JP2004530791A - 平坦な基板表面へ電解液を供給するための陽極組立体及び方法 - Google Patents

平坦な基板表面へ電解液を供給するための陽極組立体及び方法 Download PDF

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Publication number
JP2004530791A
JP2004530791A JP2002585704A JP2002585704A JP2004530791A JP 2004530791 A JP2004530791 A JP 2004530791A JP 2002585704 A JP2002585704 A JP 2002585704A JP 2002585704 A JP2002585704 A JP 2002585704A JP 2004530791 A JP2004530791 A JP 2004530791A
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JP
Japan
Prior art keywords
chamber
solution
anode
anode assembly
housing
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Pending
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JP2002585704A
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English (en)
Japanese (ja)
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JP2004530791A5 (enExample
Inventor
サイプリアン イー ウゾー
ホーマヨーン タリー
ブーレント エム バスール
Original Assignee
エヌユー トゥール インコーポレイテッド
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Publication of JP2004530791A publication Critical patent/JP2004530791A/ja
Publication of JP2004530791A5 publication Critical patent/JP2004530791A5/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/66—Wet etching of conductive or resistive materials
    • H10P50/663—Wet etching of conductive or resistive materials by chemical means only
    • H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/04—Planarisation of conductive or resistive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
JP2002585704A 2001-05-01 2002-02-06 平坦な基板表面へ電解液を供給するための陽極組立体及び方法 Pending JP2004530791A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/845,262 US6695962B2 (en) 2001-05-01 2001-05-01 Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs
PCT/US2002/003330 WO2002088431A1 (en) 2001-05-01 2002-02-06 Anode assembly and process for supplying electrolyte to a planar substrate surface

Publications (2)

Publication Number Publication Date
JP2004530791A true JP2004530791A (ja) 2004-10-07
JP2004530791A5 JP2004530791A5 (enExample) 2005-12-22

Family

ID=25294798

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002585704A Pending JP2004530791A (ja) 2001-05-01 2002-02-06 平坦な基板表面へ電解液を供給するための陽極組立体及び方法

Country Status (6)

Country Link
US (2) US6695962B2 (enExample)
EP (1) EP1392889A4 (enExample)
JP (1) JP2004530791A (enExample)
KR (1) KR100834174B1 (enExample)
CN (1) CN1289712C (enExample)
WO (1) WO2002088431A1 (enExample)

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CN110528042A (zh) * 2019-08-28 2019-12-03 深圳赛意法微电子有限公司 一种半导体器件电镀方法及用于电镀的活化槽

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US10781527B2 (en) * 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110528042A (zh) * 2019-08-28 2019-12-03 深圳赛意法微电子有限公司 一种半导体器件电镀方法及用于电镀的活化槽
CN110528042B (zh) * 2019-08-28 2021-02-09 深圳赛意法微电子有限公司 一种半导体器件电镀方法及用于电镀的活化槽

Also Published As

Publication number Publication date
CN1529769A (zh) 2004-09-15
CN1289712C (zh) 2006-12-13
US20020162750A1 (en) 2002-11-07
US6695962B2 (en) 2004-02-24
EP1392889A4 (en) 2006-10-04
WO2002088431A1 (en) 2002-11-07
KR20040038912A (ko) 2004-05-08
US20040163963A1 (en) 2004-08-26
EP1392889A1 (en) 2004-03-03
KR100834174B1 (ko) 2008-05-30

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