JP2004530791A5 - - Google Patents

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Publication number
JP2004530791A5
JP2004530791A5 JP2002585704A JP2002585704A JP2004530791A5 JP 2004530791 A5 JP2004530791 A5 JP 2004530791A5 JP 2002585704 A JP2002585704 A JP 2002585704A JP 2002585704 A JP2002585704 A JP 2002585704A JP 2004530791 A5 JP2004530791 A5 JP 2004530791A5
Authority
JP
Japan
Prior art keywords
chamber
anode assembly
solution
orifice
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002585704A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004530791A (ja
Filing date
Publication date
Priority claimed from US09/845,262 external-priority patent/US6695962B2/en
Application filed filed Critical
Publication of JP2004530791A publication Critical patent/JP2004530791A/ja
Publication of JP2004530791A5 publication Critical patent/JP2004530791A5/ja
Pending legal-status Critical Current

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JP2002585704A 2001-05-01 2002-02-06 平坦な基板表面へ電解液を供給するための陽極組立体及び方法 Pending JP2004530791A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/845,262 US6695962B2 (en) 2001-05-01 2001-05-01 Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs
PCT/US2002/003330 WO2002088431A1 (en) 2001-05-01 2002-02-06 Anode assembly and process for supplying electrolyte to a planar substrate surface

Publications (2)

Publication Number Publication Date
JP2004530791A JP2004530791A (ja) 2004-10-07
JP2004530791A5 true JP2004530791A5 (enExample) 2005-12-22

Family

ID=25294798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002585704A Pending JP2004530791A (ja) 2001-05-01 2002-02-06 平坦な基板表面へ電解液を供給するための陽極組立体及び方法

Country Status (6)

Country Link
US (2) US6695962B2 (enExample)
EP (1) EP1392889A4 (enExample)
JP (1) JP2004530791A (enExample)
KR (1) KR100834174B1 (enExample)
CN (1) CN1289712C (enExample)
WO (1) WO2002088431A1 (enExample)

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DE10322894A1 (de) * 2003-05-21 2004-12-16 Prominent Dosiertechnik Gmbh Chloritsensor
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US9523155B2 (en) 2012-12-12 2016-12-20 Novellus Systems, Inc. Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
KR101607537B1 (ko) * 2014-09-26 2016-03-31 주식회사 티케이씨 웨이퍼 도금시 아노드에서 발생되는 가스의 제거 기능을 가진 도금장치
US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) * 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
WO2020097354A2 (en) * 2018-11-09 2020-05-14 Illinois Tool Works Inc. Modular fluid application device for varying fluid coat weight
CN110528042B (zh) * 2019-08-28 2021-02-09 深圳赛意法微电子有限公司 一种半导体器件电镀方法及用于电镀的活化槽

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