JP2004516679A - 自己整合両面垂直ｍｉｍコンデンサ - Google Patents

自己整合両面垂直ｍｉｍコンデンサ Download PDF

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Publication number
JP2004516679A
JP2004516679A JP2002553224A JP2002553224A JP2004516679A JP 2004516679 A JP2004516679 A JP 2004516679A JP 2002553224 A JP2002553224 A JP 2002553224A JP 2002553224 A JP2002553224 A JP 2002553224A JP 2004516679 A JP2004516679 A JP 2004516679A
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JP
Japan
Prior art keywords
conductive
capacitor
conductive line
insulating layer
mim capacitor
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Pending
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JP2002553224A
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English (en)
Japanese (ja)
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JP2004516679A5 (OSRAM
Inventor
ニング，エックス．，ジェイ．
Original Assignee
インフィネオン テクノロジーズ ノース アメリカ コーポレイション
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Application filed by インフィネオン テクノロジーズ ノース アメリカ コーポレイション filed Critical インフィネオン テクノロジーズ ノース アメリカ コーポレイション
Publication of JP2004516679A publication Critical patent/JP2004516679A/ja
Publication of JP2004516679A5 publication Critical patent/JP2004516679A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/711—Electrodes having non-planar surfaces, e.g. formed by texturisation
    • H10D1/716—Electrodes having non-planar surfaces, e.g. formed by texturisation having vertical extensions

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2002553224A 2000-12-21 2001-11-29 自己整合両面垂直ｍｉｍコンデンサ Pending JP2004516679A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/742,918 US6451667B1 (en) 2000-12-21 2000-12-21 Self-aligned double-sided vertical MIMcap
PCT/US2001/045194 WO2002052618A2 (en) 2000-12-21 2001-11-29 Self-aligned double-sided vertical mim-capacitor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009212199A Division JP5184474B2 (ja) 2000-12-21 2009-09-14 自己整合両面垂直ｍｉｍコンデンサ

Publications (2)

Publication Number Publication Date
JP2004516679A true JP2004516679A (ja) 2004-06-03
JP2004516679A5 JP2004516679A5 (OSRAM) 2007-04-05

Family

ID=24986772

Family Applications (2)

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JP2002553224A Pending JP2004516679A (ja) 2000-12-21 2001-11-29 自己整合両面垂直ｍｉｍコンデンサ
JP2009212199A Expired - Fee Related JP5184474B2 (ja) 2000-12-21 2009-09-14 自己整合両面垂直ｍｉｍコンデンサ

Family Applications After (1)

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JP2009212199A Expired - Fee Related JP5184474B2 (ja) 2000-12-21 2009-09-14 自己整合両面垂直ｍｉｍコンデンサ

Country Status (6)

Country Link
US (1) US6451667B1 (OSRAM)
EP (1) EP1393356A2 (OSRAM)
JP (2) JP2004516679A (OSRAM)
KR (1) KR20040019268A (OSRAM)
CN (1) CN1280874C (OSRAM)
WO (1) WO2002052618A2 (OSRAM)

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JP2009059990A (ja) * 2007-09-03 2009-03-19 Rohm Co Ltd コンデンサ、電子部品、およびコンデンサの製造方法
JP2012520574A (ja) * 2009-03-17 2012-09-06 クアルコム，インコーポレイテッド 金属−酸化物−金属キャパシタ用の高容量絶縁体の選択的製作

