローブを保持する方法および装置 Expired - Fee Related JP4106273B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/804,782 US6447328B1 (en) 2001-03-13 2001-03-13 Method and apparatus for retaining a spring probe
PCT/US2001/047640 WO2002073220A2 (en) 2001-03-13 2001-12-11 Method and apparatus for retaining a spring probe

Publications (3)

Publication Number Publication Date
JP2004530870A JP2004530870A (ja) 2004-10-07
JP2004530870A5 true JP2004530870A5 (enExample) 2005-12-22
JP4106273B2 JP4106273B2 (ja) 2008-06-25

Family

ID=25189817

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002572429A Expired - Fee Related JP4106273B2 (ja) 2001-03-13 2001-12-11 スプリングプローブを保持する方法および装置

Country Status (8)

Country Link
US (1) US6447328B1 (enExample)
EP (1) EP1368666B1 (enExample)
JP (1) JP4106273B2 (enExample)
KR (1) KR100831787B1 (enExample)
CN (1) CN1288449C (enExample)
AT (1) ATE291234T1 (enExample)
DE (1) DE60109499T2 (enExample)
WO (1) WO2002073220A2 (enExample)

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KR20040087341A (ko) 2002-03-05 2004-10-13 리카 일렉트로닉스 인터내셔널, 인크. 전자 패키지와 테스트 장비를 인터페이싱시키기 위한 장치
US6902416B2 (en) 2002-08-29 2005-06-07 3M Innovative Properties Company High density probe device
US6696850B1 (en) * 2002-10-02 2004-02-24 Interconnect Devices, Inc. Contact probe with off-centered back-drilled aperture
US6824427B1 (en) * 2003-05-13 2004-11-30 3M Innovative Properties Company Coaxial probe interconnection system
US7015708B2 (en) * 2003-07-11 2006-03-21 Gore Enterprise Holdings, Inc. Method and apparatus for a high frequency, impedance controlled probing device with flexible ground contacts
JP4053962B2 (ja) * 2003-10-15 2008-02-27 株式会社東芝 半導体装置
WO2006007440A1 (en) * 2004-06-16 2006-01-19 Rika Denshi America, Inc. Electrical test probes, methods of making, and methods of using
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JP4757531B2 (ja) * 2005-04-28 2011-08-24 日本発條株式会社 導電性接触子ホルダおよび導電性接触子ユニット
US7298153B2 (en) * 2005-05-25 2007-11-20 Interconnect Devices, Inc. Eccentric offset Kelvin probe
US7740508B2 (en) * 2008-09-08 2010-06-22 3M Innovative Properties Company Probe block assembly
US20100194419A1 (en) * 2009-02-05 2010-08-05 Chan Edward K Multi-contact probe assembly
US7850489B1 (en) 2009-08-10 2010-12-14 3M Innovative Properties Company Electrical connector system
US7997933B2 (en) 2009-08-10 2011-08-16 3M Innovative Properties Company Electrical connector system
US7909646B2 (en) * 2009-08-10 2011-03-22 3M Innovative Properties Company Electrical carrier assembly and system of electrical carrier assemblies
US7927144B2 (en) * 2009-08-10 2011-04-19 3M Innovative Properties Company Electrical connector with interlocking plates
US8905795B2 (en) 2011-10-12 2014-12-09 Apple Inc. Spring-loaded contacts
JP6179780B2 (ja) 2011-10-24 2017-08-16 アーデント コンセプツ，インコーポレイテッド 被制御インピーダンスケーブル終端部アセンブリ
USRE47459E1 (en) 2011-10-24 2019-06-25 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
USRE46958E1 (en) 2011-10-24 2018-07-17 Ardent Concepts, Inc. Controlled-impedance cable termination using compliant interconnect elements
US20130330983A1 (en) * 2012-06-10 2013-12-12 Apple Inc. Spring-loaded contacts having sloped backside with retention guide
KR101403048B1 (ko) * 2012-06-26 2014-06-09 주식회사 오킨스전자 고주파 특성을 갖는 반도체 디바이스 테스트소켓
TWI555987B (zh) * 2014-01-28 2016-11-01 Spring sleeve type probe and its manufacturing method
CN104280678B (zh) * 2014-10-30 2018-11-27 通富微电子股份有限公司 半导体测试治具
CN106645809A (zh) * 2016-10-14 2017-05-10 厦门大学 一种双重包覆壳层隔绝针尖的制备方法
US10705118B2 (en) * 2017-03-23 2020-07-07 Ford Global Technologies, Llc Power module testing apparatus
CN108663553B (zh) * 2017-03-29 2022-01-25 上海中船电气有限公司 一种接触式半导体材料测试头
JP7346026B2 (ja) 2018-12-26 2023-09-19 株式会社日本マイクロニクス 電気的接続装置
CN218938344U (zh) * 2020-04-22 2023-04-28 株式会社村田制作所 检查用连接器以及检查用单元
US11293976B1 (en) * 2020-09-25 2022-04-05 Essai, Inc. Integrated circuit device test tooling with dual angle cavities
US11942722B2 (en) 2020-09-25 2024-03-26 Apple Inc. Magnetic circuit for magnetic connector
US11437747B2 (en) 2020-09-25 2022-09-06 Apple Inc. Spring-loaded contacts having capsule intermediate object
KR102503437B1 (ko) * 2021-04-26 2023-02-24 주식회사 에이플러스알에프 인쇄회로기판 테스트용 커넥터

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US4712062A (en) 1984-12-20 1987-12-08 Hughes Aircraft Company Ground shield apparatus for giga-hertz test jig
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JPH0178029U (enExample) * 1987-11-13 1989-05-25
US4965514A (en) 1989-06-05 1990-10-23 Tektronix, Inc. Apparatus for probing a microwave circuit
US5144228A (en) 1991-04-23 1992-09-01 International Business Machines Corporation Probe interface assembly
JPH0529407A (ja) * 1991-07-19 1993-02-05 Fujitsu Ltd 回路基板試験装置
US5477159A (en) 1992-10-30 1995-12-19 Hewlett-Packard Company Integrated circuit probe fixture with detachable high frequency probe carrier
US5308250A (en) 1992-10-30 1994-05-03 Hewlett-Packard Company Pressure contact for connecting a coaxial shield to a microstrip ground plane
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US5917330A (en) 1996-01-17 1999-06-29 Miley; David M. Probe ring having electrical components affixed thereto and related apparatus and processes
US5936415A (en) 1996-12-20 1999-08-10 Xilinx, Inc. Method and apparatus for a pin-configurable integrated circuit tester board
DE59810893D1 (de) * 1997-11-05 2004-04-08 Feinmetall Gmbh Prüfkopf für Mikrostrukturen mit Schnittstelle
TW438980B (en) * 1998-03-24 2001-06-07 Teradyne Inc High performance probe interface for automatic test equipment
US6160412A (en) * 1998-11-05 2000-12-12 Wentworth Laboratories, Inc. Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
US6196866B1 (en) * 1999-04-30 2001-03-06 International Business Machines Corporation Vertical probe housing
JP2001004659A (ja) * 1999-06-17 2001-01-12 Yokowo Co Ltd 測定用同軸型プローブ

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