JP2004524172A5 - - Google Patents

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Publication number
JP2004524172A5
JP2004524172A5 JP2002562213A JP2002562213A JP2004524172A5 JP 2004524172 A5 JP2004524172 A5 JP 2004524172A5 JP 2002562213 A JP2002562213 A JP 2002562213A JP 2002562213 A JP2002562213 A JP 2002562213A JP 2004524172 A5 JP2004524172 A5 JP 2004524172A5
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JP
Japan
Prior art keywords
substrate
forming
top surface
microprojections
microprojection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002562213A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004524172A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2002/003206 external-priority patent/WO2002062202A2/en
Publication of JP2004524172A publication Critical patent/JP2004524172A/ja
Publication of JP2004524172A5 publication Critical patent/JP2004524172A5/ja
Pending legal-status Critical Current

Links

JP2002562213A 2001-02-05 2002-02-05 マイクロ突起物アレイおよびマイクロ突起物の製造方法 Pending JP2004524172A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US26643101P 2001-02-05 2001-02-05
PCT/US2002/003206 WO2002062202A2 (en) 2001-02-05 2002-02-05 Microprotrusion array and methods of making a microprotrusion

Publications (2)

Publication Number Publication Date
JP2004524172A JP2004524172A (ja) 2004-08-12
JP2004524172A5 true JP2004524172A5 (https=) 2005-12-22

Family

ID=23014567

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002562213A Pending JP2004524172A (ja) 2001-02-05 2002-02-05 マイクロ突起物アレイおよびマイクロ突起物の製造方法

Country Status (4)