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US6620701B2 (en) * 2001-10-12 2003-09-16 Infineon Technologies Ag Method of fabricating a metal-insulator-metal (MIM) capacitor
US6960365B2 (en) * 2002-01-25 2005-11-01 Infineon Technologies Ag Vertical MIMCap manufacturing method
KR100818058B1 (ko) * 2002-06-28 2008-03-31 매그나칩 반도체 유한회사 엠아이엠 캐패시터 형성방법
US6787836B2 (en) * 2002-08-21 2004-09-07 International Business Machines Corporation Integrated metal-insulator-metal capacitor and metal gate transistor
KR20040019512A (ko) 2002-08-28 2004-03-06 주식회사 하이닉스반도체 반도체 소자의 캐패시터 형성방법
KR100515378B1 (ko) * 2003-01-30 2005-09-14 동부아남반도체 주식회사 박막 커패시터 제조 방법
US7268383B2 (en) * 2003-02-20 2007-09-11 Infineon Technologies Ag Capacitor and method of manufacturing a capacitor
US6706588B1 (en) * 2003-04-09 2004-03-16 Infineon Technologies Ag Method of fabricating an integrated circuit having embedded vertical capacitor
US6964908B2 (en) 2003-08-19 2005-11-15 International Business Machines Corporation Metal-insulator-metal capacitor and method of fabricating same
US6933191B2 (en) * 2003-09-18 2005-08-23 International Business Machines Corporation Two-mask process for metal-insulator-metal capacitors and single mask process for thin film resistors
US6934143B2 (en) * 2003-10-03 2005-08-23 Taiwan Semiconductor Manufacturing Co., Ltd. Metal-insulator-metal capacitor structure
US6962846B2 (en) * 2003-11-13 2005-11-08 Micron Technology, Inc. Methods of forming a double-sided capacitor or a contact using a sacrificial structure
CN100536109C (zh) * 2003-12-30 2009-09-02 中芯国际集成电路制造(上海)有限公司 用铜制造高电容量电容器的方法及其结构
DE102004033825B4 (de) * 2004-07-13 2009-05-14 Infineon Technologies Ag Verfahren zur Herstellung einer Kondensatoranordnung sowie zugehörige Kondensatoranordnung
US7312120B2 (en) * 2004-09-01 2007-12-25 Micron Technology, Inc. Method for obtaining extreme selectivity of metal nitrides and metal oxides
US7329576B2 (en) * 2004-09-02 2008-02-12 Micron Technology, Inc. Double-sided container capacitors using a sacrificial layer
KR100617057B1 (ko) 2004-12-30 2006-08-30 동부일렉트로닉스 주식회사 커패시터 구조 및 그 제조방법
US7678659B2 (en) * 2005-09-26 2010-03-16 Mediatek Inc. Method of reducing current leakage in a metal insulator metal semiconductor capacitor and semiconductor capacitor thereof
US7416953B2 (en) * 2005-10-31 2008-08-26 Taiwan Semiconductor Manufacturing Co., Ltd. Vertical MIM capacitors and method of fabricating the same
KR100771866B1 (ko) * 2006-02-24 2007-11-01 삼성전자주식회사 높은 정전용량을 갖는 커패시터, 이를 포함하는 집적회로장치 및 그 제조방법
CN100454550C (zh) * 2006-03-24 2009-01-21 联华电子股份有限公司 电容结构
EP2680009A1 (en) 2007-02-08 2014-01-01 Biogen Idec MA Inc. Nrf2 screening assays and related methods and compositions
KR100855983B1 (ko) 2007-02-27 2008-09-02 삼성전자주식회사 수직하게 적층된 캐패시터층들을 구비한 반도체 소자의캐패시턴스 트리밍회로
US7611958B2 (en) * 2007-12-05 2009-11-03 Infineon Technologies Ag Method of making a semiconductor element
US8017997B2 (en) * 2008-12-29 2011-09-13 International Business Machines Corporation Vertical metal-insulator-metal (MIM) capacitor using gate stack, gate spacer and contact via
US8916435B2 (en) 2011-09-09 2014-12-23 International Business Machines Corporation Self-aligned bottom plate for metal high-K dielectric metal insulator metal (MIM) embedded dynamic random access memory
US9252204B2 (en) 2011-09-15 2016-02-02 GlobalFoundries, Inc. Metal insulator metal (MIM) capacitor structure
CN102446917B (zh) * 2011-11-15 2014-02-05 上海华力微电子有限公司 一种多层金属-氮化硅-金属电容及其制作方法
CN103515350B (zh) * 2012-06-18 2016-02-10 上海华虹宏力半导体制造有限公司 垂直金属/绝缘层/金属mim电容及其制造方法
US9059052B2 (en) 2013-05-16 2015-06-16 International Business Machines Corporation Alternating open-ended via chains for testing via formation and dielectric integrity
CN105321886B (zh) * 2014-05-29 2019-07-05 联华电子股份有限公司 电容器结构及其制造方法
US9520461B1 (en) * 2015-08-28 2016-12-13 Texas Instruments Incorporated Integrated circuit with lateral flux capacitor
WO2017171715A1 (en) * 2016-03-28 2017-10-05 Intel Corporation Pitch division patterning approaches with increased overlay margin for back end of line (beol) interconnect fabrication and structures resulting therefrom
US10347579B2 (en) * 2017-01-19 2019-07-09 Qualcomm Incorporated Reducing tip-to-tip distance between end portions of metal lines formed in an interconnect layer of an integrated circuit (IC)
US10964779B2 (en) 2018-11-13 2021-03-30 International Business Machines Corporation Vertical plate capacitors exhibiting high capacitance manufactured with directed self-assembly
US11276684B2 (en) * 2019-05-31 2022-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Recessed composite capacitor
US11715594B2 (en) 2021-05-27 2023-08-01 International Business Machines Corporation Vertically-stacked interdigitated metal-insulator-metal capacitor for sub-20 nm pitch
US12356638B2 (en) 2021-12-06 2025-07-08 International Business Machines Corporation Metal-insulator-metal capacitor structure with enlarged capacitor area

