JP2004524172A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004524172A5 JP2004524172A5 JP2002562213A JP2002562213A JP2004524172A5 JP 2004524172 A5 JP2004524172 A5 JP 2004524172A5 JP 2002562213 A JP2002562213 A JP 2002562213A JP 2002562213 A JP2002562213 A JP 2002562213A JP 2004524172 A5 JP2004524172 A5 JP 2004524172A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- forming
- top surface
- microprojections
- microprojection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 20
- 239000000758 substrate Substances 0.000 claims 20
- 238000005530 etching Methods 0.000 claims 10
- 230000000873 masking effect Effects 0.000 claims 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Chemical compound [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 claims 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000000908 ammonium hydroxide Substances 0.000 claims 1
- 229910021417 amorphous silicon Inorganic materials 0.000 claims 1
- ONRPGGOGHKMHDT-UHFFFAOYSA-N benzene-1,2-diol;ethane-1,2-diamine Chemical compound NCCN.OC1=CC=CC=C1O ONRPGGOGHKMHDT-UHFFFAOYSA-N 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910017604 nitric acid Inorganic materials 0.000 claims 1
- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920005591 polysilicon Polymers 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910052814 silicon oxide Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US26643101P | 2001-02-05 | 2001-02-05 | |
| PCT/US2002/003206 WO2002062202A2 (en) | 2001-02-05 | 2002-02-05 | Microprotrusion array and methods of making a microprotrusion |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004524172A JP2004524172A (ja) | 2004-08-12 |
| JP2004524172A5 true JP2004524172A5 (enExample) | 2005-12-22 |
Family
ID=23014567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002562213A Pending JP2004524172A (ja) | 2001-02-05 | 2002-02-05 | マイクロ突起物アレイおよびマイクロ突起物の製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1364396A4 (enExample) |
| JP (1) | JP2004524172A (enExample) |
| AU (1) | AU2002250011A1 (enExample) |
| WO (1) | WO2002062202A2 (enExample) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6663820B2 (en) * | 2001-03-14 | 2003-12-16 | The Procter & Gamble Company | Method of manufacturing microneedle structures using soft lithography and photolithography |
| US7387742B2 (en) | 2002-03-11 | 2008-06-17 | Becton, Dickinson And Company | Silicon blades for surgical and non-surgical use |
| CN1298292C (zh) | 2002-03-11 | 2007-02-07 | 贝克顿迪肯森公司 | 制造手术刀片的系统和方法 |
| US7578954B2 (en) * | 2003-02-24 | 2009-08-25 | Corium International, Inc. | Method for manufacturing microstructures having multiple microelements with through-holes |
| WO2005027728A2 (en) | 2003-09-17 | 2005-03-31 | Becton, Dickinson And Company | Method for creating trenches in silicon wafers using a router |
| US7753888B2 (en) * | 2003-11-21 | 2010-07-13 | The Regents Of The University Of California | Method and/or apparatus for puncturing a surface for extraction, in situ analysis, and/or substance delivery using microneedles |
| US7396484B2 (en) | 2004-04-30 | 2008-07-08 | Becton, Dickinson And Company | Methods of fabricating complex blade geometries from silicon wafers and strengthening blade geometries |