Country Link
EP (1) EP1364396A4 (https=)
JP (1) JP2004524172A (https=)
AU (1) AU2002250011A1 (https=)
WO (1) WO2002062202A2 (https=)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6663820B2 (en) * 2001-03-14 2003-12-16 The Procter & Gamble Company Method of manufacturing microneedle structures using soft lithography and photolithography
US7387742B2 (en) 2002-03-11 2008-06-17 Becton, Dickinson And Company Silicon blades for surgical and non-surgical use
BRPI0308319B1 (pt) 2002-03-11 2015-06-09 Beaver Visitec Int Us Inc Método para fabricar um dispositivo de corte de material cristalino e método para fabricar uma lâmina cirúrgica de material cristalino
US7578954B2 (en) * 2003-02-24 2009-08-25 Corium International, Inc. Method for manufacturing microstructures having multiple microelements with through-holes
EP1662970A2 (en) 2003-09-17 2006-06-07 Becton, Dickinson and Company System and method for creating linear and non-linear trenches in silicon and other crystalline materials with a router
WO2005060621A2 (en) * 2003-11-21 2005-07-07 The Regents Of The University Of California Method and/or apparatus for puncturing a surface for extraction, in situ analysis, and/or substance delivery using microneedles
US7396484B2 (en) 2004-04-30 2008-07-08 Becton, Dickinson And Company Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries
US7183215B2 (en) * 2004-07-21 2007-02-27 Hewlett-Packard Development Company, L.P. Etching with electrostatically attracted ions
JP5882556B2 (ja) * 2004-12-28 2016-03-09 ナブテスコ株式会社 皮膚用針、皮膚用針製造装置および皮膚用針製造方法
WO2006075716A1 (ja) * 2005-01-14 2006-07-20 Fujikura Ltd. 医薬物運搬用器具とその製造方法
US8277409B2 (en) * 2005-12-05 2012-10-02 Becton, Dickinson And Company Cutting element for a retracting needle syringe
DE102006028781A1 (de) * 2006-06-23 2007-12-27 Robert Bosch Gmbh Verfahren zur Herstellung von porösen Mikronadeln und ihre Verwendung
DE102006040642A1 (de) 2006-08-30 2008-03-13 Robert Bosch Gmbh Mikronadeln zur Platzierung in der Haut zwecks transdermaler Applikation von Pharmazeutika
US8911749B2 (en) 2007-04-16 2014-12-16 Corium International, Inc. Vaccine delivery via microneedle arrays
AU2008241470B2 (en) 2007-04-16 2013-11-07 Corium Pharma Solutions, Inc. Solvent-cast microneedle arrays containing active
JP5410057B2 (ja) * 2008-08-06 2014-02-05 Ｓｐｐテクノロジーズ株式会社 シリコン基板のエッチング方法
WO2011140274A2 (en) 2010-05-04 2011-11-10 Corium International, Inc. Method and device for transdermal delivery of parathyroid hormone using a microprojection array
JP5845808B2 (ja) * 2011-10-28 2016-01-20 凸版印刷株式会社 マイクロニードルデバイスおよびその製造方法
JP6865524B2 (ja) 2012-12-21 2021-04-28 コリウム， インコーポレイテッド 治療剤を送達するためのマイクロアレイおよび使用方法
CA3130120A1 (en) 2013-03-12 2014-10-09 Corium, Inc. Microprojection applicators
US9182368B2 (en) 2013-03-14 2015-11-10 Sano Intelligence, Inc. Method of manufacturing a sensor for sensing analytes
US10820860B2 (en) 2013-03-14 2020-11-03 One Drop Biosensor Technologies, Llc On-body microsensor for biomonitoring
RU2711567C2 (ru) 2013-03-15 2020-01-17 Кориум, ИНК. Микрочип для доставки лекарственного средства и способы его использования
JP6689187B2 (ja) 2013-03-15 2020-04-28 コリウム， インコーポレイテッド 複数の衝突微小突起アプリケータおよび使用方法
US10384045B2 (en) 2013-03-15 2019-08-20 Corium, Inc. Microarray with polymer-free microstructures, methods of making, and methods of use
WO2014144973A1 (en) 2013-03-15 2014-09-18 Corium International, Inc. Microarray for delivery of therapeutic agent, methods of use, and methods of making
WO2015138989A1 (en) 2014-03-13 2015-09-17 Sano Intelligence, Inc. System for monitoring body chemistry
US10595754B2 (en) 2014-03-13 2020-03-24 Sano Intelligence, Inc. System for monitoring body chemistry
EP3188714A1 (en) 2014-09-04 2017-07-12 Corium International, Inc. Microstructure array, methods of making, and methods of use
JP5967595B2 (ja) * 2014-09-08 2016-08-10 株式会社かいわ 穿刺器具
WO2017004067A1 (en) 2015-06-29 2017-01-05 Corium International, Inc. Microarray for delivery of therapeutic agent, methods of use, and methods of making
JP6608336B2 (ja) * 2016-06-06 2019-11-20 三島光産株式会社 マイクロニードルアレイ
CN110076528A (zh) * 2019-05-13 2019-08-02 大连理工大学 一种平面金属微针阵列及其制备方法
CN111675190A (zh) * 2020-06-18 2020-09-18 苏州恒之清生物科技有限公司 一种微型实心硅针的制备方法
USD1086030S1 (en) 2021-04-21 2025-07-29 One Health Biosensing Inc. Charging station
USD1076079S1 (en) 2021-04-21 2025-05-20 One Health Biosensing Inc. Applicator assembly
USD988882S1 (en) 2021-04-21 2023-06-13 Informed Data Systems Inc. Sensor assembly

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5753130A (en) * 1992-05-15 1998-05-19 Micron Technology, Inc. Method for forming a substantially uniform array of sharp tips
US5536988A (en) * 1993-06-01 1996-07-16 Cornell Research Foundation, Inc. Compound stage MEM actuator suspended for multidimensional motion
US5779514A (en) * 1996-02-13 1998-07-14 National Science Council Technique to fabricate chimney-shaped emitters for field-emission devices
FR2764441B1 (fr) * 1997-06-05 2001-05-18 Suisse Electronique Microtech Procede de fabrication d'un organe palpeur pour capteur micromecanique, notamment pour microscope a force atomique
WO1999064580A1 (en) * 1998-06-10 1999-12-16 Georgia Tech Research Corporation Microneedle devices and methods of manufacture and use thereof
US6503231B1 (en) * 1998-06-10 2003-01-07 Georgia Tech Research Corporation Microneedle device for transport of molecules across tissue
US6406638B1 (en) * 2000-01-06 2002-06-18 The Regents Of The University Of California Method of forming vertical, hollow needles within a semiconductor substrate, and needles formed thereby

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