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JPH10189912A (ja) * 1996-11-06 1998-07-21 Fujitsu Ltd 半導体装置及びその製造方法
JP2000252422A (ja) * 1999-02-25 2000-09-14 Iwate Toshiba Electronics Kk 半導体装置及びその製造方法

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US5576240A (en) 1994-12-09 1996-11-19 Lucent Technologies Inc. Method for making a metal to metal capacitor
US6033919A (en) * 1996-10-25 2000-03-07 Texas Instruments Incorporated Method of forming sidewall capacitance structure
JPH11163329A (ja) * 1997-11-27 1999-06-18 Mitsubishi Electric Corp 半導体装置およびその製造方法
US6143596A (en) * 1998-11-10 2000-11-07 Vanguard International Semiconductor Corporation Planarization for interlayer dielectric
US6228707B1 (en) * 1999-06-21 2001-05-08 Philips Semiconductors, Inc. Semiconductor arrangement having capacitive structure and manufacture thereof

Patent Citations (2)

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JPH10189912A (ja) * 1996-11-06 1998-07-21 Fujitsu Ltd 半導体装置及びその製造方法
JP2000252422A (ja) * 1999-02-25 2000-09-14 Iwate Toshiba Electronics Kk 半導体装置及びその製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009059990A (ja) * 2007-09-03 2009-03-19 Rohm Co Ltd コンデンサ、電子部品、およびコンデンサの製造方法
JP2012520574A (ja) * 2009-03-17 2012-09-06 クアルコム，インコーポレイテッド 金属−酸化物−金属キャパシタ用の高容量絶縁体の選択的製作
US9245881B2 (en) 2009-03-17 2016-01-26 Qualcomm Incorporated Selective fabrication of high-capacitance insulator for a metal-oxide-metal capacitor

Also Published As

Publication number Publication date
CN1552090A (zh) 2004-12-01
US20020081814A1 (en) 2002-06-27
CN1280874C (zh) 2006-10-18
US6451667B1 (en) 2002-09-17
JP2010045378A (ja) 2010-02-25
JP5184474B2 (ja) 2013-04-17
WO2002052618A2 (en) 2002-07-04
KR20040019268A (ko) 2004-03-05
EP1393356A2 (en) 2004-03-03
WO2002052618A3 (en) 2003-11-27

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