| US7183215B2 (en) * | 2004-07-21 | 2007-02-27 | Hewlett-Packard Development Company, L.P. | Etching with electrostatically attracted ions |
| JP5882556B2 (ja) * | 2004-12-28 | 2016-03-09 | ナブテスコ株式会社 | 皮膚用針、皮膚用針製造装置および皮膚用針製造方法 |
| JP5053645B2 (ja) * | 2005-01-14 | 2012-10-17 | 久光製薬株式会社 | 医薬物運搬用器具とその製造方法 |
| US8277409B2 (en) * | 2005-12-05 | 2012-10-02 | Becton, Dickinson And Company | Cutting element for a retracting needle syringe |
| DE102006028781A1 (de) | 2006-06-23 | 2007-12-27 | Robert Bosch Gmbh | Verfahren zur Herstellung von porösen Mikronadeln und ihre Verwendung |
| DE102006040642A1 (de) | 2006-08-30 | 2008-03-13 | Robert Bosch Gmbh | Mikronadeln zur Platzierung in der Haut zwecks transdermaler Applikation von Pharmazeutika |
| US9114238B2 (en) | 2007-04-16 | 2015-08-25 | Corium International, Inc. | Solvent-cast microprotrusion arrays containing active ingredient |
| WO2009048607A1 (en) | 2007-10-10 | 2009-04-16 | Corium International, Inc. | Vaccine delivery via microneedle arrays |
| JP5410057B2 (ja) * | 2008-08-06 | 2014-02-05 | Sppテクノロジーズ株式会社 | シリコン基板のエッチング方法 |
| US9687641B2 (en) | 2010-05-04 | 2017-06-27 | Corium International, Inc. | Method and device for transdermal delivery of parathyroid hormone using a microprojection array |
| JP5845808B2 (ja) * | 2011-10-28 | 2016-01-20 | 凸版印刷株式会社 | マイクロニードルデバイスおよびその製造方法 |
| JP6865524B2 (ja) | 2012-12-21 | 2021-04-28 | コリウム, インコーポレイテッド | 治療剤を送達するためのマイクロアレイおよび使用方法 |
| JP6487899B2 (ja) | 2013-03-12 | 2019-03-20 | コリウム インターナショナル, インコーポレイテッド | 微小突起アプリケータ |
| WO2014152717A2 (en) | 2013-03-14 | 2014-09-25 | Sano Intelligence, Inc. | On-body microsensor for biomonitoring |
| US10820860B2 (en) | 2013-03-14 | 2020-11-03 | One Drop Biosensor Technologies, Llc | On-body microsensor for biomonitoring |
| WO2014144973A1 (en) | 2013-03-15 | 2014-09-18 | Corium International, Inc. | Microarray for delivery of therapeutic agent, methods of use, and methods of making |
| EP2968118B1 (en) | 2013-03-15 | 2022-02-09 | Corium, Inc. | Microarray for delivery of therapeutic agent and methods of use |
| WO2014150285A2 (en) | 2013-03-15 | 2014-09-25 | Corium International, Inc. | Multiple impact microprojection applicators and methods of use |
| AU2014237279B2 (en) | 2013-03-15 | 2018-11-22 | Corium Pharma Solutions, Inc. | Microarray with polymer-free microstructures, methods of making, and methods of use |
| EP3116397A4 (en) | 2014-03-13 | 2017-11-01 | Sano Intelligence, Inc. | System for monitoring body chemistry |
| US10595754B2 (en) | 2014-03-13 | 2020-03-24 | Sano Intelligence, Inc. | System for monitoring body chemistry |
| EP3188714A1 (en) | 2014-09-04 | 2017-07-12 | Corium International, Inc. | Microstructure array, methods of making, and methods of use |
| JP5967595B2 (ja) * | 2014-09-08 | 2016-08-10 | 株式会社かいわ | 穿刺器具 |
| WO2017004067A1 (en) | 2015-06-29 | 2017-01-05 | Corium International, Inc. | Microarray for delivery of therapeutic agent, methods of use, and methods of making |
| JP6608336B2 (ja) * | 2016-06-06 | 2019-11-20 | 三島光産株式会社 | マイクロニードルアレイ |
| CN110076528A (zh) * | 2019-05-13 | 2019-08-02 | 大连理工大学 | 一种平面金属微针阵列及其制备方法 |
