CN1289712C - 通过增强电解溶液混和来沉积平面金属的阳极设计以及使用这种设计供应电解溶液的工艺 - Google Patents

通过增强电解溶液混和来沉积平面金属的阳极设计以及使用这种设计供应电解溶液的工艺 Download PDF

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Publication number
CN1289712C
CN1289712C CNB028118448A CN02811844A CN1289712C CN 1289712 C CN1289712 C CN 1289712C CN B028118448 A CNB028118448 A CN B028118448A CN 02811844 A CN02811844 A CN 02811844A CN 1289712 C CN1289712 C CN 1289712C
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China
Prior art keywords
chamber
anode
solution
anode assembly
filter
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Expired - Lifetime
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CNB028118448A
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English (en)
Chinese (zh)
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CN1529769A (zh
Inventor
锡伯伦·E·尤左赫
赫马尤·泰莲
伯伦特·M·保索
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ASM Nutool Inc
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ASM Nutool Inc
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Publication of CN1529769A publication Critical patent/CN1529769A/zh
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/66—Wet etching of conductive or resistive materials
    • H10P50/663—Wet etching of conductive or resistive materials by chemical means only
    • H10P50/667—Wet etching of conductive or resistive materials by chemical means only by liquid etching only
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/04—Planarisation of conductive or resistive materials

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
CNB028118448A 2001-05-01 2002-02-06 通过增强电解溶液混和来沉积平面金属的阳极设计以及使用这种设计供应电解溶液的工艺 Expired - Lifetime CN1289712C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/845,262 US6695962B2 (en) 2001-05-01 2001-05-01 Anode designs for planar metal deposits with enhanced electrolyte solution blending and process of supplying electrolyte solution using such designs
US09/845,262 2001-05-01

Publications (2)

Publication Number Publication Date
CN1529769A CN1529769A (zh) 2004-09-15
CN1289712C true CN1289712C (zh) 2006-12-13

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028118448A Expired - Lifetime CN1289712C (zh) 2001-05-01 2002-02-06 通过增强电解溶液混和来沉积平面金属的阳极设计以及使用这种设计供应电解溶液的工艺

Country Status (6)

Country Link
US (2) US6695962B2 (enExample)
EP (1) EP1392889A4 (enExample)
JP (1) JP2004530791A (enExample)
KR (1) KR100834174B1 (enExample)
CN (1) CN1289712C (enExample)
WO (1) WO2002088431A1 (enExample)

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US10364505B2 (en) 2016-05-24 2019-07-30 Lam Research Corporation Dynamic modulation of cross flow manifold during elecroplating
US11001934B2 (en) 2017-08-21 2021-05-11 Lam Research Corporation Methods and apparatus for flow isolation and focusing during electroplating
US10781527B2 (en) * 2017-09-18 2020-09-22 Lam Research Corporation Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
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Also Published As

Publication number Publication date
CN1529769A (zh) 2004-09-15
JP2004530791A (ja) 2004-10-07
US20020162750A1 (en) 2002-11-07
US6695962B2 (en) 2004-02-24
EP1392889A4 (en) 2006-10-04
WO2002088431A1 (en) 2002-11-07
KR20040038912A (ko) 2004-05-08
US20040163963A1 (en) 2004-08-26
EP1392889A1 (en) 2004-03-03
KR100834174B1 (ko) 2008-05-30

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