| CN111675190A (zh) * | 2020-06-18 | 2020-09-18 | 苏州恒之清生物科技有限公司 | 一种微型实心硅针的制备方法 |
| USD1076079S1 (en) | 2021-04-21 | 2025-05-20 | One Health Biosensing Inc. | Applicator assembly |
| USD988882S1 (en) | 2021-04-21 | 2023-06-13 | Informed Data Systems Inc. | Sensor assembly |
| USD1086030S1 (en) | 2021-04-21 | 2025-07-29 | One Health Biosensing Inc. | Charging station |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5753130A (en) * | 1992-05-15 | 1998-05-19 | Micron Technology, Inc. | Method for forming a substantially uniform array of sharp tips |
| US5536988A (en) * | 1993-06-01 | 1996-07-16 | Cornell Research Foundation, Inc. | Compound stage MEM actuator suspended for multidimensional motion |
| US5779514A (en) * | 1996-02-13 | 1998-07-14 | National Science Council | Technique to fabricate chimney-shaped emitters for field-emission devices |
| FR2764441B1 (fr) * | 1997-06-05 | 2001-05-18 | Suisse Electronique Microtech | Procede de fabrication d'un organe palpeur pour capteur micromecanique, notamment pour microscope a force atomique |
| WO1999064580A1 (en) * | 1998-06-10 | 1999-12-16 | Georgia Tech Research Corporation | Microneedle devices and methods of manufacture and use thereof |
| US6503231B1 (en) * | 1998-06-10 | 2003-01-07 | Georgia Tech Research Corporation | Microneedle device for transport of molecules across tissue |
| US6406638B1 (en) * | 2000-01-06 | 2002-06-18 | The Regents Of The University Of California | Method of forming vertical, hollow needles within a semiconductor substrate, and needles formed thereby |
-
2002
- 2002-02-05 AU AU2002250011A patent/AU2002250011A1/en not_active Abandoned
- 2002-02-05 JP JP2002562213A patent/JP2004524172A/ja active Pending
- 2002-02-05 EP EP02718901A patent/EP1364396A4/en not_active Ceased
- 2002-02-05 WO PCT/US2002/003206 patent/WO2002062202A2/en not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2004524172A5 (enExample) | ||
| JP5637329B1 (ja) | 半導体片の製造方法、半導体片を含む回路基板および画像形成装置 | |
| US8308960B2 (en) | Methods for making micro needles and applications thereof | |
| US5851928A (en) | Method of etching a semiconductor substrate | |
| JP5390769B2 (ja) | 極薄ダイおよびその製造方法 | |
| US7919006B2 (en) | Method of anti-stiction dimple formation under MEMS | |
| US20040060902A1 (en) | Microprotrusion array and methods of making a microprotrusion | |
| JPH1074855A (ja) | 半導体素子のパッケージング方法 | |
| WO2002062202A2 (en) | Microprotrusion array and methods of making a microprotrusion | |
| JP2015029063A (ja) | 半導体片の製造方法、半導体片を含む回路基板および電子装置、ならびに基板のダイシング方法 | |
| JP5889232B2 (ja) | 凹凸構造体の製造方法 | |
| JP5937929B2 (ja) | インプリントモールドの製造方法 | |
| CN115626606B (zh) | 一种制作moems器件下梳齿的制备方法 | |
| US9472639B2 (en) | Forming a liquid ejection head with through holes and a depression | |
| JPH1083976A (ja) | 半導体装置及び半導体装置の製造方法 | |
| JP5152468B2 (ja) | 結晶基板のエッチング方法 | |
| JP2000055758A (ja) | 半導体圧力センサの製造方法 | |
| CN110837157A (zh) | 光学装置封装及其制造方法 | |
| JP2002319684A (ja) | 半導体装置の製造方法 | |
| TW202044522A (zh) | 微機電系統及其製造方法 | |
| JPH02162750A (ja) | 半導体装置の製造方法 | |
| CN115215285A (zh) | 基于氮化硅阳极键合的(111)硅转移工艺 | |
| JP2007240807A (ja) | マイクロレンズ基板の製造方法 | |
| JPH01206645A (ja) | 半導体装置の製造方法 | |
| JP2000269519A (ja) | 半導体センサの製造方法 |